Tong Hsing Electronic Industries

What Tong Hsing Electronic Industries does

Tong Hsing Electronic Industries, Ltd. (同欣電子工業股份有限公司, TWSE: 6271) is a Taiwan-based ceramic substrate and semiconductor micro-module packaging manufacturer founded in 1974 and headquartered in Bade District, Taoyuan City. The company operates a platform-plus-modules architecture across four product categories: (1) ceramic metalized substrates including DPC (Direct Plated Copper), DBC (Direct Bonded Copper), AMB (Active Metal Brazing), and thick film printed circuit substrates; (2) CMOS imaging products and module packaging; (3) power semiconductor and RF/high-frequency wireless communication module packaging; and (4) customized packaging and testing services spanning wafer probing, backgrinding, wafer reconstruction, assembly, automated inspection, and finished module testing. Proprietary metallization and brazing processes combine ceramic thermal management with copper conductivity for high-power, high-reliability applications.

The company's revenue model is B2B hardware sales of ceramic substrates plus professional services revenue from customized packaging and testing. End markets include automotive electronics (ADAS image sensors, EV power modules, IGBT, inverters, charging systems), consumer electronics (smartphone CMOS image sensors, 3D sensing, fingerprint recognition), wireless communications (RF modules, satellite communications), LEDs and lighting, aerospace, medical electronics, and semiconductor equipment. The company sells directly to enterprise customers worldwide, with manufacturing operations across Taiwan (Yingge, Bade, Longtan, Zhubei) and the Philippines, and a new 89,000 sqm Bade Plant under construction to add 2,300+ jobs.

Tong Hsing is a subsidiary of Yageo Corporation (國巨集團), following the 2019–2020 merger with Kingpak Technology Inc. (勝麗國際, TWSE: 6238), a leading automotive CMOS image sensor packaging company. The combined entity serves as Yageo's platform for automotive electronics, industrial products, 5G, and IoT packaging. In 2021, the company received Taiwan's 6th Outstanding Backbone Enterprise Award from the Ministry of Economic Affairs, and in 2022 underwent a generational leadership transition with CS Chang (張嘉帥) appointed General Manager.

Name

Tong Hsing Electronic Industries

Legal name

TONG HSING ELECTRONIC IND., LTD.

Website

https://theil.com

Company type

Public

Founded year

1974

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

Tong Hsing Electronic Industries is a Taiwan-based manufacturer of ceramic metalized substrates (DPC, DBC, AMB, thick film) and a provider of CMOS image sensor, power semiconductor, and RF module packaging and testing services, serving enterprise customers across automotive electronics, consumer electronics, wireless communications, medical, and industrial sectors.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging and Ceramic Substrate Manufacturing

NAICS

Semiconductor and Other Electronic Component Manufacturing (3344), Semiconductor Machinery Manufacturing (333242), Other Measuring and Controlling Device Manufacturing (334519)

SIC

Printed Circuit Boards (3672), Semiconductors & Related Devices (3674), Instruments For Meas & Testing Of Electricity & Elec Signals (3825)

akta.pro primary industry

Industrial PCB & Substrate Components (Bare PCBs, rigid-flex, ceramic substrates, thick-film) (IMAGAJAM)

Keywords

• Ceramic substrate manufacturing
• Semiconductor packaging services
• Power module packaging
• CMOS image sensor packaging
• RF module assembly

Headquarters

HQ city

Taipei

HQ country

Taiwan

HQ region

Asia

Offices5 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Operations, Infrastructure, Technology or R&D, Marketing or Sales

Revenue model

1. Ceramic Substrate Manufacturing: Manufacturing and sales of ceramic metalized substrates including DPC, DBC, AMB, and thick film products for various applications including LED, automotive, aerospace, and semiconductor equipment.
2. Module Packaging and Testing Services: Customized semiconductor micro-module packaging, testing, and assembly services for CMOS imaging sensors, power semiconductors, RF modules, and MEMS products.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

Tong Hsing Electronic Industries manufactures ceramic metalized substrates — DPC (Direct Plated Copper), DBC (Direct Bonded Copper), AMB (Active Metal Brazing) and Thick Film Printed Circuit Substrates — and delivers customized semiconductor micro-module packaging and testing services spanning wafer probing, backgrinding, assembly and finished module testing. Its products and services serve automotive electronics (including ADAS CMOS image sensors via Kingpak), high-brightness LEDs, RF microwave communications, power semiconductors, MEMS, biomedical inspection devices and aerospace applications.

Product overview

Tong Hsing Electronic Industries is a multi-product electronics manufacturing services (EMS) company operating a platform-plus-modules architecture across four core product categories: (1) Ceramic Metalized Substrates — including DPC (Direct Plated Copper), DBC (Direct Bonded Copper), AMB (Active Metal Brazing), and Thick Film Printed Circuit Substrates; (2) CMOS Imaging Products — encompassing imaging sensor packaging and testing (expanded via the merger with Kingpak Technology/勝麗國際); (3) Module Packaging — covering Power Semiconductors and RF/HF Wireless Communication Modules; and (4) Customized Module Packaging and Testing — providing wafer-level and module-level services for MEMS, image sensors, and biomedical inspection products. The company leverages thick/thin-film substrate manufacturing and advanced semiconductor packaging technologies to serve applications across wireless communications, automotive electronics, LEDs, solar cells, aerospace, medical, and networking equipment.

