What EHWA Diamond does

EHWA Diamond is a privately-held Korean industrial diamond tool manufacturer founded in 1975 and headquartered in Osan-si, Gyeonggi-do, with operations in 15+ countries. The company operates through three business units: Electronics (semiconductor IC, display, LED, and solar cell manufacturing tools including CMP pad conditioners, back-grinding wheels, dicing blades, scribing wheels, and diamond wires), Precision Machining (vitrified CBN wheels, rotary dressers, PCD/PCBN cutting inserts, and stationary dressers serving automotive engine/gear, bearing, aerospace, glass/optical, and medical applications), and Construction/Stone (saw blades, drill bits, wire saws, and mining core bits featuring the proprietary ZENESIS patterned diamond technology platform).

The company's core technology rests on its ZENESIS patterned diamond platform, which enables custom design and mass production of application-optimized diamond patterns, and patented CVD CMP pad conditioner tip configurations that maintain a consistent apex profile across the conditioning cycle. Advanced materials such as Polycrystalline Diamond (PCD), Polycrystalline Cubic Boron Nitride (PCBN), Chemical Vapor Deposition (CVD) diamond, and a hybrid HBN material round out the technical stack.

EHWA generates revenue through B2B hardware sales of custom and catalog diamond tooling, with quote-based pricing for application-specific solutions. The go-to-market is sales-led, executed via wholly-owned sales subsidiaries in Korea, the US, Japan, Germany, Italy, India, Mexico, and Thailand, supported by regional manufacturing plants in China, Vietnam, Indonesia, and Korea. Disclosed sales were 375 billion KRW in 2024 (peak) and 361 billion KRW in 2025, with the company's stated vision to be a global leader in diamond tool manufacturing.

Name

EHWA Diamond

Legal name

EHWA Diamond

Website

http://ehwadia.com

Company type

Private

Founded year

1975

Operating status

Operating

Headcount range

101–250 employees

Short description

EHWA Diamond is a Korean industrial diamond tool manufacturer founded in 1975, producing CMP pad conditioners, CBN grinding wheels, PCD/PCBN cutting tools, and ZENESIS-patterned construction/stone tools for semiconductor, automotive, aerospace, and mining customers across 15+ countries.

Ownership category

akta.pro rank

Product category

Industrial Diamond Tools

NAICS

Abrasive Product Manufacturing (32791), Abrasive Product Manufacturing (327910), Mining Machinery and Equipment Manufacturing (333131), Saw Blade and Handtool Manufacturing (332216)

SIC

Machine Tools, Metal Cutting Types (3541), Construction, Mining & Materials Handling Machinery & Equip (3530), Wholesale-Industrial Machinery & Equipment (5084)

akta.pro primary industry

EDM & Electrochemical Machining (Wire/Sinker EDM, ECM) (IMAHADAF)

Keywords

• Diamond cutting tools
• CMP pad conditioners
• Precision grinding wheels
• CBN grinding tools
• Semiconductor dicing blades

Headquarters

HQ city

Seongnam

HQ country

South Korea

HQ region

Asia

Offices19 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Personnel, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. Electronics Diamond Tools: High-precision diamond tools for semiconductor IC fabrication, flat panel display, LED, and solar cell manufacturing. Includes CMP pad conditioners, grinding wheels, dicing blades, and diamond wires.
2. Precision Machining Tools: Grinding wheels, cutting tools, and dressers for automotive, aerospace, bearings, medical devices, and industrial machinery. Includes CBN wheels, vitrified wheels, and rotary dressers.
3. Construction and Stone Diamond Tools: Diamond tools for construction, stone processing, and mining applications including saw blades, drill bits, wire saws, and ZENESIS branded products.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels3 records

Core offering

EHWA Diamond manufactures and sells industrial diamond and CBN abrasive tools through three business units: Electronics (CMP pad conditioners, back grinding wheels, dicing blades, scribing wheels, diamond wires for semiconductor/display/LED/solar manufacturing), Precision Machining (vitrified CBN wheels, rotary dressers, PCD/PCBN cutting tools for automotive, aerospace, bearings, and medical applications), and Construction/Stone (saw blades, core drill bits, wire saws, and mining tools using ZENESIS patterned diamond technology). The company sells custom-engineered tooling solutions to industrial enterprise customers globally through wholly-owned sales subsidiaries and Asian manufacturing plants.

Product overview

EHWA Diamond is a Korean manufacturer of industrial diamond tools established in 1975, operating across three business units: Electronics (semiconductor IC, Display, LED, and Solar Cell manufacturing tools including CMP pad conditioners, grinding wheels, dicing blades, diamond wires, and scribing wheels), Precision Machining (high-precision grinding wheels using CBN and diamond, rotary dressers, stationary dressers, and cutting tools including PCD/PCBN inserts for automotive, aerospace, bearings, and medical applications), and Construction/Stone (diamond saw blades, drill bits, and wire tools featuring the proprietary ZENESIS patterned diamond technology platform). The company offers a complete range of diamond tools serving semiconductor fabrication, precision engineering, construction, stone processing, mining, and metalworking industries globally.

