Thin Film Equipment
Founded in 1996 in Binasco, Italy, Thin Film Equipment (TFE) is a Plasma-Therm subsidiary that manufactures sputtering, evaporation, PVD, and PECVD deposition systems for semiconductor R&D and production customers across MEMS, power devices, photonics, and RFID end-markets worldwide.
- Company typePrivate
- Founded1996
- HeadquartersBinasco, Italy
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
What Thin Film Equipment does
Thin Film Equipment SRL (TFE) is an Italy-based, privately held thin film deposition equipment manufacturer, founded in 1996 in Binasco and operating as a subsidiary of Plasma-Therm. The company designs and sells capital equipment used in semiconductor R&D and production environments, with a portfolio built around three core deposition modalities — sputtering, evaporation, and PVD (Physical Vapor Deposition) — augmented by Plasma-Enhanced Chemical Vapor Deposition (PECVD) via the Shuttleline platform and plasma-based wafer dicing through the MDS-100. Promoted technologies include the Shuttleline Platform PECVD for thin-film processing and the MDS-100 plasma dicing system, with the company emphasizing high-purity materials, accuracy/precision, and process stability.
TFE serves semiconductor R&D facilities, volume semiconductor manufacturers, and adjacent microelectronics segments including MEMS, power devices, photonics, and RFID. Sales are conducted through direct enterprise engagement with application-specific customization and process consultation, with pricing conducted on a quote basis under multi-year arrangements typical for capital tools. Distribution relies entirely on direct sales, with no third-party channel or reseller model indicated.
The company is supported by Plasma-Therm's global infrastructure, including a US presence in Saint Petersburg, Florida that handles commercial and customer-support contact points. Marketing is light, centered on a corporate blog/news section, a customer portal, and an active LinkedIn presence. There is no public financial disclosure: no revenue, headcount, funding, or profit figure is available in the input data, and the company has no public ticker or independent ownership structure outside its parent.
Thin Film Equipment firmographics
Firmographics- Name
- Thin Film Equipment
- Legal name
- Thin Film Equipment SRL
- Website
- https://thinfilmequipment.net
- Company type
- Private
- Founded year
- 1996
- Operating status
- Operating
- Headcount range
- 11–50 employees
- Short description
- Founded in 1996 in Binasco, Italy, Thin Film Equipment (TFE) is a Plasma-Therm subsidiary that manufactures sputtering, evaporation, PVD, and PECVD deposition systems for semiconductor R&D and production customers across MEMS, power devices, photonics, and RFID end-markets worldwide.
- Ownership category
- akta.pro rank
Thin Film Equipment industry classification
Industry- Product category
- Semiconductor Capital Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- SIC
- Electronic Components, Nec (3679)
- akta.pro primary industry
- Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)
Keywords
Where Thin Film Equipment is headquartered
LocationHeadquarters
- HQ city
- Binasco
- HQ country
- Italy
- HQ region
- Europe
Offices2 records
Markets served
Thin Film Equipment business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Supply Chain, Technology or R&D, Personnel, Operations, Marketing or Sales
Revenue model
- Thin Film Equipment Sales: Sale of capital equipment systems including sputtering, evaporation, and PECVD systems for semiconductor R&D and production. Equipment is sold to research institutions and manufacturers with customization and process support services.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Custom equipment solutions with expert consultation |
Go-to-market motion1 record
Distribution channels1 record
Marketing channels3 records
Thin Film Equipment product offering
Product offeringCore offering
Thin Film Equipment manufactures and sells advanced thin film deposition capital equipment, including sputtering, evaporation, and PVD systems, the Shuttleline Platform PECVD system, and the MDS-100 plasma dicing system. The company supplies customized process solutions with high-purity materials to semiconductor R&D facilities, production manufacturers, and research institutions serving MEMS, power devices, RFID, photonics, and advanced packaging applications.
Product overview
Thin Film Equipment (TFE), a Plasma-Therm company, offers a portfolio of thin film deposition and processing equipment for semiconductor R&D and production. The company provides sputtering, evaporation, and PVD (Physical Vapor Deposition) solutions. Key products include the Shuttleline Platform PECVD system for thin-film deposition and the MDS-100 plasma dicing system. These solutions serve advanced markets including MEMS, power devices, RFID, photonics, sensors, and next-generation microelectronic devices for applications in semiconductor manufacturing and healthcare.
Differentiator
Problem solved
Functional benefit
Products and services
- Shuttleline Platform PECVD Plasma-Enhanced Chemical Vapor Deposition (PECVD) system designed for thin-film deposition processing in semiconductor manufacturing and R&D applications.
- MDS-100 Plasma Dicing System Plasma dicing system for semiconductor wafer processing, enabling precision cutting and singulation of semiconductor devices.
