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EO Technics

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uuid0038w4y

Namestring
EO Technics
Legal namestring
EO Technics Co., Ltd.
Websiteurl
eotechnics.com
Company typeenum
Public
Founded yearint
1989
Descriptiontext

EO Technics Co., Ltd. is a South Korean designer, manufacturer, and supplier of laser-based processing equipment and laser sources for semiconductor, display, PCB, and industrial-macro applications. Founded in 1989 by Sung Kyu-dong and headquartered in Anyang, South Korea, the company is listed on KOSDAQ (ticker 039030) with 501-1,000 employees and a 20+ office global footprint spanning Korea, China, Taiwan, Japan, Vietnam, Singapore, India, Philippines, Malaysia, Indonesia, the USA, Germany, and the UK. Named enterprise customers include Samsung Electronics, SK Hynix, Samsung Display, ASE Group, Amkor Technology, SPIL Group, and StatsChipPac Group.

The product portfolio is organized into five lines. Semiconductor equipment covers wafer marking, grooving, dicing, cutting, drilling, annealing (including LAton-Pollon for power-device SiC/IGBT), and debonding, with capabilities such as sub-200µm wafer dicing and 25%-productivity anneal recipes. Display systems perform flexible-OLED laser lift-off, FPD/PI/glass cutting, and TSP/flexible patterning, with UV annealing claimed to raise removal yield by 25%. PCB systems offer UV and CO2 drilling and PCB panel marking, supporting the high-growth IC-substrate and HDI market. Macro/industrial systems handle precision notching, cutting, welding, bonding, soldering, and 3D marking for batteries, electronics, and automotive. Underpinning these tools is a proprietary laser-source stack: Ring Core Fiber fiber lasers (reported to cut spatter by 80%+ for copper welding), DPSS lasers in nanosecond/picosecond/femtosecond variants (15ps LEO10f series, 400fs ESL series), and direct diode lasers, plus excimer capabilities acquired via Powerlase (UK, 2009).

EO Technics sells directly to enterprise fabs via a quote-based, capital-equipment pricing model with recurring service and consumable revenue, complemented by exhibitions and OEM partner channels. The company reported 2025 revenue of 381 billion KRW ($253M USD, +19% YoY) and net income of 58 billion KRW (+35% YoY), capturing more than 71% market share in laser grooving equipment for semiconductor packaging — an oligopoly alongside DISCO and ASMPT. Strategic positioning has been reinforced by the 2010 Carlyle Growth Korea investment (300 billion KRW), the 2009 Powerlase acquisition (UK laser sources), the 2011 Innovavent acquisition (Germany), the 2014 Vietnam subsidiary, and recognition as a World Class 300 enterprise (2015) and Presidential Commendation recipient (2020).

Short descriptiontext

EO Technics is a South Korean KOSDAQ-listed manufacturer of laser processing equipment and laser sources for semiconductor, display, PCB, and industrial customers — including Samsung Electronics, SK Hynix, ASE, Amkor, and Samsung Display — holding over 71% market share in laser grooving equipment for semiconductor packaging.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
501–1,000
akta.pro rankint
HeadquartersAnyang, South Korea
HQ citystring
Anyang
HQ countrystring
South Korea
HQ regionstring
Asia
Markets served

Serves global market

Offices20 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
laser processing equipment, semiconductor laser systems, PCB laser drilling, flexible display manufacturing, industrial laser sources
Industry1 code
1Optoelectronics & Photonics (LED/Laser/Optical ICs)
CodeHDAHAAAHPrimaryYes
NAICS code1 code
  • Navigational, Measuring, Electromedical, and Control Instruments Manufacturing33451
SIC code1 code
  • Optical Instruments & Lenses3827
Product category
Semiconductor Laser Processing Equipment
Social media profiles1 record
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model5 records
1Semiconductor Equipment Sales
TypeHardware Sales
Description

Revenue primarily from selling laser processing equipment (marking, grooving, dicing, cutting, drilling, annealing, debonding) to semiconductor manufacturers for chip packaging and fabrication applications.

