What Daisho Denshi does

Daisho Denshi Co., Ltd. (大昌電子) is a privately held Japanese printed circuit board manufacturer founded in 1968 and headquartered in Ohta, Tokyo. The company designs and produces custom high-density PCBs across two purpose-built plants: Tochigi Plant specializes in fine-pitch semiconductor package substrates (BGA, CSP, FC-BGA), module packages, and cavity boards, while Iwate Plant focuses on flex-rigid multilayer boards, build-up multilayer boards, and BVH/IVH high-density boards. The portfolio targets miniaturization and high-density interconnect requirements for mobile devices, automotive electronics, semiconductor packages, medical equipment, wearables, industrial robotics, and digital consumer electronics, with technical specifications down to 10µm/10µm line/space, coreless substrates as thin as 140µm (4-layer), and ultra-thin 3-layer boards as thin as 80µm.

The company's revenue model is built on four integrated streams: custom PCB hardware sales (the majority), bundled PCB design services (pattern design, simulation analysis, EMC and DFM rule verification), component assembly using 15 SMT lines with 40 million chips/month capacity, and outsourced production management via a certified partner network of 12 domestic and 4 overseas factories. Pricing is per-quote based on customer specifications and is not publicly disclosed. Daisho Denshi differentiates itself through its "Total Support System" — an integrated design-to-assembly workflow unique in the Japanese PCB industry — and through proprietary assembly jig technologies, most notably the patented Magic Resin Carrier (five patents, including silicone-free Type-ZERO for semiconductor fab contamination control) and Magnet Carrier, both of which enable tape-free handling of ultra-thin substrates at ±30µm placement accuracy.

Daisho Denshi serves a roster of major Japanese electronics OEMs (Fujitsu, Murata, Sharp, Canon, Mitsubishi Electric, NEC, Sony, Kyocera, ROHM) through a direct sales-led model with four Tokyo-based sales departments, a Sales SE function, and overseas sales offices in the USA (Torrance), Hong Kong, and the Philippines. The company holds company-wide ISO9001:2015 and ISO14001:2015 multi-site certification and achieved RBA VAP Platinum Status at its Tochigi Plant in June 2026, the highest possible rating across all five RBA Code of Conduct categories. As of March 2026, Daisho Denshi reported annual sales of JPY 25,534 million (approximately USD 170M) and 916 employees across Japan and overseas operations.

Name

Daisho Denshi

Legal name

DAISHO DENSHI CO., LTD.

Website

https://daisho-denshi.co.jp

Company type

Private

Founded year

1968

Operating status

Operating

Headcount range

501–1,000 employees

Short description

Daisho Denshi is a privately held Japanese PCB manufacturer founded in 1968, producing custom semiconductor package substrates, flex-rigid multilayer boards, build-up boards, and cavity boards. It offers integrated design, manufacturing, and assembly services from its Tochigi and Iwate plants to major Japanese electronics OEMs across mobile, automotive, and semiconductor sectors.

Ownership category

akta.pro rank

Headquarters

HQ city

Tokyo

HQ country

Japan

HQ region

Asia

Offices8 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Infrastructure, Supply Chain, Marketing or Sales

Revenue model

1. PCB Manufacturing & Sales: Design, manufacture, and sale of custom printed circuit boards including semiconductor package substrates, flex-rigid multilayer boards, build-up multilayer boards, cavity boards, and coreless substrates. Products are nearly 100% custom-designed per customer specifications. Revenue from domestic Japan manufacturing (Tochigi and Iwate plants) and outsourced partner production.
2. PCB Design Services: Pattern design, various simulation analyses (transmission line, impedance control, waveform control), EMC design rule check, DFM verification, and hardware/software development support. Design services are provided by 23 designers using CAD tools (Zuken CR-8000, CR-5000, Cadence APD, FIRST START) and simulation tools (Keysight PathWave ADS, Apsim SPICE). Typically bundled with PCB manufacturing as part of the Total Support System.
3. Component Assembly & Jig Manufacturing: SMT component mounting (15 lines, 40 million chips/month capacity) including BGA, CSP, 0402 size components, and flip chip. Magic Resin Carrier and Magnet Carrier assembly jig sales. 15 production lines with capability for lead-free assembly and rapid prototyping (2 working days minimum lead time).
4. Outsourcing Solutions: Subcontracted production management through a network of certified partner factories in Japan (12 TH board plants, 2 build-up plants) and overseas (4 TH board plants, 2 flexible board plants), offering over 200,000 sqm/month domestic and 250,000 sqm/month overseas capacity. Includes VA/VE consulting for cost optimization.

