Developer docs
API playgroundTry for free, no card

Search company profiles

Shikino High Tech

Full company profile

uuid000zyzv

Namestring
Shikino High Tech
Legal namestring
株式会社 シキノハイテック
Websiteurl
shikino.co.jp
Company typeenum
Public
Founded yearint
1975
Descriptiontext

Shikino High Tech Co., Ltd. (株式会社シキノハイテック, TSE Standard: 6614) is a Japanese electronics company founded in 1975 and headquartered in Uozu-shi, Toyama, with 251-500 employees. The company operates six core product lines: industrial embedded camera modules, image processing cameras for inspection, proprietary IP cores (JPEG/MIPI/ISP), semiconductor back-end test equipment (burn-in systems, analog IC testers, open-short-leakage testers, source measure units), Nessum (IEEE1901-2020 compliant) power-line communication modules, and the C-AID non-contact radar-plus-camera monitoring system for healthcare facilities. Its core technology stack originates from LSI design work begun in 1987 and includes an extensive proprietary IP catalog spanning JPEG compression formats (including JPEG XL), MIPI CSI-2/DSI interfaces, and image signal processing cores.

Short descriptiontext

Shikino High Tech is a Japanese electronics company that designs and manufactures industrial embedded cameras, proprietary image-compression and interface IP cores, semiconductor back-end test equipment, Nessum power-line communication modules, and the C-AID radar-camera healthcare monitoring system for industrial OEMs, semiconductor firms, and care facilities.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
251–500
akta.pro rankint
HeadquartersToyama, Japan
HQ citystring
Toyama
HQ countrystring
Japan
HQ regionstring
Asia
Markets served

Serves global market

Offices11 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
embedded camera modules, semiconductor testing equipment, image compression IP cores, power line communication modules, LSI design services
Industry5 codes
1Audio, Imaging & Multimedia SoCs (ISP/Codec/Display)
CodeHDAHABAHPrimaryYes
2Sensors, MEMS & Imaging ICs
CodeHDAHAAAGPrimaryNo
3Test, Measurement & Calibration Equipment Manufacturing Services (ATE, DAQ, metrology electronics)
CodeIMAGAGAHPrimaryNo
4Sensor Fusion, Interface ICs & Modules (AFE/Readout/Packaging/Calibration)
CodeHDAHALAOPrimaryNo
5Embedded & HMI Electronics Manufacturing (Industrial PCs, HMIs, Panel PCs)
CodeIMAGAGADPrimaryNo
NAICS code4 codes
  • Semiconductor Machinery Manufacturing333242
  • Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals334515
  • Electromedical and Electrotherapeutic Apparatus Manufacturing334510
  • Semiconductor and Other Electronic Component Manufacturing33441
SIC code3 codes
  • Instruments For Meas & Testing Of Electricity & Elec Signals3825
  • Industrial Instruments For Measurement, Display, And Control3823
  • Electronic & Other Electrical Equipment (No Computer Equip)3600
Product category
Industrial Cameras and Semiconductor Test Equipment
GTM motion3 records

Each record includes

Type, Description, Source

Revenue model6 records
1Industrial Camera Modules
TypeHardware Sales
Description

Sale of embedded cameras for industrial use, image processing cameras, and custom/semi-custom camera solutions for various applications including ATMs, vending machines, biometric systems, and robotics.

shikino.co.jp
2IP Core Licensing
TypeLicensing Royalties
Description

Licensing of proprietary IP cores including JPEG, MIPI, and ISP technologies to semiconductor and electronics manufacturers for integration into their products.

shikino.co.jp
3Semiconductor Testing Equipment
TypeHardware Sales
Description

Manufacturing and sale of burn-in equipment, analog IC testers, and open-short-leakage testers for semiconductor quality assurance.

shikino.co.jp
4Nessum Communication Modules
TypeHardware Sales
Description

Sale of power line communication modules compliant with IEEE1901-2020 standard for industrial IoT and smart infrastructure applications.

shikino.co.jp
5DMS/EMS Services
TypeProfessional Services
Description

Design and manufacturing services including LSI design (analog and digital/ASIC/FPGA), test solutions, burn-in solutions, and contract manufacturing.

shikino.co.jp
6Medical Monitoring Systems
TypeHardware Sales
Description

C-AID non-contact monitoring systems for healthcare and nursing facilities using millimeter-wave radar and camera integration.

