What EBRAIN does

EBRAIN (エブレン株式会社) is a Japanese industrial electronics company founded in 1973, headquartered in Hachioji, Tokyo, and publicly listed on the Tokyo Stock Exchange JASDAQ Standard under ticker 6090 since June 29, 2020. The company specializes in designing and manufacturing backplanes, bus racks, and system chassis that serve as the foundational interconnect infrastructure for industrial embedded computing systems. Its product portfolio spans industry-standard bus architectures including VME, VME64Ex, VPX, OpenVPX, CompactPCI, CompactPCI Serial, CompactPCI Express, MicroTCA, AdvancedTCA, and SHB Express, complemented by an edge computing product line comprising COM Express carrier boards, Zynq UltraScale+ MPSoC SOMs, SMARC modules, Raspberry Pi Compute Module3 carrier boards, and IoT CPU boards.

The company operates a dual manufacturing footprint comprising domestic Japanese operations (Hachioji headquarters with Osaka and Iruma offices) and a wholly-owned Chinese subsidiary (Suzhou EBRAIN Electronics Co., Ltd.) established in 2002 and expanded in 2014, providing both high-quality domestic production and cost-competitive regional manufacturing. Its business model combines sales of standard catalog products with bespoke commissioned design and manufacturing services (受注設計・生産), supported by in-house simulation capabilities covering signal integrity, power integrity, EMI, and thermal/strength analysis. Customers are B2B industrial equipment manufacturers in five primary verticals — communications and broadcasting, electronics and medical applications, measurement and control, transportation, and defense.

Revenue is generated through two streams: industrial electronics hardware sales of standardized backplanes, chassis, and embedded computing modules, and custom design/manufacturing services for projects with complex specifications. Pricing is quotation-based with no public disclosure and no e-commerce channel. Go-to-market is sales-led and event-driven, relying on direct technical engagement with engineering buyers at industry trade shows (ESEC, EdgeTech+, MEDIX, DMS) and via the company website's inquiry form. The company maintains 101-250 employees and holds a wholly-owned Japanese board computer subsidiary (Tambac Co., Ltd., acquired 2011) and a 50% equity-method software affiliate (Media Lab Co., Ltd., 2011). In May 2026, EBRAIN formalized a mutual design, development, and manufacturing partnership with Hino Engineering Co., Ltd. to extend engineering and production capacity.

Name

EBRAIN

Legal name

エブレン株式会社

Website

https://ebrain.co.jp

Company type

Public

Founded year

1973

Operating status

Operating

Headcount range

101–250 employees

Short description

EBRAIN (エブレン株式会社) is a Japanese industrial electronics company (founded 1973, TSE JASDAQ-listed, ticker 6090) that designs and manufactures backplanes, bus racks, system chassis, and edge computing modules for industrial OEM customers across defense, medical, communications, measurement, and transportation verticals, with manufacturing in Japan and China.

Ownership category

akta.pro rank

Product category

Industrial Embedded Computing Hardware

NAICS

Computer and Peripheral Equipment Manufacturing (33411), Computer Terminal and Other Computer Peripheral Equipment Manufacturing (334118)

SIC

Electronic Computers (3571), Electronic & Other Electrical Equipment (No Computer Equip) (3600)

akta.pro primary industry

Embedded & Compute Modules (SoMs, COM Express/SMARC, industrial SBC modules) (IMAGAJAK)

Keywords

• Industrial backplanes
• Embedded computing systems
• Edge computing modules
• System chassis
• CompactPCI VPX VME

Headquarters

HQ city

Hachioji

HQ country

Japan

HQ region

Asia

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Technology or R&D, Operations, Marketing or Sales

Revenue model

1. Industrial Electronics Hardware Sales: Sale of standard and custom-built backplanes, bus racks, system chassis, and embedded computing modules. Products follow industry standards (VME, VPX, CompactPCI, etc.) and are sold to industrial electronics manufacturers and defense equipment makers. Revenue is project-driven with varying order values.
2. Custom Design & Manufacturing (受注設計・生産): Bespoke design, prototyping, and mass production services for custom backplanes, chassis, and electronic equipment. These services support customers with complex, highly specialized requirements, typically billed as professional services or long-term manufacturing contracts.