Companies that use Thin Film Equipment
Customer profileNamed customers1 record
Segments6 records
Ideal customer profiles2 records
Thin Film Equipment technology and API
TechnologyTechnology focussed No
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature5 records
Thin Film Equipment partnerships and signals
Strategic signalPartnerships
One partnership is on record.
- Plasma-ThermcoreThin Film Equipment is a Plasma-Therm company, operating as a subsidiary or brand within the Plasma-Therm family. Plasma-Therm reflects on 2025 innovation, growth, and expanding global presence. Technologies and partnerships empower customers and research institutions to advance semiconductor and healthcare applications.
Scale indicators2 records
Recent moves3 records
Expansion highlights4 records
Thin Film Equipment competitors and assessment
Company assessmentDirect peers
- SPTS Technologies (KLA): Direct peer in plasma etch and PVD/CVD deposition equipment for MEMS, power devices, photonics, and advanced packaging. Now part of KLA, SPTS overlaps with TFE's core product portfolio and target markets.
- Veeco Instruments: Direct peer in thin film deposition equipment (PVD, MBE, MOCVD/ALD). Both target MEMS, photonics, RF/power device, and advanced packaging applications with similar process technologies and customer profiles.
- Oxford Instruments Plasma Technology: Direct peer in plasma-based deposition and etch equipment for semiconductor R&D and specialty production. Competes head-to-head with TFE in sputtering, PECVD, and plasma etch systems serving research institutions and niche MEMS/photonics markets.
- Evatec: Direct peer specializing in thin film deposition systems (sputtering, PECVD, evaporation) for advanced packaging, MEMS, photonics, and power semiconductor applications. Closely comparable in product scope and target segments.
- SENTECH Instruments: Direct peer in plasma-enhanced deposition (PECVD) and etching equipment for semiconductor R&D and specialty production. Competes with TFE particularly in research, MEMS, and optoelectronics segments.
Broad incumbents
- Applied Materials: Broad incumbent dominating semiconductor PVD, CVD, and PECVD equipment. Competes with TFE in advanced packaging and specialty deposition, though Applied Materials focuses on high-volume leading-edge fabs while TFE focuses on R&D and specialty production.
- ULVAC: Broad incumbent in vacuum and thin film deposition equipment (sputtering, evaporation, CVD). Overlaps with TFE in PVD/sputtered films for semiconductor and electronics applications, though ULVAC serves a much broader industrial base.
- Tokyo Electron (TEL): Broad incumbent in semiconductor coating/developing and etch systems. Overlaps with TFE in deposition and singulation equipment, with global reach across logic, memory, and specialty semiconductor fabs.
- Lam Research: Broad incumbent in semiconductor etch and deposition equipment, with strong overlap in PECVD and emerging ALD. Competes with TFE in specialty deposition as well as the MDS-100 plasma dicing adjacency.
Emerging players
- Aixtron: Specialized MOCVD deposition equipment vendor serving compound semiconductor, photonics, and power electronics end markets. Adjacent to TFE's specialty semiconductor focus, with comparable customer profile but different deposition chemistry.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat4 records
Key risks5 records
Key highlights6 records
Customer concentration
Thin Film Equipment social profiles
Digital presenceThin Film Equipment financial estimates
Financial estimateRevenue estimate
Valuation estimate
Thin Film Equipment leadership team
Management profileNumber of profiles
Thin Film Equipment funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Thin Film Equipment M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Thin Film Equipment
What does Thin Film Equipment do?
Thin Film Equipment manufactures and sells advanced thin film deposition capital equipment, including sputtering, evaporation, and PVD systems, the Shuttleline Platform PECVD system, and the MDS-100 plasma dicing system. The company supplies customized process solutions with high-purity materials to semiconductor R&D facilities, production manufacturers, and research institutions serving MEMS, power devices, RFID, photonics, and advanced packaging applications.
Is Thin Film Equipment a public or private company?
Thin Film Equipment is a private company. It is classified as corporate owned and is currently operating.
When was Thin Film Equipment founded?
Thin Film Equipment was founded in 1996. It employs 11 to 50 people.
Where is Thin Film Equipment based?
Thin Film Equipment is headquartered in Binasco, Italy, in the Europe region.
How does Thin Film Equipment make money?
One revenue line is on record: thin Film Equipment Sales.
Who are Thin Film Equipment's main competitors?
Direct peers on record are SPTS Technologies (KLA), Veeco Instruments, Oxford Instruments Plasma Technology, Evatec and SENTECH Instruments. Broad incumbents are Applied Materials, ULVAC, Tokyo Electron (TEL) and Lam Research. Aixtron is listed as an emerging player.
Does Thin Film Equipment have an API?
No public API is recorded for Thin Film Equipment.
What industry is Thin Film Equipment in?
Thin Film Equipment's product category is Semiconductor Capital Equipment. Its primary akta.pro industry code is HDAHAEAB, Deposition Equipment (CVD/PVD/ALD/Epitaxy). Its NAICS code is 333242 and its SIC code is 3679.