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Thin Film Equipment

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uuid000vqrd

Namestring
Thin Film Equipment
Legal namestring
Thin Film Equipment SRL
Company typeenum
Private
Founded yearint
1996
Descriptiontext

Thin Film Equipment SRL (TFE) is an Italy-based, privately held thin film deposition equipment manufacturer, founded in 1996 in Binasco and operating as a subsidiary of Plasma-Therm. The company designs and sells capital equipment used in semiconductor R&D and production environments, with a portfolio built around three core deposition modalities — sputtering, evaporation, and PVD (Physical Vapor Deposition) — augmented by Plasma-Enhanced Chemical Vapor Deposition (PECVD) via the Shuttleline platform and plasma-based wafer dicing through the MDS-100. Promoted technologies include the Shuttleline Platform PECVD for thin-film processing and the MDS-100 plasma dicing system, with the company emphasizing high-purity materials, accuracy/precision, and process stability.

TFE serves semiconductor R&D facilities, volume semiconductor manufacturers, and adjacent microelectronics segments including MEMS, power devices, photonics, and RFID. Sales are conducted through direct enterprise engagement with application-specific customization and process consultation, with pricing conducted on a quote basis under multi-year arrangements typical for capital tools. Distribution relies entirely on direct sales, with no third-party channel or reseller model indicated.

The company is supported by Plasma-Therm's global infrastructure, including a US presence in Saint Petersburg, Florida that handles commercial and customer-support contact points. Marketing is light, centered on a corporate blog/news section, a customer portal, and an active LinkedIn presence. There is no public financial disclosure: no revenue, headcount, funding, or profit figure is available in the input data, and the company has no public ticker or independent ownership structure outside its parent.

Short descriptiontext

Founded in 1996 in Binasco, Italy, Thin Film Equipment (TFE) is a Plasma-Therm subsidiary that manufactures sputtering, evaporation, PVD, and PECVD deposition systems for semiconductor R&D and production customers across MEMS, power devices, photonics, and RFID end-markets worldwide.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
11–50
akta.pro rankint
HeadquartersBinasco, Italy
HQ citystring
Binasco
HQ countrystring
Italy
HQ regionstring
Europe
Markets served

Serves global market

Offices2 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
thin film deposition equipment, sputtering systems, evaporation systems, PECVD systems, semiconductor manufacturing equipment
Industry1 code
1Deposition Equipment (CVD/PVD/ALD/Epitaxy)
CodeHDAHAEABPrimaryYes
NAICS code1 code
  • Semiconductor Machinery Manufacturing333242
SIC code1 code
  • Electronic Components, Nec3679
Product category
Semiconductor Capital Equipment
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model1 record
1Thin Film Equipment Sales
TypeHardware Sales
Description

Sale of capital equipment systems including sputtering, evaporation, and PECVD systems for semiconductor R&D and production. Equipment is sold to research institutions and manufacturers with customization and process support services.

thinfilmequipment.com
Marketing channels3 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels1 record

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components5 values
Supply Chain, Technology or R&D, Personnel, Operations, Marketing or Sales
Pricing details1 tier
1Custom equipment solutions with expert consultation
ModelOtherBilling cadenceMulti-year contract
Notes

Quote-based / Not publicly disclosed. Equipment is customized per application requirements.

thinfilmequipment.com
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Core offering1 text field

Thin Film Equipment manufactures and sells advanced thin film deposition capital equipment, including sputtering, evaporation, and PVD systems, the Shuttleline Platform PECVD system, and the MDS-100 plasma dicing system. The company supplies customized process solutions with high-purity materials to semiconductor R&D facilities, production manufacturers, and research institutions serving MEMS, power devices, RFID, photonics, and advanced packaging applications.

Differentiator
Functional benefit
Problem solved
Product overview1 text field

Thin Film Equipment (TFE), a Plasma-Therm company, offers a portfolio of thin film deposition and processing equipment for semiconductor R&D and production. The company provides sputtering, evaporation, and PVD (Physical Vapor Deposition) solutions. Key products include the Shuttleline Platform PECVD system for thin-film deposition and the MDS-100 plasma dicing system. These solutions serve advanced markets including MEMS, power devices, RFID, photonics, sensors, and next-generation microelectronic devices for applications in semiconductor manufacturing and healthcare.

Product and service2 records
1Shuttleline Platform PECVD
CategoryThin Film Deposition Equipment
Description

Plasma-Enhanced Chemical Vapor Deposition (PECVD) system designed for thin-film deposition processing in semiconductor manufacturing and R&D applications.

2MDS-100 Plasma Dicing System
CategorySemiconductor Wafer Processing Equipment
Description

Plasma dicing system for semiconductor wafer processing, enabling precision cutting and singulation of semiconductor devices.