shikino.co.jp
Marketing channels6 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels2 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Personnel, Technology or R&D, Supply Chain, Operations, Marketing or Sales, Infrastructure
Pricing details1 tier
1Custom semiconductor testing equipment pricing
ModelOtherBilling cadenceMulti-year contract
Notes

Pricing is customized based on customer requirements including inspection specifications, budget, and existing system upgrade needs. Quotes provided upon inquiry.

shikino.co.jp
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 of 5 records shown
1C-AID
Description

Millimeter-wave radar + camera integrated monitoring system for nursing care facilities and medical institutions

shikino.co.jp
+4 more records
Core offering1 text field

Shikino High Tech designs, manufactures, and licenses imaging and semiconductor technologies, including industrial embedded camera modules, JPEG/MIPI/ISP IP cores, semiconductor burn-in and IC testing equipment, Nessum (IEEE1901-2020) power-line communication modules, and the C-AID non-contact monitoring system for healthcare facilities. The company also provides semi-custom camera development, analog/digital LSI design, burn-in board design, and DMS/EMS contract manufacturing services to industrial, semiconductor, and healthcare customers.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 3 values shown
  • Nessum communication effective speed approximately 150Mbps with multi-hop capability up to several kilometers
+2 more records
Product overview1 text field

Shikino High Tech offers a comprehensive portfolio of imaging and semiconductor products and services. The product lineup includes six core categories: Embedded Cameras for Industrial Use (for ATMs, vending machines, biometrics), Image Processing Cameras (with built-in image processing), IP Cores (JPEG/MIPI/ISP compression and interface IPs for licensing), Semiconductor Testing Equipment (burn-in systems, analog IC testers, source measure units), Nessum Communication Modules (IEEE1901-2020 compliant PLC modules), and C-AID Monitoring Systems (millimeter-wave radar + camera for healthcare). The company also provides design services including Camera Solutions, Semi-Custom Cameras, LSI Design, Test Solutions, Burn-in Solutions, and DMS/EMS services. The portfolio operates as a multi-product ecosystem where cameras and IP cores can be combined with custom development services, and semiconductor equipment is supported by testing and burn-in solutions.

Product and service19 records
1Embedded Cameras for Industrial Use
CategoryIndustrial embedded cameras
Description

Industrial camera modules and lens options designed for embedded applications in ATMs, POS terminals, vending machines, KIOSK terminals, ticketing machines, arcade games, digital signage, code certification (1D/2D), biometric authentication (face/fingerprint), FA equipment, robots, transport equipment, and packaging equipment. Sold to industrial equipment OEMs.

2Image Processing Cameras
CategoryIndustrial embedded cameras
Description

Cameras with built-in image processing functionality targeting inspection and sensor applications. Sold to industrial and equipment manufacturers requiring on-camera processing.

3JPEG IP Core Products
CategorySemiconductor IP cores
Description

Licensable still image CODEC IP cores including JPEG Baseline, Extended, Lossless, XR, and XL formats, offered in KJN, KJN-EX, KJN-F (FPGA), and KJN-X (JPEG XR) variants for integration into customer LSI designs.

4MIPI IP Core Products
CategorySemiconductor IP cores
Description

MIPI CSI-2 and DSI IP cores compliant with MIPI alliance standards, running on FPGA, supporting 1-4 lanes with transmission rates from 80M to 1500M bps per lane. Sold to semiconductor and electronics design houses.

5ISP IP Core (Image Signal Processor)
CategorySemiconductor IP cores
Description

Image Signal Processor IP core that processes image data from image sensors, targeting surveillance cameras and general image-input systems using image sensors. Sold to semiconductor and electronics design houses.

6SHSB-2000 (24) Monitored Burn-in Equipment
CategorySemiconductor test equipment
Description

Monitored semiconductor burn-in equipment with 1 temperature zone and 2 testing zones supporting up to 24 boards (12 boards per testing zone). Features maximum airflow of 7m+ in the chamber, chip ID reading via SPI/JTAG/I2C, and temperature setting of Rt+20 to +150°C. Sold to semiconductor manufacturers for post-process quality assurance.

7SHSB-2000 (48) Monitored Burn-in Equipment
CategorySemiconductor test equipment
Description

Higher-capacity monitored semiconductor burn-in system with 1 temperature zone and 4 testing zones supporting up to 48 boards. Successor model to the BI-1300/1400 series with expanded vector memory (8M to 32M vectors) and increased monitoring channels (124ch to 363ch for TDM specification). Sold to semiconductor manufacturers.

