What E1 Dynamics does

E1 Dynamics operates under the trade name Guanghe Technology (广合科技) and is a Chinese high-end printed circuit board (PCB) manufacturer headquartered in Guangzhou, Guangdong Province. Founded in 2002 and dual-listed on the Shenzhen Stock Exchange (001389, April 2024) and Hong Kong Stock Exchange (01989, March 2026), the company specializes in high-speed, high-frequency, high-density interconnect (HDI) and multi-layer rigid-flex PCBs targeted at data center, AI server, 5G communications, and automotive electronics applications. Its core product portfolio spans data center PCBs (switch boards, server boards, storage backplanes, optical modules, SSD storage boards), AI server PCBs (high-speed server memory, AAU modules, RF transceivers), communication PCBs, and application terminal PCBs (automotive electronics, mini LED, 3D printer boards). The company operates four manufacturing bases across Guangzhou, Dongguan, Huangshi (China), and Prachinburi Province, Thailand, plus a sales office in San Jose, California (Delton Technology Inc), with a global workforce of approximately 4,998 employees.

The company generates revenue primarily through direct B2B sales of manufactured PCB products to enterprise customers, supplemented by a service-oriented manufacturing model combining customized PCB production with full lifecycle management services (recognized as a Guangdong Province Service-Oriented Manufacturing Demonstration Enterprise). Its go-to-market is enterprise field sales targeting global server OEMs, ODMs, and EMS providers, with disclosed customer relationships covering 8 of the top 10 global server manufacturers including Lenovo, Inspur, Dell, Foxconn, Quanta Computer, Wistron, Huaqin Technology, Jabil, ZTE, New H3C, Compal, and IEIT. According to Frost & Sullivan data, Guanghe ranks #3 globally and #1 in China among computing infrastructure PCB manufacturers by cumulative revenue 2022–2024. Reported annual revenue is RMB 5.485 billion (~USD $755M), with R&D investment of approximately RMB 280 million in 2025 (5.1% of operating revenue). Quality and reliability are validated through repeated customer awards including two consecutive Lenovo Perfect Quality Awards (2023, 2024) and seven consecutive Inspur Excellent Supplier Awards.

The business operates within a quote-based, contract manufacturing model with no publicly disclosed pricing; specifications, layer count, material requirements, and order volume drive each transaction. Multiple certifications anchor customer trust across verticals—ISO 9001, ISO 14001, IATF 16949 (automotive), CNAS laboratory accreditation, RBA VAP Silver, UL 2799 Zero Waste to Landfill Platinum, and ISO 56005 innovation management certification. Key technology differentiators include proprietary processes for high-density rigid-flex storage boards (9 patents), AI high-speed switching backplanes (4 granted patents), ultra-small step ladder gold finger PCBs (6 patents), and back-drilling test methods contributed to IEC/TC91. The company has also established AI-focused R&D partnerships with South China University of Technology (joint lab, September 2025) and the University of Electronic Science and Technology of China (UESTC).

Name

E1 Dynamics

Legal name

华体会官方网站在线登录入口-华体会(中国) (Guanghe Technology Co., Ltd.)

Website

https://e1dynamics.com

Company type

Public

Founded year

2002

Operating status

Operating

Headcount range

11–50 employees

Short description

Guanghe Technology is a China-headquartered, dual-listed high-end PCB manufacturer specializing in high-speed, high-frequency, and HDI boards for data centers, AI servers, 5G, and automotive applications, serving 8 of the top 10 global server manufacturers.

Ownership category

akta.pro rank

Product category

High-End Printed Circuit Board Manufacturing

NAICS

Bare Printed Circuit Board Manufacturing (334412), Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Semiconductor and Other Electronic Component Manufacturing (3344)

SIC

Printed Circuit Boards (3672)

akta.pro primary industry

PCB Fabrication (Flex & Rigid-Flex PCBs) (HDAHAOAH)

akta.pro secondary industries

PCB Fabrication (Rigid PCBs) (HDAHAOAG), Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK), Industrial PCB & Substrate Components (Bare PCBs, rigid-flex, ceramic substrates, thick-film) (IMAGAJAM)

Keywords

• High-end PCB manufacturing
• Server printed circuit boards
• AI server PCBs
• Data center circuit boards
• Rigid-flex PCB technology