Pricing tiers

Go-to-market motion1 record

Distribution channels5 records

Marketing channels7 records

Core offering

Daisho Denshi is a custom printed circuit board manufacturer offering integrated design, fabrication, assembly, and assembly jig solutions. Core manufactured products include semiconductor package substrates, flex-rigid multilayer boards, build-up multilayer boards, cavity boards, and coreless substrates, supported by SMT component mounting (15 lines, 40 million chips/month) and proprietary Magic Resin Carrier / Magnet Carrier assembly jigs for ultra-thin PCB handling.

Product overview

Daisho Denshi is a printed circuit board manufacturer offering an integrated portfolio centered on semiconductor package substrates, flex-rigid multilayer boards, build-up boards, cavity boards, and specialized assembly carriers (Magic-Resin Carrier and Magnet-Carrier). The company provides comprehensive support from design through manufacturing and assembly, including pattern design, simulation analysis, EMC/DFM verification, component mounting, and outsourcing solutions. Their products serve diverse applications including mobile devices, automotive, semiconductor, MEMS, industrial robotics, medical equipment, wearables, and consumer electronics.

Differentiator

Problem solved

Functional benefit

Products and services

• Semiconductor Package Substrates Organic material-based rigid and build-up structure substrates for semiconductor packaging. Supports fine-pitch bonding down to 40μm pad width/10μm gap, laser drilling for miniaturization, and various surface finishes (OSP, gold plating, ENEPIG). For semiconductor manufacturers and electronics companies requiring BGA, CSP, FC-BGA, module packages.
• Flex-Rigid Multilayer Board High-density flex-rigid circuit boards combining flexible circuits and rigid build-up technology. Enables connectorless designs for miniaturization, supports 4-layer to 20-layer configurations with flying tail terminals (0.3mm pitch), and halogen-free materials. For mobile devices, automotive electronics, and miniaturized electronics requiring 3D wiring integration.
• Build-Up Boards (for modules)

Quantifiable outcome

• RBA VAP Platinum Status achieved at Tochigi Plant — highest rating (200/200) in labor, safety, environment, ethics, and management system categories
• +5 more outcomes

Named customers9 records

Segments7 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

Eight partnerships are on record, tiered minor and core.

• Reed Displays (Robodex organizer)minorStrategic or Co-development Partner · 17 January 2018Daisho Denshi exhibited at the 2nd Robodex (Robot Design & Development Expo) organized by Reed Displays, introducing its PCBs and SMT jigs designed for robotics applications to the robotics industry ecosystem.
• JPCA (Japan Electronics Packaging and Circuits Association)minorStrategic or Co-development Partner · 1 June 2011Daisho Denshi exhibits at the annual JPCA Show (International Electronic Circuit Exhibition), one of the major industry events for Japan's printed circuit board and semiconductor packaging industry. JPCA organizes the exhibition where Daisho Denshi showcases its products to industry peers and customers.
• Canon Inc. (キヤノン)coreChannel Partner/ Reseller/ DistributorCanon Inc. participates in Daisho Denshi's Green Partner Program at the Tochigi Plant, committing to environmentally conscious material procurement (green procurement). This partnership reflects mutual commitment to environmental management in the electronics supply chain.
• Seiko Epson Corporation (セイコーエプソン)coreChannel Partner/ Reseller/ DistributorSeiko Epson participates in Daisho Denshi's Green Partner Program, committing to green procurement standards and joint environmental management in the electronics supply chain.
• Sony Corporation (ソニー)coreChannel Partner/ Reseller/ DistributorSony participates in Daisho Denshi's Green Partner Program, jointly pursuing green procurement and environmental compliance aligned with Sony's Green Partner environmental standards.
• Fujitsu Limited (富士通)coreChannel Partner/ Reseller/ DistributorFujitsu participates in Daisho Denshi's Green Partner Program, committing to CSR-driven supply chain management and environmental procurement standards.
• Mitsubishi Electric Corporation (三菱電機)coreChannel Partner/ Reseller/ DistributorMitsubishi Electric participates in Daisho Denshi's Green Partner Program, committing to green procurement and joint environmental responsibility in the electronics manufacturing supply chain.
• Kawasaki Frontale (J-League Soccer Club)minorGTM or Marketing PartnerDaisho Denshi is an official sponsor of J-League club Kawasaki Frontale. The partnership includes co-hosting annual parent-child soccer schools at Iwate and Tochigi plant locations, serving as both community contribution and brand visibility activity. The relationship began in 2011 as post-earthquake support for Iwate plant employees.

