Hi-Rel Group
Hi-Rel Group is a private B2B manufacturer of custom metal components for high-reliability microelectronic packaging, including hermetic lids, thermal management materials, getters, and solder preforms, serving Aerospace & Defense, Medical, Telecom, and Energy markets across the US, UK, and Canada.
- Company typePrivate
- Founded1946
- HeadquartersEssex, United States
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
What Hi-Rel Group does
Hi-Rel Group is a private B2B manufacturer of custom metal components used in the construction of high-reliability microelectronic packages. The group operates three specialized divisions — Hi-Rel Products in Essex, Connecticut (founded 1976, precision carrier components); Hi-Rel Lids in Harleston, United Kingdom (founded 1986, hermetic package lids and sealing solutions); and Hi-Rel Alloys in Niagara Falls, Ontario (founded 1996, solder and braze preforms). Its product portfolio spans thermal management (thermal spreaders, base plates, CVD diamond and diamond-metal composites), advanced getter solutions (gas adsorbers for sealed microelectronic packages), hermetic lids, EMI/RFI shielding, and ancillary items including wire bond tabs, sputtering targets, and precision wire.
The company sells exclusively through direct enterprise field sales using a custom quotation-based pricing model, with no distributors, resellers, or self-serve channels and no publicly disclosed list prices. It serves four primary vertical markets — Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy — where customers require hermetic sealing, thermal management, and long-term reliability in harsh environments. Contract cadence is described as multi-year, and revenue is generated through one-time sales of custom-fabricated components rather than licensing or subscription models.
Hi-Rel is led by President & CEO Rick Ferraid, COO Bill Hubbard, CFO Mike Kelley, and VP of Sales & Marketing Keith Barclay. The company is privately held with no disclosed parent company or institutional equity ownership beyond a 2017 financing facility with Norwest Mezzanine Partners. Its combined 70+ years of operational track record across the three divisions, combined with its qualification footprint in long-lifecycle defense, medical, and telecom programs, is the central anchor of its competitive positioning.
Hi-Rel Group firmographics
Firmographics- Name
- Hi-Rel Group
- Legal name
- Hi-Rel Group
- Website
- https://hirelgroup.com
- Company type
- Private
- Founded year
- 1946
- Operating status
- Operating
- Headcount range
- 101–250 employees
- Short description
- Hi-Rel Group is a private B2B manufacturer of custom metal components for high-reliability microelectronic packaging, including hermetic lids, thermal management materials, getters, and solder preforms, serving Aerospace & Defense, Medical, Telecom, and Energy markets across the US, UK, and Canada.
- Ownership category
- akta.pro rank
Hi-Rel Group industry classification
Industry- Product category
- Electronic Packaging Components
- NAICS
- All Other Fabricated Metal Product Manufacturing (33299)
- SIC
- Electronic Components, Nec (3679)
- akta.pro primary industry
- Thermal Management & Heat Dissipation Solutions (TIMs, Lids, Heat Sinks) (HDAHADAG)
- akta.pro secondary industry
- Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)
Keywords
Where Hi-Rel Group is headquartered
LocationHeadquarters
- HQ city
- Essex
- HQ country
- United States
- HQ region
- North America
Offices3 records
Markets served
Hi-Rel Group business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Operations, Supply Chain, Technology or R&D, Infrastructure, Marketing or Sales
Revenue model
- High-Reliability Metal Component Sales: Manufacture and sale of custom metal components including hermetic lids, thermal management solutions, getters, solder preforms, and precision carrier components for high-reliability electronic device construction. Revenue is generated through direct B2B sales of specialized components with custom fabrication based on customer specifications.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Custom quotation-based pricing for tailored metal components |
Go-to-market motion1 record
Distribution channels1 record
Marketing channels5 records
Hi-Rel Group product offering
Product offeringCore offering
Hi-Rel Group fabricates tailored metal components used in the construction of high-reliability electronic devices. Its product range spans hermetic package lids, thermal management solutions (thermal spreaders, base plates, CVD diamond, and diamond metal composites), getters (gas adsorbers) for microelectronics, solder and braze preforms, EMI/RFI shielding components, and precision carrier items such as wire bond tabs, sputtering targets, and precision wire. The company serves customers in Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy.
Product overview
Hi-Rel Group is a B2B manufacturer of tailored metal components for high-reliability electronic devices, organized into three divisions: Hi-Rel Products (precision carrier components, 50 years), Hi-Rel Lids (hermetic package lids, 40 years), and Hi-Rel Alloys (solder and braze preforms, 30 years). The product portfolio spans five main solution categories: Thermal Management Solutions (including thermal spreaders, base plates, CVD diamond, and diamond metal composites), Advanced Getter Solutions (gas adsorbers for microelectronics), Solder Alloys & Hermetic Lid Solutions, EMI/RFI Shielding and Absorber Solutions, and Other Solutions & Plating Services (wire bond tabs, sputtering targets, precision wire). These complementary product lines work together to provide comprehensive electronic packaging solutions for demanding applications.
Differentiator
Problem solved
Functional benefit
Brands
- Hi-Rel Products: Division specializing in precision metal components for high-reliability electronic devices, including thermal management solutions, getters, and precision carrier components.
- Hi-Rel Lids
- Hi-Rel Alloys
Products and services
- Thermal Management Solutions Comprehensive thermal management solutions including thermal spreaders, tabs, base plates, and advanced heat-dissipation materials such as CVD diamond and diamond metal composites for managing heat in high-reliability electronic systems. Targeted at OEMs in Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy.
- Advanced Getter Solutions Getters (gas adsorbers) for microelectronics that remove residual gas molecules to maintain vacuum or inert atmosphere inside sealed electronic packages. Used by OEMs building high-reliability microelectronic devices.
