SEP

What SEP does

SEP Co., Ltd. (에스이피) is a privately owned South Korean printed circuit board (PCB) and electronics manufacturing services (EMS) company founded in 1993 and headquartered in Suwon, Gyeonggi-Do. It designs, fabricates, and assembles high-reliability PCBs spanning HDI (up to 44 layers), semiconductor-level package substrates (CSP, FC-CSP, PBGA, BOC, FMC, SiP), flex/rigid-flex circuits, backplanes (up to 60 layers), heavy copper boards (up to 12oz external), and RF/microwave PTFE multilayers. Beyond PCB fabrication, SEP provides vertically integrated box-build services including PCB assembly, component procurement, cable and harness assembly, sheet metal fabrication, plastic injection molding, and systems integration. The company also offers front-end design engineering, original design manufacturing (ODM) of RF products such as ISDB-T tuners and automotive Semi-DVR, and new product introduction support from rapid prototyping (5–7 day quick turns) through volume manufacturing.

SEP's go-to-market is enterprise-direct, with sales and engineering offices across South Korea, China (Shenzhen), the United States (California), Canada, the United Kingdom, Russia, and the Czech Republic providing localized 24/7 customer support. Manufacturing is concentrated in two locations: the Suwon, Korea facility (15 mass-production SMT lines plus dedicated prototype lines) and the Shenzhen, China facility (50 mass-production SMT lines plus 5 prototype lines), with wholly-owned subsidiaries including SEPtron for PCB drilling and SEP Production Works for Chinese assembly. The company targets eight end-markets — automotive, consumer electronics, networking and communications, telecom, aerospace and military, medical, computing and storage, and cellular — and sells on a custom-quote basis with net-45 payment terms and IPC-A-600/IPC-6012 quality standards. Customer reference points include Philip Morris International as an approved vendor since 2016 and various telecom, automotive, and aerospace/defense customers. Certifications include ISO 9001, ISO 14001, and TS 16949 for cable and harness assembly.

Name

SEP

Legal name

SEP Co., Ltd.

Website

https://sep.co.kr

Company type

Private

Founded year

1993

Operating status

Operating

Headcount range

101–250 employees

Short description

SEP Co., Ltd. is a South Korean privately-owned PCB fabricator and EMS provider founded in 1993, offering vertically integrated design-to-volume manufacturing services — including HDI, package substrates, RF/microwave, and assembly — to enterprise customers across automotive, aerospace, telecom, medical, and consumer electronics markets globally.

Ownership category

akta.pro rank

Product category

PCB Manufacturing and Electronics Manufacturing Services

NAICS

Bare Printed Circuit Board Manufacturing (334412), Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Semiconductor and Other Electronic Component Manufacturing (3344)

SIC

Printed Circuit Boards (3672), Electronic Components, Nec (3679), Electronic Components & Accessories (3670)

akta.pro primary industry

Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK)

akta.pro secondary industries

PCB Fabrication (Rigid PCBs) (HDAHAOAG), PCB Fabrication (Flex & Rigid-Flex PCBs) (HDAHAOAH), PCB Assembly (PCBA/EMS) (HDAHAOAI)

Keywords

• Printed circuit boards
• Electronics manufacturing services
• PCB assembly
• HDI circuit fabrication
• Package substrate

Headquarters

HQ city

Gunpo

HQ country

South Korea

HQ region

Asia

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Personnel, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. PCB Fabrication: Custom printed circuit board manufacturing including HDI, multi-layer, flex/rigid-flex, backplane, RF/microwave, heavy copper, package substrates, and specialized PCBs for various applications.
2. Electronics Manufacturing Services (EMS): End-to-end contract manufacturing including PCB assembly, component procurement, cable and harness assembly, sheet metal fabrication, plastic injection molding, and systems integration.
3. Original Design Manufacturing (ODM): R&D design services and ODM products including Full Segment Digital Terrestrial TV (ISDB-T) Tuner, One Segment Digital Terrestrial TV (ISDB-T) Tuner, and Semi-DVR for automotive market.
4. Design and Engineering Services: Front-end engineering services including PCB design, CAD/CAE support, design for manufacturability, signal integrity analysis, thermal management, and regulatory assistance.