Scale indicators10 records

Recent moves13 records

Expansion highlights5 records

Direct peers

• Compeq Electronics Co., Ltd. Taiwanese PCB manufacturer producing HDI and multilayer boards for computing, mobile, and networking customers. Comparable to Daisho Denshi on build-up boards and high-density PCB products, though at greater scale and lower price points.
• TTM Technologies, Inc. US-headquartered global PCB manufacturer serving aerospace/defense, automotive, and industrial customers. Comparable to Daisho Denshi's automotive and industrial PCB segments with similar reliability/high-mix positioning.
• Ibiden Co., Ltd. Japanese PCB and IC package substrate manufacturer. Most directly comparable to Daisho Denshi in terms of geography (Japan), high-end package substrate capability, and OEM customer base. Both serve semiconductor and high-density packaging markets.
• Nippon Mektron, Ltd. Japanese flex PCB manufacturer (part of NOK Corporation). Directly comparable to Daisho Denshi's flex-rigid multilayer board offering at Iwate Plant. Both serve mobile devices, wearables, and miniaturized electronics with thin/flexible PCB technology.
• Tripod Technology Corp. Taiwanese PCB manufacturer producing multilayer, HDI, and flex-rigid boards. Comparable to Daisho Denshi on HDI/multi-layer PCB offerings for mobile, networking, and industrial applications, though serving a higher-volume, cost-competitive segment.
• Shinko Electric Industries Co., Ltd. Japan-based manufacturer of IC package substrates (Flip-Chip BGA, FC-CSP), similar to Daisho Denshi's Tochigi Plant focus. Comparable on advanced packaging substrates, Japanese OEM customer base, and fine-pitch semiconductor interconnect technology.
• AT&S Austria Technologie & Systemtechnik AG: European-headquartered PCB and IC substrate manufacturer. Comparable on advanced substrate technology (coreless, build-up, flex-rigid) targeting semiconductor, mobile, and automotive customers. Operates at a similar technology tier with similar high-density substrate offerings.
• Zhen Ding Technology Holding Ltd. Taiwanese flex PCB manufacturer (Apple supply chain). Comparable to Daisho Denshi's flex-rigid and ultra-thin flex PCB offerings serving mobile devices and wearables. Direct competitor in the carrier-handling assembly-jig challenge space for thin/flex boards.
• Unimicron Technology Corp. Taiwanese PCB manufacturer and one of the world's largest IC substrate producers. Comparable in package substrate and HDI PCB product overlap, though at significantly larger scale. Main global competitor in advanced semiconductor packaging substrates.

Broad incumbents

• Kyocera Corporation (PCB Division): Japanese conglomerate with a PCB and package substrate business — both as a Daisho Denshi customer (per disclosed customer list) and a competitor in advanced packaging substrates. Comparable on technology but operates a much broader portfolio of ceramics, components, and electronics beyond PCBs.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks7 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/daisho-denshi-america-inc

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles8 records

Subsidiaries4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Daisho Denshi