8AITS (Analog IC Test System)
CategorySemiconductor test equipment
Description

General-purpose analog IC test system for both DC and AC tests with semi-customized configurations. Supports simultaneous measurement of up to 4 DUTs, constant voltage/current sources of ±40V/±2A, and per-pin system with ground sense function. Sold to semiconductor manufacturers.

9AITS-OSL (Open-Short-Leakage Tester)
CategorySemiconductor test equipment
Description

Low-cost compact open-short-leakage tester for high pin count devices up to 2048 pins. Supports up to 8-DUT simultaneous measurement and handles open/short tests as well as leakage tests. Sold to semiconductor manufacturers.

10SHSA-101 (8-channel Source Measure Unit)
CategorySemiconductor test equipment
Description

Multi-channel high precision source measure unit (SMU) compliant with the PXI standard. Maximum voltage range ±20V and maximum current range ±100mA (SHSA-101-100) or ±50mA (SHSA-101-50), with 4-quadrant operation. Sold to semiconductor test operations.

11Nessum Communication Module (IEEE1901-2020 compliant)
CategoryWired communication modules
Description

High-speed wired communication module compliant with the IEEE1901-2020 (Nessum) standard, utilizing existing power lines and wiring infrastructure for data transmission. Supports multi-hop functionality over distances of several kilometers at effective speeds of approximately 150 Mbps. Sold to IoT and smart infrastructure integrators.

12C-AID Non-Contact Monitoring System
CategoryMedical monitoring equipment
Description

Non-contact resident/patient monitoring system combining millimeter-wave radar with a camera for nursing care facilities and medical institutions. Features real-time bed presence monitoring, heartbeat and respiratory detection through bedding, fast rising (sit-up) detection within 2 seconds with automatic event recording, and sleep state visualization. Holds Japanese general medical device registration (27B3X00345000001). Sold to nursing care facilities and medical institutions.

13Camera Solutions (Custom Camera Development)
CategoryCamera design services
Description

Custom camera and image processing module development service that delivers optimized imaging solutions for unique customer requirements. Provided to industrial and equipment manufacturers needing tailored camera designs.

14Semi-Custom Cameras
CategoryCamera design services
Description

Semi-custom camera development service that customizes existing camera module specifications to meet customer requirements at relatively low cost and short delivery times compared to full custom development. Sold to industrial and equipment OEMs.

15LSI Design Services
CategoryLSI design services
Description

Analog and digital LSI design services covering specification proposals through design, layout, evaluation, ASIC development, and FPGA development. Sold to electronics and semiconductor customers.

16Test Solutions
CategoryTest engineering services
Description

Comprehensive in-house test solution service covering printed circuit board design, component procurement, soldering assembly, and test program creation and debugging for application development. Provided to electronics and semiconductor customers.

17Burn-in Solutions
CategoryBurn-in engineering services
Description

Burn-in board (test jig) design and production service for high-temperature operating conditions, leveraging extensive experience in high-reliability board design and assembly quality. Sold to semiconductor manufacturers.

18DMS/EMS (Design and Electronics Manufacturing Services)
CategoryContract electronics manufacturing
Description

End-to-end design and electronics manufacturing service covering hardware design, software design, component procurement, assembly, and inspection. Surface mounting lines support board sizes up to 508 mm (W) x 620 mm (L), accommodating small-lot high-mix through mass production volumes. Sold to electronics OEMs.

19Shop Cameras (Retail Analytics Cameras)
CategoryRetail analytics cameras
Description

Specialized cameras for retail environments featuring age and gender detection, people counting, and congestion detection capabilities for customer analytics applications. Sold to retailers and retail analytics integrators.

Scale indicator3 records

Each record includes

Type, Value, Description, Source

Partnership7 partners
Strategic tierCoreTypeChannel Partner/ Reseller/ DistributorAnnounced on2026-03-10
Description

European trading company acting as distributor and exhibition partner at Embedded World 2026 (Hall 3A Booth 417) for embedded camera products in the German/European market.

Strategic tierCoreTypeTechnology or IntegrationAnnounced on2026-03-10
Description

Exhibiting Shikino camera solutions at Renesas booth (Hall 1-234) at Embedded World 2026. Partnership in Renesas Preferred Partner Program.

