What JCET Group does

JCET Group (江苏长电科技股份有限公司) is the world's third-largest and China's mainland No.1 Outsourced Semiconductor Assembly and Test (OSAT) provider, founded in 1972 and listed on the Shanghai Stock Exchange (600584) since 2003. The company is controlled by China Resources (华润) since 2024 and operates ~8 manufacturing campuses and 20+ business offices across China, South Korea, Singapore, the United States, and Europe, with ~20,000 employees globally. JCET delivers integrated circuit back-end manufacturing and technology services spanning design, wafer bumping, wafer probe, packaging, final test, and shipment to end customers.

The company's product portfolio is organized around turnkey services, with underlying platforms including XDFOI® (multi-dimensional fan-out chiplet integration for 2D/2.5D/3D HPC packaging), XDPKG-3DSiP (3D system-in-package for AI data center power modules), HFBP (a China Patent Gold Award-winning flat bump packaging technology with over 10 billion shipments), eWLB (fan-out wafer-level packaging), and comprehensive wafer-level tooling (FIWLP, FOWLP, IPD, TSV). Application segments are automotive electronics, high-performance computing, storage/memory, edge AI, and power & energy. The firm holds 3,000+ global patents and maintains a deep certification stack including IATF 16949, ISO 27001, Sony Green Partner, Samsung Eco-Partner, and Common Criteria.

JCET generates revenue through B2B enterprise sales of IC back-end manufacturing services on a global direct-sales model, with senior sales leadership in China, North America, South Korea, Singapore, and Europe. In 2025, JCET reported record full-year revenue of RMB 38.87 billion (up 8.1% YoY), profit before tax of RMB 1.74 billion (up 5.4% YoY), and net profit attributable to shareholders of RMB 1.57 billion. Advanced packaging revenue reached RMB 27 billion, with application-level growth led by computing electronics (+42.6%), industrial & medical (+40.6%), and automotive (+31.7%). Q1 2026 net profit attributable to shareholders grew 42.7% YoY, and R&D investment grew 21.4% YoY to RMB 2.09 billion in 2025.

Name

JCET Group

Legal name

江苏长电科技股份有限公司

Website

https://jcetglobal.com

Company type

Public

Founded year

1972

Operating status

Operating

Headcount range

51–100 employees

Short description

JCET Group is the world's third-largest and China's mainland No.1 OSAT provider, offering turnkey IC back-end manufacturing services — design, wafer bumping, packaging, and test — to semiconductor customers across automotive, HPC, storage, edge AI, and power & energy.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging and Test Services

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Services-Testing Laboratories (8734), Instruments For Meas & Testing Of Electricity & Elec Signals (3825)

akta.pro primary industry

Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey) (HDAHADAJ)

akta.pro secondary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Semiconductor packaging services
• IC assembly and test
• Wafer level packaging
• OSAT manufacturing
• Advanced chip packaging

Headquarters

HQ city

Jiangyin

HQ country

China

HQ region

Asia

Offices9 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Operations, Supply Chain, Infrastructure

Revenue model

1. IC Back-End Manufacturing Services: Comprehensive turnkey solutions for integrated circuit manufacturing including semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipments. Revenue from packaging services, testing services, and integrated turnkey solutions spanning from design to delivery.

Go-to-market motion2 records

Distribution channels1 record

Marketing channels5 records

Core offering

JCET Group is the world's third-largest and China's mainland No.1 Outsourced Semiconductor Assembly and Test (OSAT) provider, delivering integrated circuit back-end manufacturing and technology services spanning IC design, package integration design, wafer bumping, wafer probing, multi-die stacked assembly, final testing, packaging, and drop shipment to end customers. The company operates eight manufacturing campuses globally and offers full-spectrum packaging (wirebond, flip chip, wafer bumping, wafer-level, system-in-package, MEMS/sensors, power devices) alongside comprehensive test services, with proprietary platforms including XDFOI, HFBP, XDPKG-3DSiP, and eWLB.

Product overview

JCET Group is the world's third-largest and China's mainland No.1 OSAT (Outsourced Semiconductor Assembly and Test) provider, offering integrated circuit back-end manufacturing and technology services. The company delivers comprehensive turnkey solutions encompassing design services, packaging services (wirebond, flip chip, wafer bumping, wafer level packaging, system-in-package, MEMS/sensors, power devices, and mainstream package advancement), and test services. The product portfolio centers on Turnkey Services as the primary service model, supported by Design Services and Packaging Services as core capabilities, with Test Services providing full-suite testing. Key technology platforms include XDFOI for high-density multi-dimensional heterogeneous integration, XDPKG-3DSiP for 3D system-in-package, HFBP for high-reliability flat bump packaging, and eWLB for fan-out wafer level packaging. Applications span Automotive (electrification, ADAS, communications, computing), High-Performance Computing, Storage (NAND Flash, DRAM), Edge AI devices, and Power & Energy sectors. The company operates 8 manufacturing campuses globally with ~20,000 employees and holds 3,000+ global patents.

