What Hexagon Semi does

Hexagon Semi (合肥六角形半导体有限公司) is a Chinese fabless semiconductor company founded in April 2019 and headquartered in Hefei, with R&D operations in Shanghai and a dedicated marketing center in Shenzhen. The company designs high-integration, low-power image processing SoC chips built on a self-developed RISC-V CPU core foundation combined with proprietary image processing IPs in heterogeneous architectures spanning RISC-V + DSP/NPU + dedicated pipelines. Its product portfolio includes the HX77 "Tianxiang" series targeting AI+AR glasses main-control applications, the HX7710 and HX66XX display/SoC lines, the HX5520 SoC, the HX32L303 MCU, and the HX6613 battery management system chip.

The company serves ODMs, OEMs, and module makers across AR/VR glasses, industrial HMI, medical devices, consumer electronics, smart home, and automotive electronics. Its go-to-market emphasizes single-chip integration that eliminates external DRAM and reduces the bill of materials by a stated 25-35%, paired with turnkey hardware reference designs and software toolchains that allow customers to reach mass production in approximately 3 months.

Hexagon Semi monetizes through direct chip sales to manufacturers, a horizontally segmented product strategy addressing multiple end verticals, and an outbound channel combining its Shenzhen marketing operation with participation in industry shows such as VR/AR EXPO CHINA and SEMI-e. The company holds ISO9001 certification and national-level "Specialized, Refined, and Novel Small Giant Enterprise" status, supporting supply chain access for medical and automotive customers.

Name

Hexagon Semi

Legal name

合肥六角形半导体有限公司

Website

https://hexagonsemi.com

Company type

Private

Founded year

2019

Operating status

Operating

Headcount range

1–10 employees

Short description

Hexagon Semi is a Chinese fabless semiconductor company founded in 2019 that designs high-integration, low-power image processing SoC chips built on self-developed RISC-V cores, serving AR/VR glasses, industrial HMI, medical, consumer electronics, and automotive OEMs.

Ownership category

akta.pro rank

Product category

Semiconductor SoC Chips

NAICS

Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Audio, Imaging & Multimedia SoCs (ISP/Codec/Display) (HDAHABAH)

akta.pro secondary industries

System-on-Chip (SoC) Platforms (Mobile/Consumer/Embedded) (HDAHAJAC), Compute & Acceleration ICs (CPU/GPU/AI/FPGA/ASIC) (HDAHABAC), Real-Time & Industrial Control Processors (RT MCUs/PLC-class SoCs) (HDAHAJAL)

Keywords

• Image processing SoC chips
• AR/VR display processors
• Human-machine interface chips
• Low-power microcontrollers
• Video decoder SoCs

Headquarters

HQ city

Hefei

HQ country

China

HQ region

Asia

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

1. SoC Chip Product Sales: Hexagon Semi generates revenue primarily from the sale of proprietary image processing SoC chips and microcontrollers. Chips are sold directly to manufacturers and ODMs/OEMs across consumer electronics, AR/VR, industrial, medical, and automotive sectors. The company achieved annual revenue exceeding 100 million RMB in 2022, with continued strong growth.
2. Turnkey Solutions and Reference Design Services: Hexagon Semi provides turnkey solutions, reference designs, and development kits to AR/VR and HMI device manufacturers, including the Tianxiang public reference design for AR glasses, HX66xx HMI turnkey solutions, and algorithm/software support packages. This complements chip sales and deepens customer lock-in.

Go-to-market motion3 records

Distribution channels3 records

Marketing channels5 records

Core offering

Hexagon Semi designs and sells high-integration, low-power image processing SoC chips built on a self-developed RISC-V CPU architecture, targeting AR/VR glasses, human-machine interface (HMI) terminals, consumer electronics, automotive display, and battery management applications. Its product line includes the HX77 Tianxiang AR display processor, HX7710 AR terminal image processing chip, HX66xx HMI SoC, HX5520 video decoder SoC, HX32L303 ultra-low-power MCU, and HX6613 BMS chip, complemented by turnkey reference designs and self-developed gesture recognition algorithms for ODMs/OEMs.

Product overview

Hexagon Semi offers a portfolio of high-integration, low-power image processing SoC chips and microcontrollers. The product line includes: (1) HX77 Series (Tianxiang Chip) - flagship AR display processor for AI+AR glasses with heterogeneous architecture supporting 2K@60fps; (2) HX7710 - AR terminal image processing chip with gesture recognition; (3) HX66XX series - human-machine interaction (HMI) chips for industrial control, medical and smart home applications; (4) HX5520 - video decoder SoC for 2K@120fps processing; (5) HX32L303 - ultra-low power MCU; (6) HX6613 - battery management system chip. All products leverage self-developed RISC-V CPU cores and proprietary image processing algorithms, with applications spanning AR/VR, consumer electronics, automotive, and industrial control.