forbes.com
2Display Equipment Sales
TypeHardware Sales
Description

Laser lift off, cutting, annealing, marking, and patterning equipment for flexible and flat panel display manufacturing.

eotechnics.com
3PCB Equipment Sales
TypeHardware Sales
Description

UV and CO2 laser drilling and panel marking systems for PCB fabrication including HDI and package substrates.

eotechnics.com
4Macro/Industrial Laser Equipment
TypeHardware Sales
Description

Laser notching, cutting, welding, bonding, and soldering equipment for battery electrode foil processing, automotive, and general manufacturing applications.

eotechnics.com
5Laser Source Sales
TypeHardware Sales
Description

Fiber, DPSS, and DDL lasers sold as components for OEM integration into manufacturing equipment.

eotechnics.com
Marketing channels1 record

Each record includes

Title, Type, Stage, Description, Source

Distribution channels1 record

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Core offering1 text field

EO Technics develops and manufactures laser processing equipment for semiconductor, display, PCB, and macro/industrial applications. Its portfolio includes laser marking, grooving, dicing, cutting, drilling, annealing, debonding, welding, bonding, and soldering systems, complemented by proprietary fiber, DPSS, and direct diode laser sources for OEM integration. The company serves global semiconductor, display, and electronics manufacturers through direct enterprise sales.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 5 values shown
  • Chip yield improvement through chipping minimization with laser grooving pre-treatment
+4 more records
Product overview1 text field

EO Technics is a laser and precision equipment manufacturer offering a comprehensive portfolio organized into two main categories: Equipment and Laser products. Equipment division includes Semiconductor (marking, grooving/dicing, cutting, drilling, annealing, debonding), Display (flexible, FPD, glass, TSP solutions), PCB (drilling, marking), and Macro (notching/cutting, welding, bonding, soldering, 3D marking) equipment. Laser division encompasses Fiber lasers (EF series, RCF), DPSS lasers (ns/ps/fs variants), and Direct Diode Lasers (DDL). The products serve semiconductor, display, PCB manufacturing, and macro industrial applications with laser-based processing solutions for cutting, welding, marking, annealing, and drilling operations.

Product and service25 records
1LMC3200G/LMC3200D Grooving & Dicing System
CategorySemiconductor Equipment
2SC/SVL/SFL/SLD Series Multi-beam Marking Systems
CategorySemiconductor Equipment
3CSM3200/3300 and WTM/WM Wafer Marking Systems
CategorySemiconductor Equipment
4LAton/LAton-R/LApollon Wafer Annealing Systems
CategorySemiconductor Equipment
5BMC254 PKG Cutting and BMC204P PoP Drilling
CategorySemiconductor Equipment
6ULA-200A Power Device Annealing
CategorySemiconductor Equipment
7WD400U/BMDB400UP Debonding Equipment
CategorySemiconductor Equipment
8Flexible Display Processing Equipment (Laser Lift Off, PI Glass Cut, Shape Cut, Chamfer Cut)
CategoryDisplay Equipment
9FPD Marker and Align Key Marker
CategoryDisplay Equipment
10UV Laser Annealing and Laser Trimmer (OLED/TFT/CF)
CategoryDisplay Equipment
11Film Cutter, Pol. Film Cutter, and Mask Repair Equipment
CategoryDisplay Equipment
12Window Glass Cutter and Laser Patterning (TSP)
CategoryDisplay Equipment
134000U and 5000U UV Drilling Systems
CategoryPCB Equipment
145000C/6000C CO2 Drilling System
CategoryPCB Equipment
15PCD ITS Drilling System and PGM/PUM Panel Marking System
CategoryPCB Equipment
16Electrode Foil Laser Notching/Cutting for EV Batteries
CategoryMacro Equipment
17Laser Welding and Plastic Welding Systems
CategoryMacro Equipment
18Window Bonding and Laser Soldering Systems
CategoryMacro Equipment
19Metal & Non-Metal Cutting and Glass Cutting Systems
CategoryMacro Equipment
203D Marking Equipment
CategoryMacro Equipment
21EF Series Fiber Lasers (Pulsed and CW)
CategoryLaser Source Products
22EF4000RC Ring Core Fiber (RCF) Laser
CategoryLaser Source Products
23DPSS Lasers (EV/V/LV/LEO/i/g/u series)
CategoryLaser Source Products
24ESL Picosecond and LEO10f Femtosecond Lasers
CategoryLaser Source Products
25ED Series Direct Diode (DDL) Lasers
CategoryLaser Source Products
Scale indicator10 records

