Haesung DS
Haesung DS is a South Korea-based semiconductor component manufacturer producing lead frames, PCB substrates for memory chips, and tape substrates for smart cards. The company serves global IDMs and OSATs including Samsung, SK Hynix, and Texas Instruments across automotive, mobile, and memory end markets.
- Company typePublic
- Founded1984
- HeadquartersYeoksamdong, South Korea
- Headcount1,001–5,000
- GTM typeB2B
- OfferingHardware or Manufacturing
What Haesung DS does
Haesung DS Co., Ltd. (KRX: 195870) is a South Korea-based semiconductor component manufacturer operating four core product lines: lead frames, PCB (package) substrates, tape substrates, and graphene. The company's lead frame business spans stamped and etched formats (QFP, SOIC, QFN, Rt-QFN, Discrete, Power Module) used across automotive, mobile, and PC semiconductors, while its PCB substrate business supplies BOC, FBGA, Flip-Chip FBGA, and Multi-Layer FBGA products for memory chips including DDR4/DDR5/DDR6 DRAM. Haesung DS operates a proprietary Reel-to-Reel (RTR) continuous manufacturing process for PCB substrates — described as the world's first and only such application — alongside a proprietary μ-PPF plating technology certified to AEC-Q100 Grade 0 and MSL Level 1 for automotive high-reliability applications, and super-fine pitch stamped QFP tools with ILP 110μm that exceed the industry standard of 130μm.
The company generates revenue through direct B2B hardware sales to global semiconductor IDMs and OSATs, including Samsung Electronics, SK Hynix, Texas Instruments, TFME, ATX Group, and CXMT. Approximately 99% of revenue is from exports, with significant exposure to China (~35% of revenue), Southeast Asia (Malaysia, Thailand, Philippines), Japan, Europe, and the United States. Pricing is quote-based and negotiated per customer and product specification. Manufacturing is concentrated at the Changwon, South Korea plant, which underwent a ~KRW 320 billion expansion completed in 2025 (with full operation targeted for H2 2026), supplemented by a wholly-owned Philippines production subsidiary (PSMP, acquired 2022) and sales offices in Suzhou, Shenzhen, Fukuoka, and Manila. Lead frame is the primary revenue driver, while the package substrate business has shifted into turnaround in H2 2025 on DDR5 ramp momentum.
Haesung DS was formed in March 2014 when Samsung Techwin's MDS Division (with roots tracing back to 1984) was spun off and joined the Haesung Group conglomerate. The company listed on KOSPI in June 2016. The company is currently pursuing DDR6 packaging substrate qualifications (including via Chinese memory entrant CXMT), evaluating panel-based production for higher-layer-count substrates, and has begun deploying AI-driven autonomous manufacturing solutions (Inspection.AI, Recipe.AI, Quality.AI, PHM.AI) in partnership with INTERX starting April 2026.
Haesung DS firmographics
Firmographics- Name
- Haesung DS
- Legal name
- HAESUNG DS CO.,LTD.
- Website
- https://haesungds.com
- Company type
- Public
- Founded year
- 1984
- Operating status
- Operating
- Headcount range
- 1,001–5,000 employees
- Short description
- Haesung DS is a South Korea-based semiconductor component manufacturer producing lead frames, PCB substrates for memory chips, and tape substrates for smart cards. The company serves global IDMs and OSATs including Samsung, SK Hynix, and Texas Instruments across automotive, mobile, and memory end markets.
