What Interflex does

Interflex Co., Ltd. (주식회사 인터플렉스) is a South Korea-based mobile component manufacturer founded in 1994 and headquartered in Ansan-si, Gyeonggi-do. The company designs and produces Flexible Printed Circuit Boards (FPCB), Rigid-Flex and Build-up FPCB, Touch Screen Panels (TSP) in GFF/G1F/GF1/GFD/GF2 capacitive configurations, surface-mount technology modules (SUB PBA, System FPCB for audio/I/O/home button), and proprietary automation equipment (press, plasma, sputter systems). Interflex's technology is anchored in a patented roll-to-roll FPCB manufacturing system, the in-house I-Soft raw material combined with a Semi-Additive Process (SAP) achieving 15µm pitch fine patterning, G-FAST thin-film EMI shielding, and emerging platforms in Flexible OLED, Printable FPCB, and Ag Nanowire flexible electrodes. The business serves consumer electronics OEMs (notably the Samsung group's Electronics, Electro-Mechanics, and SDI units, plus Lenovo, with Sony participation as a green-supply-chain partner) along with automotive electronics, lighting/LED, and medical device OEMs.

The company operates a tri-country manufacturing footprint spanning Korea (Ansan Smart Center headquarters), China (Tianjin), and Vietnam (Interflex Vina, Vinh Phuc Province). It is publicly listed on the Korea Stock Exchange and is part of the Young Poong Group (영풍), a diversified non-ferrous metals conglomerate, with Korea Circuit acting as controlling shareholder (approximately 47.7% as of December 2025). The revenue model is B2B hardware sales with project-based negotiated pricing; revenue streams span FPCB and Flex & R/F sales, TSP module sales, SUB PBA / System module sales, and automation equipment sales.

At the consolidated level, Interflex reported 2025 revenue of approximately KRW 467.9 billion (roughly USD $350M), down from KRW 497.5B in 2024 and KRW 438.2B in 2023. Total assets stood at KRW 401.8B and equity at KRW 317.9B at end-2025. The company holds ISO 14001 (since 2002), ISO 14064-1 (since 2013), ISO/TS 16949 automotive quality certification, and Authorized Economic Operator (AEO) status, alongside an extensive granted Korean patent portfolio covering core FPCB and TSP manufacturing methods.

Name

Interflex

Legal name

주식회사 인터플렉스 (Interflex Co., Ltd.)

Website

https://interflex.co.kr

Company type

Public

Founded year

1994

Operating status

Operating

Headcount range

251–500 employees

Short description

Interflex is a South Korean mobile component manufacturer founded in 1994, producing Flexible Printed Circuit Boards (FPCB), Touch Screen Panels (TSP), SMT modules, and proprietary automation equipment for global consumer electronics, automotive, lighting, and medical OEMs, with a Korean-China-Vietnam manufacturing footprint and anchor relationships across the Samsung group.

Ownership category

akta.pro rank

Product category

Flexible Printed Circuit Boards (FPCB) and Touch Screen Panels

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Printed Circuit Boards (3672)

akta.pro primary industry

PCB Fabrication (Flex & Rigid-Flex PCBs) (HDAHAOAH)

akta.pro secondary industries

Smartphone Components & Modules (Displays, Cameras, Batteries, Sensors, RF modules) (CRACALAD), Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK)

Keywords

• Flexible printed circuit boards
• Touch screen panels
• FPCB manufacturing
• Electronic component manufacturing
• Mobile component supply

Headquarters

HQ city

Ansan

HQ country

South Korea

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Personnel, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. FPCB and Flex & R/F Sales: Sale of flexible printed circuit boards including display, camera, cable, NFC antenna, battery, LED, and fingerprint sensor applications for smartphones, tablets, wearables, automotive, and other electronics.
2. Touch Screen Panel (TSP) Module Sales: Sale of complete TSP modules including GFF, G1F, GF1, GFD, and GF2 capacitive touch sensor configurations.
3. Module / SUB PBA Sales: Sale of surface-mount technology modules including SUB PBA (USB3.0, Touchkey, Key, SPK, various sensors) and System modules (Audio, I/O, Home Button).
4. Automation Equipment Sales: Sale of proprietary manufacturing equipment (press series, plasma systems, sputter systems, DC power supplies) developed from accumulated FPCB and TSP production expertise.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

Interflex manufactures Flexible Printed Circuit Boards (FPCB) and Touch Screen Panels (TSP) for smartphones, tablets, wearables, automotive electronics, and other compact devices. Product lines include Flex & R/F FPCBs (display, camera, cable, NFC, battery, LED, fingerprint sensor applications), SMT-based Module products (SUB PBA and System modules), TSP capacitive touch sensors in multiple configurations, and proprietary automation equipment for FPCB/TSP production. Manufacturing facilities are located in Korea (Ansan headquarters/Smart Center), China (Tianjin), and Vietnam (Vinh Phuc).

Product overview

Interflex is a Mobile Component company offering a portfolio of products centered on Flexible Printed Circuit Boards (FPCB) and Touch Screen Panels (TSP). The core offerings include: Flex & R/F (flexible printed circuit boards for display, camera, cable, LED applications), Module products (SMT-based sub modules and system modules), TSP (capacitive touch sensors in GFF/G1F/GF1/GFD/GF2 configurations), and Automation Equipment (press systems, plasma systems, sputter equipment). The company also develops specialized technologies including Fine Pattern (15um pitch SAP process), EMI Shielding (G-FAST), Printable FPCB, and Flexible OLED. Production facilities are located in Korea (Smart Center - headquarters), China (Tianjin), and Vietnam (Hanoi).

