ELEXCON

What ELEXCON does

ELEXCON (elexcon Shenzhen International Electronics Show and Embedded System Exhibition) is an annual B2B trade exhibition and conference organizer focused on the electronics and embedded systems industry. Operated by Informa Creative Exhibition (Shenzhen) Co., Ltd. (博闻创意会展（深圳）有限公司) — a subsidiary of UK-listed Informa Group — ELEXCON runs the 23rd edition of its flagship exhibition on September 9–11, 2026 at Shenzhen International Convention and Exhibition Center (Baoan), co-located with CIOE China Optoelectronics Expo and IC Innovation Expo to create a combined 340,000 sqm platform. The exhibition covers chips, storage, embedded AI, power semiconductors, automotive electronics, electronic components, modules, SiP/advanced packaging, and AIoT solutions, with themed tracks under "All for AI, All for Green."

The product portfolio centers on the annual exhibition and six concurrent specialized forums and conferences: the 8th China Embedded Technology Conference, 10th China System-in-Package (SiP) Conference, Solid-State Transformer (SST) Technology Innovation and Industry Development Forum, 2026 Shenzhen International Automotive Electronics Innovation Technology Forum, and KAIFA GALA Greater Bay Area Developer/Engineer Carnival. Conference programming is anchored by presidency and co-chair units including ChipHeat (芯和半导体), Alibaba Cloud (阿里云), Moore Threads (奇异摩尔), OE Auto, AI PowerDC, and 21dianyuan.

The business model is event-driven B2B, generating revenue primarily through one-time booth rental licenses from exhibitors (5,000+ companies at the 2026 edition) and professional services revenue from conference and forum participation fees, sponsorship, and association partnerships. Visitor attendance is free of charge to maximize attendance. Marketing and distribution leverage 20+ industry media partners, 30+ supporting industry associations (including Shenzhen Semiconductor Industry Association, Shenzhen Automotive Electronics Industry Association, ICEA, and VNETA), the official website, and WeChat. Customer segments include engineers, developers, procurement managers, and technical decision-makers from consumer electronics, automotive, communications, data centers, medical electronics, industrial control, and IoT verticals. Pricing is not publicly disclosed and is handled through direct inquiry via the official registration portal (bj.infosalons.com.cn).

Name

ELEXCON

Legal name

博闻创意会展（深圳）有限公司

Website

https://elexcon.com

Company type

Private

Founded year

2003

Operating status

Operating

Headcount range

11–50 employees

Short description

ELEXCON operates the elexcon Shenzhen International Electronics Show and Embedded System Exhibition, an annual B2B trade show and conference platform serving 5,000+ exhibitors and 240,000+ professional visitors in chips, embedded AI, power semiconductors, automotive electronics, and SiP/advanced packaging. It is run by Informa Creative Exhibition (Shenzhen) Co., Ltd.

Ownership category

akta.pro rank

Product category

Trade Show & Exhibition Services

NAICS

Convention and Trade Show Organizers (56192)

akta.pro primary industry

Technology & Innovation Expos Organizers (THAHABAE)

akta.pro secondary industries

Engineering & Technology Congresses (THAHAJAE), Professional & Certification Expos Organizers (THAHABAD)

Keywords

• Electronics trade show
• Embedded systems exhibition
• Semiconductor conference
• Automotive electronics forum
• Professional exhibition services

Headquarters

HQ city

Shenzhen

HQ country

China

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Operations, Marketing or Sales, Personnel, Infrastructure, Technology or R&D

Revenue model

1. Exhibition Booth Fees: Revenue generated from companies renting exhibition booths to showcase their electronic components, semiconductors, embedded systems, and related technologies to professional visitors
2. Conference and Forum Participation: Revenue from specialized conferences including 中国嵌入式技术大会, 中国系统级封装大会SiP, 汽车电子创新技术论坛, and other technical forums

Go-to-market motion1 record

Distribution channels3 records

Marketing channels3 records

Core offering

ELEXCON organizes an annual B2B trade exhibition and embedded systems show at Shenzhen International Convention and Exhibition Center (Baoan), co-located with CIOE China Optoelectronics Expo and IC Innovation Expo to create a 340,000 sqm combined technology showcase. Revenue is generated by selling exhibition booths to electronics component, semiconductor, embedded systems, power electronics, and automotive electronics companies, and by running 100+ concurrent paid technical conferences and forums including the China Embedded Technology Conference, China System-in-Package Conference (SiP), Solid-State Transformer Forum, and Automotive Electronics Innovation Technology Forum. The 2026 edition is themed 'All for AI, All for Green' and targets engineers, developers, procurement managers, and technical decision-makers across consumer electronics, automotive, communications, data centers, medical electronics, industrial control, and IoT sectors.

