Cressem

What Cressem does

Cressem (CRESSEM Co., Ltd. / 크레셈) is a South Korean manufacturer of customized automated inspection equipment for the semiconductor and PCB packaging industry. Founded in June 2014 as a KAIST research-based spin-off initially focused on ultrasonic ACF bonding technology, the company pivoted around 2017 to semiconductor post-process inspection and now produces AI-powered inspection systems (AOI and AFVI), 3D thickness and warpage measurement systems, wafer inspection equipment (including HBM-related systems), and supporting automation modules such as dry cleaning, laser marking, AMR material handling, and vacuum/bending packaging. Its platform-based architecture combines proprietary 2D/3D vision technology, a Dual-Layer AI Filtering inspection pipeline, and an MLOps autonomous optimization platform that enables real-time monitoring and automated model redeployment on production lines without manual intervention.

The company's core technology differentiators are concentrated in computer-vision-driven defect detection for advanced packaging formats (HBM, FC-BGA, FC-CSP, CSP, BGA) and in inline automation that integrates inspection with cleaning, marking, measurement, sorting, and packaging into single lines, with documented outcomes such as ±2um 3D measurement repeatability, 3-sigma 1um bump-height precision, and 75–92% space savings versus conventional lines. Product naming explicitly emphasizes AI integration (Inline AI AOI, Inline AI AFVI across BGA/CSP/FC-CSP variants), and the company has invested since 2019 in proprietary AI libraries, robotics, and optics for semiconductor packaging.

Cressem generates revenue primarily through one-time sales of customized capital equipment sold directly to semiconductor manufacturers, substrate producers, LED package makers, and automotive electronics packagers via an enterprise field-sales motion, supported by a multilingual website and dedicated sales channels. It operates a wholly-owned branch network across South Korea (HQ Incheon, factory Songdo, former R&D base Daejeon), China, Taiwan, Philippines, and Vietnam. The company is privately held and venture-backed, with investors including Mirae Holdings, SETI Advanced Tech Venture Fund, and Korea Development Bank; specific funding amounts and revenue are not publicly disclosed.

Name

Cressem

Legal name

CRESSEM Co., Ltd. (크레셈)

Website

https://cressem.com

Company type

Private

Founded year

2014

Operating status

Operating

Headcount range

1–10 employees

Short description

Cressem (크레셈) is a South Korean manufacturer of customized AI-powered automated optical inspection (AOI/AFVI), 3D thickness/warpage, and wafer inspection equipment — including HBM systems — for semiconductor packaging, substrate, and PCB manufacturers, sold directly to fabs across East and Southeast Asia.

Ownership category

akta.pro rank

Product category

Semiconductor Inspection Equipment

NAICS

Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables (334513), Navigational, Measuring, Electromedical, and Control Instruments Manufacturing (33451)

SIC

Industrial Instruments For Measurement, Display, And Control (3823), Instruments For Meas & Testing Of Electricity & Elec Signals (3825)

akta.pro industry

PRIMARYHDAAAEAG

Industrial Vision & Quality Inspection

Hardware, Technology & Telecom/Artificial Intelligence & Machine Learning/Computer Vision & Video Analytics

SECONDARYIMAGAGAH

Test, Measurement & Calibration Equipment Manufacturing Services (ATE, DAQ, metrology electronics)

Industrials, Manufacturing & Construction/Electrical Equipment & Industrial Electronics/Industrial Electronics Manufacturing Services (EMS/ODM for industrial electronics)

SECONDARYHDAHAEAI

Wafer Handling, Automation & Robotics (AMHS)

Hardware, Technology & Telecom/Semiconductors & Electronic Components/Semiconductor Manufacturing Equipment

Keywords

• Semiconductor inspection equipment
• Automated optical inspection
• AI vision inspection systems
• PCB substrate inspection
• Semiconductor packaging inspection

Headquarters

HQ city

Daejeon

HQ country

South Korea

HQ region

Asia

Offices5 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Customized Inspection Equipment Sales: CRESSEM generates revenue primarily through the design, development, and sale of customized automated inspection equipment for semiconductor, PCB substrate, LED package, and automotive electronic package manufacturing sectors. Equipment includes AOI systems, AFVI systems, thickness measurement systems, and integrated automation lines.