Strategic tierCoreTypeChannel Partner/ Reseller/ DistributorAnnounced on2025-06-24
Description

European distributor agreement signed to accelerate expansion in European markets, announced June 2025.

Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2025-06-02
Description

Strategic partnership to expand global reach of embedded camera products, announced June 2025.

Strategic tierCoreTypeChannel Partner/ Reseller/ DistributorAnnounced on2025-04-24
Description

Collaboration to expand sales in specific markets, announced April 2025.

Strategic tierCoreTypeTechnology or IntegrationAnnounced on2025-03-05
Description

Membership in Lattice Partner Network providing FPGA design services.

Strategic tierMinorTypeStrategic or Co-development PartnerAnnounced on2021-12-03
Description

Prototype communication module development for Nessum technology compliant with IEEE1901-2020.

Recent move14 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight6 records

Each record includes

Type, Description

Peers10 records
TypeBroad incumbent
Description

Global leader in semiconductor automatic test equipment, including burn-in and SoC testers. Overlaps with Shikino's burn-in and IC test product lines (SHSB-2000, AITS, AITS-OSL) but at vastly greater scale and broader portfolio.

2ParameteriX (Nessum/Panasonic HD-PLC ecosystem)
TypeEmerging player
Description

Panasonic-related powerline communication activities tied to the IEEE1901-2020 (Nessum) standard. Comparable to Shikino's Nessum communication module business as participants in the same emerging standard ecosystem.

TypeDirect peer
Description

German industrial camera manufacturer offering embedded vision modules and OEM camera solutions. Closely matches Shikino's embedded camera and image-processing camera product lines for factory automation, robotics, and inspection.

4CAST, Inc.
TypeDirect peer
Description

Silicon IP vendor offering JPEG, compression, and interface IP cores for FPGA and ASIC. Directly comparable to Shikino's JPEG/MIPI/ISP IP core licensing business and an existing joint-marketing partner.

TypeDirect peer
Description

Embedded camera module maker with strong customization services for industrial, medical, and IoT applications. Directly comparable to Shikino's embedded camera and semi-custom offerings, and announced as a strategic partner of Shikino in June 2025.

TypeBroad incumbent
Description

Major Japanese microcontroller and semiconductor vendor operating a Preferred Partner Program that includes Shikino. While much larger, Renesas is a strategic partner and end-customer channel for Shikino's camera solutions and LSI design services.

TypeBroad incumbent
Description

Dominant Japanese industrial sensor, vision system, and measurement instrument vendor. Comparable to Shikino in serving industrial and FA customers with cameras and sensors, but operates at much larger scale across a broad automation portfolio.

TypeDirect peer
Description

Industrial and embedded vision camera vendor with strong presence in factory automation and machine vision. Comparable to Shikino in target customers (FA equipment, robotics, kiosks) and product form factor (compact industrial cameras).

TypeDirect peer
Description

Japanese fabless LSI design house offering custom SoC and ASIC design services. Directly comparable to Shikino's LSI design service and IP core licensing businesses, and an existing co-development partner on Nessum modules.

TypeEmerging player
Description

AI software company focused on low-power computer vision and image processing for embedded cameras. Comparable to Shikino's image-processing camera and AI-compatible camera module work, and an existing joint-marketing partner at Embedded World.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat5 records

Each record includes

Type, Details

Key risks2 records

Each record includes

Headline, Details, Source

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers4 records

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment5 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile5 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature8 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles1 record

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

Subsidiaries2 records

Each record includes

Name, Acquired on, Relationship type, Type, Business focus

Compliance3 records

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Shikino High Tech

Industrial Cameras and Semiconductor Test Equipmentshikino.co.jp

Shikino High Tech is a Japanese electronics company that designs and manufactures industrial embedded cameras, proprietary image-compression and interface IP cores, semiconductor back-end test equipment, Nessum power-line communication modules, and the C-AID radar-camera healthcare monitoring system for industrial OEMs, semiconductor firms, and care facilities.

