Developer docs
API playgroundTry for free, no card

Search company profiles

Hi-Rel Group

Full company profile

uuid0021i68

Namestring
Hi-Rel Group
Legal namestring
Hi-Rel Group
Websiteurl
hirelgroup.com
Company typeenum
Private
Founded yearint
1946
Descriptiontext

Hi-Rel Group is a private B2B manufacturer of custom metal components used in the construction of high-reliability microelectronic packages. The group operates three specialized divisions — Hi-Rel Products in Essex, Connecticut (founded 1976, precision carrier components); Hi-Rel Lids in Harleston, United Kingdom (founded 1986, hermetic package lids and sealing solutions); and Hi-Rel Alloys in Niagara Falls, Ontario (founded 1996, solder and braze preforms). Its product portfolio spans thermal management (thermal spreaders, base plates, CVD diamond and diamond-metal composites), advanced getter solutions (gas adsorbers for sealed microelectronic packages), hermetic lids, EMI/RFI shielding, and ancillary items including wire bond tabs, sputtering targets, and precision wire.

The company sells exclusively through direct enterprise field sales using a custom quotation-based pricing model, with no distributors, resellers, or self-serve channels and no publicly disclosed list prices. It serves four primary vertical markets — Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy — where customers require hermetic sealing, thermal management, and long-term reliability in harsh environments. Contract cadence is described as multi-year, and revenue is generated through one-time sales of custom-fabricated components rather than licensing or subscription models.

Hi-Rel is led by President & CEO Rick Ferraid, COO Bill Hubbard, CFO Mike Kelley, and VP of Sales & Marketing Keith Barclay. The company is privately held with no disclosed parent company or institutional equity ownership beyond a 2017 financing facility with Norwest Mezzanine Partners. Its combined 70+ years of operational track record across the three divisions, combined with its qualification footprint in long-lifecycle defense, medical, and telecom programs, is the central anchor of its competitive positioning.

Short descriptiontext

Hi-Rel Group is a private B2B manufacturer of custom metal components for high-reliability microelectronic packaging, including hermetic lids, thermal management materials, getters, and solder preforms, serving Aerospace & Defense, Medical, Telecom, and Energy markets across the US, UK, and Canada.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
101–250
akta.pro rankint
HeadquartersEssex, United States
HQ citystring
Essex
HQ countrystring
United States
HQ regionstring
North America
Markets served

Serves global market

Offices3 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
electronic packaging components, hermetic sealing solutions, thermal management materials, precision metal fabrication, microelectronic packaging
Industry2 codes
1Thermal Management & Heat Dissipation Solutions (TIMs, Lids, Heat Sinks)
CodeHDAHADAGPrimaryYes
2Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders)
CodeHDAHAGAMPrimaryNo
NAICS code1 code
  • All Other Fabricated Metal Product Manufacturing33299
SIC code1 code
  • Electronic Components, Nec3679
Product category
Electronic Packaging Components
Social media profiles1 record
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model1 record
1High-Reliability Metal Component Sales
TypeOne Time License
Description

Manufacture and sale of custom metal components including hermetic lids, thermal management solutions, getters, solder preforms, and precision carrier components for high-reliability electronic device construction. Revenue is generated through direct B2B sales of specialized components with custom fabrication based on customer specifications.

hi-rel.com
Marketing channels5 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels1 record

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Personnel, Operations, Supply Chain, Technology or R&D, Infrastructure, Marketing or Sales
Pricing details1 tier
1Custom quotation-based pricing for tailored metal components
ModelOtherBilling cadenceMulti-year contract
Notes

Pricing determined through custom quotations based on customer specifications, quantities, and component complexity. No public pricing tiers or list prices available.

hi-rel.com
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 of 3 records shown
1Hi-Rel Products
Description

Division specializing in precision metal components for high-reliability electronic devices, including thermal management solutions, getters, and precision carrier components.

hi-rel.com
+2 more records
Core offering1 text field

Hi-Rel Group fabricates tailored metal components used in the construction of high-reliability electronic devices. Its product range spans hermetic package lids, thermal management solutions (thermal spreaders, base plates, CVD diamond, and diamond metal composites), getters (gas adsorbers) for microelectronics, solder and braze preforms, EMI/RFI shielding components, and precision carrier items such as wire bond tabs, sputtering targets, and precision wire. The company serves customers in Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy.

