FUKUDA

What FUKUDA does

FUKUDA Metal Foil & Powder Co., Ltd. (福田金属箔粉工業株式会社) is a Kyoto-headquartered Japanese specialty materials manufacturer, founded in 1700, that designs and produces metal foils and metal powders for industrial customers. The company operates approximately 20 distinct production methods — including electrolytic deposition, mechanical pounding, gas and water atomization, ultra-high-pressure swirling water atomization, chemical reduction, plasma rotating electrode, and uniform droplet spray — yielding more than 1,000 product grades. Its portfolio spans copper, silver, nickel, tin, zinc, aluminum and alloy foils and powders in dendritic, flake, and spherical morphologies, sold under sub-brands such as nanoShin, HWQ, FAM, Fukudaloy, F-Blaze, and Color Ace. FUKUDA also supplies processed/multi-material products including aluminum composite panels, packaging films, sputtering targets, lead-free solder balls, and copper core balls for BGA/CSP applications.

The company sells exclusively through direct B2B channels, with regional sales offices in Tokyo, Nagoya, and Kansai supplementing the Kyoto headquarters, and serves five primary verticals: electronics (PCBs, capacitors, semiconductor packaging, printed electronics), automotive (conductive materials, EM shielding, bearings, additive manufacturing), pharmaceutical and food packaging (PTP aluminum foil, clean films), construction (Color Ace panels), and energy (battery current collectors, fuel cells, brazing). Pricing is quote-based and not publicly disclosed. FUKUDA maintains production subsidiaries in Suzhou, China (Suzhou Fukuda Metal and Suzhou Fukuda High-Tech Powder) and a group of domestic related companies, indicating a small group corporate structure under the privately held parent. The firm holds UL ECVP 2809-2 third-party verification for 100% recycled copper content in its electrolytic and rolled copper foil lines, and is recognized as a Regional Future Driving Company by Japan's METI and as a Kyoto City Brighter Regional Companies award recipient.

Name

FUKUDA

Legal name

福田金属箔粉工業株式会社

Website

https://fukuda-kyoto.co.jp

Company type

Private

Founded year

1700

Operating status

Operating

Headcount range

501–1,000 employees

Short description

FUKUDA is a 320+ year-old Kyoto-based manufacturer of metal foils and metal powders, producing 1,000+ product grades via 20+ proprietary processes for electronics, automotive, pharmaceutical packaging, energy, and construction customers, with direct B2B sales in Japan and production subsidiaries in China.

Ownership category

akta.pro rank

Product category

Metal Powders and Metal Foils (Industrial Metal Materials)

NAICS

Copper Rolling, Drawing, Extruding, and Alloying (331420), Aluminum Sheet, Plate, and Foil Manufacturing (331315), Nonferrous Metal (except Copper and Aluminum) Rolling, Drawing, Extruding, and Alloying (33149)

SIC

Primary Smelting & Refining Of Nonferrous Metals (3330)

akta.pro primary industry

Current Collectors & Foils (Copper, Aluminum) Manufacturing (EUAFABAF)

akta.pro secondary industry

Aluminum Trays, Pans & Foil Containers (Semi-Rigid) (IMALADAH)

Keywords

• Metal foil manufacturing
• Metal powder production
• Electrolytic copper foil
• Powder metallurgy products
• Printed electronics materials

Headquarters

HQ city

Kyoto

HQ country

Japan

HQ region

Asia

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Technology or R&D, Personnel, Marketing or Sales, Infrastructure

Revenue model

1. Metal powder sales: Sale of metal powder products including electrolytic powder, atomized powder, chemically reduced powder, flake powder, and metal balls. Products span copper, silver, nickel, tin, zinc, aluminum, and various alloy compositions. Sold directly to industrial customers with pricing based on specifications and order volume.
2. Metal foil sales: Sale of metal foil products including electrolytic copper foil, rolled copper foil, nickel foil, aluminum foil, and processed/multi-material foils. Includes specialty products such as ultra-low-profile foil, carrier-attached ultra-thin copper foil, and plated foils (tin-plated, nickel-plated). Sold directly to electronics, packaging, and construction customers.
3. Processed/multi-material products: Sale of processed products derived from metal foils and powders including Color Ace aluminum composite panels (decorative, signage, building materials), packaging materials (PTP foil, anti-static bags, clean films), conductive materials, sputtering/evaporation targets, solder balls, and copper core balls.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels6 records

Core offering

FUKUDA manufactures and sells metal foils and metal powders using approximately 20 proprietary production methods (electrolytic deposition, mechanical pounding, gas/water atomization, chemical reduction, plasma rotating electrode, uniform droplet spray, heat treatment, rolling). The portfolio spans more than 1,000 product varieties across copper, silver, nickel, tin, zinc, aluminum, and alloy compositions for electronics, automotive, pharmaceutical packaging, energy, and construction industries. Processed products include aluminum composite panels, solder balls, copper core balls, and brazing powders.