Headquarters

HQ city

Montgomery

HQ country

United States

HQ region

North America

Offices5 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Operations, Technology or R&D, Personnel, Supply Chain, Infrastructure, Marketing or Sales

Revenue model

1. PCB Product Manufacturing and Sales: E1 Dynamics generates revenue primarily through the manufacture and sale of high-end printed circuit boards including data center PCBs, AI server PCBs, communication PCBs, and application terminal PCBs. The company focuses on high-speed, high-frequency PCB products for servers, AI, 5G, and data center applications. Revenue is derived from long-term supply agreements with enterprise customers including server manufacturers and EMS providers.
2. Customized Manufacturing + Full Lifecycle Management: The company operates a service-oriented manufacturing model combining customized PCB manufacturing with full lifecycle management services, recognized as a Guangdong Province Service-Oriented Manufacturing Demonstration Enterprise.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

E1 Dynamics (Guanghe Technology / 广合科技) manufactures and sells high-end printed circuit boards (PCBs) focused on high-speed, high-frequency, high-density interconnect (HDI) and multi-layer rigid-flex boards. Products are organized into Data Center PCBs (switch boards, server PCBs, storage backplanes, optical module boards, SSD storage boards), AI Server PCBs (high-speed server storage, AAU module boards, RF transceiver boards), Communication PCBs, and Application Terminal PCBs (automotive, mini LED, 3D printer), serving server manufacturers, EMS providers, and data center operators globally.

Product overview

E1 Dynamics (广合科技/Guanghe Technology) is a leading PCB (Printed Circuit Board) manufacturer specializing in high-end printed circuit boards for computing infrastructure. The company offers a comprehensive product portfolio organized into four main categories: Data Center PCBs (including switch boards, server PCBs, storage backplanes, optical module boards, and SSD storage boards), AI Server PCBs (including high-speed server memory, AAU module boards, and RF transceiver boards), Communication PCBs, and Application Terminal Product PCBs (including automotive electronics, mini LED, and 3D printer PCBs). The company focuses on high-layer-count, high-density, and high-speed PCBs primarily for servers, data centers, AI computing, 5G communications, and automotive electronics applications. With manufacturing bases in Guangzhou, Dongguan, Huangshi (China), and Thailand, E1 Dynamics serves global server manufacturers and is positioned as China's leading server PCB manufacturer.

Differentiator

Problem solved

Functional benefit

Products and services

• Data Center PCB - Switch Board (数据中心PCB - 交换机板) High-layer-count PCBs (12+ layers) with high aspect ratios (9:1+) for data center switch applications, featuring ultra-low loss materials, backdrilling, and resin plugging for high-speed signal transmission.
• Data Center PCB - Server PCB Board (数据中心PCB - 服务器PCB板) High-density server PCBs supporting PCIe 5.0 platforms (Intel Eagle Stream and AMD Genoa), with 14+ layers, high aspect ratios, backdrilling D+8mil design, and signal integrity controls for data center applications.
• Data Center PCB - Storage Backplane (数据中心PCB - 硬盘存储背板) Storage backplane PCBs with high layer counts and thickness for hard disk storage arrays in data centers, featuring high-speed materials and backdrilling + resin plugging + press-fit hole processes.
• Data Center PCB - Optical Module Board (数据中心PCB - 光模块板) Integrated HDI-structure PCBs for optical module applications in high-speed data transmission, using Very Low Loss materials for AI server signal transmission.
• Data Center PCB - SSD Storage Board (数据中心PCB - SSD存储板) Flexible-rigid combined PCBs for high-density SSD storage products in AI and HPC applications, featuring 3D stacking packaging with 12+ layers and 2-4 flexible layers.
• AI Server PCB - High-Speed Server Memory (AI服务器PCB - 高速服务器用存储器) High-density rigid-flex PCBs for enterprise server storage with high aspect ratios (10:1 to 16:1), using Low Loss materials and backdrilling + resin plugging for high-speed signal insertion loss control.
• AI Server PCB - AAU Module Board (AI服务器PCB - AAU模块板) Highly integrated PCBs for 5G base station Active Antenna Units with 14+ layers, high-speed materials, POFV, backdrilling, and embedded copper blocks for thermal management.
• AI Server PCB - RF Transceiver Board (AI服务器PCB - 射频收发板) RF transceiver PCBs for 5G communication networks using hydrocarbon or PTFE substrates, typically 2-8 layers with fine-line precision and ENIG surface finish.
• Application Terminal PCB - Automotive Electronics (应用终端产品PCB - 汽车电子PCB板) Automotive PCBs for various vehicle systems including infotainment, body, safety, powertrain, and chassis applications, featuring HDI, heavy copper, and POFV designs with reliability requirements.
• Application Terminal PCB - Mini LED (应用终端产品PCB - mini LED) PCBs for Mini LED displays using BT materials for dimensional stability, featuring HDI technology, 50μm fine pitch, and high reflectivity manufacturing techniques.
• Application Terminal PCB - 3D Printer (应用终端产品PCB - 3D打印机PCB) High-precision PCBs for 3D printers with up to 10 layers, featuring high stability, diverse interfaces, thermal management, and ENIG finish with thick gold plating (4uinch) for laser direct bonding.