Differentiator
Functional benefit
Problem solved
Product overview1 text field

Hi-Rel Group is a B2B manufacturer of tailored metal components for high-reliability electronic devices, organized into three divisions: Hi-Rel Products (precision carrier components, 50 years), Hi-Rel Lids (hermetic package lids, 40 years), and Hi-Rel Alloys (solder and braze preforms, 30 years). The product portfolio spans five main solution categories: Thermal Management Solutions (including thermal spreaders, base plates, CVD diamond, and diamond metal composites), Advanced Getter Solutions (gas adsorbers for microelectronics), Solder Alloys & Hermetic Lid Solutions, EMI/RFI Shielding and Absorber Solutions, and Other Solutions & Plating Services (wire bond tabs, sputtering targets, precision wire). These complementary product lines work together to provide comprehensive electronic packaging solutions for demanding applications.

Product and service5 records
1Thermal Management Solutions
CategoryThermal Management
Description

Comprehensive thermal management solutions including thermal spreaders, tabs, base plates, and advanced heat-dissipation materials such as CVD diamond and diamond metal composites for managing heat in high-reliability electronic systems. Targeted at OEMs in Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy.

2Advanced Getter Solutions
CategoryHermetic Packaging
Description

Getters (gas adsorbers) for microelectronics that remove residual gas molecules to maintain vacuum or inert atmosphere inside sealed electronic packages. Used by OEMs building high-reliability microelectronic devices.

3Hi-Rel Solder Alloys & Hermetic Lid Solutions
CategoryHermetic Packaging
Description

Solder and braze preforms combined with hermetic lid solutions for creating airtight seals in electronic packages. Supports Hi-Rel Lids and Hi-Rel Alloys divisions in serving OEMs that require reliable hermetic packaging.

4Advanced EMI/RFI Shielding and Absorber Solutions
CategoryEMI/RFI Shielding
Description

Electromagnetic interference (EMI) and radio frequency interference (RFI) shielding components and absorbers that protect sensitive electronic devices from electromagnetic disturbances. Targeted at high-reliability electronic system OEMs.

5Other Solutions and Plating Services
CategoryPrecision Components and Plating
Description

Additional precision components and plating services including precision wire bond tabs, sputtering targets, and precision wire for electronic interconnect and thin-film deposition applications. Targeted at high-reliability electronic device manufacturers.

Scale indicator3 records

Each record includes

Type, Value, Description, Source

Recent move5 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight4 records

Each record includes

Type, Description

Peers10 records
TypeDirect peer
Description

Materion supplies advanced specialty metals, alloys, and microelectronic packaging materials including lids, preforms, and thermal management materials — a close functional peer across Hi-Rel Alloys and Hi-Rel Products portfolios.

TypeBroad incumbent
Description

CoorsTek manufactures technical ceramics and engineered components including hermetic packages and lids for semiconductor, aerospace, and medical markets — competing with Hi-Rel Lids and Hi-Rel Products in high-reliability applications.

TypeBroad incumbent
Description

Kyocera produces hermetic ceramic packages, lids, and electronic components across a much broader portfolio; its semiconductor and electronic device packaging lines compete directly with Hi-Rel in aerospace, telecom, and medical applications.

TypeDirect peer
Description

Boyd specializes in thermal management and engineered materials including heat spreaders, cold plates, and dissipative solutions for electronics — directly comparable to Hi-Rel's thermal spreaders, base plates, and heat dissipation offerings.

TypeDirect peer
Description

Indium Corporation is a leading supplier of solder alloys, solder and braze preforms, and related joining materials for high-reliability electronics packaging — directly competitive with Hi-Rel Alloys' preform business.

TypeDirect peer
Description

Ferrotec provides hermetic packaging, thermal management solutions, and advanced materials for semiconductor and photonics customers, making it a direct comparable across Hi-Rel's lids, thermal spreaders, and precision components.

TypeBroad incumbent
Description

Ametek's engineered materials and electronic packaging businesses produce hermetic interconnect solutions, thermal management components, and precision metals serving defense, medical, and industrial markets — broadly comparable to Hi-Rel's portfolio.