Product overview

FUKUDA Metal Foil & Powder Co., Ltd. is a manufacturer specializing in metal foils and metal powders, established in 1700. The company operates two core business divisions: the Metal Powder Business and the Metal Foil Business. The product portfolio includes over 1,000 varieties of metal powders (electrolytic, atomized, chemically reduced, flake, and nanoparticle types) and various metal foils (electrolytic copper foil, rolled copper foil, nickel foil, aluminum foil). The company also produces processed products including aluminum composite panels (Color Ace series), solder balls, copper core balls, and industrial materials. Products serve diverse industries including electronics (PCBs, capacitors, conductive materials), automotive (bearings, brushes, friction materials), energy (batteries, fuel cells), and construction materials. Advanced technologies include additive manufacturing powders for 3D printing, ultra-thin copper flakes for printed electronics, and cold spray coatings.

Differentiator

Problem solved

Functional benefit

Brands

• FAMシリーズ: Additive manufacturing copper and copper alloy powders for 3D printing
• カラーエース
• フクダロイ
• ナノシン
• HWQシリーズ
• フクダ技報

Products and services

• Electrolytic Copper Powder CE Copper powder manufactured using the electrolytic method with a unique dendritic (branch-like) shape, low apparent density and high specific surface area; used in sintered mechanical parts, oil-impregnated bearings, carbon brushes, and friction materials for industrial buyers.
• Chemically Reduced Copper Powder Cu-C Series Ultra-fine copper powder (0.2–1.0 micrometer particle diameter) manufactured by chemical reduction method, suitable for electronic materials applications including conductive pastes, circuits, and displays.
• Copper Flake Powder Series (nanoThin) Flake-shaped copper powder with high aspect ratio produced by proprietary pounding/stamping technology, including the ultra-thin nanoThin series (CuX-4 to CuX-7); used in capacitors, conductive materials, printed electronics, catalysts, powder metallurgy, antibacterial applications, paints, and inks.
• Flake Powder HWF Series (Copper, Silver) Copper and silver flake powders produced by crushing ultra-high pressure swirling water atomized powder (HWQ), developed for miniaturizing and thinning electronic components and providing improved conductivity via increased contact area between flake particles.
• Zinc Flake Powder Zn-S-D8S Flake-shaped zinc powder with high aspect ratio achieved through proprietary stamping technology, offering excellent coating properties for industrial applications.
• Ultra-Low Roughness Electrolytic Copper Foil CF-T4X-SV Ultra-low roughness double-sided glossy electrolytic copper foil with proprietary micro-fine roughening treatment 'T4X', combining ultra-low profile with high anchoring effect for excellent transmission characteristics and fine-line processing for rigid PCBs and flexible PCBs.
• Ultra-Low Roughness Non-Roughening Electrolytic Copper Foil CF-T9DA-SV Lowest roughness electrolytic copper foil SV combined with T9DA non-roughening treatment, offering excellent heat resistance for substrates and optical applications.
• High-Purity Electrolytic Nickel Foil NIF Extremely high-purity electrolytic nickel foil for applications requiring stable device performance under harsh environments, such as battery current collectors and electronic components.
• Electromagnetic Wave Shielding Electrolytic Copper Foil CF Electrolytic copper foil leveraging copper's high electromagnetic wave shielding properties for construction materials and electronic components, with sheet cutting processing available for use as a release film alternative in resin molding.
• Additive Manufacturing Copper Powder FAM-QCU Spherical copper powder manufactured by gas atomization method with excellent fluidity essential for metal additive manufacturing (3D printing), for conductive and heat-dissipating components. Part of the FAM series.
• Gas Atomized Powder (Copper, Tin, Copper Alloy) Powder produced by injecting high-pressure gas into molten metal, causing it to scatter and cool/solidify during falling; available in copper, tin, and copper alloy compositions with particle size controlled through sieving.
• Ultra-High Pressure Swirling Water Atomized Powder HWQ Series Fine spherical metal powder produced using ultra-high pressure swirling water jet atomization technology, enabling mass production of powders with small average particle size and minimal aggregation.
• Lead-Free Solder Ball True spherical lead-free solder balls produced by the uniform droplet spray method in an inert gas atmosphere, for BGA and CSP semiconductor packaging applications.
• Copper Core Ball Spherical metal balls with copper core plated with lead-free solder, used as interconnect materials for BGA and CSP semiconductor package applications.
• Color Ace Aluminum Composite Panel Series Aluminum composite panels with colored aluminum facesheets and foamed polyethylene resin core, including the environment-friendly EP+eco variant using recycled materials, for signage, decorative, and building material applications.
• Electrostatic Shielding Aluminum Foil Aluminum foil with excellent electrostatic shielding properties for packaging electronic components and precision equipment.
• Fukudaloy Surface Hardening Alloy Powder Surface hardening alloy powder (brand 'Fukudaloy') for hardfacing chemical plant valves, engine valves, and injection molding machine screws, as well as boiler tube thermal spray materials.
• Nickel Brazing Alloy Powder 'F-Blaze' Nickel brazing alloy powder sold under the 'F-Blaze' brand for joining stainless steel heat exchangers.
• Anti-Rust Paper Vapor-phase anti-rust paper effective for steel products and non-ferrous metals including aluminum, copper, and zinc, providing rust prevention even under high temperature, humidity, and acidic conditions.
• Logistics Materials (Containers, Pallets) Containers and pallets for transporting and storing liquids, powders, and roll-shaped products.