Differentiator

Problem solved

Functional benefit

Products and services

• Flex & R/F (Flexible Printed Circuit Board) Flexible Printed Circuit Boards applicable to various electronic devices. Types include Display FPCB (for AMOLED/LCD), Camera FPCB, Digitizer, Finger Print Sensor, Cable (PCB to PCB / Module to Module connection), TSP, and LED FPCB. Supports applications in smartphones, wearables, tablets, notebooks, navigation, automotive, lighting, displays, household appliances, OA, and medical devices.
• Module (SUB PBA / System Modules) Surface-mount technology (SMT) products including SUB PBA sub-modules (USB3.0, Touchkey, Key, SPK, various sensors built on FPCB / Rigid Flex substrates) and System FPCB modules (Audio, I/O, Home Button applications). Targeted at smartphone, wearable, and consumer electronics OEMs.
• TSP (Touch Screen Panel)
• Automation Equipment

Quantifiable outcome

• First mass production of Folder-type FPCB in Korea (1999)
• +3 more outcomes

Named customers1 record

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

Seven partnerships are on record, tiered minor, major and core.

• Korea Environment CorporationminorOthers · 1 January 2013ISO 14064-1 Greenhouse Gas Inventory certification issued by Korea Environment Corporation (2013), indicating compliance with greenhouse gas measurement and reporting standards.
• SonymajorStrategic or Co-development Partner · 1 January 2009Sony Green Partnership Agreement (2009). Interflex participates in Sony's green supply chain partner program, committing to environmental management standards.
• Samsung ElectronicscoreStrategic or Co-development Partner · 1 January 2007Samsung Electronics ECO Partnership Agreement (2007) and Samsung S-Partner certification. Interflex supplies FPCB and TSP components and receives environmental management support as part of Samsung's supply chain sustainability program.
• Samsung Electro-MechanicscoreStrategic or Co-development Partner · 1 January 2007Samsung Electro-Mechanics S-Partner certification (2007). Partnership for supply of FPCB components and modules to Samsung Electro-Mechanics.
• Samsung SDIcoreStrategic or Co-development Partner · 1 January 2007Samsung SDI S-Partner certification (2007). Partnership for FPCB and related component supply to Samsung SDI.
• KTLMS (Korea Testing Laboratory)minorOthers · 1 January 2002ISO 14001 certification body. KTLMS has been the certifying organization for Interflex's environmental management system since 2002.
• Young Poong Group (영풍)coreOthersInterflex is affiliated with Young Poong Group (영풍그룹). Korea Circuit (special relationship party) holds approximately 47.7% of Interflex shares as of December 2025. Young Poong Group also includes Korea Zinc, YP Electronics, Korea Circuit, Signetics, Terranix, and Young Poong Books.

Scale indicators3 records

Recent moves12 records

Expansion highlights5 records

Direct peers

• Zhen Ding Technology Holding: Taiwan-based, world's largest FPCB maker supplying smartphone, tablet, and wearable applications for major OEMs including Apple. Comparable as a direct competitor in flex PCB and rigid-flex PCBs serving consumer electronics brands.
• Nippon Mektron: Japanese FPCB manufacturer (Mektec Group), one of the largest globally, serving smartphones, automotive, and industrial applications. Closest analogue to Interflex in technology breadth (multi-layer, rigid-flex, fine-pitch).
• Flexium Interconnect: Taiwan-based FPCB supplier serving smartphone, tablet, and wearable OEMs with a comparable product mix (display, camera, antenna FPCBs). Directly competes with Interflex in consumer electronics flex PCB programs.
• Career Technology Co. (Mfg.): Taiwan-based manufacturer of flexible printed circuits and substrates for mobile devices, consumer electronics, and automotive applications. Directly comparable in FPCB technology and customer base overlap.
• Sumitomo Electric Industries (Flex Circuit Division): Japanese conglomerate with a significant FPCB division serving mobile, automotive, and industrial customers. Directly competes with Interflex on fine-pitch, high-reliability flex PCB, particularly for automotive applications.
• Daeduck Electronics: Korea-based manufacturer of PCBs including FPCB and rigid-flex, serving mobile and display customers in the same Korean OEM ecosystem as Interflex. Direct domestic peer competing for shared Samsung and LG programs.
• BH Electronics: Korean FPCB and touch sensor panel manufacturer serving smartphone and display customers. Closely comparable in TSP/GFF-type capacitive touch sensor technology and Korea-centric customer base.
• Tripod Technology: Taiwan-based manufacturer of PCBs including FPCB products for mobile phones and consumer electronics. Directly comparable in flexible circuit offerings serving Asian OEM supply chains.

Broad incumbents

• Samsung Electro-Mechanics: Korean electronic components giant producing MLCC, camera modules, package substrates, and rigid-flex PCBs. Partly vertical competitor and partly customer of Interflex; broader portfolio but overlapping FPCB technology.
• LG Innotek: Korean electronic components maker producing camera modules, substrates, and FPCB for smartphones. Broad incumbent with overlapping product portfolio and large customer overlap with display OEMs.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks4 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/interflex

Compliance8 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Interflex