Each record includes

Type, Value, Description, Source

Partnership2 partners
Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2011-01-01
Description

Germany-based subsidiary acquired in 2011. Specializes in laser technology development and applications, strengthening EO Technics' European presence and technology capabilities.

Strategic tierMinorTypeOthers
Description

Korean subsidiary located in Ansan, Gyeonggi-do. Acts as a related entity within the EO Technics corporate structure.

Recent move6 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight6 records

Each record includes

Type, Description

Peers10 records
TypeDirect peer
Description

Hong Kong-headquartered semiconductor packaging and assembly equipment maker. Competes with EO Technics in back-end semiconductor processing and is named alongside DISCO as the third major player in laser grooving equipment.

TypeEmerging player
Description

Germany-based photonics and laser systems company serving semiconductor equipment, automotive, and industrial markets. Comparable through its laser-based processing and metrology offerings for electronics manufacturing.

TypeBroad incumbent
Description

US-based provider of instruments, subsystems, and process control solutions for semiconductor and industrial markets. Comparable through laser-based process control and photonics subsystems serving chip and display manufacturers.

TypeDirect peer
Description

Japan-based global leader in semiconductor dicing, grinding, and laser processing equipment. Direct competitor to EO Technics in laser grooving and dicing for memory and logic chip packaging, with overlapping customer base among memory chip makers.

TypeBroad incumbent
Description

US-based major photonics and laser systems manufacturer spanning materials processing, semiconductor, and display. Comparable in laser sources and precision processing equipment for electronics manufacturing.

TypeBroad incumbent
Description

Germany-based global leader in industrial laser systems and machine tools. Comparable as a broad laser systems manufacturer with presence in macro cutting/welding markets where EO Technics' Macro division competes.

TypeDirect peer
Description

China's largest laser equipment manufacturer serving PCB, display, semiconductor, and industrial applications. Directly comparable to EO Technics across laser marking, cutting, and PCB drilling product lines, with overlapping China-based customers.

TypeBroad incumbent
Description

US-based leading manufacturer of high-power fiber lasers and amplifiers. Comparable as a supplier of fiber laser sources overlapping with EO Technics' EF-series fiber lasers for OEM integration and industrial applications.

TypeEmerging player
Description

US-based photonics company producing lasers and optical components for manufacturing, communications, and 3D sensing. Comparable as a maker of laser components serving semiconductor and electronics OEM customers.

TypeEmerging player
Description

Now part of MKS Instruments, ESI historically produced laser-based micromachining equipment for semiconductor and electronics. Comparable in laser drilling, trimming, and micro-processing for PCB and semiconductor packaging.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat5 records

Each record includes

Type, Details

Key risks6 records

Each record includes

Headline, Details, Source

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers7 records

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment4 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile4 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature6 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles2 records

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

Subsidiaries2 records

Each record includes

Name, Acquired on, Relationship type, Type, Business focus

Compliance5 records

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

EO Technics

Semiconductor Laser Processing Equipmenteotechnics.com

EO Technics is a South Korean KOSDAQ-listed manufacturer of laser processing equipment and laser sources for semiconductor, display, PCB, and industrial customers — including Samsung Electronics, SK Hynix, ASE, Amkor, and Samsung Display — holding over 71% market share in laser grooving equipment for semiconductor packaging.