Differentiator

Problem solved

Functional benefit

Brands

• ZENESIS: Platform technology for patterned diamond tools with optimal diamond patterns for construction and stone applications
• ZENESIS 5 PRO
• ZENESIS 5
• ZENESIS-R+
• ZENESIS-R
• DiamondX
• Nexxo

Products and services

• CVD CMP Pad Conditioner Semiconductor front-end application CMP pad conditioner featuring CVD diamond coated tips with various patterns; the flat-faced apex maintains critical pressure for pad conditioning with constant pad cut rate throughout the conditioning cycle, supporting yield and uniformity in wafer processing.
• New BSL CMP Pad Conditioner Semiconductor front-end CMP pad conditioner using BSL bonding to deliver strong diamond holding force through combined chemical reaction and mechanical contact, with a carbide interface for corrosion resistance and maximized diamond chip pocket for high diamond exposure.
• Electroplated CMP Pad Conditioner CMP pad conditioner produced via Ni electroplating (mechanical bonding) that delivers excellent disk flatness for superior wafer uniformity and near-zero micro-scratches during semiconductor pad conditioning.
• Back Grinding Wheel – Nano Pol (Vitrified) Semiconductor back-end vitrified back grinding wheel that improves wafer surface roughness and die strength while reducing grinding stress and edge chipping; capable of grinding Si wafers down to 17 micrometers for ultra-thin wafer applications.
• Back Grinding Wheel – Resin Semiconductor back-end resin-bonded grinding wheel available in rough grinding (Z1) and fine grinding (Z2) configurations for thin wafer processing with minimal edge chipping.
• Dicing Blade High accuracy, super-thin diamond dicing blade for semiconductor back-end dicing operations with minimized chipping and consistent quality achieved through stringent particle size distribution control.
• Diamond Wire – Wafer Slicing Solar industry diamond wire engineered for high-throughput wafer slicing with superior cutting quality and reduced kerf loss versus slurry-based processes.
• Diamond Wire – Squaring Solar diamond wire for squaring operations featuring high throughput, reduced kerf loss, and enhanced flatness; enables 3-10x faster cutting versus slurry process with longer wire lifetime and no wire breakage.
• Scribing Wheel Display industry diamond scribing wheel with stable performance enabled by an automatic manufacturing system and excellent edge strength of glass during the scribing process.
• Vitrified CBN Wheel Cubic boron nitride grinding wheel available in multiple configurations for camshaft, crankshaft, bearing, and CV joint grinding applications with high removal rates and longer wheel life in automotive precision machining.
• Rotary Dresser Diamond rotary dresser for precision dressing of grinding wheels used in engine valve, turbocharger, CV joint, ball screw, and LM guide applications in automotive and industrial precision machining.
• Cutting Tools (PCD/PCBN/Carbide Inserts) PCD, PCBN, and carbide cutting tool inserts including turning, boring, grooving, parting, and milling inserts plus rotating tools for CNC machining in precision engineering applications.
• HBN (Hybrid Solid PCBN) Material Hybrid polycrystalline cubic boron nitride material manufactured using a special sintering process with ceramic binder and CBN powder, designed for roughing and finishing of cast iron components.
• Stationary Dressers (SDD, FDD, MDD, IDD) Diamond stationary dressers for conventional abrasive wheels, including Single-point Diamond Dresser (SDD), Forming Diamond Dresser (FDD), Multi-point Diamond Dresser (MDD), and Impregnated Diamond Dresser (IDD) for grinding wheel conditioning.
• ZENESIS Patterned Diamond Technology Platform Proprietary platform technology enabling custom design and mass production of optimal diamond patterns for construction and stone applications; multiple generations (ZENESIS 5 PRO, ZENESIS 5, ZENESIS-R+, ZENESIS-R) target different aggregate hardness and concrete reinforcement levels.
• ZENESIS Floor Saw Blade Patterned diamond floor saw blade for cured concrete using ZENESIS technology, available in variants tailored to hard, medium, and soft aggregate conditions.
• ZENESIS Wall Saw Blade Patterned diamond wall saw blade using ZENESIS technology engineered for cutting heavily reinforced concrete in construction demolition and remodeling applications.
• Wire Saws Diamond wire saws for construction cutting, quarrying, and stone slabbing in stone processing operations, designed for efficient cutting of stone blocks with minimal kerf loss.
• Core Drill Bits Core drill bits for wet and dry drilling in construction applications, available in standard, 3-piece, and segment type configurations to match varying substrate and rig requirements.
• Mining Core Bits Mining drilling tools including Geo-Pro Series and Explorer Series core bits, plus casing shoes, reaming shells, and core drills for exploration and production drilling operations.
• DiamondX Metal-Working Tools Diamond tools for demanding metal-working applications including cut-off wheels, grinding discs, and depressed center grinding discs for sheet metal, pipe, and foundry operations, sold under the DiamondX sub-brand.

Quantifiable outcome

• Faster cutting speed: 3-10 times compared with slurry process
• +2 more outcomes

Segments3 records

Ideal customer profiles3 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Scale indicators3 records

Recent moves19 records

Expansion highlights6 records

Market position

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/johnny_ehwa
• Facebookfacebook.com/pt.ehwadia.co.kr
• LinkedInlinkedin.com/company/ehwa-diamon

Compliance5 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries13 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about EHWA Diamond