TypeDirect peer
Description

MacDermid Alpha supplies solder materials, braze preforms, and assembly chemistries for high-reliability electronics manufacturing — overlapping directly with Hi-Rel Alloys' preform product line in defense, medical, and telecom.

TypeBroad incumbent
Description

Honeywell supplies advanced electronic materials, precision metals, and packaging components across aerospace, defense, and industrial markets; its electronic materials segment competes with Hi-Rel in thermal management and high-reliability joining materials.

TypeDirect peer
Description

SCHOTT's Electronic Packaging division manufactures hermetic lids, housings, and feedthroughs for microelectronic and optoelectronic packages — directly overlapping Hi-Rel Lids' core offering across defense, medical, and optical-networking customers.

Market position
Strengths4 records

Each record includes

Headline, Details, Source

Weaknesses4 records

Each record includes

Headline, Details, Source

Competitive moat4 records

Each record includes

Type, Details

Key risks6 records

Each record includes

Headline, Details, Source

Key highlights6 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Segment4 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile4 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
No
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature8 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles4 records

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
No data
Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds1 record

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors1 record

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Hi-Rel Group

Electronic Packaging Componentshirelgroup.com

Hi-Rel Group is a private B2B manufacturer of custom metal components for high-reliability microelectronic packaging, including hermetic lids, thermal management materials, getters, and solder preforms, serving Aerospace & Defense, Medical, Telecom, and Energy markets across the US, UK, and Canada.

What Hi-Rel Group does

Hi-Rel Group is a private B2B manufacturer of custom metal components used in the construction of high-reliability microelectronic packages. The group operates three specialized divisions — Hi-Rel Products in Essex, Connecticut (founded 1976, precision carrier components); Hi-Rel Lids in Harleston, United Kingdom (founded 1986, hermetic package lids and sealing solutions); and Hi-Rel Alloys in Niagara Falls, Ontario (founded 1996, solder and braze preforms). Its product portfolio spans thermal management (thermal spreaders, base plates, CVD diamond and diamond-metal composites), advanced getter solutions (gas adsorbers for sealed microelectronic packages), hermetic lids, EMI/RFI shielding, and ancillary items including wire bond tabs, sputtering targets, and precision wire.

The company sells exclusively through direct enterprise field sales using a custom quotation-based pricing model, with no distributors, resellers, or self-serve channels and no publicly disclosed list prices. It serves four primary vertical markets — Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy — where customers require hermetic sealing, thermal management, and long-term reliability in harsh environments. Contract cadence is described as multi-year, and revenue is generated through one-time sales of custom-fabricated components rather than licensing or subscription models.

Hi-Rel is led by President & CEO Rick Ferraid, COO Bill Hubbard, CFO Mike Kelley, and VP of Sales & Marketing Keith Barclay. The company is privately held with no disclosed parent company or institutional equity ownership beyond a 2017 financing facility with Norwest Mezzanine Partners. Its combined 70+ years of operational track record across the three divisions, combined with its qualification footprint in long-lifecycle defense, medical, and telecom programs, is the central anchor of its competitive positioning.

Hi-Rel Group firmographics

Firmographics
Name
Hi-Rel Group
Legal name
Hi-Rel Group
Website
https://hirelgroup.com
Company type
Private
Founded year
1946
Operating status
Operating
Headcount range
101–250 employees
Short description
Hi-Rel Group is a private B2B manufacturer of custom metal components for high-reliability microelectronic packaging, including hermetic lids, thermal management materials, getters, and solder preforms, serving Aerospace & Defense, Medical, Telecom, and Energy markets across the US, UK, and Canada.
Ownership category
akta.pro rank

Hi-Rel Group industry classification

Industry
Product category
Electronic Packaging Components
NAICS
All Other Fabricated Metal Product Manufacturing (33299)
SIC
Electronic Components, Nec (3679)
akta.pro primary industry
Thermal Management & Heat Dissipation Solutions (TIMs, Lids, Heat Sinks) (HDAHADAG)
akta.pro secondary industry
Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)