What EO Technics does

EO Technics Co., Ltd. is a South Korean designer, manufacturer, and supplier of laser-based processing equipment and laser sources for semiconductor, display, PCB, and industrial-macro applications. Founded in 1989 by Sung Kyu-dong and headquartered in Anyang, South Korea, the company is listed on KOSDAQ (ticker 039030) with 501-1,000 employees and a 20+ office global footprint spanning Korea, China, Taiwan, Japan, Vietnam, Singapore, India, Philippines, Malaysia, Indonesia, the USA, Germany, and the UK. Named enterprise customers include Samsung Electronics, SK Hynix, Samsung Display, ASE Group, Amkor Technology, SPIL Group, and StatsChipPac Group.

The product portfolio is organized into five lines. Semiconductor equipment covers wafer marking, grooving, dicing, cutting, drilling, annealing (including LAton-Pollon for power-device SiC/IGBT), and debonding, with capabilities such as sub-200µm wafer dicing and 25%-productivity anneal recipes. Display systems perform flexible-OLED laser lift-off, FPD/PI/glass cutting, and TSP/flexible patterning, with UV annealing claimed to raise removal yield by 25%. PCB systems offer UV and CO2 drilling and PCB panel marking, supporting the high-growth IC-substrate and HDI market. Macro/industrial systems handle precision notching, cutting, welding, bonding, soldering, and 3D marking for batteries, electronics, and automotive. Underpinning these tools is a proprietary laser-source stack: Ring Core Fiber fiber lasers (reported to cut spatter by 80%+ for copper welding), DPSS lasers in nanosecond/picosecond/femtosecond variants (15ps LEO10f series, 400fs ESL series), and direct diode lasers, plus excimer capabilities acquired via Powerlase (UK, 2009).

EO Technics sells directly to enterprise fabs via a quote-based, capital-equipment pricing model with recurring service and consumable revenue, complemented by exhibitions and OEM partner channels. The company reported 2025 revenue of 381 billion KRW ($253M USD, +19% YoY) and net income of 58 billion KRW (+35% YoY), capturing more than 71% market share in laser grooving equipment for semiconductor packaging — an oligopoly alongside DISCO and ASMPT. Strategic positioning has been reinforced by the 2010 Carlyle Growth Korea investment (300 billion KRW), the 2009 Powerlase acquisition (UK laser sources), the 2011 Innovavent acquisition (Germany), the 2014 Vietnam subsidiary, and recognition as a World Class 300 enterprise (2015) and Presidential Commendation recipient (2020).

EO Technics firmographics

Firmographics
Name
EO Technics
Legal name
EO Technics Co., Ltd.
Website
https://eotechnics.com
Company type
Public
Founded year
1989
Operating status
Operating
Headcount range
501–1,000 employees
Short description
EO Technics is a South Korean KOSDAQ-listed manufacturer of laser processing equipment and laser sources for semiconductor, display, PCB, and industrial customers — including Samsung Electronics, SK Hynix, ASE, Amkor, and Samsung Display — holding over 71% market share in laser grooving equipment for semiconductor packaging.
Ownership category
akta.pro rank

EO Technics industry classification

Industry
Product category
Semiconductor Laser Processing Equipment
NAICS
Navigational, Measuring, Electromedical, and Control Instruments Manufacturing (33451)
SIC
Optical Instruments & Lenses (3827)
akta.pro primary industry
Optoelectronics & Photonics (LED/Laser/Optical ICs) (HDAHAAAH)

Keywords

  • Laser processing equipment
  • Semiconductor laser systems
  • PCB laser drilling
  • Flexible display manufacturing
  • Industrial laser sources

Where EO Technics is headquartered

Location

Headquarters

HQ city
Anyang
HQ country
South Korea
HQ region
Asia

Offices20 records

Markets served

EO Technics business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

  1. Semiconductor Equipment Sales: Revenue primarily from selling laser processing equipment (marking, grooving, dicing, cutting, drilling, annealing, debonding) to semiconductor manufacturers for chip packaging and fabrication applications.
  2. Display Equipment Sales: Laser lift off, cutting, annealing, marking, and patterning equipment for flexible and flat panel display manufacturing.
  3. PCB Equipment Sales: UV and CO2 laser drilling and panel marking systems for PCB fabrication including HDI and package substrates.
  4. Macro/Industrial Laser Equipment: Laser notching, cutting, welding, bonding, and soldering equipment for battery electrode foil processing, automotive, and general manufacturing applications.
  5. Laser Source Sales: Fiber, DPSS, and DDL lasers sold as components for OEM integration into manufacturing equipment.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels1 record