Pricing tiers

Go-to-market motion2 records

Distribution channels1 record

Marketing channels1 record

Core offering

SEP designs and manufactures high-reliability printed circuit boards (PCBs), including HDI, package substrate, rigid, flex/rigid-flex, backplane, probecard, heavy copper, RF/microwave, and heatsink/metal core boards, and provides end-to-end electronics manufacturing services (EMS) covering PCB assembly, component procurement, cable & harness, sheet metal fabrication, and plastic injection molding. It supports customers across the full product lifecycle from PCB design and engineering, prototyping, and new product introduction (NPI) through volume production.

Product overview

SEP (에스이피) is a South Korean privately-owned Printed Circuit Board and Contract Manufacturing company founded in 1993, offering high-reliability solutions from design through volume manufacturing. The company's core product portfolio consists of two main categories: (1) PCB products including HDI, Package Substrates (CSP, FC-CSP, PBGA, BOC, FMC, SiP), Flex/Rigid-Flex, Backplane, Probecard, Heatsink/Metal Core, Heavy Copper, and RF/Microwave variants; and (2) EMS services including PCB Assembly, Component Procurement, Cable & Harness, Sheet Metal Fabrication, and Plastic Injection Molding. Supporting these core offerings, SEP provides design engineering services encompassing Product Design & Development, Original Design Manufacturing (ODM), PCB Design & Engineering, Prototype through Production, and New Product Introduction (NPI).

Differentiator

Problem solved

Functional benefit

Products and services

• High Density Interconnect (HDI) PCBs

Quantifiable outcome

• Global operations spanning 6+ countries with localized 24/7 support capability
• +2 more outcomes

Named customers4 records

Segments8 records

Ideal customer profiles6 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Scale indicators4 records

Recent moves9 records

Expansion highlights5 records

Direct peers

• AT&S (Austria Technologie & Systemtechnik): European PCB and IC substrate manufacturer with HDI, substrate, and EMS offerings across automotive, industrial, and medical end markets — directly comparable in technology breadth (especially substrates) and high-reliability customer focus.
• Compeq Manufacturing: Taiwan-based PCB manufacturer specializing in HDI, rigid-flex, and multilayer boards for smartphones, networking, and automotive — closely mirroring SEP's HDI-heavy product mix and customer verticals.
• Shinko Electric Industries: Japanese manufacturer specializing in IC substrates (FC-BGA, flip-chip) and plastic packages — a direct technology peer to SEP's Package Substrate line, particularly FC-CSP and PBGA offerings.
• Tripod Technology: Taiwan PCB manufacturer with HDI, multilayer, and flex capabilities serving networking, automotive, and consumer electronics — comparable mid-sized Asian PCB fabricator with overlapping technology and customer base.
• Ibiden: Japanese IC substrate and PCB manufacturer with leading IC substrate (FC-BGA) capability — directly comparable in package substrate technology, particularly the FC-CSP and BGA/PBGA products in SEP's portfolio.
• Zhen Ding Technology: Taiwan-listed flex PCB leader with HDI and rigid-flex capabilities for smartphones, wearables, and automotive — directly comparable to SEP's Flex/Rigid-Flex and HDI product categories.
• Unimicron Technology: Taiwan-listed PCB and IC substrate manufacturer with HDI, rigid, flex, and substrate capabilities that directly overlap SEP's product portfolio. Comparable as both a PCB fabricator and emerging package substrate player serving similar semiconductor and consumer electronics OEMs.

Broad incumbents

• TTM Technologies: US-based broad-line PCB manufacturer serving aerospace/defense, automotive, medical, and networking — a much larger incumbent that competes with SEP across many of the same high-reliability end markets.
• Jabil: Global EMS provider with design, manufacturing, and supply chain services across diverse end markets — a broad incumbent comparable to SEP's PCB assembly, cable/harness, and systems integration offerings at much larger scale.
• Flex Ltd: Global EMS giant offering design, PCB assembly, and systems integration across consumer, automotive, medical, and aerospace — directly comparable to SEP's EMS services and vertically integrated model, though at vastly larger scale.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/sep-co.-ltd

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles14 records

Subsidiaries8 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about SEP