Differentiator

Problem solved

Functional benefit

Products and services

• HX77 Series (Tianxiang Chip) High-performance, low-power AR display processor SoC with heterogeneous architecture (CPU+GPU+DPU) supporting 2K@60fps output, 3DoF spatial hover, and multiple display interfaces (MIPI, LVDS, DP/eDP) for AR/VR glasses and display terminals.
• HX7710 AR Terminal Image Processing Chip AR terminal image processing chip with RISC-V core, integrated AI gesture recognition for AR human-computer interaction, supporting wired (USB-Type C) or wireless (Bluetooth 5.1) connectivity to phones or cloud.
• HX66XX Series Highly integrated low-power image processing SoC with RISC-V core (300MHz, FPU, DSP), DP/eDP input, dual MIPI or 4-group LVDS output, JPEG codec, Audio Codec, USB3.1, built-in PMU, for HMI applications including industrial control, medical devices, and smart home.
• HX5520 Video Decoder SoC Video processing display control SoC chip with 4-lane MIPI RX input and 4-lane MIPI TX output, supporting 2K@120fps ultra-high definition input/output, with self-developed 32-bit RISC-V CPU core, 2.5D GPU, and integrated PMU.
• HX32L303 Ultra-Low Power MCU ARM Cortex-M0+ 32-bit microcontroller up to 48MHz with built-in high-speed memory, enhanced I/O ports and multiple peripherals, suitable for ultra-low power intelligent terminal applications.
• HX6613 BMS Chip Highly integrated lithium battery management system (BMS) chip for 5-13 cell lithium batteries, applicable to electric bicycles, motorcycles, balance vehicles, scooters, elderly vehicles, toys, appliances, power tools, communication/storage, and solar energy storage systems.
• Tianxiang Turnkey Reference Design for AR Glasses Complete turnkey reference design solution package including chips, self-developed algorithms (gesture recognition), reference designs (hardware schematics, PCB layouts, software drivers, optical module adaptation), and SDK enabling customer mass production within 3 months for AR/VR and HMI device manufacturers.

Quantifiable outcome

• HX77 Tianxiang chip achieves 40%+ lower power consumption than comparable foreign products, with display latency and image quality reaching international advanced levels.
• +4 more outcomes

Named customers6 records

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability4 records

Feature7 records

Partnerships

One partnership is on record.

• VeriSilicon (芯原微电子)coreTechnology or Integration · 10 March 2026Hexagon Semi's HX77 AR display processor SoC successfully achieved first-pass silicon tape-out leveraging VeriSilicon's IP portfolio including GCNanoUltraV 2.5D GPU IP, DW100 DeWarp Processing IP, and DC9200Nano Display Processing IP. The collaboration enables ultra-low power consumption (milliwatt-level) at 2K@60fps for AR glasses, with image processing achievable without external DDR memory, reducing system latency and energy consumption. VeriSilicon's Nano wearable IP portfolio enables subsystem-level integration optimization for optimal power efficiency, performance, and time-to-market balance.

Scale indicators11 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• Ambarella: US-listed fabless semiconductor company specializing in low-power, high-definition video and image processing SoCs for AIoT, automotive, and edge AI applications. Ambarella's CV series competes with Hexagon's HX5520 and HX77 in low-power image/video processing for camera-centric edge devices.
• GigaDevice: Beijing-headquartered Chinese fabless semiconductor company specializing in flash memory, MCUs (GD32 series), and SoCs. The GD32 MCU line directly competes with Hexagon's HX32L303 ultra-low-power MCU in industrial control, smart appliances, and IoT terminals.
• VeriSilicon: Shanghai-based fabless semiconductor IP and design services company that is Hexagon Semi's core technology partner — VeriSilicon's GCNanoUltraV GPU, DW100 DeWarp, and DC9200Nano display IPs power Hexagon's HX77 AR SoC. Both are Chinese fabless chip designers targeting image/multimedia processing, with overlapping customer bases in AR/VR and IoT.
• Amlogic: Chinese fabless SoC company specializing in multimedia and video processing SoCs for smart TV, set-top boxes, and AIoT. Competes with Hexagon's HX5520 and HX66xx in video codec processing, HMI applications, and smart display terminals.
• Allwinner Technology: Chinese fabless SoC company offering application processors for smart home, AIoT, and consumer electronics. Competes with Hexagon in HMI, smart appliance, and low-power multimedia SoC segments with similar Chinese OEM customer bases.
• Rockchip (Fuzhou Rockchip Electronics): Chinese fabless SoC company specializing in ARM-based application processors for tablets, smart displays, IoT, and AIoT. Overlapping with Hexagon's HX66xx HMI and HX32L303 MCU products in smart home appliances, HMI panels, and consumer electronics.
• Sigmastar (Xinova Microelectronics): A Chinese fabless SoC company (subsidiary of Novtek) focused on image processing, video codec, and display SoCs for automotive, AIoT, and smart vision applications. Direct competitor to Hexagon's HX5520 and HX66xx lines with overlapping target customers in HMI, automotive, and consumer electronics.
• Actions Semiconductor: Chinese fabless SoC company focused on multimedia application processors for AIoT, Bluetooth audio, and video processing applications. Competes with Hexagon's HX5520 video decoder SoC in consumer electronics and Bluetooth/wireless connected devices.

Broad incumbents

• MediaTek: Taiwanese fabless semiconductor giant supplying SoCs across mobile, smart home, automotive, and IoT. MediaTek's Kompanio and Dimensity lines include display/image processing capabilities that compete with Hexagon's multimedia SoC portfolio in smartphones, AR/VR, and consumer electronics.
• Qualcomm: Global semiconductor incumbent whose Snapdragon AR1/AR2 platforms target the same AI+AR glasses SoC market as Hexagon's HX77 Tianxiang. While Qualcomm operates across mobile, automotive, and IoT broadly, its dedicated AR silicon represents the most direct competitive threat to Hexagon's flagship product line.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Subsidiaries1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Hexagon Semi