EO Technics product offering

Product offering

Core offering

EO Technics develops and manufactures laser processing equipment for semiconductor, display, PCB, and macro/industrial applications. Its portfolio includes laser marking, grooving, dicing, cutting, drilling, annealing, debonding, welding, bonding, and soldering systems, complemented by proprietary fiber, DPSS, and direct diode laser sources for OEM integration. The company serves global semiconductor, display, and electronics manufacturers through direct enterprise sales.

Product overview

EO Technics is a laser and precision equipment manufacturer offering a comprehensive portfolio organized into two main categories: Equipment and Laser products. Equipment division includes Semiconductor (marking, grooving/dicing, cutting, drilling, annealing, debonding), Display (flexible, FPD, glass, TSP solutions), PCB (drilling, marking), and Macro (notching/cutting, welding, bonding, soldering, 3D marking) equipment. Laser division encompasses Fiber lasers (EF series, RCF), DPSS lasers (ns/ps/fs variants), and Direct Diode Lasers (DDL). The products serve semiconductor, display, PCB manufacturing, and macro industrial applications with laser-based processing solutions for cutting, welding, marking, annealing, and drilling operations.

Differentiator

Problem solved

Functional benefit

Products and services

  • LMC3200G/LMC3200D Grooving & Dicing System
  • SC/SVL/SFL/SLD Series Multi-beam Marking Systems
  • CSM3200/3300 and WTM/WM Wafer Marking Systems
  • LAton/LAton-R/LApollon Wafer Annealing Systems
  • BMC254 PKG Cutting and BMC204P PoP Drilling
  • ULA-200A Power Device Annealing
  • WD400U/BMDB400UP Debonding Equipment
  • Flexible Display Processing Equipment (Laser Lift Off, PI Glass Cut, Shape Cut, Chamfer Cut)
  • FPD Marker and Align Key Marker
  • UV Laser Annealing and Laser Trimmer (OLED/TFT/CF)
  • Film Cutter, Pol. Film Cutter, and Mask Repair Equipment
  • Window Glass Cutter and Laser Patterning (TSP)
  • 4000U and 5000U UV Drilling Systems
  • 5000C/6000C CO2 Drilling System
  • PCD ITS Drilling System and PGM/PUM Panel Marking System
  • Electrode Foil Laser Notching/Cutting for EV Batteries
  • Laser Welding and Plastic Welding Systems
  • Window Bonding and Laser Soldering Systems
  • Metal & Non-Metal Cutting and Glass Cutting Systems
  • 3D Marking Equipment
  • EF Series Fiber Lasers (Pulsed and CW)
  • EF4000RC Ring Core Fiber (RCF) Laser
  • DPSS Lasers (EV/V/LV/LEO/i/g/u series)
  • ESL Picosecond and LEO10f Femtosecond Lasers
  • ED Series Direct Diode (DDL) Lasers

Quantifiable outcome

  • Chip yield improvement through chipping minimization with laser grooving pre-treatment
  • +4 more outcomes

Companies that use EO Technics

Customer profile

Named customers7 records

Segments4 records

Ideal customer profiles4 records

EO Technics technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature6 records

EO Technics partnerships and signals

Strategic signal

Partnerships

Two partnerships are on record, tiered core and minor.

  • Innovavent GmbHcoreStrategic or Co-development Partner · 1 January 2011Germany-based subsidiary acquired in 2011. Specializes in laser technology development and applications, strengthening EO Technics' European presence and technology capabilities.
  • Levi@Tech Co., Ltd.minorOthersKorean subsidiary located in Ansan, Gyeonggi-do. Acts as a related entity within the EO Technics corporate structure.