What Shikino High Tech does

Shikino High Tech Co., Ltd. (株式会社シキノハイテック, TSE Standard: 6614) is a Japanese electronics company founded in 1975 and headquartered in Uozu-shi, Toyama, with 251-500 employees. The company operates six core product lines: industrial embedded camera modules, image processing cameras for inspection, proprietary IP cores (JPEG/MIPI/ISP), semiconductor back-end test equipment (burn-in systems, analog IC testers, open-short-leakage testers, source measure units), Nessum (IEEE1901-2020 compliant) power-line communication modules, and the C-AID non-contact radar-plus-camera monitoring system for healthcare facilities. Its core technology stack originates from LSI design work begun in 1987 and includes an extensive proprietary IP catalog spanning JPEG compression formats (including JPEG XL), MIPI CSI-2/DSI interfaces, and image signal processing cores.

Shikino High Tech firmographics

Firmographics
Name
Shikino High Tech
Legal name
株式会社 シキノハイテック
Website
https://shikino.co.jp
Company type
Public
Founded year
1975
Operating status
Operating
Headcount range
251–500 employees
Short description
Shikino High Tech is a Japanese electronics company that designs and manufactures industrial embedded cameras, proprietary image-compression and interface IP cores, semiconductor back-end test equipment, Nessum power-line communication modules, and the C-AID radar-camera healthcare monitoring system for industrial OEMs, semiconductor firms, and care facilities.
Ownership category
akta.pro rank

Shikino High Tech industry classification

Industry
Product category
Industrial Cameras and Semiconductor Test Equipment
NAICS
Semiconductor Machinery Manufacturing (333242), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515), Electromedical and Electrotherapeutic Apparatus Manufacturing (334510), Semiconductor and Other Electronic Component Manufacturing (33441)
SIC
Instruments For Meas & Testing Of Electricity & Elec Signals (3825), Industrial Instruments For Measurement, Display, And Control (3823), Electronic & Other Electrical Equipment (No Computer Equip) (3600)
akta.pro primary industry
Audio, Imaging & Multimedia SoCs (ISP/Codec/Display) (HDAHABAH)
akta.pro secondary industries
Sensors, MEMS & Imaging ICs (HDAHAAAG), Test, Measurement & Calibration Equipment Manufacturing Services (ATE, DAQ, metrology electronics) (IMAGAGAH), Sensor Fusion, Interface ICs & Modules (AFE/Readout/Packaging/Calibration) (HDAHALAO), Embedded & HMI Electronics Manufacturing (Industrial PCs, HMIs, Panel PCs) (IMAGAGAD)

Keywords

  • Embedded camera modules
  • Semiconductor testing equipment
  • Image compression IP cores
  • Power line communication modules
  • LSI design services

Where Shikino High Tech is headquartered

Location

Headquarters

HQ city
Toyama
HQ country
Japan
HQ region
Asia

Offices11 records

Markets served

Shikino High Tech business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Personnel, Technology or R&D, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

  1. Industrial Camera Modules: Sale of embedded cameras for industrial use, image processing cameras, and custom/semi-custom camera solutions for various applications including ATMs, vending machines, biometric systems, and robotics.
  2. IP Core Licensing: Licensing of proprietary IP cores including JPEG, MIPI, and ISP technologies to semiconductor and electronics manufacturers for integration into their products.
  3. Semiconductor Testing Equipment: Manufacturing and sale of burn-in equipment, analog IC testers, and open-short-leakage testers for semiconductor quality assurance.
  4. Nessum Communication Modules: Sale of power line communication modules compliant with IEEE1901-2020 standard for industrial IoT and smart infrastructure applications.
  5. DMS/EMS Services: Design and manufacturing services including LSI design (analog and digital/ASIC/FPGA), test solutions, burn-in solutions, and contract manufacturing.
  6. Medical Monitoring Systems: C-AID non-contact monitoring systems for healthcare and nursing facilities using millimeter-wave radar and camera integration.

Pricing tiers

ModelBillingPrice
OtherMulti-year contractCustom semiconductor testing equipment pricing

Go-to-market motion3 records

Distribution channels2 records

Marketing channels6 records

Shikino High Tech product offering

Product offering

Core offering

Shikino High Tech designs, manufactures, and licenses imaging and semiconductor technologies, including industrial embedded camera modules, JPEG/MIPI/ISP IP cores, semiconductor burn-in and IC testing equipment, Nessum (IEEE1901-2020) power-line communication modules, and the C-AID non-contact monitoring system for healthcare facilities. The company also provides semi-custom camera development, analog/digital LSI design, burn-in board design, and DMS/EMS contract manufacturing services to industrial, semiconductor, and healthcare customers.

