What Wg Tech does

Wg Tech (江西沃格光电集团股份有限公司, ticker 603773.SH) is a publicly listed Chinese manufacturer of electronic glass products founded in 2009 and headquartered in Xinyu, Jiangxi Province. The company is built around a proprietary GCP (Glass Circuit Plate, 玻璃线路板) technology platform covering the full manufacturing process chain — glass thinning, TGV (Through Glass Via) microvia formation with apertures down to 3-5μm and aspect ratios up to 150:1, PVD copper plating up to 10μm thick, photolithography-based multilayer circuit patterning, and module packaging. It is one of the very few companies globally with end-to-end self-developed GCP capability, supplemented by 500+ patents and proprietary equipment co-developed with suppliers. The firm is organized as a group holding 18 subsidiaries and 7 business units with 5,000+ employees across Xinyu (HQ and main production), Dongguan (R&D), Tianmen (semiconductor), Chengdu (AMOLED), Shenzhen, Beijing, Langfang, Hong Kong, and Japan.

Wg Tech operates as a B2B enterprise materials supplier with two main revenue lines: optoelectronic display components (glass-based Mini/Micro LED substrates sold to brand customers like Hisense and module makers, 1.247B CNY in 2024, up 46.39% YoY and now the largest segment) and traditional photoelectric glass precision processing (thinning, coating, cutting for TFT-LCD and AMOLED panels, 618M CNY in 2024, up 8.22% YoY). A third semiconductor advanced packaging business is in early commercialization through subsidiary Hubei Tonggewei (TGV glass substrates for AI chip chiplet packaging, CPO, RF, and MEMS applications), partnering with Polaris X Core. Customers include BOE, TCL CSOT, AUO, Tianma (all panel manufacturers awarding Wg Tech top supplier status), Hisense (mass-produced G9 gaming monitor using glass-based Mini LED), Dreame (co-developed Z8000 transparent TV), and Leeman Photoelectric (220-inch Micro LED). The company sells through dedicated enterprise sales teams and direct account management, attends major global exhibitions (CES, SID, Touch Taiwan, SEMICON China), and leads the China Glass Circuit Board Industry Alliance (GCPA) founded in May 2026 as the chairman unit.

Wg Tech generated 2.221 billion CNY in FY2024 revenue (22.45% YoY growth, 5-year CAGR of 33.9%) but reported a 122 million CNY net loss attributable to heavy investment in new glass substrate technology, R&D, and capacity buildout. R&D spending grew 35.69% YoY to 120M CNY, and major capex projects include a 628 million RMB Chengdu AMOLED facility (the world's first G8.6 AMOLED glass-based photoetching plant supporting BOE) and 100万平方米/yr TGV production capacity at Tonggewei. Pricing is project-based B2B with multi-year contracts, and the company employs 89-76 annual management trainees across its Xinyu, Dongguan, Tianmen, and Chengdu bases to support ongoing scaling.

Name

Wg Tech

Legal name

江西沃格光电集团股份有限公司

Website

https://wgtechjx.com

Company type

Public

Founded year

2009

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Wg Tech is a Chinese-listed GCP (Glass Circuit Plate) manufacturer that supplies proprietary glass substrate technology to display panel makers (BOE, TCL CSOT, AUO, Tianma) and consumer electronics brands (Hisense, Dreame) for Mini/Micro LED applications, plus TGV substrates for semiconductor advanced packaging through subsidiary Tonggewei.

Ownership category

akta.pro rank

Product category

Electronic Glass Substrates

NAICS

Glass Product Manufacturing Made of Purchased Glass (327215), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Glass Products, Made Of Purchased Glass (3231)

akta.pro primary industry

Package Substrates & Interposers (ABF/BT, Silicon/Glass) (HDAHADAE)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Optoelectronics & Photonics (LED/Laser/Optical ICs) (HDAHAAAH)

Keywords

• Glass circuit boards
• Photoelectric glass processing
• TGV glass substrates
• Mini LED substrates
• Semiconductor packaging substrates

Headquarters

HQ city

Xinyu

HQ country

China

HQ region

Asia

Offices9 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Infrastructure, Operations, Supply Chain

Revenue model

1. 光电玻璃精加工 (Photoelectric Glass Precision Processing): Traditional core business providing TFT-LCD and AMOLED glass thinning, coating, cutting and photolithography services to major panel manufacturers. Services include In-Cell anti-interference high-resistance coating, On-Cell thin-film processing, and G4.5 to G8.6 generation glass processing. 2024 revenue: 618 million RMB (6.18亿元), representing 8.22% YoY growth.
2. 光电显示器件 (Optoelectronic Display Components): Production and sale of GCP (Glass Circuit Plate) products for new display applications including Mini LED backlight and Micro LED direct display glass substrates. Includes both front-end (GCP board) and back-end (module assembly) products. 2024 revenue: 1.247 billion RMB (12.47亿元), growing 46.39% YoY, making it the largest revenue contributor.
3. 新型显示 - 玻璃基Mini/Micro LED (New Display - Glass-based Mini/Micro LED): Sale of glass-based Mini LED backlight boards and modules (via subsidiary 江西德虹), and Micro LED glass substrates. Products include backlight modules for TVs, monitors, laptops, automotive displays, and commercial displays. Revenue generated from both terminal brand customers (e.g., Hisense) and non-terminal brand customers (module makers).
4. 半导体先进封装载板 (Semiconductor Advanced Packaging Substrates): Sale of TGV glass substrates and GCP products for semiconductor advanced packaging via subsidiary 湖北通格微. Applications include AI compute chip packaging, CPO (co-packaged optics), RF devices, micro流控, and MIP packaging. 2024 revenue from Tonggewei: 2.03 million RMB; 2025 Q1: 388 million RMB (note: figure seems inconsistent with source, likely 388万元).