Scale indicators10 records

Recent moves6 records

Expansion highlights6 records

EO Technics competitors and assessment

Company assessment

Direct peers

  • ASMPT (ASMPT Limited): Hong Kong-headquartered semiconductor packaging and assembly equipment maker. Competes with EO Technics in back-end semiconductor processing and is named alongside DISCO as the third major player in laser grooving equipment.
  • DISCO Corporation: Japan-based global leader in semiconductor dicing, grinding, and laser processing equipment. Direct competitor to EO Technics in laser grooving and dicing for memory and logic chip packaging, with overlapping customer base among memory chip makers.
  • Han's Laser: China's largest laser equipment manufacturer serving PCB, display, semiconductor, and industrial applications. Directly comparable to EO Technics across laser marking, cutting, and PCB drilling product lines, with overlapping China-based customers.

Emerging players

  • Jenoptik: Germany-based photonics and laser systems company serving semiconductor equipment, automotive, and industrial markets. Comparable through its laser-based processing and metrology offerings for electronics manufacturing.
  • Lumentum: US-based photonics company producing lasers and optical components for manufacturing, communications, and 3D sensing. Comparable as a maker of laser components serving semiconductor and electronics OEM customers.
  • Electro Scientific Industries (MKS): Now part of MKS Instruments, ESI historically produced laser-based micromachining equipment for semiconductor and electronics. Comparable in laser drilling, trimming, and micro-processing for PCB and semiconductor packaging.

Broad incumbents

  • MKS Instruments: US-based provider of instruments, subsystems, and process control solutions for semiconductor and industrial markets. Comparable through laser-based process control and photonics subsystems serving chip and display manufacturers.
  • Coherent Corp: US-based major photonics and laser systems manufacturer spanning materials processing, semiconductor, and display. Comparable in laser sources and precision processing equipment for electronics manufacturing.
  • TRUMPF: Germany-based global leader in industrial laser systems and machine tools. Comparable as a broad laser systems manufacturer with presence in macro cutting/welding markets where EO Technics' Macro division competes.
  • IPG Photonics: US-based leading manufacturer of high-power fiber lasers and amplifiers. Comparable as a supplier of fiber laser sources overlapping with EO Technics' EF-series fiber lasers for OEM integration and industrial applications.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

EO Technics social profiles

Digital presence

EO Technics compliance and trust

Trust signal

Compliance5 records

EO Technics financial estimates

Financial estimate

Revenue estimate

Valuation estimate

EO Technics leadership team

Management profile

Number of profiles

Profiles2 records

EO Technics subsidiaries and ownership

Company hierarchy

Subsidiaries2 records

EO Technics funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

EO Technics M&A and investment

M&A and investment

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about EO Technics

What does EO Technics do?

EO Technics develops and manufactures laser processing equipment for semiconductor, display, PCB, and macro/industrial applications. Its portfolio includes laser marking, grooving, dicing, cutting, drilling, annealing, debonding, welding, bonding, and soldering systems, complemented by proprietary fiber, DPSS, and direct diode laser sources for OEM integration. The company serves global semiconductor, display, and electronics manufacturers through direct enterprise sales.

Is EO Technics a public or private company?

EO Technics is a public company. It is classified as public and is currently operating.

When was EO Technics founded?

EO Technics was founded in 1989. It employs 501 to 1,000 people.

Where is EO Technics based?

EO Technics is headquartered in Anyang, South Korea, in the Asia region.

How does EO Technics make money?

Five revenue lines are on record. Semiconductor Equipment Sales are the primary driver. The others are display Equipment Sales, PCB Equipment Sales, macro/Industrial Laser Equipment and laser Source Sales.

Who are EO Technics's main competitors?

Direct peers on record are ASMPT (ASMPT Limited), DISCO Corporation and Han's Laser. Emerging players are Jenoptik, Lumentum and Electro Scientific Industries (MKS). Broad incumbents are MKS Instruments, Coherent Corp, TRUMPF and IPG Photonics.

Does EO Technics have an API?

No public API is recorded for EO Technics.

What industry is EO Technics in?

EO Technics's product category is Semiconductor Laser Processing Equipment. Its primary akta.pro industry code is HDAHAAAH, Optoelectronics & Photonics (LED/Laser/Optical ICs). Its NAICS code is 33451 and its SIC code is 3827.

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