Product overview

Shikino High Tech offers a comprehensive portfolio of imaging and semiconductor products and services. The product lineup includes six core categories: Embedded Cameras for Industrial Use (for ATMs, vending machines, biometrics), Image Processing Cameras (with built-in image processing), IP Cores (JPEG/MIPI/ISP compression and interface IPs for licensing), Semiconductor Testing Equipment (burn-in systems, analog IC testers, source measure units), Nessum Communication Modules (IEEE1901-2020 compliant PLC modules), and C-AID Monitoring Systems (millimeter-wave radar + camera for healthcare). The company also provides design services including Camera Solutions, Semi-Custom Cameras, LSI Design, Test Solutions, Burn-in Solutions, and DMS/EMS services. The portfolio operates as a multi-product ecosystem where cameras and IP cores can be combined with custom development services, and semiconductor equipment is supported by testing and burn-in solutions.

Differentiator

Problem solved

Functional benefit

Brands

  • C-AID: Millimeter-wave radar + camera integrated monitoring system for nursing care facilities and medical institutions
  • SHSB-2000
  • AITS
  • AITS-OSL
  • SHSA-101

Products and services

  • Embedded Cameras for Industrial Use Industrial camera modules and lens options designed for embedded applications in ATMs, POS terminals, vending machines, KIOSK terminals, ticketing machines, arcade games, digital signage, code certification (1D/2D), biometric authentication (face/fingerprint), FA equipment, robots, transport equipment, and packaging equipment. Sold to industrial equipment OEMs.
  • Image Processing Cameras Cameras with built-in image processing functionality targeting inspection and sensor applications. Sold to industrial and equipment manufacturers requiring on-camera processing.
  • JPEG IP Core Products Licensable still image CODEC IP cores including JPEG Baseline, Extended, Lossless, XR, and XL formats, offered in KJN, KJN-EX, KJN-F (FPGA), and KJN-X (JPEG XR) variants for integration into customer LSI designs.
  • MIPI IP Core Products MIPI CSI-2 and DSI IP cores compliant with MIPI alliance standards, running on FPGA, supporting 1-4 lanes with transmission rates from 80M to 1500M bps per lane. Sold to semiconductor and electronics design houses.
  • ISP IP Core (Image Signal Processor) Image Signal Processor IP core that processes image data from image sensors, targeting surveillance cameras and general image-input systems using image sensors. Sold to semiconductor and electronics design houses.
  • SHSB-2000 (24) Monitored Burn-in Equipment Monitored semiconductor burn-in equipment with 1 temperature zone and 2 testing zones supporting up to 24 boards (12 boards per testing zone). Features maximum airflow of 7m+ in the chamber, chip ID reading via SPI/JTAG/I2C, and temperature setting of Rt+20 to +150°C. Sold to semiconductor manufacturers for post-process quality assurance.
  • SHSB-2000 (48) Monitored Burn-in Equipment Higher-capacity monitored semiconductor burn-in system with 1 temperature zone and 4 testing zones supporting up to 48 boards. Successor model to the BI-1300/1400 series with expanded vector memory (8M to 32M vectors) and increased monitoring channels (124ch to 363ch for TDM specification). Sold to semiconductor manufacturers.
  • AITS (Analog IC Test System) General-purpose analog IC test system for both DC and AC tests with semi-customized configurations. Supports simultaneous measurement of up to 4 DUTs, constant voltage/current sources of ±40V/±2A, and per-pin system with ground sense function. Sold to semiconductor manufacturers.
  • AITS-OSL (Open-Short-Leakage Tester) Low-cost compact open-short-leakage tester for high pin count devices up to 2048 pins. Supports up to 8-DUT simultaneous measurement and handles open/short tests as well as leakage tests. Sold to semiconductor manufacturers.
  • SHSA-101 (8-channel Source Measure Unit) Multi-channel high precision source measure unit (SMU) compliant with the PXI standard. Maximum voltage range ±20V and maximum current range ±100mA (SHSA-101-100) or ±50mA (SHSA-101-50), with 4-quadrant operation. Sold to semiconductor test operations.
  • Nessum Communication Module (IEEE1901-2020 compliant) High-speed wired communication module compliant with the IEEE1901-2020 (Nessum) standard, utilizing existing power lines and wiring infrastructure for data transmission. Supports multi-hop functionality over distances of several kilometers at effective speeds of approximately 150 Mbps. Sold to IoT and smart infrastructure integrators.
  • C-AID Non-Contact Monitoring System Non-contact resident/patient monitoring system combining millimeter-wave radar with a camera for nursing care facilities and medical institutions. Features real-time bed presence monitoring, heartbeat and respiratory detection through bedding, fast rising (sit-up) detection within 2 seconds with automatic event recording, and sleep state visualization. Holds Japanese general medical device registration (27B3X00345000001). Sold to nursing care facilities and medical institutions.
  • Camera Solutions (Custom Camera Development) Custom camera and image processing module development service that delivers optimized imaging solutions for unique customer requirements. Provided to industrial and equipment manufacturers needing tailored camera designs.
  • Semi-Custom Cameras Semi-custom camera development service that customizes existing camera module specifications to meet customer requirements at relatively low cost and short delivery times compared to full custom development. Sold to industrial and equipment OEMs.
  • LSI Design Services Analog and digital LSI design services covering specification proposals through design, layout, evaluation, ASIC development, and FPGA development. Sold to electronics and semiconductor customers.
  • Test Solutions Comprehensive in-house test solution service covering printed circuit board design, component procurement, soldering assembly, and test program creation and debugging for application development. Provided to electronics and semiconductor customers.
  • Burn-in Solutions Burn-in board (test jig) design and production service for high-temperature operating conditions, leveraging extensive experience in high-reliability board design and assembly quality. Sold to semiconductor manufacturers.
  • DMS/EMS (Design and Electronics Manufacturing Services) End-to-end design and electronics manufacturing service covering hardware design, software design, component procurement, assembly, and inspection. Surface mounting lines support board sizes up to 508 mm (W) x 620 mm (L), accommodating small-lot high-mix through mass production volumes. Sold to electronics OEMs.
  • Shop Cameras (Retail Analytics Cameras) Specialized cameras for retail environments featuring age and gender detection, people counting, and congestion detection capabilities for customer analytics applications. Sold to retailers and retail analytics integrators.