Quantifiable outcome

• Customer satisfaction score of 96.28 points with 100% customer audit pass rate in 2025
• +3 more outcomes

Named customers15 records

Segments5 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

Eleven partnerships are on record, tiered moderate and core.

• Vocational Schools in Koh Kong and Kaeng Khoi Districts, ThailandmoderateStrategic or Co-development Partner · 1 January 2026Guanghe Thailand signed school-enterprise cooperation agreements with two vocational schools in Koh Kong and Kaeng Khoi districts to jointly develop PCB talent through talent localization strategy. Covers talent training, practical training, curriculum co-building, and directional employment.
• South China University of Technology (华南理工大学) - AI High Computing Power PCB Intelligent Manufacturing Joint LaboratorycoreStrategic or Co-development Partner · 1 September 2025Established 'AI High Computing Power PCB Intelligent Manufacturing Joint Laboratory' with South China University of Technology in September 2025 to advance AI computing power PCB research and manufacturing innovation.
• University of Electronic Science and Technology of China (UESTC / 电子科技大学)coreStrategic or Co-development Partner · 1 January 2025Joint R&D partnership with UESTC on AI server PCB technology. Collaborated on 'AI Server Ultra-High-Layer Multi-Layer Composite Substrate Key Technology and Industrialization' project which won the China Electronics Society Science and Technology Progress Third Prize. Joint research involves Dr. Chen Yuanming who provided training on board-level interconnection manufacturing technology and technical writing.
• Lenovo Group (联想集团)coreStrategic or Co-development Partner · 1 January 2024Core strategic partner and PCB supplier for Lenovo ISG (Infrastructure Solution Group). Won Perfect Quality Award at both 2023 and 2024 Lenovo Global Supplier Conferences. Collaboration covers high-layer PCB process capability improvement, automated production line upgrades, and quality management.
• Foxconn Technology Group (富士康科技集团)moderateStrategic or Co-development Partner · 1 January 2024Long-term manufacturing partner awarded Foxconn 2023 Technology Cooperation Award and 2025 Sustainability Award (G-Direction Outstanding Case Award) for joint technology development and ESG practices.
• ZTE Corporation (中兴通讯)moderateStrategic or Co-development Partner · 1 January 2024Strategic partnership covering 5 years of collaboration. Awarded 'Excellent Collaboration Award' and 'Best Collaboration Support Individual Award' at ZTE's 2025 Global Supplier Conference, recognizing cost optimization and urgent order response achievements.
• SAC/TC47 全国印制电路标准化技术委员会moderateStrategic or Co-development Partner · 1 January 2024Guanghe Technology participates in national and international PCB standardization through SAC/TC47. Served as lead drafter for national standard 'PCB Surface Plating Appearance Inspection Method.' Actively contributes to IEC/TC91 WG4 and WG10 working groups.
• South China University of Technology (华南理工大学)coreStrategic or Co-development Partner · 1 January 2023Industry-academia-research collaboration with South China University of Technology on big data server PCB technology. Joint project 'Key Technologies and Industrialization of High-Speed High-Layer PCBs for Big Data Server Motherboards' won Guangdong Province Science and Technology Progress Second Prize.
• Guangdong University of Technology (广东工业大学)moderateStrategic or Co-development Partner · 1 January 2023Established industry-academia-research cooperation with Guangdong University of Technology. The university provided talent training support and participated in the PCB Industry Integration College initiative with scholarship programs for students.
• Huaqin Technology (华勤技术)moderateStrategic or Co-development Partner · 1 January 2023Partner in AI server and smart terminal design. Received Huaqin Excellent Quality Award and Joint Innovation Award (2024) for deep collaboration in PCB design, technology R&D, material research, and product standardization.
• Inspur Information Technology Co., Ltd. (浪潮信息)coreStrategic or Co-development Partner · 1 January 2018Long-term strategic partnership spanning over 10 years. Recognized as Inspur Excellent Supplier for 7 consecutive years (2016-2022). Collaboration focuses on cost optimization, technology innovation, and agile delivery across server PCB supply.

