SwissSEM Technologies

Name

SwissSEM Technologies

Legal name

SwissSEM Technologies AG

Website

https://swiss-sem.com

Company type

Private

Founded year

2020

Operating status

Operating

Headcount range

51–100 employees

Ownership category

akta.pro rank

Headquarters

HQ city

Lenzburg

HQ country

Switzerland

HQ region

Europe

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Operations, Personnel, Marketing or Sales, Infrastructure

Revenue model

1. Power Semiconductor Module Sales: Sale of IGBT and SiC power semiconductor modules including ED-Type, ST-Type, EV-Type, HEEV, and EVD封装 modules for industrial and automotive applications
2. Power Semiconductor Chip Sales: Sale of proprietary IGBT chips (i20 series) and SiC MOSFET chips to customers for their own module packaging

Go-to-market motion1 record

Distribution channels3 records

Marketing channels5 records

Core offering

SwissSEM Technologies designs, develops, and wholesale-supplies power semiconductor products, including proprietary IGBT chips and modules (i20, i23, d20 FRD, ED-Type, ST-Type, EV-Type) and Silicon Carbide (SiC) MOSFET chips and modules (HEEV, EVD packaging). Chip design and R&D are headquartered in Lenzburg, Switzerland, with module manufacturing performed at the Sunking Pacific Semiconductors facility in Jiashan, Zhejiang, China. End applications include electric vehicle drives, photovoltaic and wind inverters, energy storage converters, and industrial motor drives.

Product overview

SwissSEM Technologies is a rapid-growing independent supplier of power semiconductors, offering a comprehensive portfolio of IGBT chips, modules, and SiC (silicon carbide) solutions. The product lineup includes: i20 and i23 series IGBT chipsets (1200V/250A to 1700V) paired with d20 FRD chips; ED-Type, ST-Type, and EV-Type IGBT modules in various voltage/current ratings for industrial and automotive applications; and HEEV and EVD packaging SiC modules for electric vehicles. The company also provides PLECS simulation models for product design support. All products target renewable energy, industrial automation, and electric mobility applications, with manufacturing facilities in both Switzerland and China.

Differentiator

Problem solved

Functional benefit

Products and services

• i23 Series 900A/1200V Half-Bridge IGBT Modules Second-generation IGBT modules engineered to significantly reduce saturation voltage drop and switching losses, available in 450A–900A current ratings, targeting renewable energy generation and industrial automation applications.
• i20 Series IGBT Chipsets Self-developed FS-Trench structure IGBT chips featuring narrow mesa, short channel, 3D structure, and optimized N-enhancement layer, available in 1200V/250A and 1700V variants with up to 250A current capability and 175°C maximum junction temperature, sold to customers for module packaging.
• d20 FRD Chips Fast Recovery Diode chips developed alongside i20 IGBT for optimal matching, featuring advanced emitter efficiency management and optimized anode diffusion curve, achieving low FRD losses and reduced IGBT conduction losses.
• ED-Type IGBT Modules Industrial EconoDual packaged IGBT modules using i20 ultra-low loss micro-pattern Trench IGBT chipset with straight-line optimized layout for improved current sharing, available in 1200V/750A, 1200V/600A, and 1700V variants, featuring Al2O3 ceramic substrate and Cu baseplate for low thermal resistance.
• ST-Type IGBT Modules 62mm industry-standard package IGBT modules with optimized layout and 3D signal transmission design, achieving lowest internal thermal resistance, connection impedance, and stray inductance among comparable products, suitable for PV inverters, low-voltage VFDs, UPS, motor drives, and CNC machine tools.
• EV-Type IGBT Modules Single-sided cooling IGBT modules designed for automotive and new energy applications, featuring extremely high current density, low overshoot voltage, ultra-low conduction voltage drop, SiN substrate for low thermal resistance, and superior power cycling capability.
• HEEV Packaging SiC Modules High-Efficiency Electric Vehicle silicon carbide MOSFET modules featuring transfer molding, sintering, ultrasonic welding, and direct baseplate-free liquid cooling design, suitable for 800V platforms and e-axle systems up to 250kW.
• EVD Packaging SiC Modules Six-in-one automotive-grade compact silicon carbide modules with innovative signal terminal design and advanced internal SiC chip parallel layout, compatible with both Si and SiC chips, covering 100kW to 300kW EV inverter needs.
• 1200V/13mΩ SiC MOSFET Chip Self-developed silicon carbide MOSFET chip using planar gate technology with cell pitch reduced to 5.0 micrometers, achieving 1200V/13mΩ performance at industry-leading level, sold to customers for module packaging.

Quantifiable outcome

• Energy savings up to 30% compared to traditional mechanical throttling methods in industrial motor control
• +4 more outcomes

Named customers3 records

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

Three partnerships are on record, tiered minor and core.

• China Electric Equipment Research Institute (中国电气装备研究院)minorStrategic or Co-development Partner · 18 October 2023State-owned enterprise under State-owned Assets Supervision and Administration Commission. Research institute focused on power transmission and transformation technology. Visit to SwissSEM Jiashan base for technical exchange and potential collaboration in new power systems and power electronics technology.
• Chen Qingquan (陈清泉) - AcademiciancoreStrategic or Co-development Partner · 18 August 2021Academician of Chinese Academy of Engineering, Founder and Rotating Chairman of World Electric Vehicle Association, Chairman of Asia-Pacific Electric Vehicle Association. Appointed as Senior Strategic Advisor for Electric Vehicles and New Energy Industry to provide research direction and industrial strategy guidance.
• ABB SwitzerlandcoreTechnology or Integration · 1 March 2019ABB was the original employer and technology source for SwissSEM founders. SwissSEM CEO Roland Villiger previously served as ABB Vice President, and the company's technology is based on expertise developed at ABB semiconductor division. The company leverages ABB semiconductor heritage in its IGBT technology development.

Scale indicators9 records

Recent moves11 records

Expansion highlights7 records

Market position

Competitive moat5 records

Key risks6 records

Key highlights5 records

Customer concentration

• LinkedInlinkedin.com/company/swisssem-technologies-ag

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles10 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about SwissSEM Technologies