Named customers4 records

Segments5 records

Ideal customer profiles5 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

Four partnerships are on record, tiered minor.

• 公益財団法人京都市都市緑化協会 (Kyoto Urban Greening Association)minorStrategic or Co-development PartnerFUKUDA collaborates with the Kyoto Urban Greening Association on biodiversity conservation, specifically cultivating Ominameshi and Hiougi plants at its Kyoto Factory wastewater treatment facility. The association provides Kyoto native plant species for FUKUDA to grow and preserve, contributing to ex-situ conservation of rare plants and raising awareness of their cultural and environmental value in Kyoto.
• 京都水族館 AQTION! サポーター (Kyoto Aquarium AQTION! Supporter)minorOthersFUKUDA participates as an AQTION! Supporter in the Kyoto Aquarium's sustainability initiative, contributing to environmental awareness and conservation activities that engage children and local communities with marine and environmental themes.
• ひょうごメタルベルトコンソーシアム (Hyogo Metal Belt Consortium)minorStrategic or Co-development PartnerFUKUDA participates in the Hyogo Metal Belt Consortium, presenting research on additive manufacturing metal powders and related technologies at annual sessions. The consortium brings together regional companies and research institutions in the metal/machining sector.
• 京都サンガF.C. (Kyoto Sanga FC)minorGTM or Marketing PartnerFUKUDA serves as an Official Platinum Sponsor of Kyoto Sanga FC, a J-League professional soccer club. The partnership includes promotional visibility at matches, digital branding, and player visits to FUKUDA facilities. This sponsorship supports local community engagement and regional brand building.

Scale indicators5 records

Recent moves6 records

Expansion highlights6 records

Emerging players

• American Elements: US-based catalog supplier of advanced and engineered metal powders including copper, silver, zinc, and alloy powders for electronics and additive manufacturing. Overlaps with FUKUDA's wide metal powder catalog offering at smaller manufacturing scale.

Direct peers

• Tanaka Holdings (Tanaka Kikinzoku Kogyo): Japanese specialist in precious metal powders (gold, silver, platinum) used in electronics, semiconductors, and decorative applications. Direct competitor to FUKUDA's silver flake powder and precious metal powder product lines.
• Mitsui Mining & Smelting: One of Japan's largest producers of electrolytic copper foil for PCBs and lithium-ion battery current collectors (Mitsui MicroThin). Directly competes with FUKUDA in copper foil manufacturing for electronics and battery current collector applications.
• Furukawa Electric: Diversified Japanese materials manufacturer producing electrolytic copper foil, rolled copper foil, and metal powders. Overlaps directly with FUKUDA's copper foil and electronic materials portfolio across PCB and automotive applications.
• Mitsubishi Materials: Japanese manufacturer of copper, aluminum, and rare metal products with powder metallurgy operations. Overlaps with FUKUDA's metal powder business for automotive bearings, friction materials, and electronics applications.
• JX Nippon Mining & Metals: Major Japanese nonferrous metals refiner and copper foil producer serving battery and electronics markets. Direct peer in electrolytic copper foil and battery current collector foils with substantially greater scale than FUKUDA.
• Dowa Electronics Materials: Japanese manufacturer of semiconductor materials and metal powders including silver, copper, and tin powders. Directly competes with FUKUDA in electronic materials and conductive powders for printed electronics and capacitors.
• Sumitomo Metal Mining: Japanese nonferrous metals refiner producing electrolytic copper foil, nickel, and battery cathode materials. Competes directly with FUKUDA in copper and nickel foil markets for battery and electronics applications.

Broad incumbents

• Materion Corporation: US-based specialty metals and materials producer offering beryllium, copper alloy strip, thin film deposition materials, and metal powders. Comparable to FUKUDA in specialty processed metal foils and engineered powders serving electronics and industrial markets.
• Höganäs AB: Swedish-headquartered global leader in metal powders for powder metallurgy, brazing, and additive manufacturing. A broader specialty metal powder incumbent with deeper AM powder market penetration compared to FUKUDA's emerging FAM series.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

Compliance7 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Subsidiaries6 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about FUKUDA