VIA electronic

What VIA electronic does

VIA electronic GmbH is a German "Smart LTCC Foundry" specializing in Low Temperature Co-fired Ceramic technology for custom multilayer ceramic substrates. Founded in 1997 and headquartered in Hermsdorf, Thuringia, the company manufactures custom LTCC packages, multilayer boards, and sensor modules for customers in aerospace and defense, telecommunications, industrial electronics, scientific instrumentation, and biotechnology. Since 2017 it has operated as a wholly-owned subsidiary of Japanese electronic components manufacturer KOA Corporation, and it has completed more than 700 distinct custom LTCC designs over its 27-year history. Notable technical qualifications include fine-line thickfilm printing down to 70 µm, embedded passive components inside the ceramic stack, vacuum brazing for hermetic sealing, 3D cavity and channel structuring, and substrate operation qualified to peak temperatures of 650°C for the ITER nuclear fusion magnetic-sensor program.

The company's offering spans the full project lifecycle: early-stage consulting, CAD layout, design-rule consultancy, and feasibility studies, followed by prototyping and small-to-medium-volume series production. Manufacturing is performed in an ISO Class 5 (10,000) cleanroom under DIN ISO 9001:2015 certification with a documented zero-defect strategy. The firm works with multiple LTCC material systems (Ferro, Heraeus, KOA KLC Tape, plus glass, Al2O3, and AlN substrates) and supports RF/HF designs into the GHz range. VIA maintains research partnerships with four Fraunhofer institutes (IKTS, IZM, IPA, IOF), Fachhochschule Jena, TU Ilmenau, BAM, and Leibniz IPHT across projects including ApaLab, CeraTrust, HIPS, SPIRIT, ProFunK, and PROACTIF (2025-2028). It won the 2024 F4E Technology Transfer Demonstrator Award for copper-LTCC interconnection work on the ITER project.

VIA operates a sales-led, consultative go-to-market through two named direct sales contacts (Kathrin Jööstel and Harald Klaubert). Customers supply electrical schematics or requirements, and VIA performs CAD layout, prototyping, and series production against quote-based pricing under EXW Hermsdorf (Incoterms 2020) terms with 14-day payment cycles. Revenue is generated from custom hardware product sales plus engineering and professional services covering CAD layout, vacuum brazing, and contract assembly. Marquee customers include Fusion for Energy (ITER, Cadarache, France) and EU-funded consortia such as PROACTIF; customer-specific audits have been demonstrated across Sensor, Medical, Nuclear Energy, Aerospace, and Defense industries.

Name

VIA electronic

Legal name

VIA electronic GmbH

Website

https://via-electronic.de

Company type

Private

Founded year

1997

Operating status

Operating

Headcount range

11–50 employees

Short description

VIA electronic GmbH is a German Smart LTCC Foundry that custom-designs and manufactures Low Temperature Co-fired Ceramic packages, multilayer boards, and sensor modules for aerospace, defense, telecom, industrial, and scientific customers, operating as a wholly-owned subsidiary of Japan's KOA Corporation.

Ownership category

akta.pro rank

Product category

Custom Ceramic Electronic Substrates and Packaging

NAICS

Semiconductor and Other Electronic Component Manufacturing (3344), Semiconductor and Other Electronic Component Manufacturing (33441), Communications Equipment Manufacturing (3342), Other Communications Equipment Manufacturing (33429)

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600), Industrial Instruments For Measurement, Display, And Control (3823), Communications Equipment, Nec (3669)

akta.pro primary industry

Ruggedized/Harsh-Environment Electronics Manufacturing (IP-rated, shock/vibration, wide-temp) (IMAGAGAF)

akta.pro secondary industries

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Embedded & HMI Electronics Manufacturing (Industrial PCs, HMIs, Panel PCs) (IMAGAGAD), System-Level, Multi-Physics & Package/PCB Co-Design (EDA) (HDAHAFAD), Test, Measurement & Calibration Equipment Manufacturing Services (ATE, DAQ, metrology electronics) (IMAGAGAH)

