L-TRIS
Photonics Systems GmbH (L-TRIS), founded 1985 in Krailling, Germany, is a private laser micro-processing equipment manufacturer serving photovoltaic, electronics, and semiconductor customers with precision systems for PCB cutting, wafer trimming, ceramic processing, and solar cell manufacturing.
- Company typePrivate
- Founded1985
- HeadquartersKrailling, Germany
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
What L-TRIS does
L-TRIS (legally Photonics Systems GmbH, doing business as Photonics Systems Group) is a German manufacturer of precision laser micro-processing systems, headquartered in Krailling near Munich. Founded in 1985 and operating as a privately held GmbH with 11-50 employees, the company develops, produces, and globally distributes laser equipment for the photovoltaic, electronics, and semiconductor industries. Its core business is capital equipment: laser machines that cut, drill, route, structure, and trim materials with sub-micron precision and minimal thermal impact, replacing mechanical processes in PCB and semiconductor manufacturing.
The product portfolio spans eight principal system families. The DP10x0 series performs laser singulation of PCBs without mechanical stress; the DR20/30 series handles PCB drilling and routing of large substrates up to 736×736 mm using UV or green ultra-short-pulse (UKP) lasers; the WT35X0/M350 series trims wafers with configurable pulse lengths and sub-0.5µm accuracy; the LT50x0 series applies femtosecond and picosecond laser sources to thick-film and thin-film trimming; the CR20x0 series processes ceramic DCB and AMB substrates for power electronics; and DIMENSO, LUMION, and ULTAGO serve thin-film and crystalline solar cell manufacturing, with LUMION delivering throughput up to 7,500 wafers per hour. The underlying technology stack includes proprietary UV, green, and infrared ultra-short-pulse laser sources, an InfinityScan scanning system, and SMEMA-compatible automation with JEDEC tray feeders and custom software integration.
The company operates a direct enterprise sales model with a demonstration-driven Application Center at its Krailling headquarters, supported by application consulting, custom software integration, after-sales service, and global field service. Revenue is generated through hardware sales of laser systems, recurring after-sales support and maintenance, and application consulting engagements. The company has no disclosed pricing, no named customer logos, no disclosed funding or ownership structure beyond independent private ownership, and no leadership bios publicly available.
L-TRIS firmographics
Firmographics- Name
- L-TRIS
- Legal name
- Photonics Systems GmbH
- Website
- https://l-tris.com
- Company type
- Private
- Founded year
- 1985
- Operating status
- Operating
- Headcount range
- 11–50 employees
- Short description
- Photonics Systems GmbH (L-TRIS), founded 1985 in Krailling, Germany, is a private laser micro-processing equipment manufacturer serving photovoltaic, electronics, and semiconductor customers with precision systems for PCB cutting, wafer trimming, ceramic processing, and solar cell manufacturing.
- Ownership category
- akta.pro rank
L-TRIS industry classification
Industry- Product category
- Industrial Laser Micro-Processing Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- SIC
- Optical Instruments & Lenses (3827)
- akta.pro primary industry
- Industrial PCB & Substrate Components (Bare PCBs, rigid-flex, ceramic substrates, thick-film) (IMAGAJAM)
- akta.pro secondary industry
- Optics & Laser/Light Engine Components (Lenses, Galvos, Laser Modules, UV Engines) (IMAAAIAC)
Keywords
Where L-TRIS is headquartered
LocationHeadquarters
- HQ city
- Krailling
- HQ country
- Germany
- HQ region
- Europe
Offices1 record
Markets served
L-TRIS business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Operations, Technology or R&D, Personnel, Marketing or Sales, Infrastructure
Revenue model
- Laser System Sales: Sale of high-precision laser processing machines and systems including DP10x0 (nutrient cutting), DR20/30 (PCB routing/drilling), WT35X0 (wafer trimming), LT50x0 (laser trimming), CR20x0 (ceramic processing), DIMENSO/LUMION (photovoltaic), and ULTAGO (photovoltaic turning table) series.
- After-Sales Service & Support: After-sales support services ensuring laser systems operate smoothly and efficiently post-purchase, including maintenance, troubleshooting, and technical support.
- Application Consulting: Expert application consulting services to develop customized solutions for customer requirements using the Application Center facilities.
