Hana Microelectronics Public

What Hana Microelectronics Public does

Hana Microelectronics Public Co., Ltd. is a Thailand-headquartered, publicly listed (SET: HANA) independent Electronics Manufacturing Services (EMS) and Outsourced Semiconductor Assembly and Test (OSAT) provider operating 6+ production facilities across Thailand (Lamphun, Ayutthaya, Bangkok HQ), China (Jiaxing), the United States (Ohio), Cambodia (Koh Kong), and Korea (Power Master Semiconductor). Founded in 1978 and listed since 1993, the group employs more than 10,000 personnel across over 1.1 million square feet of manufacturing floor space and runs an installed IC packaging capacity of approximately 20 million units per day, with roughly 80% of packaging tested in-house.

The company's core offerings fall into two segments: a Microelectronics (PCBA) division delivering SMT, flip-chip, chip-on-board (COB), chip-on-flex, and box-build assembly at the Lamphun, Jiaxing, and Cambodia facilities; and an IC division providing wafer-level chip scale packaging (WLCSP), copper wire bonding, multi-die/stacked-die, System-in-Package (SIP), and final test services at the Ayutthaya and Jiaxing OSAT facilities. Specialized lines include IGBT and silicon carbide (SiC) power modules for electric vehicles, optical sensor packages (oDFN/oLGA), LCOS and MEMS microdisplays, and high-speed roll-to-roll RFID inlay manufacturing. The portfolio carries IATF 16949, ISO 13485, ISO 9001, ISO 14001, ISO 45001, ISO 27001, and IECQ QC 080000 certifications, qualifying Hana for automotive, medical, and industrial safety-critical applications.

Hana generates revenue through B2B manufacturing services billed on a quote-based, volume- and complexity-driven pricing model to multinational customers in automotive, consumer electronics, industrial, medical devices, and telecommunications. Go-to-market is direct enterprise sales via offices in Santa Clara (USA), Philippines, Singapore, and representatives in France and Germany, supplemented by an investor-relations-driven positioning as a low-cost Southeast Asian manufacturing partner. The most recent disclosed quarterly revenue was THB 4,932 million (USD 156 million) in Q1 2026, with USD-denominated revenue essentially flat (+1%) year-over-year, while normalized profit margin compressed sharply from 8.7% to 2.1%.

Name

Hana Microelectronics Public

Legal name

Hana Microelectronics Public Co., Ltd.

Website

https://hanagroup.com

Company type

Public

Founded year

1978

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Hana Microelectronics is a Thailand-headquartered, SET-listed independent EMS and OSAT provider operating 6 production facilities across Thailand, China, the US, Cambodia, and Korea, serving global automotive, consumer electronics, industrial, medical, and telecom customers with PCBA, IC packaging, and microdisplay services.

Ownership category

akta.pro rank

Product category

Electronic Manufacturing Services (EMS)

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Semiconductor and Related Device Manufacturing (334413)

SIC

Printed Circuit Boards (3672), Semiconductors & Related Devices (3674)

akta.pro primary industry

PCB Assembly (PCBA/EMS) (HDAHAOAI)

akta.pro secondary industries

Optoelectronics & Photonics (LED/Laser/Optical ICs) (HDAHAAAH), High-Voltage, Power Discretes & Modules (IGBT/MOSFET/SiC/GaN) (HDAHAAAK)

Keywords

• Electronics manufacturing services
• Semiconductor assembly
• Printed circuit boards
• Microdisplay manufacturing
• Power module assembly

Headquarters

HQ city

Lak Si

HQ country

Thailand

HQ region

Asia

Offices7 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Supply Chain, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. Printed Circuit Board Assembly (PCBA): PCBA segment produces and sells PCBA products including SMT, COB, flip-chip assembly for automotive, consumer electronics, industrial, medical, and telecommunication applications. Revenue is generated through manufacturing services for customer-specified assemblies.
2. Integrated Circuit (IC) Assembly and Test: IC segment produces and sells IC assemblies including packaging, wafer processing, and final test services. Revenue derived from semiconductor assembly and test services with approximately 20 million units per day capacity.
3. Microdisplay and RFID Products: Ohio facility manufactures LCOS microdisplays and RFID devices for sale to customers in telecommunications and security/access control markets.

Go-to-market motion2 records

Distribution channels3 records

Marketing channels4 records

Core offering

Hana Microelectronics manufactures electronic products on a contract basis through two main segments: (1) Microelectronics/PCBA division providing printed circuit board assembly, SMT, chip-on-board, flip-chip, and box build services for automotive, consumer electronics, industrial, and medical applications; and (2) IC division providing Outsourced Semiconductor Assembly and Test (OSAT) services including wafer processing, die attach, wire bonding, molding, and final testing. Specialized facilities in Ohio produce LCOS/MEMS microdisplays and RFID inlays, while Power Master Semiconductor in Korea manufactures IC power management and SiC wafer devices.

