DUKSAN Hi-Metal

What DUKSAN Hi-Metal does

DUKSAN Hi-Metal Co., Ltd. (덕산하이메탈㈜) is a South Korean materials and components manufacturer specializing in semiconductor packaging interconnect materials. Founded in 1999 and headquartered in Ulsan, the company operates as a subsidiary of DS Holdings (덕산홀딩스) and runs a focused portfolio of solder-based products—solder balls, core solder balls, low alpha tin, solder powder, flux, and solder paste—targeting BGA (Ball Grid Array) and CSP (Chip Scale Package) packaging applications for semiconductor manufacturers. Production emphasizes strict constant temperature and humidity control, automated processes, and diverse alloy compositions to deliver high-reliability interconnect materials. The company also develops DS Metpost™, a proprietary copper post technology positioned for advanced packaging interconnections, reflecting an R&D push beyond traditional solder materials into next-generation interconnect solutions.

The business model is direct B2B hardware sales to semiconductor manufacturers, with pricing negotiated on a per-contract basis tied to volume and technical specifications. Marketing channels are limited to corporate communications (IR/PR website) and industry events such as INNO-Creator, consistent with an enterprise field-sales motion. In January 2024 the company signed an industry-academia MOU with Pukyong National University's College of Engineering to build a specialized workforce pipeline, and in early 2026 it was visited as part of Korea Eximbank's AX Special Program—a national AI transformation initiative pledging over 22 trillion won ($15 billion) in five-year financial support—placing it within a strategic funding ecosystem though without disclosed AI capability of its own. The company operates privately within the DS Holdings group (which also includes NeoLux, Navcours, AETHER CT, Turbomachinery, and Tigris), with no public listing, no disclosed revenue, and limited publicly available leadership information beyond the R&D Center Director.

Name

DUKSAN Hi-Metal

Legal name

덕산하이메탈(주)

Website

https://hi-metal.co.kr

Company type

Private

Founded year

1999

Operating status

Operating

Headcount range

11–50 employees

Short description

DUKSAN Hi-Metal is a South Korean subsidiary of DS Holdings that manufactures semiconductor packaging interconnect materials—including solder balls, core solder balls, low alpha tin, flux, solder powder, and paste—for B2B semiconductor manufacturers using BGA and CSP packaging technologies.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Materials

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441), Semiconductor and Related Device Manufacturing (334413)

SIC

Electronic Components & Accessories (3670), Electronic Components, Nec (3679)

akta.pro primary industry

Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)

akta.pro secondary industries

Leadframes & Package Interconnect Materials (HDAHADAF), Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Semiconductor packaging materials
• Solder ball manufacturing
• BGA interconnect solutions
• Chip packaging materials
• Advanced packaging materials

Headquarters

HQ city

Ulsan

HQ country

South Korea

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Operations, Supply Chain, Technology or R&D, Personnel, Infrastructure

Revenue model

1. Semiconductor Packaging Materials Sales: Revenue generated from the sale of solder balls, core solder balls, solder powder, flux, and solder paste to semiconductor manufacturers for chip packaging applications.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels2 records

Core offering

DUKSAN Hi-Metal manufactures and supplies solder-based interconnect materials for semiconductor packaging, including solder balls, core solder balls, solder powder, flux, solder paste, low alpha tin, and DS Metpost™ copper post technology. These materials are sold to semiconductor manufacturers for BGA, CSP, and advanced chip packaging applications.

Product overview

DUKSAN Hi-Metal is a materials and components company specializing in semiconductor packaging solutions. The company offers a unified portfolio of solder-based products including solder balls, core solder balls, low alpha tin, solder powder, flux, and solder paste—all essential materials for BGA, CSP, and other semiconductor package technologies. The product line is complemented by R&D offerings such as DS Metpost™ copper post technology. The company emphasizes strict temperature and humidity control, automated processes, diverse alloy compositions, and advanced manufacturing capabilities to deliver high-reliability products with excellent workability.