Go-to-market motion1 record
Distribution channels1 record
Marketing channels5 records
L-TRIS product offering
Product offeringCore offering
L-TRIS (Photonics Systems Group) develops, produces, and globally distributes high-precision laser micro-processing systems for the photovoltaic, electronics, and semiconductor industries. The portfolio covers PCB singulation, PCB drilling and routing, wafer trimming, laser trimming of thin/thick-film components, ceramic substrate processing for power electronics, and dedicated solar cell processing systems. Each system is delivered with integrated automation (SMEMA, JEDEC tray feeders, conveyors) and customer-specific software, supported by an in-house Application Center for application consulting and after-sales service.
Product overview
Photonics Systems Group (L-TRIS) offers a comprehensive portfolio of precision laser micro-machining systems for the photovoltaic, electronics, and semiconductor industries. The product lineup includes: DP10x0 series for PCB singulation; DR20/30 series for PCB drilling and routing; WT35X0/M350 wafer trimming systems; LT50x0 laser trimming systems with femtosecond and picosecond technology; CR20x0 series for ceramic and power electronics substrates; and DIMENSO/LUMION systems for solar cell processing. These systems combine deep process expertise with mature laser technology, integrated automation solutions, and customer-specific software for seamless integration into manufacturing processes.
Differentiator
Problem solved
Functional benefit
Products and services
- DP10x0 Series Fully-automated high-speed laser singulation systems for precise separation of printed circuit boards without mechanical stress. The series includes DP1010 (stand-alone), DP1020 (with JEDEC tray feeder), DP1030 (in-line), and DP1040 (with Tiefzieh tray feeder) models, supporting up to 2 laser heads and SMEMA interface integration. Targeted at PCB manufacturers needing stress-free singulation in automated production lines.
- DR20/30 Series Laser systems for drilling and routing large substrates including PCBs and RCBs, available with UV laser (DR2010/DR3010) or green laser (DR2000/DR3000) configurations. Supports panel sizes up to 736×736 mm and integrates the InfinityScan scanning system for large substrate processing. Designed for PCB and RCB manufacturers requiring high-precision drilling and routing.
- WT35X0/M350 Series Wafer trimming systems with configurable pulse length, offering long-pulse WT3520 (long pulse, >3.5 µm link distance, >0.5 µm accuracy) and short-pulse WT3510 for fine precision applications. Targeted at semiconductor manufacturers requiring µm-accurate wafer trimming results.
- LT50x0 Series Femtosecond and picosecond laser trimming systems for thick-film, thin-film, and precision component applications. Models include LT5000 (infrared, >20 µm spotsize), LT5010 (green for thin film), LT5020 (green UKP), LT5030 (IR picosecond, >8 µm spotsize), and LT5040 (UV femtosecond, >6 µm spotsize) with high-speed prober system. Designed for semiconductor element processing and precision thin-/thick-film trimming.
- CR20x0 Series Laser systems for processing DCB (Direct Copper Bond) and AMB (Active Metal Brazing) printed circuit boards for power electronics and ceramic substrates. The CR2000 offers individual ceramic substrate processing; CR2010 features green picosecond laser for smallest hole diameters with <5 µm accuracy; CR2020 includes IR picosecond for highest process speed with optional metrology. Targeted at power electronics and ceramic processing manufacturers.
- DIMENSO Laser system for processing thin-film solar cells with integrated automation for loading and unloading. Targeted at photovoltaic manufacturers requiring efficient thin-film solar cell processing.
- LUMION Laser system for processing crystalline solar cells with throughput up to 7,500 wafers/hour, supporting LDSE, LCO, and LDC processes with automated loading/unloading. Designed for high-throughput photovoltaic manufacturers.
- ULTAGO Rotary table laser machine for high-precision photovoltaic applications. Targeted at photovoltaic manufacturers requiring turntable-style high-precision laser processing.
- Application Consulting & After-Sales Service Expert application consulting, custom software integration, and global after-sales service including maintenance, troubleshooting, and technical support, delivered through the Krailling headquarters Application Center. Targeted at industrial customers needing tailored process development and ongoing support for installed laser systems.
Quantifiable outcome
- Throughput of up to 7,500 wafers/hour for crystalline solar cell processing (LUMION system)
- +4 more outcomes
Companies that use L-TRIS
Customer profileSegments4 records
Ideal customer profiles4 records
L-TRIS technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature7 records
L-TRIS partnerships and signals
Strategic signalScale indicators1 record
Recent moves4 records
Expansion highlights5 records
L-TRIS competitors and assessment
Company assessmentBroad incumbents
- Trumpf SE + Co. KG: German industrial laser and machine tool giant with broad portfolios spanning macro processing, EUV, and ultrashort-pulse sources. Far larger than L-TRIS and addresses overlapping end-customers through its laser systems and TruMicro product family.