Go-to-market motion2 records

Distribution channels1 record

Marketing channels3 records

Core offering

EBRAIN designs, manufactures, and sells industrial backplanes, bus racks, and system chassis for embedded computing applications across multiple industry-standard bus architectures (VME, VPX, OpenVPX, CompactPCI, CompactPCI Serial, CompactPCI Express, MicroTCA, AdvancedTCA, SHB Express). The company also offers edge computing modules (SOM, COM Express carrier boards, SMARC series, Zynq UltraScale+ MPSoC modules) and custom design/manufacturing services including signal/power integrity simulation, prototyping, and mass production.

Product overview

EBRAIN is an industrial electronics company specializing in backplanes, bus racks, and system chassis for information, communications, control, video, and measurement applications. The product portfolio centers on two main pillars: (1) the System Solution/Edge Computing line, comprising COM Express carrier boards (350-PCECC07-COME, 753-PCECC07), Zynq UltraScale+ MPSoC SOM, Zynq DIMM modules, Raspberry Pi Compute Module3 carrier boards, SMARC series modules, and i.MX 6UltraLite IoT CPU boards; and (2) the EBRAIN Backplane Series, covering CompactPCI Serial (PICMG CPCI-S.0), CompactPCI Express (PICMG EXP R1.0), CompactPCI (PICMG2.0 R3.0), VME (IEEE 1014-1987), VME64Ex (ANSI/VITA 1.1), VPX/Open VPX (VITA65/VITA46.0), Advanced TCA (PICMG 3.1), MicroTCA (PICMG MTCA.0), and SHB Express (PICMG1.3) standards — all available as backplanes, subracks, system racks, and chassis. Supporting accessories include option boards, fan control boards, plug-in power supplies, extender cards, and PCI Express expansion units. EBRAIN additionally offers commissioned custom design and manufacturing services, as well as engineering simulation services (Signal Integrity, Power Integrity, EMI, thermal/strength analysis).

Differentiator

Problem solved

Functional benefit

Products and services

• System Solution (Edge Computing) System-level solutions encompassing hardware/software development, enclosure and thermal design, and verification services for industrial board computers, covering the full product lifecycle from design to mass production.
• COM Express Carrier Board Carrier board products for COM Express modules, including models 350-PCECC07-COME and 753-PCECC07, enabling integration of COM Express computer-on-modules into end-user systems.
• Zynq UltraScale+ MPSoC SOM System on Module based on Xilinx Zynq UltraScale+ MPSoC, integrating DDR4 memory, eMMC, and GbE, designed for industrial Ethernet communication and machine vision applications.
• Zynq DIMM DIMM-format module based on Xilinx Zynq, with a basic kit option, for industrial embedded applications.
• Raspberry Pi Compute Module3 Carrier Board Carrier board enabling the use of Raspberry Pi Compute Module 3 in industrial embedded applications, with the Raspberry Pi Edge Computer as an integrated solution.
• EBRAIN SMARC Series SMARC-format (Smart Mobility ARChitecture) computer-on-module carrier boards and modules for embedded computing applications.
• i.MX 6UltraLite IoT CPU Board IoT-focused CPU board based on the i.MX 6UltraLite processor, part of the COM Express carrier board product line.
• EBRAIN Backplane Series Full line of backplane products serving as the primary motherboard-like board in electronic equipment, connecting multiple circuit boards through slots without hosting CPUs directly. Includes CompactPCI, VME, VPX, and related bus standards.
• CompactPCI Serial Backplane PICMG CPCI-S.0 compliant backplane supporting high-speed serial interconnects including 10GBaseT Ethernet (8 ports), PCI Express 8Gbps, SATA 6Gbps, USB 3.0 5Gbps, and USB 2.0 480Mbps.
• CompactPCI Express Backplane PICMG EXP R1.0 compliant backplane and extender cards (3U and 6U) for CompactPCI Express systems, supporting Gen2 (5Gbps) and Gen3 (8Gbps) data rates with re-driver and equalizer functionality.
• CompactPCI Backplane (PICMG2.0 R3.0) CompactPCI backplane family compliant with PICMG2.0 REV3.0, available in 3U and 6U sizes, with ATX power connector options and rear I/O board support.
• VME Backplane and System Products VME (IEEE 1014-1987) standard backplanes, subracks, and system racks in 3U and 6U sizes, including J1, J2, and monolithic configurations, plus DIN extender cards.
• VME64Ex Backplane VME64Ex (ANSI/VITA 1.1) standard compliant backplane and system racks, supporting extended VME bus with higher data rates.
• VPX Backplane and Chassis VPX (ANSI/VITA 46.0) and Open VPX (VITA65) compliant backplanes and evaluation chassis. Models include 650-VPX05W (6U x 5-slot, VITA46.1), 650-OPVPX06-G (3U x 6-slot, VITA46.0), and 775-VPX06OP open-frame evaluation chassis.
• Advanced TCA (ATCA) Chassis PICMG 3.1 R1.0 compliant Advanced TCA chassis, 3U x 2-slot, with redundant AC/DC power supplies, IPMI-based shelf management for telecommunications infrastructure.
• MicroTCA Products MicroTCA (PICMG MTCA.0 R1.0) chassis and 12-slot backplane supporting MCH, PM, and 12 AMC slots for telecom and data center applications.
• SHB Express (PICMG1.3) Products SHB Express (System Host Board Express) backplane and chassis compliant with PICMG1.3 standard, designed for industrial automation, medical, and military applications in desktop PC format.
• Commissioned Design and Manufacturing (受託設計・生産) Custom design and manufacturing services for electronic equipment, covering prototyping, design, and mass production of backplanes, bus racks, system chassis, and surrounding electronic components, supporting standards including VME, VPX, CompactPCI, Advanced TCA, MicroTCA, PXI, and SHB Express.
• Simulation Services Engineering simulation services covering Signal Integrity (transmission line/waveform simulation, TDR, S-parameter analysis, network analyzer, jitter), Power Integrity (IR drop, current density), plane resonance analysis, EMI checks (return path, GV crossing, radiation, filtering, decoupling, crosstalk), and thermal/strength analysis.