Differentiator

Problem solved

Functional benefit

Brands

• DS Metpost™: Cu post product developed by the company's R&D division for advanced semiconductor packaging applications.

Products and services

• Solder Ball (솔더볼) Core interconnect components for semiconductor package technologies such as BGA (Ball Grid Array) and CSP (Chip Scale Package), connecting chips to substrates. Sold to semiconductor manufacturers.
• Core Solder Ball (코어솔더볼) Specialized core solder balls offering enhanced thermal and electrical performance characteristics for advanced semiconductor packaging applications. Sold to semiconductor manufacturers.
• Low Alpha Tin Specialty solder material designed for semiconductor applications requiring reduced alpha particle emission to prevent soft error failures in advanced packages. Sold to semiconductor manufacturers.
• Solder Powder (솔더파우더) Solder powder used in electronic assembly and semiconductor packaging processes for creating reliable metallurgical connections. Sold to semiconductor manufacturers and electronics assemblers.
• Flux (플럭스) Flux materials for semiconductor and electronics assembly that clean oxide surfaces and improve wetting during soldering processes. Sold to semiconductor manufacturers and electronics assemblers.
• Solder Paste (솔더페이스트) Solder paste formulations for surface mount technology and semiconductor packaging applications enabling precise component attachment. Sold to semiconductor manufacturers and electronics assemblers.
• DS Metpost™ (Cu post) Proprietary copper post (Cu post) technology developed by the company's R&D division for advanced semiconductor packaging interconnections. Sold to semiconductor manufacturers.

Segments1 record

Ideal customer profiles1 record

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

One partnership is on record.

• Pukyong National University (국립부경대학교)supportingStrategic or Co-development Partner · 30 January 2024DUKSAN Hi-Metal signed an industry-academia cooperation MOU with Pukyong National University's College of Engineering on January 30, 2024. The partnership aims to cultivate professional workforce in the semiconductor packaging materials field, combining academic expertise with industry practical experience.

Scale indicators1 record

Recent moves4 records

Expansion highlights4 records

Direct peers

• Senju Metal Industry Co., Ltd. Japan-based global leader in solder balls and flux for BGA and CSP packaging. Directly comparable to DUKSAN Hi-Metal across core solder ball and packaging material product lines serving the same semiconductor packaging customers.
• Tatsuta Electric Wire & Cable Co., Ltd. Japanese manufacturer of specialty conductive materials including solder and bonding materials for semiconductor packaging. Comparable to DUKSAN Hi-Metal in advanced interconnect and packaging material offerings.
• Mitsui Mining & Smelting Co., Ltd. Japanese materials manufacturer producing solder powders, fluxes, and advanced packaging materials. Direct peer in advanced and conventional packaging materials supplied to semiconductor manufacturers.
• Alpha Assembly Solutions (MacDermid Alpha): Global supplier of solder materials, fluxes, and pastes for electronics assembly and semiconductor packaging. Directly overlaps DUKSAN Hi-Metal's full solder materials portfolio.
• Heraeus Electronics: German specialty materials supplier of solder pastes, bonding wires, and packaging materials for semiconductor and power electronics. Direct competitor in advanced interconnect and packaging materials.
• Nihon Superior Co., Ltd. Japanese supplier of solder alloys, solder pastes, and fluxes for electronics and semiconductor packaging. Comparable to DUKSAN Hi-Metal in alloy chemistry, packaging materials, and customer base.
• Indium Corporation: US-based specialty materials supplier of solder powders, fluxes, and solder pastes for electronics and semiconductor packaging. Direct competitor in DUKSAN's core solder materials categories including powder, paste, and flux.

Broad incumbents

• Proterial, Ltd. (formerly Hitachi Metals): Diversified Japanese materials and electronic components group with a portfolio that includes solder materials, bonding wires, and packaging materials. Comparable in product categories but operates as a broader incumbent rather than a packaging-materials specialist.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks5 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/duk-san-hi-metal-co-ltd

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about DUKSAN Hi-Metal