DAP

What DAP does

DAP Corporation (주식회사 디에이피) is a South Korea-based specialized printed circuit board (PCB) manufacturer focused on High Density Interconnect (HDI) PCBs for compact electronic devices. Founded in 1987 and KOSDAQ-listed (code: 066900) since May 2004, the company operates two manufacturing facilities — Anseong headquarters (600 employees, new factory completed July 2014) and Ansan (500 employees, established October 2010) — totaling 1,100 staff. DAP's product portfolio spans eight HDI PCB structures (Any Layer, 4D Type, 3D Type, D Type, C Type, B Type, BVH Type) targeting mobile phones, tablets, wearables, and automotive electronics, with fine-pattern capability down to 30/40µm line/space and 0.32 BGA pitch on flagship Any Layer products. Core processes include CNC/Laser Drill & Router, MLB (Multi-Layer Board), Plating, D/F (Dry Film), and PSR & Surface Treatment, all performed in-house under a '전 Process 내제화' (full process internalization) model.

The company generates revenue exclusively through direct B2B sales of custom HDI PCBs to enterprise OEMs, with named customers including Samsung Electronics (Global Strong SME designation 2014, EHS Excellent Partner 2015), LG Electronics (Cooperative Association member 2023), and Hyundai Motor Group (SQ Best Partner 2012). Reported consolidated revenue grew from KRW 333.7B (2022) to KRW 403.5B (2023) to KRW 488.8B (2024) — a 46.5% two-year increase — though 2024 results also reflected an operating loss of KRW -30.4B and a net loss of KRW -43.3B. The company holds 67 registered patents and maintains IATF 16949, ISO 9001, ISO 14001, and ISO 45001 certifications, positioning it for premium OEM qualification and automotive-grade PCB supply.

The business model is sales-led direct enterprise engagement with no channel, reseller, or self-serve distribution; pricing is contracted per customer specification with no public pricing disclosure. Customer concentration on three Korean conglomerates represents the principal revenue risk. Strategic capability rests on vertical integration, patented process IP, and the shortest-in-industry lead times (Any Layer samples at 3.6–4.8 days), which together form the basis of DAP's competitive position in HDI PCB manufacturing.

Name

DAP

Legal name

주식회사 디에이피

Website

https://dap.co.kr

Company type

Public

Founded year

1987

Operating status

Operating

Headcount range

501–1,000 employees

Short description

DAP Corporation is a South Korean KOSDAQ-listed manufacturer of HDI (High Density Interconnect) printed circuit boards, supplying specialized PCB structures for mobile phones, tablets, wearables, and automobiles primarily to Samsung Electronics, LG Electronics, and Hyundai Motor Group.

Ownership category

akta.pro rank

Product category

PCB Manufacturing (HDI Printed Circuit Boards)

NAICS

Bare Printed Circuit Board Manufacturing (334412)

SIC

Printed Circuit Boards (3672)

akta.pro primary industry

PCB Fabrication (Rigid PCBs) (HDAHAOAG)

akta.pro secondary industry

Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK)

Keywords

• HDI PCB manufacturing
• Printed circuit boards
• Automotive electronics PCBs
• Mobile device PCBs
• Multilayer PCB fabrication

Headquarters

HQ city

Anseong

HQ country

South Korea

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Supply Chain, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. PCB Manufacturing and Sales: DAP generates revenue through the design and manufacture of HDI PCBs including Any Layer, 4D Type, 3D Type, D Type, C Type, B Type, and BVH Type products, sold primarily to major Korean electronics and automotive companies including Samsung Electronics, LG Electronics, and Hyundai Motor Group for use in mobile phones, tablets, wearables, and automobiles.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels2 records

Core offering

DAP designs and manufactures High Density Interconnect (HDI) Printed Circuit Boards across eight product architectures — HDI PCB Structure, Any Layer, 4D Type, 3D Type, D Type, C Type, B Type, and BVH Type — for use in mobile phones, tablets, wearables, and automobiles. The company operates full in-house manufacturing from raw material intake through CNC/Laser Drilling, Multi-Layer Board lamination, Plating, Dry Film patterning, and PSR/Surface Treatment (including ENIG, OSP, and Immersion Tin). DAP supplies custom HDI PCBs directly to enterprise OEMs including Samsung Electronics, LG Electronics, and Hyundai Motor Group.

Product overview

DAP (주식회사 디에이피) is a specialized PCB (Printed Circuit Board) manufacturer offering a comprehensive portfolio of HDI (High Density Interconnect) PCBs. The product portfolio ranges from entry-level C and B Type products through advanced 4D, 3D, D Type, and flagship Any Layer HDI PCBs, all built on FR-4 substrate materials with variations including BVH Type for automotive applications (using Teflon). These products target mobile phones, tablet PCs, wearables, and automobiles, with manufacturing processes encompassing CNC/Laser Drill & Router, MLB, Plating, D/F, and PSR & Surface Treatment capabilities.