Differentiator

Problem solved

Functional benefit

Products and services

• Turnkey Services Comprehensive IC back-end manufacturing and technology services spanning from IC design through test program development, wafer bump, wafer probe, multi-die stacked assembly, final test, packaging, and shipment to end customers. Provided as a full turnkey solutions offering for semiconductor companies.
• Design Services Full-service semiconductor package design and simulation services including thermal analysis, mold flow analysis, mechanical analysis, and electrical analysis for laminate, leadframe, and wafer-level packages. Used by semiconductor companies to develop reliable, high-performance package designs.
• Wirebond Packaging Wire bonding interconnection technology using gold, silver, copper, and aluminum wires for packages including QFN, DFN, QFP, WB-BGA, and WB-LGA formats. Sold as a discrete packaging service to semiconductor customers with hundreds of billions of wirebond units shipped to date.
• Flip Chip Packaging Flip chip interconnection with solder bumps for dense interconnect and high electrical/thermal performance. Covers fcCSP, fcBGA, FCoL, C2W, and 3DIC formats. Used by semiconductor customers needing high I/O density and superior electrical performance.
• Wafer Bumping Wafer bump and redistribution services for 200mm and 300mm wafers using printed bump, ball drop, and plated technology with eutectic, lead-free, and copper pillar alloys. Sold as a discrete wafer bumping service to semiconductor customers.
• Wafer Level Packaging

Quantifiable outcome

• Over 10 billion HFBP shipments and hundreds of billions of wirebond units shipped
• +2 more outcomes

Named customers3 records

Segments5 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability3 records

Feature9 records

Partnerships

Two partnerships are on record, tiered core.

• Advanced Packaging Ecosystem PartnerscoreStrategic or Co-development Partner · 10 March 2026JCET hosts the Advanced Packaging Developers Conference (APDC) bringing together developers from smart vehicle and robotics companies, core component suppliers, chip design, wafer manufacturing, packaging and testing, equipment and materials, software and services, and research institutes for technology exchange and joint innovation.
• Top Three Global Memory ManufacturerscoreStrategic or Co-development PartnerClose collaboration with the world's top memory makers, delivering stable mass production for NAND Flash and DRAM products. JCET partners with top memory manufacturers worldwide with over 20 years of memory packaging experience.

Scale indicators10 records

Recent moves13 records

Expansion highlights7 records

Broad incumbents

• Intel Foundry: Intel's foundry services include EMIB and Foveros advanced packaging offerings; competes with JCET at the leading-edge 2.5D/3D packaging tier for HPC and AI customers.
• TSMC: The world's largest foundry and a growing competitor in advanced packaging (CoWoS, InFO, SoIC); while primarily a wafer-fab player, TSMC's expanding advanced packaging offering competes with JCET for HPC/AI chiplet business.

Direct peers

• UTAC Holdings: Singapore-based OSAT providing analog, mixed-signal, and power IC packaging and test services globally; a regional direct peer competing in mature and mid-range packaging segments.
• Amkor Technology: The world's #2 OSAT and largest US-headquartered packaging/test provider, offering turnkey and advanced packaging services (including 2.5D/3D) for automotive, HPC, mobile, and memory customers — closely comparable in advanced packaging capabilities and customer mix.
• ASE Technology Holding: The world's largest OSAT provider, headquartered in Taiwan, offering wirebond, flip chip, WLP, SiP, and advanced packaging services across similar end-markets including automotive, HPC, memory, and consumer — directly comparable across product portfolio, customer base, and business model.
• Powertech Technology: Taiwan-based OSAT providing IC packaging and testing services including flip chip, wafer bumping, and advanced packaging; competes directly with JCET for memory and logic customers globally.
• Hana Microelectronics: Thailand-based IC assembly and test services provider serving consumer, industrial, and automotive markets; a regional direct peer with similar turnkey packaging capabilities.
• ChipMOS Technologies: Taiwan-based OSAT specializing in memory and mixed-signal packaging and test services, including DDR, NAND, and display driver ICs — a direct competitor particularly in the memory packaging segment.
• Tongfu Microelectronics: The largest Chinese-headquartered OSAT competitor to JCET, offering flip chip, WLP, and advanced packaging for memory, logic, and automotive — competes head-to-head for domestic Chinese customers.
• King Yuan Electronics (KYEC): Taiwan-based leading IC test services provider offering wafer sort, final test, and burn-in services; comparable as a specialist competitor in the test services portion of JCET's portfolio.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/jcetgroup
• Xx.com/JCETGroup
• Facebookfacebook.com/JCETGroup

Compliance19 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles6 records

Subsidiaries10 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about JCET Group