What NanoTEM does

NanoTEM Co., Ltd. (株式会社ナノテム) is a Japanese precision manufacturing company founded in April 1998 as the first university-originated venture from Nagaoka University of Technology, headquartered in Nagaoka City, Niigata Prefecture, with a Tokyo sales office (Makuhari) opened in 2017. The company specializes in three integrated product lines built on proprietary multi-porous ceramics sintering technology and a differentiated diamond abrasive bonding design: (1) porous ceramics vacuum chucks (AeroFIX) featuring uniform 2μm pores at 40% porosity for substrate fixation up to 2500mm x 2500mm with electrostatic dissipation and non-contact levitation transport; (2) special diamond abrasive tools (UNIVA-X, cup/pellet/honeycomb diamond wheels, dicing blades) where the diamond segment bonds more strongly than the core so the core wears first, keeping diamonds in constant contact with the workpiece; and (3) precision grinding/lapping/polishing equipment including The Grinder (multifunction machine for sapphire/quartz/silicon), NRG2000 (large substrate grinder for FPD glass up to 1400x1600mm), and a precision multi-function lapping machine.

NanoTEM serves semiconductor wafer processing (Si, SiC, GaN backgrinding and dicing), flat panel display (LCD/OLED glass substrate handling and large-substrate grinding), LED manufacturing (sapphire substrate grinding/lapping/dicing), printed circuit board, and film/printing/coating industries. Revenue is generated through four streams: hardware sales of abrasives and chucks, equipment sales of grinding/lapping machines, contract precision processing services (added in 2003), and custom-order manufacturing for specialized sizes/shapes. The go-to-market is direct factory sales from Nagaoka supplemented by sample-lending programs, website inquiry forms, and regular participation in Japanese industry exhibitions (NEPCON Japan, SEMICON Japan, Finetech Japan, CONVERTECH, mechanical elements technology shows). Standard AeroFIX pricing is ¥250,000 per φ500mm unit with volume discounts at 10+ units and custom quotes for non-standard sizes; equipment pricing is by inquiry.

The company has been financed through five rounds of third-party capital allocations totaling ¥125.5M in paid-in capital, with Tohoku Innovation Capital Co., Ltd. as the lead institutional investor in the 2003, 2005, and 2006 rounds. There have been no disclosed funding rounds since September 2006. NanoTEM operates with 1-10 employees and is privately held, with Atsushi Takada (高田篤) serving as Representative Director/President. Recognition includes the 14th Advanced Display of the Year (ADY2009) award in the Components and Materials category for the large substrate porous chuck product.

Name

NanoTEM

Legal name

株式会社ナノukum

Website

https://nano-tem.com

Company type

Private

Founded year

1998

Operating status

Operating

Headcount range

1–10 employees

Short description

NanoTEM is a Japanese niche precision manufacturer founded in 1998 from Nagaoka University of Technology, producing proprietary porous ceramics vacuum chucks (AeroFIX), special diamond abrasive tools (UNIVA-X), and precision grinding/lapping machines serving semiconductor, flat panel display, LED, and PCB manufacturers in Japan.

Ownership category

akta.pro rank

Product category

Precision Machining Equipment and Tooling

NAICS

Machine Shops (33271)

SIC

Machine Tools, Metal Cutting Types (3541), Metalworkg Machinery & Equipment (3540)

akta.pro primary industry

Grinding, Honing & Superfinishing Equipment (IMAHADAE)

akta.pro secondary industry

Spindles & High-Speed Drives (Machine Tool Spindles, High-speed Motors) (IMAGACAL)

Keywords

• Precision grinding tools
• Porous ceramics vacuum chucks
• Diamond abrasive tools
• Semiconductor substrate processing
• Flat panel display equipment

Headquarters

HQ city

Nagaoka

HQ country

Japan

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Marketing or Sales, Supply Chain, Infrastructure