Go-to-market motion2 records

Distribution channels1 record

Marketing channels2 records

Core offering

Cressem designs, develops, and manufactures customized AI-powered inspection equipment (AOI, AFVI, thickness/warpage measurement systems) for semiconductor substrates, packages, and wafers, as well as related inline automation modules (dry cleaning, laser marking, AMR, packaging). The equipment integrates proprietary 2D/3D vision technology, Dual-Layer AI Filtering, and an MLOps autonomous optimization platform, and is sold to semiconductor and PCB manufacturers globally.

Product overview

CRESSEM is a customized equipment manufacturer specializing in total PCB and semiconductor inspection solutions. The product portfolio comprises four main categories: (1) Semiconductor Substrate Inspection Equipment (AOI and AFVI systems with AI capabilities, plus thickness measurement), (2) Package Inspection Equipment (External Appearance Inspection, Ball Inspection, Wire Inspection), (3) Wafer Inspection Equipment (HBM inspection including surface/transmission and die stacking, sawing inspection, warpage measurement), and (4) Automation Systems (Dry Cleaning, Laser Marking, AMR, Vacuum Packaging, Bending Packaging). The company's platform-based approach combines 2D/3D vision technology, AI libraries, optics, and robotics to deliver AI-powered inspection systems (AOI/AFVI) with MLOps autonomous optimization capabilities. Key differentiated products include Panel Inline AI AOI and Strip Inline AI AFVI systems (CSP, FC-CSP, BGA variants) that integrate inspection with dry cleaning, marking, measurement, sorting, and packaging into single inline solutions.

Differentiator

Problem solved

Functional benefit

Products and services

• External Appearance Inspection (AOI / standard) Inline visual inspection system for semiconductor packages, substrates, and PCBs; automatically feeds materials from upstream machines, performs inspection, and transfers to the next machine. Equipped with 8-step lighting, customizable 2D/3D optical system, full suite of semiconductor packaging inspection algorithms, and SECS/GEM compatibility.
• External Appearance Inspection (AOI / variable magnification) Wire inspection system with variable magnification optical capabilities for detailed semiconductor package examination.
• External Appearance Inspection (AOI / auto focus) Automated visual inspection system with auto-focus capabilities for semiconductor package external appearance examination.
• Ball Inspection Inspection system for ball grid array and solder ball examination in semiconductor packages.
• Individual Panel AI AOI AI-powered 2D line-scan camera system for inspecting underplating, Au spread, protrusions, dents, Open, Short, Slit, Pin Hole, Pattern Slip, Pattern Separation, Space, Gap, Stain, DF Peeling, and Dent defects on individual semiconductor substrate panels.
• Panel Inline AI AOI AI-powered in-line panel inspection system for the substrate manufacturing process that automatically classifies panels as good or defective, with USC Dry Cleaning, Flip, Line Scan auto magnification (3.5-1.75μm), Detail Scan 1.6μm resolution, and ODB data interface. Achieves 81% space savings and saves 33 operators per 3-shift operation.
• Strip Inline AI AFVI (CSP) All-in-one inline AI inspection solution for Chip Scale Packages (CSP) that performs CO2 dry cleaning, 2D AFVI inspection, laser marking, 3D thickness and warpage measurement, sorting, and packaging. Features Line Scan 1-3X auto magnification, Detail Scan 0.1-0.5X auto magnification, and 3D sensor with ±2μm repeatability. Achieves 92% space savings and saves 141 operators.
• Strip Inline AI AFVI (FC-CSP) Industry-first inline inspection system integrating warpage, thickness, 2D, and 3D inspections for FC-CSP (Flip-Chip Chip Scale Package) products. Features Line Scan with 1.5-3μm resolution and an auto tool changer. Achieves 69% space savings and saves 18 operators.
• Unit Inline AI AFVI (BGA) Inline system for FC-BGA devices supplied in JEDEC trays that classifies devices by warpage and thickness, performs 2D/3D AFVI inspection, then packages them. Features Tornado Dry Cleaning, Top/Bottom Line Scan plus Area Scan, 3D warpage and thickness measuring at ±2μm repeatability, Line Scan at 3μm resolution, Detail Scan at 1.6μm resolution, 3D Sensor Ball at 3 Sigma 1μm bump height, and AI-powered VRS for 120-body inspection. Achieves 75% space savings and saves 33 operators.
• Individual Strip AI AFVI (BGA) Non-contact 3D measurement system for measuring bump height (FBH, RBH), diameter, coplanarity, volume, and surface roughness before and after the SOP Coin process for BGA packages. Features manual loading/unloading and inspects for Foreign Material, Scratch, Crack, Damage, Shorts, Protrusion, SR Dirt, Discolor, Pressed, Residue, Dent, Pin Hole, Warpage, Thickness, and Ball Inspection.
• PCB Warpage & Thickness Measurement System Thickness measurement system that uses a 3D sensor instead of conventional contact methods to measure top and bottom thickness simultaneously. Supports DDR4, DDR5, and SOCAMM2 memory modules. Features non-contact 3D inspection, ±2μm repeatability accuracy, sorting function, and selective data extraction from desired positions.
• HBM Wafer Inspection Systems Inspection equipment for HBM (High Bandwidth Memory) wafer processes, including wafer surface and transmission inspection as well as wafer die stacking height and tilt inspection for 3D semiconductor packaging.
• Wafer Die Chipping & Crack Inspection Sawing-related wafer inspection system for detecting die chipping and cracks during semiconductor wafer dicing processes.
• Wafer Warpage Measurement & Inspection System for measuring and inspecting wafer warpage in semiconductor manufacturing processes.