Product overview

ELEXCON operates as a professional electronics trade show and exhibition platform, organizing the elexcon Shenzhen International Electronics Show and Embedded System Exhibition annually. The event features multiple specialized conferences and forums including the 8th China Embedded Technology Conference, 10th China System-in-Package Conference, Solid-State Transformer (SST) Technology Forum, and the 2026 Shenzhen International Automotive Electronics Innovation Technology Forum. The exhibition covers core sectors including chips, storage, embedded AI, power semiconductors, automotive electronics, electronic components and modules, serving engineers, developers, procurement managers and technical decision-makers from consumer electronics, automotive, communications, data centers, medical electronics, industrial control, and IoT sectors. The 2026 edition themed 'All for AI, All for Green' spans 340,000㎡ with over 240,000 professional visitors and 5,000+ exhibitors.

Differentiator

Problem solved

Functional benefit

Products and services

• elexcon Shenzhen International Electronics Show and Embedded System Exhibition (elexcon深圳国际电子展暨嵌入式展) Annual B2B professional trade show focused on electronic components and embedded technology, held at Shenzhen International Convention and Exhibition Center (Baoan). The exhibition covers chip components, storage, embedded AI, power semiconductors, automotive electronics, electronic components and modules, and serves engineers, developers, procurement managers, and technical decision-makers from consumer electronics, automotive, communications, data centers, medical electronics, industrial control, and IoT sectors.
• China Embedded Technology Conference (中国嵌入式技术大会), 8th edition Annual conference held during the ELEXCON exhibition focusing on embedded systems, edge AI, wireless connectivity, operating systems, and industrial control technologies. Targets embedded systems developers and engineers across the electronics value chain.
• China System-in-Package Conference SiP (中国系统级封装大会SiP), 10th edition Annual conference focused on system-level packaging technology including SiP, 2.5D/3D advanced packaging, Chiplet, and heterogeneous integration in the AI computing era. Targets semiconductor packaging engineers, IC designers, and advanced packaging technology decision-makers.
• Solid-State Transformer (SST) Technology Innovation and Industry Development Forum (固态变压器SST技术创新与产业发展论坛) Forum covering the entire Solid-State Transformer (SST) industry chain from research, components, and systems to applications and standards. Targets power electronics engineers, data center infrastructure designers, and power supply industry professionals, with particular focus on AI data center power infrastructure.
• 2026 Shenzhen International Automotive Electronics Innovation Technology Forum (2026深圳国际汽车电子创新技术论坛) Forum jointly organized with OE Auto discussing automotive electronic technology innovation and development in the context of vehicle electrification, intelligence, networking, and sharing transformation. Targets automotive electronics engineers, Tier 1 suppliers, OEMs, and automotive industry decision-makers.
• KAIFA GALA Greater Bay Area Developer/Engineer Carnival (KAIFA GALA 大湾区开发者/工程师嘉年华) Annual event for developers and engineers in the Greater Bay Area, held as part of the ELEXCON exhibition program. Targets embedded systems developers, hardware engineers, and software developers working in the electronics industry.

Named customers6 records

Segments2 records

Ideal customer profiles3 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature1 record

Partnerships

Nine partnerships are on record, tiered minor and core.