Keywords

  • Electronic packaging components
  • Hermetic sealing solutions
  • Thermal management materials
  • Precision metal fabrication
  • Microelectronic packaging

Where Hi-Rel Group is headquartered

Location

Headquarters

HQ city
Essex
HQ country
United States
HQ region
North America

Offices3 records

Markets served

Hi-Rel Group business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Personnel, Operations, Supply Chain, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

  1. High-Reliability Metal Component Sales: Manufacture and sale of custom metal components including hermetic lids, thermal management solutions, getters, solder preforms, and precision carrier components for high-reliability electronic device construction. Revenue is generated through direct B2B sales of specialized components with custom fabrication based on customer specifications.

Pricing tiers

ModelBillingPrice
OtherMulti-year contractCustom quotation-based pricing for tailored metal components

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

Hi-Rel Group product offering

Product offering

Core offering

Hi-Rel Group fabricates tailored metal components used in the construction of high-reliability electronic devices. Its product range spans hermetic package lids, thermal management solutions (thermal spreaders, base plates, CVD diamond, and diamond metal composites), getters (gas adsorbers) for microelectronics, solder and braze preforms, EMI/RFI shielding components, and precision carrier items such as wire bond tabs, sputtering targets, and precision wire. The company serves customers in Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy.

Product overview

Hi-Rel Group is a B2B manufacturer of tailored metal components for high-reliability electronic devices, organized into three divisions: Hi-Rel Products (precision carrier components, 50 years), Hi-Rel Lids (hermetic package lids, 40 years), and Hi-Rel Alloys (solder and braze preforms, 30 years). The product portfolio spans five main solution categories: Thermal Management Solutions (including thermal spreaders, base plates, CVD diamond, and diamond metal composites), Advanced Getter Solutions (gas adsorbers for microelectronics), Solder Alloys & Hermetic Lid Solutions, EMI/RFI Shielding and Absorber Solutions, and Other Solutions & Plating Services (wire bond tabs, sputtering targets, precision wire). These complementary product lines work together to provide comprehensive electronic packaging solutions for demanding applications.

Differentiator

Problem solved

Functional benefit

Brands

  • Hi-Rel Products: Division specializing in precision metal components for high-reliability electronic devices, including thermal management solutions, getters, and precision carrier components.
  • Hi-Rel Lids
  • Hi-Rel Alloys

Products and services

  • Thermal Management Solutions Comprehensive thermal management solutions including thermal spreaders, tabs, base plates, and advanced heat-dissipation materials such as CVD diamond and diamond metal composites for managing heat in high-reliability electronic systems. Targeted at OEMs in Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy.
  • Advanced Getter Solutions Getters (gas adsorbers) for microelectronics that remove residual gas molecules to maintain vacuum or inert atmosphere inside sealed electronic packages. Used by OEMs building high-reliability microelectronic devices.
  • Hi-Rel Solder Alloys & Hermetic Lid Solutions Solder and braze preforms combined with hermetic lid solutions for creating airtight seals in electronic packages. Supports Hi-Rel Lids and Hi-Rel Alloys divisions in serving OEMs that require reliable hermetic packaging.
  • Advanced EMI/RFI Shielding and Absorber Solutions Electromagnetic interference (EMI) and radio frequency interference (RFI) shielding components and absorbers that protect sensitive electronic devices from electromagnetic disturbances. Targeted at high-reliability electronic system OEMs.
  • Other Solutions and Plating Services Additional precision components and plating services including precision wire bond tabs, sputtering targets, and precision wire for electronic interconnect and thin-film deposition applications. Targeted at high-reliability electronic device manufacturers.