Segments5 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

One partnership is on record.

• 株式会社日野エンジニアリング (Hino Engineering Co., Ltd.)coreStrategic or Co-development Partner · 19 May 2026On May 19, 2026, EBRAIN entered a business partnership with Hino Engineering Co., Ltd. (Tokyo Hachioji) aimed at strengthening design, development, and manufacturing capabilities for both companies. The partnership establishes mutual cooperation in design/development work (mutual outsourcing and production technology integration for manufacturing efficiency, cost reduction, and quality improvement) and manufacturing operations (optimal production location selection and joint material procurement for cost reduction). Hino Engineering (capital: ¥30 million; established January 23, 1978; representative: Kazuhisa Endo) specializes in industrial computer and camera unit design/development/manufacturing, as well as metal and resin processed parts. The companies had an existing supplier relationship prior to this formalization.

Scale indicators5 records

Recent moves10 records

Expansion highlights4 records

Direct peers

• Acromag: US embedded computing and I/O specialist offering VME, VPX, and CompactPCI boards plus custom design services. Comparable in providing niche embedded computing hardware with customization capabilities.
• Concurrent Technologies: UK-based designer and manufacturer of VME, VPX, and CompactPCI single-board computers and embedded systems. Closely comparable product mix focused on open-standard embedded boards for defense and industrial markets.
• Pixus Technologies: North American specialist in VME, VPX, OpenVPX, and AdvancedTCA backplanes, chassis, and embedded systems. Directly comparable niche focus on open-standard backplanes for defense and industrial customers.
• Elma Electronic: Swiss-headquartered manufacturer of backplanes, chassis, and embedded computing platforms serving defense, medical, and industrial customers. Directly comparable product portfolio (VME/VPX/CompactPCI backplanes, system integration) and similar customer verticals.
• Mercury Systems: US defense electronics company specializing in mission-critical embedded processing (VME, VPX/OpenVPX). Comparable in serving defense primes with high-reliability open-standard embedded computing subsystems.
• Kontron: German embedded computing module and SBC manufacturer with broad VME, VPX, CompactPCI, COM Express, and SMARC product lines. Closest comparable in combining embedded compute modules with carrier/backplane solutions for industrial and defense applications.
• VadaTech: US embedded computing company specializing in VPX, OpenVPX, MicroTCA, and AdvancedTCA chassis, backplanes, and modules. Highly comparable product portfolio targeting defense, telecom, and industrial customers.
• Trenton Systems: US manufacturer of ruggedized servers, workstations, and backplanes with VME/VPX/OpenVPX expertise for defense and industrial customers. Comparable niche in high-reliability embedded computing infrastructure.

Broad incumbents

• Curtiss-Wright Defense Solutions: Major defense electronics supplier with extensive VME, VPX, and ruggedized embedded computing product lines. Comparable in defense vertical and open-architecture computing standards, but with broader portfolio and global scale.
• Advantech: Taiwanese embedded computing platform giant offering single-board computers, COM Express, SMARC modules, and industrial IoT systems. Much larger scale but overlaps significantly in edge computing and industrial embedded compute modules.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat3 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries3 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about EBRAIN