Differentiator

Problem solved

Functional benefit

Products and services

• HDI PCB Structure Foundational HDI PCB architecture using sequential layer processing and laser drilling for compact, high-performance circuit boards used in mobile phones, tablets, wearables, and automobiles.
• Any Layer HDI PCB Flagship HDI PCB utilizing All Stack Via technology with L/S=30/40µm specifications and 0.32 BGA pitch for the most advanced interconnection in ultra-miniaturized electronics.
• 4D Type HDI PCB 10-layer HDI PCB with FR-4 material, 0.65–1.0T (±10%) board thickness, and 0.04/0.04µm minimum line/space for high-density mobile applications.
• 3D Type HDI PCB 10-layer HDI PCB with FR-4 material, 0.6–1.0T (±10%) board thickness, supporting both 0.04/0.04µm and 0.04/0.085µm line/space configurations for versatile electronic applications.
• D Type HDI PCB 10-layer HDI PCB with FR-4 material, 0.8T board thickness, and 0.04/0.04µm or 0.05/0.05µm line/space specifications for smartphone and tablet applications.
• C Type HDI PCB Entry-level 10-layer HDI PCB with FR-4 material, 0.65–0.8T board thickness, and 0.04/0.04µm or 0.05/0.05µm line/space for cost-effective mobile devices.
• B Type HDI PCB 10-layer HDI PCB with FR-4 material, 0.65–0.8T board thickness, featuring 0.04/0.08µm or 0.05/0.05µm line/space for mainstream electronics.
• BVH Type HDI PCB 8-layer HDI PCB with FR-4 or Teflon material, 0.9–1.1T board thickness, and 0.12/0.15µm line/space for automotive and specialized applications requiring enhanced thermal properties.

Quantifiable outcome

• Lead time for HDI PCB (Any Layer): 3.6 days Special / 4.8 days Normal for samples; 14.0 days Special / 16.5 days Normal for mass production
• +2 more outcomes

Named customers3 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Two partnerships are on record, tiered minor.

• Dynamic ElectronicsminorStrategic or Co-development Partner · 1 May 2006Technology transfer agreement signed with Dynamic Electronics in May 2006 for PCB manufacturing technology, enabling DAP to acquire advanced PCB fabrication know-how.
• PLOTECHminorStrategic or Co-development Partner · 1 November 2003Technology transfer agreement concluded with PLOTECH in November 2003, providing additional PCB manufacturing technology capabilities.

Scale indicators6 records

Recent moves9 records

Expansion highlights4 records

Direct peers

• Daeduck Electronics: Korean PCB manufacturer with multi-layer and HDI PCB offerings serving mobile, automotive, and semiconductor packaging customers. Comparable in product portfolio (rigid and HDI PCBs), Korean customer base, and end-market exposure.
• Tripod Technology: Taiwanese HDI PCB manufacturer with operations in China serving mobile handset, networking, and automotive customers. Comparable in HDI technology focus, customer end-markets (mobile handsets, automotive), and global manufacturing footprint.
• Samsung Electro-Mechanics (SEMCO): Korean PCB and component manufacturer, part of the Samsung Group, producing HDI and substrate PCBs for mobile and automotive applications. Directly comparable as a Korea-based HDI PCB peer serving the same anchor customers (Samsung Electronics, automotive OEMs).
• Shennan Circuits: Chinese PCB manufacturer with strong HDI and substrate PCB capabilities serving communications, mobile, and automotive end-markets. Comparable in HDI PCB product focus and end-market exposure (mobile devices, automotive electronics).
• Young Poong Electronics: Korean PCB maker (KOSDAQ-listed) producing HDI and rigid PCBs for mobile phones, displays, and automotive applications. Comparable in scale, Korean HDI focus, and customer base of Korean electronics conglomerates.
• Korea Circuit: Korean PCB manufacturer specializing in multi-layer and HDI PCBs for mobile handsets and telecommunications. Directly comparable in geography, technology focus (HDI for mobile), and customer overlap with Korean OEMs.

Broad incumbents

• TTM Technologies: US-headquartered PCB manufacturer with broad portfolio spanning HDI, rigid, flex, and substrate-like PCBs for aerospace, automotive, communications, and computing. Comparable in HDI PCB product line and automotive/communications end-markets, with broader geographic and product diversification.
• Zhen Ding Technology Holding: Taiwanese/Chinese PCB maker, world's largest flexible PCB supplier with growing HDI presence, serving mobile, computing, and automotive customers. Comparable in HDI product offering and mobile customer base; broader flex PCB focus and larger scale.
• Ibiden: Japanese PCB and substrate manufacturer with IC substrate and HDI offerings for computing, mobile, and automotive markets. Comparable in high-end PCB technology and Japanese/Korean OEM customer base; broader substrate and electronics materials portfolio.
• Unimicron Technology: Taiwanese PCB manufacturer and one of the world's largest, producing HDI, IC substrates, and rigid PCBs. Comparable in HDI PCB manufacturing for mobile and computing applications; significantly larger scale and broader substrate portfolio.

Market position

Strengths4 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance5 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about DAP