Electronic Products (EPI)

What Electronic Products (EPI) does

Electronic Products Inc. (EPI), founded in 1960 and headquartered in Newburyport, Massachusetts, is a vertically integrated, powder-to-package manufacturer of hermetic microelectronic packages serving OEMs across military/aerospace, satellite, medical, industrial/energy, RF/microwave, and sensor applications. The company operates a 26,000 sq ft ISO 9001:2015-certified and ITAR-registered manufacturing facility, employing between 51 and 100 people. EPI was acquired in July 2022 by Douglas Electrical Components (Randolph, NJ), a manufacturer of epoxy-based hermetic feedthroughs, and continues to operate as a subsidiary with cross-selling and cross-training integration.

EPI's core technology rests on two platforms: High-Temperature Co-fired Ceramic (HTCC) multilayer circuits using aluminum nitride (AlN) fired at over 1800°C, achieving 4.5 ppm/°C coefficient of thermal expansion and 170-180 W/mK thermal conductivity; and glass-to-metal seals using compression and matched seals with CTE-matched materials (Kovar, ASTM-F15, ASTM-F30/Alloy 52). These technologies can be combined into hybrid hermetic packages. The product portfolio includes RF & Microwave Packages, Optical/Optoelectronic Packages, Power Discrete Packages, and TO Packages/Headers (TO-5, TO-8, TO-18, TO-39, TO-46). In-house capabilities span ceramic milling, tape casting, screen printing (Tungsten, Molybdenum/Manganese, dielectrics), lamination, firing up to 2100°C, clean room processing, electrolytic Nickel/Gold/Silver plating, tooling, and inspection.

The business model is B2B direct OEM sales with quote-based pricing determined by specifications, materials, layer count, customization, and volume. Revenue is generated through custom package manufacturing contracts and standard product sales, supported by technical consultation, prototyping, and testing services through application engineers. Distribution is direct only with no resellers or marketplaces; European customers are served through DEC Europe GmbH in Ratingen, Germany. Certifications including ITAR, ISO 9001:2015, DFARS, RoHS, REACH, and JEDEC compliance position the company for defense, aerospace, medical, and international markets.

Name

Electronic Products (EPI)

Legal name

Electronic Products Inc.

Website

https://epihermetics.com

Company type

Private

Founded year

1960

Operating status

Operating

Headcount range

51–100 employees

Short description

Electronic Products Inc. (EPI) is a vertically integrated, powder-to-package manufacturer of hermetic microelectronic packages using HTCC ceramic and glass-to-metal seal technologies. The company serves OEM customers in military/aerospace, satellite, medical, industrial/energy, and sensor markets from its Newburyport, MA facility.

Ownership category

akta.pro rank

Product category

Hermetic Microelectronic Packaging

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441), Electrical Equipment Manufacturing (33531)

SIC

Electronic Components, Nec (3679), Electronic & Other Electrical Equipment (No Computer Equip) (3600)

akta.pro primary industry

Ruggedized/Harsh-Environment Electronics Manufacturing (IP-rated, shock/vibration, wide-temp) (IMAGAGAF)

akta.pro secondary industry

Thermal & EMI/EMC Interconnect Materials (Shielding, Gaskets, Grounding) (HDAHAOAL)

Keywords

• Hermetic microelectronic packaging
• HTCC ceramic packages
• Glass-to-metal seals
• Transistor outline headers
• Optoelectronic hermetic packages

Headquarters

HQ city

Newburyport

HQ country

United States

HQ region

North America

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Operations, Personnel, Supply Chain, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. Custom Microelectronic Package Manufacturing: EPI generates revenue through the design and manufacture of custom and standard hermetic microelectronic packages for OEM applications. The company produces RF/Microwave packages, optical/optoelectronic packages, power discrete packages, and TO packages/headers. Revenue is generated through project-based manufacturing contracts with technical consultation, prototyping, and production phases. The vertically integrated manufacturing model allows cost control from powder to finished package.
2. Standard Package Products: Sale of standard hermetic package products including TO-5, TO-8, TO-18, TO-39, TO-46 headers and packages, and various RF/optical/power discrete packages. Supports legacy package requirements for discontinued or obsolete packages.
3. Engineering and Design Services: Technical sales support and application engineering services for custom package development, including consultation, design, prototyping, and testing to ensure highest performance standards.

Pricing tiers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

EPI designs and manufactures custom and standard hermetic microelectronic packages for OEM customers requiring protection of sensitive electronic components in harsh environments. The company uses High-Temperature Co-fired Ceramic (HTCC) multilayer ceramic circuits and glass-to-metal seal technologies, with the ability to combine both into hybrid hermetic packages. Product lines include RF & Microwave Packages, Optical/Optoelectronic Packages, Power Discrete Packages, and TO Packages & Headers, applied across military/aerospace, satellite, medical, industrial/energy, and sensor markets.