Companies that use Hi-Rel Group

Customer profile

Segments4 records

Ideal customer profiles4 records

Hi-Rel Group technology and API

Technology

Technology focussed No

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature8 records

Hi-Rel Group partnerships and signals

Strategic signal

Scale indicators3 records

Recent moves5 records

Expansion highlights4 records

Hi-Rel Group competitors and assessment

Company assessment

Direct peers

  • Materion Corporation: Materion supplies advanced specialty metals, alloys, and microelectronic packaging materials including lids, preforms, and thermal management materials — a close functional peer across Hi-Rel Alloys and Hi-Rel Products portfolios.
  • Boyd Corporation: Boyd specializes in thermal management and engineered materials including heat spreaders, cold plates, and dissipative solutions for electronics — directly comparable to Hi-Rel's thermal spreaders, base plates, and heat dissipation offerings.
  • Indium Corporation: Indium Corporation is a leading supplier of solder alloys, solder and braze preforms, and related joining materials for high-reliability electronics packaging — directly competitive with Hi-Rel Alloys' preform business.
  • Ferrotec Corporation: Ferrotec provides hermetic packaging, thermal management solutions, and advanced materials for semiconductor and photonics customers, making it a direct comparable across Hi-Rel's lids, thermal spreaders, and precision components.
  • MacDermid Alpha Electronics Solutions: MacDermid Alpha supplies solder materials, braze preforms, and assembly chemistries for high-reliability electronics manufacturing — overlapping directly with Hi-Rel Alloys' preform product line in defense, medical, and telecom.
  • SCHOTT Electronic Packaging: SCHOTT's Electronic Packaging division manufactures hermetic lids, housings, and feedthroughs for microelectronic and optoelectronic packages — directly overlapping Hi-Rel Lids' core offering across defense, medical, and optical-networking customers.

Broad incumbents

  • CoorsTek: CoorsTek manufactures technical ceramics and engineered components including hermetic packages and lids for semiconductor, aerospace, and medical markets — competing with Hi-Rel Lids and Hi-Rel Products in high-reliability applications.
  • Kyocera Corporation: Kyocera produces hermetic ceramic packages, lids, and electronic components across a much broader portfolio; its semiconductor and electronic device packaging lines compete directly with Hi-Rel in aerospace, telecom, and medical applications.
  • Ametek Electronic Systems & Packaging: Ametek's engineered materials and electronic packaging businesses produce hermetic interconnect solutions, thermal management components, and precision metals serving defense, medical, and industrial markets — broadly comparable to Hi-Rel's portfolio.
  • Honeywell Electronic Materials: Honeywell supplies advanced electronic materials, precision metals, and packaging components across aerospace, defense, and industrial markets; its electronic materials segment competes with Hi-Rel in thermal management and high-reliability joining materials.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

Hi-Rel Group social profiles

Digital presence

Hi-Rel Group financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Hi-Rel Group leadership team

Management profile

Number of profiles

Profiles4 records

Hi-Rel Group funding detail

Funding detail

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Hi-Rel Group M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Hi-Rel Group

What does Hi-Rel Group do?

Hi-Rel Group fabricates tailored metal components used in the construction of high-reliability electronic devices. Its product range spans hermetic package lids, thermal management solutions (thermal spreaders, base plates, CVD diamond, and diamond metal composites), getters (gas adsorbers) for microelectronics, solder and braze preforms, EMI/RFI shielding components, and precision carrier items such as wire bond tabs, sputtering targets, and precision wire. The company serves customers in Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy.

When was Hi-Rel Group founded?

Hi-Rel Group was founded in 1946. It employs 101 to 250 people.

Where is Hi-Rel Group based?

Hi-Rel Group is headquartered in Essex, United States, in the North America region.

How does Hi-Rel Group make money?

One revenue line is on record: high-Reliability Metal Component Sales.

Who are Hi-Rel Group's main competitors?

Direct peers on record are Materion Corporation, Boyd Corporation, Indium Corporation, Ferrotec Corporation, MacDermid Alpha Electronics Solutions and SCHOTT Electronic Packaging. Broad incumbents are CoorsTek, Kyocera Corporation, Ametek Electronic Systems & Packaging and Honeywell Electronic Materials.

Does Hi-Rel Group have an API?

No public API is recorded for Hi-Rel Group.

What industry is Hi-Rel Group in?

Hi-Rel Group's product category is Electronic Packaging Components. Its primary akta.pro industry code is HDAHADAG, Thermal Management & Heat Dissipation Solutions (TIMs, Lids, Heat Sinks), with a secondary code of HDAHAGAM, Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders). Its NAICS code is 33299 and its SIC code is 3679.

Unlock the full company data

50 free credits on sign-up, no credit card required.

Contact sales
Live signals