• AI PowerDCminorStrategic or Co-development Partner · 10 September 2026Co-organizer of the 固态变压器（SST）技术创新与产业发展论坛 (Solid-State Transformer Technology Innovation and Industry Development Forum), focusing on AI data center power infrastructure.
• 21世纪电源网minorStrategic or Co-development Partner · 10 September 2026Co-organizer of the 固态变压器（SST）技术创新与产业发展论坛, providing expertise in power electronics and power supply industry communication.
• OE汽车coreStrategic or Co-development Partner · 9 September 2026Co-organizer of the 2026深圳国际汽车电子创新技术论坛 (2026 Shenzhen International Automotive Electronics Innovation Technology Forum). OE汽车 collaborates with elexcon to explore automotive electronic technology innovation and development, bringing together industry elites to share cutting-edge technologies and discuss solutions to promote high-quality development of the automotive electronics industry.
• 芯和半导体coreStrategic or Co-development Partner · 9 September 2026Co-chair unit of the 第十届中国系统级封装大会SiP (10th China System-in-Package Conference). As conference co-chair, 芯和半导体 plays a leading role in the SiP and advanced packaging conference, which has reached its 10th year milestone.
• 阿里云coreStrategic or Co-development Partner · 9 September 2026Conference presidency unit for the 10th China SiP Conference, contributing expertise in AI computing and advanced packaging integration.
• 奇异摩尔coreStrategic or Co-development Partner · 9 September 2026Conference presidency unit for the 10th China SiP Conference, bringing expertise in chip-level integration technologies.
• 博闻创意会展（深圳）有限公司coreOthersThe organizing company (主办单位) of elexcon深圳国际电子展暨嵌入式展. 博闻创意会展 is the parent company responsible for organizing and managing the exhibition.
• CIOE中国光博会coreStrategic or Co-development PartnerCo-located exhibition partner for the 2026 event. The three exhibitions (elexcon, CIOE, IC创新博览会)联动 with combined scale of 340,000 square meters, creating synergies across optoelectronics and electronics industries.
• IC创新博览会coreStrategic or Co-development PartnerCo-located exhibition partner for the 2026 event, integrated with elexcon and CIOE中国光博会 in the three-exhibition linkage strategy.

Scale indicators5 records

Recent moves3 records

Expansion highlights6 records

Direct peers

• CITE (China Information Technology Expo): Major Chinese electronics and information technology trade show held in Shenzhen. Direct peer for Chinese electronics exhibitors and visitors, operating in the same Shenzhen venue ecosystem and competing for similar government and industry association support.
• embedded world: Annual trade fair focused on embedded systems held in Nuremberg by NürnbergMesse. Most direct competitor to ELEXCON's embedded technology focus, serving overlapping customer segments including embedded systems engineers, developers, and component suppliers.
• productronica: World's leading trade fair for electronics development and production, held biennially in Munich by Messe München. Most direct competitor for electronics manufacturing equipment exhibitors (SMT, testing, packaging), complementing electronica in the same Munich cycle.
• CIOE (China International Optoelectronic Exposition): China's leading optoelectronics trade show and ELEXCON's co-located partner in the 2026 three-exhibition strategy. Directly comparable in format, scale, and electronics industry focus, serving overlapping exhibitor and professional visitor audiences.
• Nepcon Asia: Asia's premier electronics manufacturing industry trade show covering SMT, testing, and packaging. Directly comparable in scope (electronics manufacturing equipment and processes) and target audience of engineers and procurement managers.
• Computex Taipei: Major B2B trade show for ICT and electronics held annually in Taipei by TAITRA. Comparable in scale and audience (electronics professionals, exhibitors), and the leading Greater China peer for IT and electronics industry stakeholders.

Broad incumbents

• SEMICON: Global semiconductor manufacturing trade show series organized by SEMI. Major competitor for semiconductor exhibitors, particularly relevant given ELEXCON's IC Innovation Expo co-location and SiP conference focus on advanced packaging.
• electronica: World's leading trade fair for electronic components, systems, and applications, held biennially in Munich by Messe München. Direct competitor for international electronics exhibitor attention and the gold-standard global reference for electronic components trade shows.
• CEATEC: Japan's largest combined IT and electronics exhibition organized by JEITA. Comparable in combining consumer electronics with industrial and embedded technology, competing for Asia-Pacific exhibitor mindshare and showcasing similar component and module trends.

Emerging players

• ICCAD (China IC Design Conference): China's leading integrated circuit design industry conference and exhibition. Direct overlap with ELEXCON's IC Innovation Expo co-located exhibition and SiP conference focus, serving Chinese IC designers, EDA vendors, and semiconductor IP providers.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about ELEXCON