Scale indicator2 records

Each record includes

Type, Value, Description, Source

Partnership1 partner
Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2026-01-09
Description

Thin Film Equipment is a Plasma-Therm company, operating as a subsidiary or brand within the Plasma-Therm family. Plasma-Therm reflects on 2025 innovation, growth, and expanding global presence. Technologies and partnerships empower customers and research institutions to advance semiconductor and healthcare applications.

Recent move3 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight4 records

Each record includes

Type, Description

Peers10 records
TypeDirect peer
Description

Direct peer in plasma etch and PVD/CVD deposition equipment for MEMS, power devices, photonics, and advanced packaging. Now part of KLA, SPTS overlaps with TFE's core product portfolio and target markets.

TypeDirect peer
Description

Direct peer in thin film deposition equipment (PVD, MBE, MOCVD/ALD). Both target MEMS, photonics, RF/power device, and advanced packaging applications with similar process technologies and customer profiles.

TypeBroad incumbent
Description

Broad incumbent dominating semiconductor PVD, CVD, and PECVD equipment. Competes with TFE in advanced packaging and specialty deposition, though Applied Materials focuses on high-volume leading-edge fabs while TFE focuses on R&D and specialty production.

TypeDirect peer
Description

Direct peer in plasma-based deposition and etch equipment for semiconductor R&D and specialty production. Competes head-to-head with TFE in sputtering, PECVD, and plasma etch systems serving research institutions and niche MEMS/photonics markets.

TypeBroad incumbent
Description

Broad incumbent in vacuum and thin film deposition equipment (sputtering, evaporation, CVD). Overlaps with TFE in PVD/sputtered films for semiconductor and electronics applications, though ULVAC serves a much broader industrial base.

TypeEmerging player
Description

Specialized MOCVD deposition equipment vendor serving compound semiconductor, photonics, and power electronics end markets. Adjacent to TFE's specialty semiconductor focus, with comparable customer profile but different deposition chemistry.

TypeBroad incumbent
Description

Broad incumbent in semiconductor coating/developing and etch systems. Overlaps with TFE in deposition and singulation equipment, with global reach across logic, memory, and specialty semiconductor fabs.

TypeDirect peer
Description

Direct peer specializing in thin film deposition systems (sputtering, PECVD, evaporation) for advanced packaging, MEMS, photonics, and power semiconductor applications. Closely comparable in product scope and target segments.

TypeDirect peer
Description

Direct peer in plasma-enhanced deposition (PECVD) and etching equipment for semiconductor R&D and specialty production. Competes with TFE particularly in research, MEMS, and optoelectronics segments.

TypeBroad incumbent
Description

Broad incumbent in semiconductor etch and deposition equipment, with strong overlap in PECVD and emerging ALD. Competes with TFE in specialty deposition as well as the MDS-100 plasma dicing adjacency.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat4 records

Each record includes

Type, Details

Key risks5 records

Each record includes

Headline, Details, Source

Key highlights6 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers1 record

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment6 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile2 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
No
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature5 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
No data
No data
Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Thin Film Equipment

Semiconductor Capital Equipmentthinfilmequipment.net

Founded in 1996 in Binasco, Italy, Thin Film Equipment (TFE) is a Plasma-Therm subsidiary that manufactures sputtering, evaporation, PVD, and PECVD deposition systems for semiconductor R&D and production customers across MEMS, power devices, photonics, and RFID end-markets worldwide.

What Thin Film Equipment does

Thin Film Equipment SRL (TFE) is an Italy-based, privately held thin film deposition equipment manufacturer, founded in 1996 in Binasco and operating as a subsidiary of Plasma-Therm. The company designs and sells capital equipment used in semiconductor R&D and production environments, with a portfolio built around three core deposition modalities — sputtering, evaporation, and PVD (Physical Vapor Deposition) — augmented by Plasma-Enhanced Chemical Vapor Deposition (PECVD) via the Shuttleline platform and plasma-based wafer dicing through the MDS-100. Promoted technologies include the Shuttleline Platform PECVD for thin-film processing and the MDS-100 plasma dicing system, with the company emphasizing high-purity materials, accuracy/precision, and process stability.

TFE serves semiconductor R&D facilities, volume semiconductor manufacturers, and adjacent microelectronics segments including MEMS, power devices, photonics, and RFID. Sales are conducted through direct enterprise engagement with application-specific customization and process consultation, with pricing conducted on a quote basis under multi-year arrangements typical for capital tools. Distribution relies entirely on direct sales, with no third-party channel or reseller model indicated.

The company is supported by Plasma-Therm's global infrastructure, including a US presence in Saint Petersburg, Florida that handles commercial and customer-support contact points. Marketing is light, centered on a corporate blog/news section, a customer portal, and an active LinkedIn presence. There is no public financial disclosure: no revenue, headcount, funding, or profit figure is available in the input data, and the company has no public ticker or independent ownership structure outside its parent.