Keywords

• LTCC ceramic substrates
• Multilayer ceramic packaging
• Custom ceramic manufacturing
• Harsh environment electronics
• Thick film technology

Headquarters

HQ city

Hermsdorf

HQ country

Germany

HQ region

Europe

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Operations, Supply Chain, Marketing or Sales

Revenue model

1. Custom LTCC Product Manufacturing: Custom design and manufacturing of LTCC multilayer substrates, packages, and sensor carriers for small to medium volumes. Includes consulting, feasibility studies, layout and design, prototyping, and series production services.
2. Engineering and Development Services: Early-stage project collaboration, CAD layout services, design rule consulting, feasibility studies, and prototyping support. Customers can provide electrical schematics for VIA to create manufacturing-ready designs.
3. Brazing and Assembly Services: Vacuum brazing of frames, heatsinks, RF connectors, tubes and pins. Assembly services including gluing of components with conductive and non-conductive adhesives for small and medium volumes.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

VIA electronic GmbH is a custom LTCC (Low Temperature Co-fired Ceramic) foundry that designs and manufactures bespoke multilayer ceramic substrates, packages, and sensor modules. The company provides end-to-end services from consulting and CAD layout through prototyping to series production for small and medium volumes, serving customers in aerospace, defense, telecommunications, industrial electronics, and scientific instruments.

Product overview

VIA Electronic GmbH is a Smart LTCC Foundry specializing in Low Temperature Co-Fired Ceramic (LTCC) technology. The company offers a unified portfolio of LTCC-based products and manufacturing services including LTCC Packages (housings), LTCC Multilayer Boards, and LTCC Sensor Modules as core products. These are supported by Thickfilm Technology manufacturing, Brazing/Soldering Services, Assembly Services (gluing), and CAD/Layout Services for custom design. The company operates under ISO 9001:2015 certified quality management and provides R&D partnership services for technology development. Founded in 1997, VIA Electronic has delivered over 700+ different LTCC designs and became part of the KOA Group in 2017.

Differentiator

Problem solved

Functional benefit

Products and services

• LTCC Packages Highly specialized ceramic packages using LTCC technology with 3D construction flexibility. Supports LCC, Ball Grid, and Land Grid Arrays with options for high frames, deep cavities, and integrated channels for fluids or gases. Designed for aerospace, defense, and high-reliability electronics.
• LTCC Multilayer Boards
• LTCC Sensor Modules
• CAD/Layout Services
• Brazing/Soldering Services
• Assembly Services

Quantifiable outcome

• Over 700 custom LTCC designs completed for customers across various industries
• +3 more outcomes

Named customers4 records

Segments5 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

14 partnerships are on record, tiered core and minor.