- IPG Photonics: Global leader in fiber laser sources widely deployed as building blocks in industrial micro-processing systems, including those used for PCB and semiconductor manufacturing. Comparable end-customers but operates at the laser source layer rather than as an integrated systems OEM.
- Coherent Corp: Large diversified photonics company combining II-VI's materials platform with laser systems for semiconductor, electronics, and industrial markets. Overlaps with L-TRIS through precision laser tools used across PCB, ceramic substrate, and advanced packaging.
- Manz AG: German-based equipment manufacturer with strong overlap in solar cell production lines, electronics manufacturing, and battery assembly. Competes with L-TRIS specifically in PV laser-based cell processing systems.
- Han's Laser Technology: China's largest industrial laser systems supplier with broad coverage of PCB marking/cutting, semiconductor, and consumer electronics applications. Targets the same Asian electronics manufacturing base from a regional incumbent vantage point.
Direct peers
- LPKF Laser & Electronics: German-headquartered laser systems manufacturer specializing in PCB depaneling, drilling, and structuring. Direct product overlap with L-TRIS's DP10x0 and DR20/30 series for stress-free PCB processing and similar enterprise customer base in electronics manufacturing.
- DISCO Corporation: Japanese manufacturer of precision cutting, grinding, and polishing equipment with leading laser dicing systems for wafer singulation. Competes directly with L-TRIS's wafer-level trimming and PCB singulation offerings in semiconductor back-end packaging.
- Innolas Solutions: Germany-based laser system integrator serving semiconductor, photovoltaic, and thin-film markets with comparable process-focused platforms. Closely aligned with L-TRIS's PV laser processing and laser trimming product lines.
- ESI / MKS Instruments: MKS acquired ESI to expand into laser-based PCB drilling and routing systems used by HDI and IC substrate manufacturers. Direct competitor to L-TRIS's DR series laser drilling and routing platforms in advanced PCB production.
Others
- Lumentum Holdings: Photonics component supplier providing lasers, optics, and sub-systems used inside industrial micro-processing tools such as those L-TRIS builds. Adjacent rather than directly competitive, serving as a potential enabling supplier in L-TRIS's bill of materials.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat4 records
Key risks6 records
Key highlights7 records
Customer concentration
L-TRIS social profiles
Digital presenceL-TRIS financial estimates
Financial estimateRevenue estimate
Valuation estimate
L-TRIS leadership team
Management profileNumber of profiles
L-TRIS funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
L-TRIS M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about L-TRIS
What does L-TRIS do?
L-TRIS (Photonics Systems Group) develops, produces, and globally distributes high-precision laser micro-processing systems for the photovoltaic, electronics, and semiconductor industries. The portfolio covers PCB singulation, PCB drilling and routing, wafer trimming, laser trimming of thin/thick-film components, ceramic substrate processing for power electronics, and dedicated solar cell processing systems. Each system is delivered with integrated automation (SMEMA, JEDEC tray feeders, conveyors) and customer-specific software, supported by an in-house Application Center for application consulting and after-sales service.
Is L-TRIS a public or private company?
L-TRIS is a private company. It is classified as founder individual operated bootstrapped and is currently operating.
When was L-TRIS founded?
L-TRIS was founded in 1985. It employs 11 to 50 people.
Where is L-TRIS based?
L-TRIS is headquartered in Krailling, Germany, in the Europe region.
How does L-TRIS make money?
Three revenue lines are on record. Laser System Sales are the primary driver. The others are after-Sales Service & Support and application Consulting.
Who are L-TRIS's main competitors?
Broad incumbents on record are Trumpf SE + Co. KG, IPG Photonics, Coherent Corp, Manz AG and Han's Laser Technology. Direct peers are LPKF Laser & Electronics, DISCO Corporation, Innolas Solutions and ESI / MKS Instruments. Lumentum Holdings is listed as an others.
Does L-TRIS have an API?
No public API is recorded for L-TRIS.
What industry is L-TRIS in?
L-TRIS's product category is Industrial Laser Micro-Processing Equipment. Its primary akta.pro industry code is IMAGAJAM, Industrial PCB & Substrate Components (Bare PCBs, rigid-flex, ceramic substrates, thick-film), with a secondary code of IMAAAIAC, Optics & Laser/Light Engine Components (Lenses, Galvos, Laser Modules, UV Engines). Its NAICS code is 333242 and its SIC code is 3827.