- Ownership category
- akta.pro rank
Haesung DS industry classification
Industry- Product category
- Semiconductor Packaging Components
- NAICS
- Semiconductor and Related Device Manufacturing (334413), Bare Printed Circuit Board Manufacturing (334412)
- SIC
- Semiconductors & Related Devices (3674), Printed Circuit Boards (3672)
- akta.pro primary industry
- Leadframes & Package Interconnect Materials (HDAHADAF)
- akta.pro secondary industries
- Package Substrates & Interposers (ABF/BT, Silicon/Glass) (HDAHADAE), Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK)
Keywords
Where Haesung DS is headquartered
LocationHeadquarters
- HQ city
- Yeoksamdong
- HQ country
- South Korea
- HQ region
- Asia
Offices7 records
Markets served
Haesung DS business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Supply Chain, Operations, Personnel, Technology or R&D, Infrastructure, Marketing or Sales
Revenue model
- Lead Frame Sales: Revenue from manufacturing and supplying lead frames for automotive, mobile, and PC applications. Lead frames are the primary revenue driver, with products including QFP, SOIC, QFN, Rt-QFN, Discrete, and Power Module categories. The company maintains #1 position in the lead frame sector globally.
- PCB Substrate (Package Substrate) Sales: Revenue from PCB substrate products used in memory semiconductors. Products include BOC, FBGA, Flip Chip FBGA, and Multi Layer FBGA. The company is expanding into DDR5 substrates and targeting DDR6 next-generation products. The Reel-to-Reel production process provides cost competitiveness in the commodity DRAM market.
- Tape Substrate Sales: Revenue from tape substrates for smart card applications including SIM cards, credit cards, and e-passports. Produced via Reel-to-Reel continuous process with 500mm wide-width mass production providing 3x higher productivity than competitors.
Go-to-market motion2 records
Distribution channels4 records
Marketing channels7 records
Haesung DS product offering
Product offeringCore offering
Haesung DS manufactures and supplies semiconductor packaging components, principally Lead Frames (stamped and etched), PCB (Package) Substrates for memory chips, and Tape Substrates for smart cards. It is one of the few global manufacturers capable of mass-producing all three core semiconductor substrates, serving major IDMs, OSATs, and foundries across automotive, mobile, computing, memory, and smart card applications. It also produces large-area graphene via proprietary CVD synthesis.
Product overview
Haesung DS is a semiconductor component manufacturer offering four core product lines: Lead Frame, PCB Substrate, Tape Substrate, and Graphene. Lead Frame electrically connects semiconductor chips to external circuits and supports chips within packages, with solutions for automotive, mobile, and PC applications. PCB Substrate serves as the core component connecting memory chips to mainboards, available in BOC, FBGA, Flip Chip FBGA, and Multi Layer variants. Tape Substrate is a key component for smart cards including SIM cards, credit cards, and e-passports. Graphene is a 2D carbon material with applications in films, cables, and custom manufacturing. The company is one of the few global manufacturers capable of mass-producing and supplying all three core semiconductor substrates (lead frames, package substrates, and tape substrates).
Differentiator
Problem solved
Functional benefit
Brands
- μ-PPF: Micro-PPF plating technology for high reliability semiconductor lead frames with superior corrosion resistance, passing TCoB 6,000 cycle test
Products and services
- Lead Frame Semiconductor lead frame components that electrically connect chips to external circuits and physically support chips within packages; provided in stamped and etched variants for automotive, mobile, and PC applications, including QFP, SOIC, QFN, Rt-QFN, Discrete, and Power Module configurations.
- PCB Substrate (Package Substrate) Core substrate component that electrically connects memory semiconductor chips to the mainboard; available in BOC, FBGA, Flip Chip FBGA, and Multi Layer FBGA variants, produced via proprietary Reel-to-Reel continuous stacking process for DDR4/DDR5/DDR6 DRAM and other memory applications.
- Tape Substrate Reel-to-Reel produced tape substrate for smart card applications including SIM cards, credit cards, and e-passports, offering secure miniaturized chip embedding with wide-width mass production.
- Graphene Two-dimensional carbon material with honeycomb structure offering excellent physical and chemical stability; produced via RTCVD-based synthesis with large-area capability (up to 500x600mm) and low-temperature direct growth on Alloy Cu, Al, Ag, and Au substrates for film, cable, and custom applications.