Quantifiable outcome

  • Nessum communication effective speed approximately 150Mbps with multi-hop capability up to several kilometers
  • +2 more outcomes

Companies that use Shikino High Tech

Customer profile

Named customers4 records

Segments5 records

Ideal customer profiles5 records

Shikino High Tech technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature8 records

Shikino High Tech partnerships and signals

Strategic signal

Partnerships

Seven partnerships are on record, tiered core and minor.

  • Ineltek GmbHcoreChannel Partner/ Reseller/ Distributor · 10 March 2026European trading company acting as distributor and exhibition partner at Embedded World 2026 (Hall 3A Booth 417) for embedded camera products in the German/European market.
  • Renesas Electronics CorporationcoreTechnology or Integration · 10 March 2026Exhibiting Shikino camera solutions at Renesas booth (Hall 1-234) at Embedded World 2026. Partnership in Renesas Preferred Partner Program.
  • INELTEKcoreChannel Partner/ Reseller/ Distributor · 24 June 2025European distributor agreement signed to accelerate expansion in European markets, announced June 2025.
  • e-con SystemscoreStrategic or Co-development Partner · 2 June 2025Strategic partnership to expand global reach of embedded camera products, announced June 2025.
  • AGNEZ TECHcoreChannel Partner/ Reseller/ Distributor · 24 April 2025Collaboration to expand sales in specific markets, announced April 2025.
  • Lattice SemiconductorcoreTechnology or Integration · 5 March 2025Membership in Lattice Partner Network providing FPGA design services.
  • SocionextminorStrategic or Co-development Partner · 3 December 2021Prototype communication module development for Nessum technology compliant with IEEE1901-2020.

Scale indicators3 records

Recent moves14 records

Expansion highlights6 records

Shikino High Tech competitors and assessment

Company assessment

Broad incumbents

  • Advantest: Global leader in semiconductor automatic test equipment, including burn-in and SoC testers. Overlaps with Shikino's burn-in and IC test product lines (SHSB-2000, AITS, AITS-OSL) but at vastly greater scale and broader portfolio.
  • Renesas Electronics: Major Japanese microcontroller and semiconductor vendor operating a Preferred Partner Program that includes Shikino. While much larger, Renesas is a strategic partner and end-customer channel for Shikino's camera solutions and LSI design services.
  • Keyence: Dominant Japanese industrial sensor, vision system, and measurement instrument vendor. Comparable to Shikino in serving industrial and FA customers with cameras and sensors, but operates at much larger scale across a broad automation portfolio.