Thin Film Equipment firmographics

Firmographics
Name
Thin Film Equipment
Legal name
Thin Film Equipment SRL
Website
https://thinfilmequipment.net
Company type
Private
Founded year
1996
Operating status
Operating
Headcount range
11–50 employees
Short description
Founded in 1996 in Binasco, Italy, Thin Film Equipment (TFE) is a Plasma-Therm subsidiary that manufactures sputtering, evaporation, PVD, and PECVD deposition systems for semiconductor R&D and production customers across MEMS, power devices, photonics, and RFID end-markets worldwide.
Ownership category
akta.pro rank

Thin Film Equipment industry classification

Industry
Product category
Semiconductor Capital Equipment
NAICS
Semiconductor Machinery Manufacturing (333242)
SIC
Electronic Components, Nec (3679)
akta.pro primary industry
Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)

Keywords

  • Thin film deposition equipment
  • Sputtering systems
  • Evaporation systems
  • PECVD systems
  • Semiconductor manufacturing equipment

Where Thin Film Equipment is headquartered

Location

Headquarters

HQ city
Binasco
HQ country
Italy
HQ region
Europe

Offices2 records

Markets served

Thin Film Equipment business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Supply Chain, Technology or R&D, Personnel, Operations, Marketing or Sales

Revenue model

  1. Thin Film Equipment Sales: Sale of capital equipment systems including sputtering, evaporation, and PECVD systems for semiconductor R&D and production. Equipment is sold to research institutions and manufacturers with customization and process support services.

Pricing tiers

ModelBillingPrice
OtherMulti-year contractCustom equipment solutions with expert consultation

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Thin Film Equipment product offering

Product offering

Core offering

Thin Film Equipment manufactures and sells advanced thin film deposition capital equipment, including sputtering, evaporation, and PVD systems, the Shuttleline Platform PECVD system, and the MDS-100 plasma dicing system. The company supplies customized process solutions with high-purity materials to semiconductor R&D facilities, production manufacturers, and research institutions serving MEMS, power devices, RFID, photonics, and advanced packaging applications.

Product overview

Thin Film Equipment (TFE), a Plasma-Therm company, offers a portfolio of thin film deposition and processing equipment for semiconductor R&D and production. The company provides sputtering, evaporation, and PVD (Physical Vapor Deposition) solutions. Key products include the Shuttleline Platform PECVD system for thin-film deposition and the MDS-100 plasma dicing system. These solutions serve advanced markets including MEMS, power devices, RFID, photonics, sensors, and next-generation microelectronic devices for applications in semiconductor manufacturing and healthcare.

Differentiator

Problem solved

Functional benefit

Products and services

  • Shuttleline Platform PECVD Plasma-Enhanced Chemical Vapor Deposition (PECVD) system designed for thin-film deposition processing in semiconductor manufacturing and R&D applications.
  • MDS-100 Plasma Dicing System Plasma dicing system for semiconductor wafer processing, enabling precision cutting and singulation of semiconductor devices.

Companies that use Thin Film Equipment

Customer profile

Named customers1 record

Segments6 records

Ideal customer profiles2 records

Thin Film Equipment technology and API

Technology

Technology focussed No

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature5 records

Thin Film Equipment partnerships and signals

Strategic signal

Partnerships

One partnership is on record.

  • Plasma-ThermcoreStrategic or Co-development Partner · 9 January 2026Thin Film Equipment is a Plasma-Therm company, operating as a subsidiary or brand within the Plasma-Therm family. Plasma-Therm reflects on 2025 innovation, growth, and expanding global presence. Technologies and partnerships empower customers and research institutions to advance semiconductor and healthcare applications.

Scale indicators2 records

Recent moves3 records

Expansion highlights4 records

Thin Film Equipment competitors and assessment

Company assessment

Direct peers

  • SPTS Technologies (KLA): Direct peer in plasma etch and PVD/CVD deposition equipment for MEMS, power devices, photonics, and advanced packaging. Now part of KLA, SPTS overlaps with TFE's core product portfolio and target markets.
  • Veeco Instruments: Direct peer in thin film deposition equipment (PVD, MBE, MOCVD/ALD). Both target MEMS, photonics, RF/power device, and advanced packaging applications with similar process technologies and customer profiles.
  • Oxford Instruments Plasma Technology: Direct peer in plasma-based deposition and etch equipment for semiconductor R&D and specialty production. Competes head-to-head with TFE in sputtering, PECVD, and plasma etch systems serving research institutions and niche MEMS/photonics markets.
  • Evatec: Direct peer specializing in thin film deposition systems (sputtering, PECVD, evaporation) for advanced packaging, MEMS, photonics, and power semiconductor applications. Closely comparable in product scope and target segments.
  • SENTECH Instruments: Direct peer in plasma-enhanced deposition (PECVD) and etching equipment for semiconductor R&D and specialty production. Competes with TFE particularly in research, MEMS, and optoelectronics segments.