• PROACTIF Project Consortium (41 partners, 13 countries)coreStrategic or Co-development Partner · 1 January 2025EU-funded project for unmanned aerial vehicles in civil security missions. VIA developing 4D radar system packaging. Consortium funded by EU, BMFTR, and TAB. Duration: 2025-2028.
• KOA Corporation (Japan)coreStrategic or Co-development Partner · 1 January 2017Parent company of VIA electronic since 2017. KOA is a Japanese corporation specializing in electronic components. VIA has access to KOA LTCC materials (KLC Tape) and benefits from KOA's global technology ecosystem.
• Fraunhofer IKTS (Institut für Keramische Technologien und Systeme)coreStrategic or Co-development PartnerFraunhofer IKTS is a key research partner, particularly for the ApaLab project developing LTCC-based Lab-on-a-Chip modules for bio-particle analysis using acoustic phoresis.
• Fachhochschule Jena (University of Applied Sciences Jena)coreStrategic or Co-development PartnerAcademic research partner collaborating on LTCC technology development and applications.
• Bundesanstalt für Materialforschung und -prüfung (BAM)coreStrategic or Co-development PartnerFederal Institute for Materials Research and Testing as academic/governmental partner for materials research.
• Technische Universität IlmenaucoreStrategic or Co-development PartnerTechnical University partner for research collaboration on LTCC applications and ceramic technologies.
• Institut für Fügetechnik und Werkstoffprüfung Jena (ifw Jena)coreStrategic or Co-development PartnerLocal institute for joining technology and materials testing, collaborating on LTCC assembly and brazing technologies. Partner in ApaLab, ProFunK, and HIPS projects.
• Fraunhofer IZM (Institut für Zuverlässigkeit und Mikrointegration)coreStrategic or Co-development PartnerFraunhofer institute for reliability and microintegration, partnering on advanced packaging and integration technologies.
• Fraunhofer IPA (Institut für Produktionstechnik und Automatisierung)coreStrategic or Co-development PartnerFraunhofer institute for production technology and automation, collaborating on manufacturing processes.
• Fraunhofer IOF (Institut für Angewandte Optik und Feinmechanik)coreStrategic or Co-development PartnerFraunhofer institute for applied optics and precision engineering, collaborating on optical integration in LTCC.
• LCP Laser-Cut-ProcessingminorStrategic or Co-development PartnerPartner in ApaLab project for laser cutting of LTCC materials in Lab-on-a-Chip applications.
• Leibniz IPHT (Institut für Photonische Technologien)minorStrategic or Co-development PartnerLeibniz Institute for Photonic Technology, partner in ApaLab project for fluidic LTCC structures and optical integration.
• MildendominorStrategic or Co-development PartnerPartner in ApaLab project for LTCC Lab-on-a-Chip development.
• Fusion for Energy (F4E)coreStrategic or Co-development PartnerEU agency managing Europe's contribution to ITER. VIA selected as manufacturing partner for magnetic sensors in nuclear fusion reactor. Won F4E Technology Transfer Demonstrator Award.

Scale indicators8 records

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• TDK Corporation: Major Japanese electronics components group with LTCC and multilayer ceramic product lines for automotive, telecom and industrial — comparable technology but much larger scale and broader portfolio.
• Murata Manufacturing Co., Ltd. Global leader in ceramic passive components and LTCC-based modules for RF, telecom and automotive — competing with VIA in LTCC-based RF modules and packages but at vastly larger scale.
• Maruwa Co., Ltd. Japanese manufacturer of ceramic substrates and LTCC-based packages for automotive, telecom and industrial RF — comparable LTCC technology base with significantly larger scale and product breadth.
• Kyocera Corporation: Japanese ceramics and electronics conglomerate producing LTCC/HTCC substrates and packages for semiconductor, automotive and industrial customers — a broad incumbent in the same ceramic-packaging space.
• NGK Insulators / NTK Technologies: Japanese ceramics manufacturer producing ceramic substrates and packages for semiconductor and harsh-environment electronics — overlapping ceramic-substrate capability with very different scale.
• Cicor Group: Swiss EMS group with advanced microelectronics and ceramic substrate capabilities serving aerospace, medical and industrial — overlapping customer segments with a much broader scale and service portfolio.

Direct peers

• Remtec Inc. US-based custom LTCC and ceramic packaging foundry serving aerospace, defense, medical and RF customers with multilayer ceramic substrates and packages — directly comparable custom-manufacturing model to VIA.
• AdTech Ceramics (Materion): Ceramic substrates and packaging manufacturer (now part of Materion) producing thick-film and LTCC-based multilayer ceramics for harsh-environment and high-reliability electronics — overlapping product portfolio and customer base.
• Micro Systems Engineering (MSE): Germany-based specialist in ceramic substrates, LTCC and HTCC packaging for medical, aerospace and industrial customers — directly comparable European LTCC foundry competing for the same niches.

Others

• DuPont Microcircuit Materials: Supplier of LTCC tapes and thick-film pastes used in multilayer ceramic manufacturing — adjacent ecosystem participant enabling VIA's production process rather than a direct competitor.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/via-electronic

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about VIA electronic