Revenue model

1. Special diamond abrasive tools sales: Manufacture and sale of special diamond abrasive tools including cup-type, pellet-type, and lapping tool setters. Diamond segments with differential bonding strength technology for high-efficiency grinding.
2. AeroFIX porous ceramics vacuum chuck sales: Sale of multi-porous ceramics vacuum chucks in various sizes and shapes including plane type and roll type. Standard product at ¥250,000 per □500mm. Custom orders available.
3. Grinding and lapping equipment sales: Sale of precision grinding machines including The Grinder, large grinding machines (NRG2000), and precision multi-functional lapping machines.
4. Contract processing services: Precision grinding, lapping, and dicing contract processing services using company's proprietary equipment and expertise.

Pricing tiers

Go-to-market motion2 records

Distribution channels1 record

Marketing channels5 records

Core offering

NanoTEM manufactures and sells porous ceramics vacuum chucks (AeroFIX), special diamond abrasive tools (UNIVA-X and related cup/pellet/honeycomb diamond wheels), precision dicing blades, and precision grinding/lapping/polishing machines (The Grinder, NRG2000, Precision Multi-function Lapping Machine) for semiconductor, flat panel display, LED, and printed circuit board manufacturers. The company also provides contract precision grinding, lapping, and dicing processing services using its proprietary equipment and abrasives.

Product overview

NanoTEM is a university-originated venture company (founded at Nagaoka University of Technology) specializing in precision machining technology for the semiconductor, flat panel display (FPD), LED, and printed circuit board industries. The product portfolio centers on proprietary porous ceramics technology and special diamond abrasive tools. Core products include: (1) UNIVA-X special diamond abrasive for high-hardness substrates, (2) AeroFIX porous ceramics vacuum chuck for high-precision adsorption and non-contact levitation transport, (3) The Grinder precision multi-function grinding/lapping/polishing machine, (4) NRG2000 large grinding machine for glass substrates, (5) Precision multi-function lapping machines, (6) Dicing blades, (7) Precision diamond abrasive tools in various configurations (cup, pellet, honeycomb), and (8) Suction rolls for film materials. The company also provides contract precision processing services and has received recognition including the Advanced Display of the Year 2009 award.

Differentiator

Problem solved

Functional benefit

Brands

• UNIVA-X: Special diamond grinding wheel for high-hardness substrates like SiC and GaN, enabling faster processing and reduced grinding stone replacement frequency.
• エアロフィックス (AeroFIX)
• ザ・グラインダー (The Grinder)
• サクションロール (Suction Roll)
• NRG2000

Products and services

• UNIVA-X (ユニバックス) Special Diamond Abrasive Tool Special diamond abrasive tool developed for processing high-hardness substrates such as SiC and GaN. Features proprietary abrasive manufacturing technology enabling faster processing and reduced abrasive replacement frequency compared to conventional tools.
• AeroFIX (エアロフィックス) Porous Ceramics Vacuum Chuck High-precision porous ceramics vacuum chuck utilizing proprietary sintering technology to create uniform 2μm pores with 40% porosity. Features electrostatic dissipation, partial adsorption capability, non-contact levitation transport, and works in both dry and wet environments up to 150°C. Standard product at ¥250,000 per Φ500mm.
• The Grinder (ザ・グラインダー) Precision Grinding/Lapping/Polishing Machine Precision grinding machine that enables grinding, lapping, and polishing in a single machine. Features proprietary constant-force and constant-size feeding mechanisms, with water and air supply from inside the diamond abrasive for workpiece surface control. Optimized for difficult-to-cut materials like sapphire, quartz glass, and silicon.
• NRG2000 Large Grinding Machine Large grinding machine for glass substrate processing with maximum 1400x1600x40t chuck size. Equipped with cup and straight diamond abrasives on left and right spindles for processing flat and curved surfaces. Features 21,000kg weight, FANUC 18i control system, and targets flat panel display industry.
• Precision Multi-function Lapping Machine (精密多機能ラップ盤) High-precision dual-surface lapping machine with built-in porous diamond abrasive tools. Features water and air supply through abrasive interior for high precision, work drop prevention, and adjustable processing speed via water and air pressure control.
• Dicing Blades (ダイシングブレード) Ceramic-bonded diamond dicing blades with 40% porosity structure for high-speed cutting of difficult materials including sapphire, quartz glass, silicon, and ceramics. Features sustained cutting sharpness, anti-wandering properties, and no chipping. 50-500μm thickness range.
• Precision Diamond Abrasive Tools (精密ダイヤモンド砥石) Precision diamond abrasive tools featuring diamond portion with higher bonding strength than core, causing core to wear first to keep diamond in constant contact. Contains over 40% porosity for water/air flow, enabling efficient chip discharge and cooling. Available in cup, pellet, and honeycomb types.
• Suction Rolls (サクションロール) Porous ceramic suction rolls with 2μm average pore diameter for adsorbing film materials without suction marks. Applied in printing, display, film manufacturing, coating, paper, and metal foil industries.
• Contract Precision Processing Services Precision grinding, lapping, and dicing contract processing services using company's proprietary special abrasives and vacuum chucks. Began in 2003 after obtaining SME Creation Act certification.