Broad incumbents

  • Applied Materials: Broad incumbent dominating semiconductor PVD, CVD, and PECVD equipment. Competes with TFE in advanced packaging and specialty deposition, though Applied Materials focuses on high-volume leading-edge fabs while TFE focuses on R&D and specialty production.
  • ULVAC: Broad incumbent in vacuum and thin film deposition equipment (sputtering, evaporation, CVD). Overlaps with TFE in PVD/sputtered films for semiconductor and electronics applications, though ULVAC serves a much broader industrial base.
  • Tokyo Electron (TEL): Broad incumbent in semiconductor coating/developing and etch systems. Overlaps with TFE in deposition and singulation equipment, with global reach across logic, memory, and specialty semiconductor fabs.
  • Lam Research: Broad incumbent in semiconductor etch and deposition equipment, with strong overlap in PECVD and emerging ALD. Competes with TFE in specialty deposition as well as the MDS-100 plasma dicing adjacency.

Emerging players

  • Aixtron: Specialized MOCVD deposition equipment vendor serving compound semiconductor, photonics, and power electronics end markets. Adjacent to TFE's specialty semiconductor focus, with comparable customer profile but different deposition chemistry.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks5 records

Key highlights6 records

Customer concentration

Thin Film Equipment social profiles

Digital presence

Thin Film Equipment financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Thin Film Equipment leadership team

Management profile

Number of profiles

Thin Film Equipment funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Thin Film Equipment M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Thin Film Equipment

What does Thin Film Equipment do?

Thin Film Equipment manufactures and sells advanced thin film deposition capital equipment, including sputtering, evaporation, and PVD systems, the Shuttleline Platform PECVD system, and the MDS-100 plasma dicing system. The company supplies customized process solutions with high-purity materials to semiconductor R&D facilities, production manufacturers, and research institutions serving MEMS, power devices, RFID, photonics, and advanced packaging applications.

Is Thin Film Equipment a public or private company?

Thin Film Equipment is a private company. It is classified as corporate owned and is currently operating.

When was Thin Film Equipment founded?

Thin Film Equipment was founded in 1996. It employs 11 to 50 people.

Where is Thin Film Equipment based?

Thin Film Equipment is headquartered in Binasco, Italy, in the Europe region.

How does Thin Film Equipment make money?

One revenue line is on record: thin Film Equipment Sales.

Who are Thin Film Equipment's main competitors?

Direct peers on record are SPTS Technologies (KLA), Veeco Instruments, Oxford Instruments Plasma Technology, Evatec and SENTECH Instruments. Broad incumbents are Applied Materials, ULVAC, Tokyo Electron (TEL) and Lam Research. Aixtron is listed as an emerging player.

Does Thin Film Equipment have an API?

No public API is recorded for Thin Film Equipment.

What industry is Thin Film Equipment in?

Thin Film Equipment's product category is Semiconductor Capital Equipment. Its primary akta.pro industry code is HDAHAEAB, Deposition Equipment (CVD/PVD/ALD/Epitaxy). Its NAICS code is 333242 and its SIC code is 3679.

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Live signals
GlobeNewswirePlasma-Therm Announces Acquisition of Thin Film Equipment SrLPlasma-Therm acquired Thin Film Equipment SrL (TFE) effective September 18, 2023. The acquisition expands Plasma-Therm's European footprint and adds PVD tools for power device applications. TFE will continue operating independently while combining with Plasma-Therm's plasma technology.PlasmathermPlasma-Therm Announces Acquisition of Thin Film Equipment SrLPlasma-Therm announced the acquisition of Thin Film Equipment Srl (TFE), effective September 18, 2023, to expand its footprint in Europe and enhance its portfolio in the power device market. The deal integrates TFE’s physical vapor deposition technologies with Plasma-Therm’s existing solutions, aiming to capture growth in the power semiconductor sector projected to reach $6.3 billion by 2027.Semiconductor DigestPlasma-Therm Announces Acquisition of Thin Film Equipment SrLPlasma-Therm announced the acquisition of Thin Film Equipment SrL (TFE), effective September 18, 2023, to expand its European footprint and power device portfolio. The deal integrates TFE's physical vapor deposition technologies with Plasma-Therm's existing solutions to target the growing power semiconductor market.CB InsightsThin Film Equipment Stock Price, Funding, Valuation, Revenue & Financial StatementsPlasma-Therm acquired Thin Film Equipment on September 18, 2023. The acquisition details regarding the specific financial amount were not disclosed in the available data. Thin Film Equipment is a corporation based in Florida.