Quantifiable outcome

• 3D Warpage and Thickness Measurement accuracy: ±2um repeatability
• +7 more outcomes

Segments1 record

Ideal customer profiles1 record

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability3 records

Feature5 records

Partnerships

Two partnerships are on record, tiered minor.

• Taiwan BranchminorChannel Partner/ Reseller/ Distributor · 1 December 2025Taiwan branch established in December 2025 as direct market presence for Taiwan semiconductor industry.
• China Agent/PartnerminorChannel Partner/ Reseller/ Distributor · 1 January 2017China agent contract signed in January 2017 with business launch for semiconductor post-process inspection equipment sales in China market.

Scale indicators2 records

Recent moves14 records

Expansion highlights5 records

Broad incumbents

• Onto Innovation: Onto Innovation is a larger US-listed inspection/metrology incumbent serving semiconductor packaging, advanced packaging and HBM with broader product breadth than Cressem, but its 2D/3D packaging AOI overlaps directly with Cressem's platform.
• SCREEN Holdings: SCREEN Holdings is a Japanese diversified semiconductor equipment maker whose cleaning and wafer surface inspection systems (e.g., SPE series) overlap with Cressem's wafer/HBM inspection and dry cleaning module products in semiconductor back-end.
• KLA Corporation: KLA is the dominant inspection and metrology incumbent across the semiconductor supply chain, including packaging and substrate — Cressem competes in the same inspection layer but at a smaller scale and with a narrower packaging-focused portfolio.
• CyberOptics (Nordson): CyberOptics, now part of Nordson, supplies optical and 3D sensing inspection systems for semiconductor and electronics assembly, comparable in technology (2D/3D vision, AI) to Cressem's platform although positioned upstream into SMT/back-end assembly.
• Chroma ATE: Chroma ATE is a Taiwan-listed test and inspection equipment maker for semiconductor, PCB, and electronics, providing broader test coverage but overlapping with Cressem on optical/automated inspection for advanced packaging.

Direct peers

• Koh Young Technology: Koh Young is a Korean-headquartered 3D inspection and metrology vendor for SMT, semiconductor packaging, and PCB substrate processes, providing direct competition to Cressem's Inline AI AOI/AFVI and 3D warpage/thickness measurement systems.
• Camtek: Camtek manufactures automated optical inspection (AOI) and metrology systems for semiconductor packaging and substrate inspection — the same product category (AOI/AFVI for advanced packaging) that Cressem sells into FC-BGA, FC-CSP, HBM and substrate inspection lines.
• Mirtec: Mirtec is a Korean AOI/optical inspection equipment maker focused on SMT and semiconductor packaging — competing head-to-head with Cressem in substrate and package inspection for Korean memory and display customers.
• Test Research, Inc. (TRI): TRI is a Taiwan-based manufacturer of AOI, X-ray, and ICT systems for PCB and semiconductor assembly, overlapping directly with Cressem's Panel Inline AI AOI and Strip Inline AI AFVI product lines serving the same fab/substrate customer base.
• Saki Corporation: Saki Corporation is a Japan-headquartered AOI and 3D inspection vendor specializing in semiconductor packaging and PCB inspection, with product overlap to Cressem's AFVI systems for FC-BGA, FC-CSP and substrate inspection lines.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks5 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/mirtec

Revenue estimate

Valuation estimate

Number of profiles

Subsidiaries4 records

Funding overview

Funding rounds2 records

Investors2 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Cressem