Product overview

Hana Microelectronics Public Co., Ltd. operates as a leading independent electronics manufacturing service (EMS) and outsourced semiconductor assembly and test (OSAT) company in Southeast Asia, with six manufacturing facilities in Thailand, China, USA, and Cambodia, plus a seventh subsidiary Power Master Semiconductor in Korea. The company offers two main business segments: the Microelectronics (PCBA) division providing printed circuit board assembly, chip-on-board, SMT, and box build services across Lamphun, Jiaxing, and Cambodia facilities; and the IC division providing semiconductor assembly, packaging, and test services through Ayutthaya and Jiaxing IC operations. The company also operates specialized facilities for microdisplays (LCOS) and RFID in Ohio, and power management/SiC devices in Korea. Key product lines include custom semiconductor packaging (MEMS, sensors, SIP, multi-chip modules), optical sensor packages, RFID devices, LED assembly (automotive and general lighting), and power modules including IGBT and SiC. The company employs over 10,000 personnel across more than 1,100,000 square feet of manufacturing space.

Differentiator

Problem solved

Functional benefit

Products and services

• Printed Circuit Board Assembly (PCBA) PCBA manufacturing services including SMT, flip chip, chip-on-board, and box build assembly for automotive, consumer, industrial, and medical applications.
• Integrated Circuit (IC) Assembly and Test Services Outsourced semiconductor assembly and test (OSAT) services including wafer processing, die attach, wire bonding, molding, and final testing for various IC packages with approximately 20 million units per day total installed capacity and over 600 test systems.
• IC and LED Assembly (Jiaxing) IC assembly and test, LED packaging, power modules including IGBT and SiC modules, RFID devices, and micro PCBA assembly services at the Jiaxing, China facility.
• Microdisplays and RFID (Hana Technologies) Liquid Crystal on Silicon (LCOS) microdisplays, MEMS-based microdisplays, and high-speed roll-to-roll RFID inlay manufacturing at Ohio, USA facility.
• EMS Assembly (Cambodia) SMT and labor-intensive microelectronics assemblies for logical and physical access control devices, remote controls, commercial products, and home appliances at Cambodia facility.
• IC Power Management and SiC Devices (Power Master Semiconductor) IC power management devices and silicon carbide (SiC) wafer device manufacturing through subsidiary Power Master Semiconductor in Korea.
• Custom Semiconductor Packaging Solutions

Segments5 records

Ideal customer profiles6 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

One partnership is on record.

• FT1 Corporation LimitedcoreStrategic or Co-development Partner · 1 January 2024Hana Microelectronics invested THB 0.49 million initially and later increased investment by THB 744.80 million in FT1 Corporation Limited, a subsidiary of PTT Public Co., Ltd., resulting in 49% ownership. This represents a strategic business opportunity in the smart electronics industry.

Scale indicators9 records

Recent moves12 records

Expansion highlights5 records

Broad incumbents

• Advanced Semiconductor Engineering (ASE): World's largest OSAT provider offering IC packaging and test services at significantly larger scale than Hana's Ayutthaya facility. Comparable as incumbent OSAT competitor serving overlapping semiconductor customers.
• Amkor Technology: Large-scale OSAT provider offering semiconductor packaging and test services including advanced packaging. Comparable to Hana's IC assembly and test business, especially for power and automotive-grade packages.

Direct peers

• Jabil Inc. One of the world's largest EMS companies providing PCBA, systems assembly, and design services across diverse verticals including automotive and industrial. Direct competitor to Hana in the EMS tier with overlapping automotive-grade certification requirements.
• Celestica Inc. Toronto-listed global EMS company serving aerospace, communications, industrial, and consumer end-markets. Similar multi-country manufacturing model and customer base, with overlapping automotive and industrial customers.
• Fabrinet: EMS provider specializing in optical, complex PCBA, and OSAT services for communications, networking, and laser products. Directly comparable to Hana's LCOS microdisplay and telecommunications module work from its Ohio facility.
• Benchmark Electronics: Mid-tier US-headquartered EMS provider specializing in complex PCBA and systems integration for aerospace, medical, industrial, and semiconductor capital equipment customers. Comparable business model to Hana with similar IATF/ISO-certified manufacturing requirements.
• Powertech Technology Inc. Taiwan-headquartered OSAT company providing IC packaging and test services with growing focus on memory and power discrete packaging. Comparable to Hana Ayutthaya and Power Master Semiconductor operations.
• Flex Ltd: Global EMS provider offering design, manufacturing, and supply chain services across automotive, consumer, industrial, and medical end-markets. Directly comparable to Hana's PCBA services and multi-country footprint, though at significantly larger scale.
• Sanmina Corporation: Global EMS provider with capabilities in PCBA, cable, integration, and repair across medical, industrial, automotive, and communications end-markets. Comparable diversified EMS business model and customer overlap with Hana.
• Plexus Corp. EMS provider focused on mid-to-low volume complex PCBA and engineering services for regulated markets (medical, aerospace/defense, industrial). Closely comparable to Hana's high-complexity microelectronics positioning.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks5 records

Key highlights6 records

Customer concentration

Compliance23 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles9 records

Subsidiaries7 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Hana Microelectronics Public