Quantifiable outcome

• Processing efficiency improvement through reduced multi-stage grinding - rough, intermediate, and finish grinding consolidated
• +3 more outcomes

Named customers4 records

Segments5 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Scale indicators4 records

Recent moves7 records

Expansion highlights5 records

Direct peers

• Lapmaster Wolters: Specialist in precision lapping, grinding, and polishing equipment including double-sided lapping machines. Directly comparable to NanoTEM's Precision Multi-function Lapping Machine and The Grinder.
• Fujimi Corporation: Japanese manufacturer of high-purity abrasive slurries and precision loose/pellet abrasives for semiconductor and optics polishing. Comparable to NanoTEM's abrasive consumables portfolio.
• DISCO Corporation: Tokyo-headquartered leader in semiconductor dicing blades, back-grinders, and precision cutting/grinding equipment. Most directly comparable to NanoTEM because it serves the same semiconductor/FPD customers with dicing blades and grinding machines at much larger scale.
• Engis Corporation: US/Japan-headquartered manufacturer of precision diamond/CBN abrasive tools, lapping/polishing equipment, and fluids. Closely comparable to NanoTEM's precision diamond abrasive wheels, dicing blades, and lapping machines.
• ACCRETECH (Tokyo Seimitsu): Manufactures semiconductor back-grinders (HRG series), dicing blades, and CMP equipment. Directly comparable to NanoTEM's grinder/blade product line for wafer thinning and dicing applications.
• Komatsu NTC: Japanese producer of precision grinding machines (surface, double-disc, creep-feed) and semiconductor manufacturing equipment. Comparable to NanoTEM's precision grinding equipment lines.
• Okamoto Corporation: Japanese maker of precision surface and profile grinding machines for electronics and materials processing. Comparable to NanoTEM's The Grinder and NRG2000 large grinding machine offerings.

Emerging players

• Logitech (precision lapping/polishing): UK-based specialist in precision lapping, polishing, and material-removal equipment for semiconductors, optics, and research. Comparable to NanoTEM's The Grinder and lapping machine, though focused more on research/optics than FPD production lines.

Broad incumbents

• 3M (Abrasive Systems): Diversified manufacturer of industrial abrasives, including precision grinding wheels and diamond tooling. Comparable only at the consumable layer; not a focused competitor in NanoTEM's vacuum-chuck or precision-grinder niches.
• Saint-Gobain (Surface Conditioning /abrasives): Global materials incumbent offering Norton and other abrasive products, including diamond/CBN wheels and dicing blades. Overlaps with NanoTEM on abrasive consumables, but as part of a much broader industrial portfolio rather than a focused niche.

Market position

Strengths4 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about NanoTEM