- Hi-Rel Solder Alloys & Hermetic Lid Solutions Solder and braze preforms combined with hermetic lid solutions for creating airtight seals in electronic packages. Supports Hi-Rel Lids and Hi-Rel Alloys divisions in serving OEMs that require reliable hermetic packaging.
- Advanced EMI/RFI Shielding and Absorber Solutions Electromagnetic interference (EMI) and radio frequency interference (RFI) shielding components and absorbers that protect sensitive electronic devices from electromagnetic disturbances. Targeted at high-reliability electronic system OEMs.
- Other Solutions and Plating Services Additional precision components and plating services including precision wire bond tabs, sputtering targets, and precision wire for electronic interconnect and thin-film deposition applications. Targeted at high-reliability electronic device manufacturers.
Companies that use Hi-Rel Group
Customer profileSegments4 records
Ideal customer profiles4 records
Hi-Rel Group technology and API
TechnologyTechnology focussed No
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature8 records
Hi-Rel Group partnerships and signals
Strategic signalScale indicators3 records
Recent moves5 records
Expansion highlights4 records
Hi-Rel Group competitors and assessment
Company assessmentDirect peers
- Materion Corporation: Materion supplies advanced specialty metals, alloys, and microelectronic packaging materials including lids, preforms, and thermal management materials — a close functional peer across Hi-Rel Alloys and Hi-Rel Products portfolios.
- Boyd Corporation: Boyd specializes in thermal management and engineered materials including heat spreaders, cold plates, and dissipative solutions for electronics — directly comparable to Hi-Rel's thermal spreaders, base plates, and heat dissipation offerings.
- Indium Corporation: Indium Corporation is a leading supplier of solder alloys, solder and braze preforms, and related joining materials for high-reliability electronics packaging — directly competitive with Hi-Rel Alloys' preform business.
- Ferrotec Corporation: Ferrotec provides hermetic packaging, thermal management solutions, and advanced materials for semiconductor and photonics customers, making it a direct comparable across Hi-Rel's lids, thermal spreaders, and precision components.
- MacDermid Alpha Electronics Solutions: MacDermid Alpha supplies solder materials, braze preforms, and assembly chemistries for high-reliability electronics manufacturing — overlapping directly with Hi-Rel Alloys' preform product line in defense, medical, and telecom.
- SCHOTT Electronic Packaging: SCHOTT's Electronic Packaging division manufactures hermetic lids, housings, and feedthroughs for microelectronic and optoelectronic packages — directly overlapping Hi-Rel Lids' core offering across defense, medical, and optical-networking customers.
Broad incumbents
- CoorsTek: CoorsTek manufactures technical ceramics and engineered components including hermetic packages and lids for semiconductor, aerospace, and medical markets — competing with Hi-Rel Lids and Hi-Rel Products in high-reliability applications.
- Kyocera Corporation: Kyocera produces hermetic ceramic packages, lids, and electronic components across a much broader portfolio; its semiconductor and electronic device packaging lines compete directly with Hi-Rel in aerospace, telecom, and medical applications.
- Ametek Electronic Systems & Packaging: Ametek's engineered materials and electronic packaging businesses produce hermetic interconnect solutions, thermal management components, and precision metals serving defense, medical, and industrial markets — broadly comparable to Hi-Rel's portfolio.
- Honeywell Electronic Materials: Honeywell supplies advanced electronic materials, precision metals, and packaging components across aerospace, defense, and industrial markets; its electronic materials segment competes with Hi-Rel in thermal management and high-reliability joining materials.
Market position
Strengths4 records
Weaknesses4 records
Competitive moat4 records
Key risks6 records
Key highlights6 records
Customer concentration
Hi-Rel Group social profiles
Digital presenceHi-Rel Group financial estimates
Financial estimateRevenue estimate
Valuation estimate
Hi-Rel Group leadership team
Management profileNumber of profiles
Profiles4 records
Hi-Rel Group funding detail
Funding detailFunding overview
Funding rounds1 record
Investors1 record
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Hi-Rel Group M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Hi-Rel Group
What does Hi-Rel Group do?
Hi-Rel Group fabricates tailored metal components used in the construction of high-reliability electronic devices. Its product range spans hermetic package lids, thermal management solutions (thermal spreaders, base plates, CVD diamond, and diamond metal composites), getters (gas adsorbers) for microelectronics, solder and braze preforms, EMI/RFI shielding components, and precision carrier items such as wire bond tabs, sputtering targets, and precision wire. The company serves customers in Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy.
When was Hi-Rel Group founded?
Hi-Rel Group was founded in 1946. It employs 101 to 250 people.
Where is Hi-Rel Group based?
Hi-Rel Group is headquartered in Essex, United States, in the North America region.
How does Hi-Rel Group make money?
One revenue line is on record: high-Reliability Metal Component Sales.
Who are Hi-Rel Group's main competitors?
Direct peers on record are Materion Corporation, Boyd Corporation, Indium Corporation, Ferrotec Corporation, MacDermid Alpha Electronics Solutions and SCHOTT Electronic Packaging. Broad incumbents are CoorsTek, Kyocera Corporation, Ametek Electronic Systems & Packaging and Honeywell Electronic Materials.
Does Hi-Rel Group have an API?
No public API is recorded for Hi-Rel Group.
What industry is Hi-Rel Group in?
Hi-Rel Group's product category is Electronic Packaging Components. Its primary akta.pro industry code is HDAHADAG, Thermal Management & Heat Dissipation Solutions (TIMs, Lids, Heat Sinks), with a secondary code of HDAHAGAM, Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders). Its NAICS code is 33299 and its SIC code is 3679.