Differentiator

Problem solved

Functional benefit

Products and services

• Direct Plated Copper — DPC Ceramic Substrates (直接電鍍銅 DPC) Ceramic substrates formed by sputtering and photolithography to produce high-density, well-bonded copper circuit patterns on ceramic. Designed for high-brightness high-power LEDs, microwave communications, laser systems and semiconductor equipment.
• Direct Bonded Copper — DBC Ceramic Substrates (直接覆銅 DBC) Proprietary DBC ceramic substrates produced by bonding thick copper foil directly to ceramic through high-temperature oxidation sintering, then patterned by photolithography. Used in IGBT modules, high-frequency switching power supplies, automotive, aerospace, satellite communications, solar cells, telecom power supplies and laser systems.
• Active Metal Brazing — AMB Substrates (活性金屬硬焊 AMB) AMB substrates made by brazing ultra-thick copper foil onto silicon nitride ceramic with a proprietary brazing material, then patterning by photolithography. Features high thermal conductivity, heat dissipation and reliability for high-power modules in energy conversion, electric vehicles, trams and charging systems.
• Thick Film Printed Circuit Substrates (厚膜印刷電路板) Thick film ceramic substrates produced by screen printing conductor traces, dielectric, resistors and over-glass onto ceramic, followed by high-temperature sintering and laser trimming for precision resistance. Used in aerospace, automotive and medical products requiring high precision in harsh environments.
• Power Semiconductor Packaging and Testing (功率半導體 Power Semiconductor) Provides standard lead frame packaging and power semiconductor module packaging and testing services, combined with high-thermal-conductivity ceramic substrates for a one-stop packaging solution.
• RF / High-Frequency Wireless Communication Module Packaging (高頻無線通訊模組 RF Package) Integrates surface mount, die bonding, wire bonding, flip chip, encapsulation and back-end packaging/test processes to deliver QFN, LGA, BGA, Air Cavity, PCBA, SiP and AiP modules for high-frequency wireless communication applications.
• CMOS Imaging Products — Image Sensor Packaging and Testing (CMOS 影像產品) CMOS image sensor packaging and testing services for consumer and automotive applications, including smartphones, IoT, ADAS, connected cars and AR/VR. Capabilities built on the 2020 merger with Kingpak Technology, Taiwan's leading automotive CMOS image sensor packaging company.
• Module Packaging Services (模組封裝) Module packaging services covering power semiconductor modules and RF communication modules, delivering comprehensive packaging and testing solutions for a range of electronic applications.
• Customized Module Packaging and Testing (客製化封裝與測試) Customized semiconductor micro-module packaging and testing services — wafer probing, backgrinding, wafer reconstruction, assembly, automated inspection and finished module testing — for image sensors, MEMS and biomedical inspection products.

Named customers3 records

Segments5 records

Ideal customer profiles3 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

One partnership is on record.

• Kingpak Technology Inc. (勝麗國際股份有限公司)coreStrategic or Co-development Partner · 27 December 2019Tong Hsing merged with Kingpak Technology (stock code 6238) via share conversion. Each Kingpak share was exchanged for 1.244 Tong Hsing shares. The merger combined consumer electronics and automotive CMOS image sensor packaging capabilities. Kingpak became a 100% owned subsidiary of Tong Hsing, creating synergies in product lines and customer base for imaging sensor markets including smartphones, IoT, ADAS, and AR/VR applications.

Scale indicators6 records

Recent moves8 records

Expansion highlights12 records

Direct peers

• CoorsTek: US-based global technical ceramics manufacturer serving semiconductor, automotive, aerospace, and medical markets. Comparable to Tong Hsing in advanced ceramic substrate manufacturing for high-reliability applications.
• TDK Corporation: Major Japanese manufacturer of electronic components and substrates, including ceramic substrates for power modules and automotive electronics. Competes with Tong Hsing in ceramic substrate manufacturing for similar end markets.
• Kyocera Corporation: Japanese ceramics and electronic components manufacturer with a substantial ceramic substrate and packaging business serving automotive, semiconductor, and industrial customers. Comparable product portfolio to Tong Hsing's ceramic substrate and module packaging offerings.
• Murata Manufacturing: Japanese global leader in ceramic-based electronic components and substrates, including multilayer ceramic capacitors and ceramic substrate products. Directly competes with Tong Hsing in ceramic metallized substrates used in power electronics, RF modules, and automotive applications.
• NGK Insulators: Japanese specialty ceramics manufacturer producing ceramic substrates for power electronics and semiconductor applications. Directly comparable to Tong Hsing's ceramic substrate business serving power semiconductor and high-power LED markets.

Regional players

• Unimicron Technology: Taiwan-based PCB and IC substrate manufacturer serving global semiconductor and electronics customers. Comparable substrate-and-electronics-interconnect focus to Tong Hsing, though broader in PCB categories.

Broad incumbents

• ASE Technology Holding: Taiwan-based global leader in semiconductor packaging and testing services. Comparable to Tong Hsing's packaging and testing services for image sensors, MEMS, and power semiconductors, though ASE operates at significantly larger scale.

Emerging players

• ChipMOS Technologies: Taiwan-based semiconductor packaging and testing services provider serving display driver, memory, and mixed-signal customers. Overlaps with Tong Hsing's module packaging and testing service offerings.

Others

• Kingpak Technology: Taiwan-based automotive CMOS image sensor packaging and testing specialist that merged with Tong Hsing in 2020. Now a wholly-owned subsidiary, but historically a direct peer in automotive image sensor packaging.
• Yageo Corporation: Taiwan-based global passive components manufacturer and parent company of Tong Hsing. Yageo is not a direct competitor but provides strategic context, group synergies, and financial backing as Tong Hsing's majority/strategic parent.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/tong-hsing-electronic-ind.

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Tong Hsing Electronic Industries