Product overview

Electronic Products (EPI) is a vertically integrated, powder-to-package manufacturer of microelectronic hermetic packages and sealing solutions. The company's product portfolio centers on four core product lines: RF & Microwave Packages for military, aerospace, and satellite communications; Optical / Optoelectronic Packages for VCSEL, LEDs, and imaging applications; Power Discrete Packages featuring HTCC ceramic technology for high-power applications; and TO Packages & Headers encompassing TO-5, TO-8, TO-18, TO-39, and TO-46 transistor outline packages. These products are built on two technology platforms—High-Temperature Cofired Ceramic (HTCC) and Glass-to-Metal Seals—which are applied across targeted application solutions including Thermal Imaging, Industrial & Energy, Medical, Military and Aerospace, Satellite, and Sensors & Instrumentation sectors.

Differentiator

Problem solved

Functional benefit

Products and services

• RF & Microwave Packages

Quantifiable outcome

• Low Coefficient of Thermal Expansion (CTE) of 4.5 ppm/°C matched to Tungsten and Silicon
• +3 more outcomes

Segments7 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

One partnership is on record.

• Douglas Electrical ComponentscoreOthers · 1 July 2022In July 2022, EPI was acquired by Douglas Electrical Components, based in Randolph, NJ. Douglas Electrical is a leading manufacturer of hermetic electrical feedthrough and connectivity solutions using epoxy-based technology. The acquisition brought together complementary hermetic sealing technologies (ceramic/glass-to-metal from EPI and epoxy from Douglas), creating a broader portfolio of capabilities for attributes such as pressure, temperature, mechanical packaging, size, density, and power. EPI continues to operate as a subsidiary with cross-training, partnering, and advancement opportunities with the parent company.

Scale indicators4 records

Recent moves6 records

Expansion highlights5 records

Direct peers

• Hermetic Solutions Group: Multi-brand manufacturer of hermetic packages, headers, and feedthroughs (including Sintech, Specialty Hermetics). Competes with EPI across glass-to-metal seals, ceramic packaging, and headers for defense, aerospace, and medical markets.
• Egide: French-headquartered specialist in hermetic packages for microelectronics serving military, aerospace, and space markets with RF/microwave, optoelectronic, and power packages. Direct competitor to EPI in custom hermetic microelectronic packaging, particularly for high-reliability applications.

Broad incumbents

• CoorsTek: Global technical ceramics manufacturer supplying ceramic substrates, packages, and engineered components. Competes with EPI in HTCC ceramic packaging and precision ceramic components for industrial, defense, and semiconductor capital equipment.
• Schott AG: Global specialty materials giant producing glass-to-metal seals, hermetic feedthroughs, and ceramic packages among its broad portfolio. Competes with EPI in glass-to-metal sealing technology and is a leading supplier into defense and semiconductor equipment end markets.
• Kyocera: Large Japanese ceramics and electronics conglomerate producing ceramic packages, substrates, and electronic components. Competes with EPI in ceramic packaging and substrates for RF, power, and optoelectronic applications across industrial and semiconductor markets.
• Quantic Electronics: Private-equity-owned portfolio of specialty electronics businesses (including hermetic packaging, RF/microwave, and packaging firms such as Quantic ECI and others). Competes with EPI in custom hermetic and high-reliability microelectronics packaging for defense/aerospace.
• Ametek (Electronic & Engineered Materials Solutions): Diversified industrial manufacturer with electronic components and engineered materials businesses producing hermetic packaging, feedthroughs, and specialty electronic assemblies. Competes with EPI in hermetic interconnect and packaging for defense and aerospace.
• Materion Corporation: Specialty materials supplier producing beryllium-based and other advanced materials used in hermetic packages, headers, and microelectronic enclosures. Adjacent peer supplying materials and components overlapping with EPI's packaging applications.

Others

• Douglas Electrical Components: Parent company of EPI (acquired July 2022), specializing in epoxy-based hermetic electrical feedthroughs and connectivity. Related through ownership and complementary hermetic sealing technologies that broaden the combined portfolio.

Emerging players

• Winchester Interconnect / Kings Electronics (HEICO): HEICO-owned specialty connector and hermetic interconnect manufacturer producing hermetic feedthroughs, headers, and packaging solutions. Competes with EPI in hermetic interconnect and packaging for military, aerospace, and space applications.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance6 records

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Electronic Products (EPI)