Quantifiable outcome
- Achieved 'A' rating in KCGS ESG evaluation for 7 consecutive years (excluding 2022)
- +5 more outcomes
Companies that use Haesung DS
Customer profileNamed customers6 records
Segments5 records
Ideal customer profiles4 records
Haesung DS technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
AI capability4 records
Feature6 records
Haesung DS partnerships and signals
Strategic signalPartnerships
Five partnerships are on record, tiered strategic and minor.
- INTERXstrategicHaesung DS signed a partnership agreement with INTERX, an AX (Autonomous Manufacturing) autonomous manufacturing solutions specialist, to drive AI-driven autonomous manufacturing transformation in semiconductor production facilities. INTERX will provide its quality inspection AI solution 'Inspection.AI' to Haesung DS manufacturing sites as the first step, with plans to expand into broader production execution AX solutions including Recipe.AI, Quality.AI, and PHM.AI for predictive equipment maintenance. INTERX has established numerous AX transformation cases across diverse manufacturing industries and conducted the world's first live demonstration of a 'Fully Autonomous Machine' at SIMTOS 2026.
- AIPIM, WISEnut, Korea Electronics Technology Institute (KETI), Kyung Hee University Industry-Academic Cooperation FoundationstrategicConsortium partners for national R&D project 'Development and On-site Demonstration of a Digital AI Platform for Carbon Footprint Management' valued at KRW 9.7 billion (approx. USD 7 million) over 45 months, initiated by Korea's Ministry of Trade, Industry and Energy (MOTIE). Haesung DS is the lead company overseeing the entire R&D process. The AI platform will quantify and analyze greenhouse gas emissions in real time across manufacturing processes to optimize production lines and reduce energy consumption and GHG output.
- Korea Commission for Corporate Partnership (KCCP)minorHaesung DS held a win-win growth meeting with KCCP chaired by Lee Dal-gon at its Changwon plant. KCCP operates programs to encourage co-growth among private-sector companies, helping establish a healthy collaboration culture and boost global competitiveness. Haesung DS was previously recognized as 'Outstanding Company for Price Linkage' in 2023 and designated as first 'Partner Company for Price Linkage.'
- World ShareminorInternational relief and development NGO World Share partners with Haesung DS for ongoing CSR efforts supporting children in Pampanga, Philippines. Activities include scholarship support for students at Sitio Target Integrated School and monthly provision of food supplies including rice, powdered milk, canned goods, ramen, cereal, and vitamins. Each party provides annual funding of KRW 10 million. World Share was founded in 2006 and operates in education, hygiene, healthcare, and emergency relief globally.
- Department of Social Welfare and Development (DSWD) Region 3 (Philippines)minorPartnership with DSWD Region 3 for school support project in Central Philippines. The MOU signing ceremony was attended by Haesung DS headquarters and its Philippine subsidiary, World Share's Philippine branch, and DSWD Region 3 officials. Supported schools were selected through discussions with DSWD Region 3.
Scale indicators12 records
Recent moves8 records
Expansion highlights5 records
Haesung DS competitors and assessment
Company assessmentDirect peers
- Ibiden: Japan-based manufacturer of high-end IC substrates (FCBGA, Build-up substrates) used in data center CPUs, GPUs, and memory. Comparable as a substrate peer targeting the same advanced packaging nodes that Haesung DS pursues with DDR5/DDR6.
- Shinko Electric Industries: Japan-based manufacturer of plastic lead frames and IC package substrates (Flip Chip BGA, FBGA). Directly comparable to Haesung DS across both lead frame and package substrate lines, with similar IDM/OSAT customer base in memory and logic.
- Unimicron Technology: Taiwan-based PCB and IC substrate manufacturer with strong memory substrate exposure (DRAM, NAND). Direct competitor in package substrates for memory packaging, a key segment Haesung DS is targeting with DDR5/DDR6 substrates.