Emerging players

  • ParameteriX (Nessum/Panasonic HD-PLC ecosystem): Panasonic-related powerline communication activities tied to the IEEE1901-2020 (Nessum) standard. Comparable to Shikino's Nessum communication module business as participants in the same emerging standard ecosystem.
  • IRIDA-Labs: AI software company focused on low-power computer vision and image processing for embedded cameras. Comparable to Shikino's image-processing camera and AI-compatible camera module work, and an existing joint-marketing partner at Embedded World.

Direct peers

  • Basler AG: German industrial camera manufacturer offering embedded vision modules and OEM camera solutions. Closely matches Shikino's embedded camera and image-processing camera product lines for factory automation, robotics, and inspection.
  • CAST, Inc. Silicon IP vendor offering JPEG, compression, and interface IP cores for FPGA and ASIC. Directly comparable to Shikino's JPEG/MIPI/ISP IP core licensing business and an existing joint-marketing partner.
  • e-con Systems: Embedded camera module maker with strong customization services for industrial, medical, and IoT applications. Directly comparable to Shikino's embedded camera and semi-custom offerings, and announced as a strategic partner of Shikino in June 2025.
  • IDS Imaging Development Systems: Industrial and embedded vision camera vendor with strong presence in factory automation and machine vision. Comparable to Shikino in target customers (FA equipment, robotics, kiosks) and product form factor (compact industrial cameras).
  • Socionext: Japanese fabless LSI design house offering custom SoC and ASIC design services. Directly comparable to Shikino's LSI design service and IP core licensing businesses, and an existing co-development partner on Nessum modules.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks2 records

Key highlights7 records

Customer concentration

Shikino High Tech social profiles

Digital presence

Shikino High Tech compliance and trust

Trust signal

Compliance3 records

Shikino High Tech financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Shikino High Tech leadership team

Management profile

Number of profiles

Profiles1 record

Shikino High Tech subsidiaries and ownership

Company hierarchy

Subsidiaries2 records

Shikino High Tech funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Shikino High Tech M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Shikino High Tech

What does Shikino High Tech do?

Shikino High Tech designs, manufactures, and licenses imaging and semiconductor technologies, including industrial embedded camera modules, JPEG/MIPI/ISP IP cores, semiconductor burn-in and IC testing equipment, Nessum (IEEE1901-2020) power-line communication modules, and the C-AID non-contact monitoring system for healthcare facilities. The company also provides semi-custom camera development, analog/digital LSI design, burn-in board design, and DMS/EMS contract manufacturing services to industrial, semiconductor, and healthcare customers.

Is Shikino High Tech a public or private company?

Shikino High Tech is a public company. It is classified as public and is currently operating.

When was Shikino High Tech founded?

Shikino High Tech was founded in 1975. It employs 251 to 500 people.

Where is Shikino High Tech based?

Shikino High Tech is headquartered in Toyama, Japan, in the Asia region.

How does Shikino High Tech make money?

Six revenue lines are on record. Industrial Camera Modules are the primary driver. The others are IP Core Licensing, semiconductor Testing Equipment, nessum Communication Modules, DMS/EMS Services and medical Monitoring Systems.

Who are Shikino High Tech's main competitors?

Broad incumbents on record are Advantest, Renesas Electronics and Keyence. Emerging players are ParameteriX (Nessum/Panasonic HD-PLC ecosystem) and IRIDA-Labs. Direct peers are Basler AG, CAST, Inc., e-con Systems, IDS Imaging Development Systems and Socionext.

Does Shikino High Tech have an API?

No public API is recorded for Shikino High Tech.

What industry is Shikino High Tech in?

Shikino High Tech's product category is Industrial Cameras and Semiconductor Test Equipment. Its primary akta.pro industry code is HDAHABAH, Audio, Imaging & Multimedia SoCs (ISP/Codec/Display), with a secondary code of HDAHAAAG, Sensors, MEMS & Imaging ICs. Its NAICS code is 333242 and its SIC code is 3825.

Unlock the full company data

50 free credits on sign-up, no credit card required.

Contact sales