Scale indicators9 records

Recent moves6 records

Expansion highlights7 records

Broad incumbents

• AT&S (Austria Technologie & Systemtechnik): AT&S is a European PCB and IC substrate leader with strong presence in high-end substrates for AI servers and data centers. While headquartered in Austria with production across Europe and Asia, it is a global incumbent serving the same hyperscaler and server OEM customer base as E1 Dynamics in AI infrastructure PCBs.
• Zhen Ding Technology: Zhen Ding is the world's largest PCB manufacturer by revenue, based in Taiwan, with broad exposure across consumer electronics, mobile, and computing PCBs. While it competes in some high-end segments, its core scale advantages and breadth make it a broad incumbent with overlapping capabilities to E1 Dynamics in computing infrastructure.
• Shinko Electric Industries: Shinko Electric is a Japanese PCB and IC packaging substrate manufacturer serving high-end computing, server, and AI applications. It is a global incumbent competing in the same high-end server PCB market as E1 Dynamics, with a particular focus on substrate-level integration for advanced computing platforms.

Direct peers

• Shennan Circuits: Shennan Circuits (深南电路) is a leading Chinese PCB manufacturer with a strong focus on high-end backplane, mid-backplane, and HDI PCBs for communications and data center equipment. It is the most direct domestic peer, competing head-to-head in server PCB and substrate markets and ranking among China's top-tier PCB suppliers alongside E1 Dynamics.
• Kinwong Electronic: Kinwong Electronic (景旺电子) is a major Chinese PCB maker producing multi-layer, HDI, rigid-flex, and metal-base PCBs for communications, computing, automotive, and industrial applications. It directly competes with E1 Dynamics in domestic and global server PCB supply chains.
• Suntak Technology: Suntak Technology (崇达技术) is a Chinese PCB manufacturer specializing in multi-layer, HDI, and rigid-flex PCBs serving communications, computing, automotive, and consumer electronics customers. It competes directly with E1 Dynamics in high-end server PCB and rigid-flex board segments.
• Tripod Technology: Tripod Technology is a Taiwan-based global PCB leader specializing in multi-layer, HDI, and rigid-flex PCBs for computing, networking, and automotive applications. It directly competes with E1 Dynamics in high-end server PCB and rigid-flex board segments, with comparable technology and customer profile.
• Ibiden: Ibiden is a Japanese PCB manufacturer with deep expertise in high-layer, high-speed PCBs and IC substrates, particularly for high-end servers, networking, and AI applications. It is one of the strongest global competitors to E1 Dynamics in the premium server PCB market where both companies participate.
• WUS Printed Circuit (Shennan): WUS Printed Circuit is a major Chinese PCB manufacturer specializing in high-layer-count and HDI boards for servers, communications, and automotive electronics. As a fellow Shenzhen-listed Chinese PCB supplier, it competes directly with E1 Dynamics in the server and high-end computing PCB market.
• Unimicron Technology: Unimicron is a Taiwan-based global PCB and IC substrate leader with extensive HDI, rigid-flex, and substrate capabilities serving server, networking, and AI applications. It competes with E1 Dynamics in high-end server PCBs and increasingly in AI server backplane and switching board segments.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks7 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/e1-dynamics-inc-

Compliance10 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles8 records

Subsidiaries4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about E1 Dynamics