- Powertech Technology (PTI): Taiwan-based OSAT and substrate manufacturer producing Flip Chip BGA and memory package substrates for DRAM customers. Comparable as a multi-product substrate supplier with memory concentration similar to Haesung DS.
- LG Innotek: Korean peer in semiconductor packaging substrates and IC substrates, including Flip Chip BGA offerings. Comparable as a fellow Korean substrate supplier serving global memory and system semiconductor customers with overlapping products.
- Mitsui High-tec: Japan-based global leader in lead frames, directly comparable to Haesung DS's core lead frame business. Both serve Tier 1 IDMs/OSATs across automotive, mobile, and PC semiconductor packaging with overlapping product portfolios (QFP, QFN, SOIC).
- Kinsus Interconnect Technology: Taiwan-based IC substrate manufacturer producing Flip Chip substrates for memory and logic. Directly comparable to Haesung DS's PCB substrate product line, particularly for BOC/FBGA package substrates used in DRAM.
- Samsung Electro-Mechanics: Korean manufacturer of IC substrates (FCBGA, FC-CSP, RF/MLCC substrates) and one of the largest substrate producers globally. Overlaps directly with Haesung DS's package substrate business in memory and logic chip applications.
Broad incumbents
- ASE Technology Holding: Taiwanese world's-largest OSAT providing packaging and test services, including IC substrate-adjacent offerings for memory and logic. Comparable as a broad incumbent in the semiconductor packaging supply chain that competes for the same IDM/OSAT wallet share as Haesung DS.
- Amkor Technology: Korean-headquartered OSAT leader providing advanced packaging (Flip Chip, WLFO, 2.5D/3D) to global semiconductor customers. Overlaps with Haesung DS as a Korean packaging supply-chain incumbent serving similar IDM customers.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
Haesung DS social profiles
Digital presenceHaesung DS compliance and trust
Trust signalCompliance9 records
Haesung DS financial estimates
Financial estimateRevenue estimate
Valuation estimate
Haesung DS leadership team
Management profileNumber of profiles
Profiles3 records
Haesung DS subsidiaries and ownership
Company hierarchySubsidiaries6 records
Haesung DS funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Haesung DS M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Haesung DS
What does Haesung DS do?
Haesung DS manufactures and supplies semiconductor packaging components, principally Lead Frames (stamped and etched), PCB (Package) Substrates for memory chips, and Tape Substrates for smart cards. It is one of the few global manufacturers capable of mass-producing all three core semiconductor substrates, serving major IDMs, OSATs, and foundries across automotive, mobile, computing, memory, and smart card applications. It also produces large-area graphene via proprietary CVD synthesis.
Is Haesung DS a public or private company?
Haesung DS is a public company. It is classified as public and is currently operating.
When was Haesung DS founded?
Haesung DS was founded in 1984. It employs 1,001 to 5,000 people.
Where is Haesung DS based?
Haesung DS is headquartered in Yeoksamdong, South Korea, in the Asia region.
How does Haesung DS make money?
Three revenue lines are on record. Lead Frame Sales are the primary driver. The others are PCB Substrate (Package Substrate) Sales and tape Substrate Sales.
Who are Haesung DS's main competitors?
Direct peers on record are Ibiden, Shinko Electric Industries, Unimicron Technology, Powertech Technology (PTI), LG Innotek, Mitsui High-tec, Kinsus Interconnect Technology and Samsung Electro-Mechanics. Broad incumbents are ASE Technology Holding and Amkor Technology.
Does Haesung DS have an API?
No public API is recorded for Haesung DS.
What industry is Haesung DS in?
Haesung DS's product category is Semiconductor Packaging Components. Its primary akta.pro industry code is HDAHADAF, Leadframes & Package Interconnect Materials, with a secondary code of HDAHADAE, Package Substrates & Interposers (ABF/BT, Silicon/Glass). Its NAICS code is 334413 and its SIC code is 3674.