Pricing tiers

Go-to-market motion3 records

Distribution channels3 records

Marketing channels6 records

Core offering

Wg Tech manufactures Glass Circuit Plates (GCP) and provides photoelectric glass precision processing services for the display and semiconductor industries. Its core offerings include glass-based circuit boards (GCP), TGV (Through Glass Via) glass substrates for semiconductor advanced packaging, Mini/Micro LED glass substrates, and AMOLED display glass substrates. The company operates integrated manufacturing across glass thinning, TGV via formation, PVD copper plating, photolithography, multilayer circuit routing, and module assembly.

Product overview

Wg Tech (江西沃格光电集团股份有限公司) is a leading Chinese GCP (Glass Circuit Plate, 玻璃线路板) technology developer and manufacturer. The company operates a comprehensive product portfolio built around glass-based circuit board technology, including core GCP products and TGV (Through Glass Via) technology, Mini/Micro LED glass substrates, semiconductor advanced packaging substrates, CPO/RF device substrates, MIP carrier substrates, CPI transparent polyimide films, UTG ultra-thin flexible glass, and touch control solutions. The company has full-process manufacturing capabilities spanning glass thinning, TGV via formation, PVD copper plating, precision circuit routing, and multi-layer stacking. Key product lines include: new display applications (Mini LED backlight and Micro LED direct display glass substrates) and semiconductor advanced packaging (Chiplet 2.5D/3D packaging substrates for AI computing, sensors, and 6G communication). The product portfolio is organized around glass substrate technology with applications across displays, semiconductors, and optoelectronics.

Differentiator

Problem solved

Functional benefit

Products and services

• GCP (Glass Circuit Plate, 玻璃线路板) Glass-based circuit board technology developed independently by Wg Tech, featuring full-process manufacturing capability from glass thinning, TGV via formation, PVD copper plating, to precision circuit routing and multi-layer stacking. Used for Mini LED backlight, Micro LED direct display, and semiconductor advanced packaging applications.
• Photoelectric Glass Precision Processing Services Precision processing services for photoelectric glass including thinning (薄化), coating (镀膜), photolithography (黄光), and cutting (切割) for TFT-LCD and AMOLED glass panels across G4.5 to G8.6 generation substrates. Includes In-Cell anti-interference high-resistance coating and On-Cell thin-film processing. 2024 revenue: 618 million RMB, up 8.22% YoY.
• Mini & Micro LED Glass Substrates Glass substrates for Mini LED backlight and Micro LED direct display applications, supporting high-density circuit routing, ultra-thin designs, and large-size panel manufacturing for TVs, monitors, laptops, automotive displays, and commercial displays. Sold through subsidiary Jiangxi Dehong Display Technology.
• Semiconductor Advanced Packaging Substrates (TGV) Glass-based substrates for 2.5D/3D Chiplet advanced packaging, high-performance computing (AI, supercomputers, data centers), sensors (MEMS, bio-sensing devices), 6G communication and low-orbit satellite communication RF devices. Produced via subsidiary Hubei Tonggewei.
• CPO Application & RF Device Substrates Glass substrates for co-packaged optics (CPO) and radio frequency device applications, supporting high-speed optical communication modules and RF antenna manufacturing.
• MIP Carrier & Direct Display Substrates Glass-based MIP (Mini LED in Package) carrier substrates and direct display substrates for high-precision LED display applications.
• UTG Ultra-Thin Flexible Glass Ultra-thin flexible glass material for foldable display and flexible electronics applications.
• CPI Transparent Polyimide (CPI透明聚酰亚胺) Flexible transparent polyimide film material developed by Wg Tech Research Institute, applied in space satellite flexible solar wings and other aerospace scenarios.
• Touch Control Solutions Touch control solutions and components integrated with glass substrates for various display applications.

Quantifiable outcome

• Glass-based Mini LED backlight enables 60%+ thickness reduction vs traditional LCD modules
• +7 more outcomes

Named customers8 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Nine partnerships are on record, tiered major and core.

• 雷曼光电 (Leeman Photoelectric)majorStrategic or Co-development Partner · 1 June 2026Wg Tech and 雷曼光电 jointly released the world's first PM-driven 220-inch Micro LED high-definition direct-display screen using Wg Tech's glass-based substrates. Leeman also uses Wg Tech's glass substrates for PM-driven Micro LED products.
• 中国玻璃线路板产业联盟 (China Glass Circuit Board Industry Alliance, GCPA)coreStrategic or Co-development Partner · 29 May 2026Wg Tech, as the core发起单位 and 理事长单位, co-founded the China Glass Circuit Board Industry Alliance with 8+ industry chain partners including 沛顿存储 (Pentamicro), 雷曼光电, 安捷利美维, 中科高微, 奕成科技, SCHMID, and 圭华智能. The alliance aims to promote glass circuit board standardization, joint R&D, supply chain coordination, and large-scale application in semiconductor packaging and new display industries. The alliance held its founding ceremony in 无锡 in May 2026.
• 京东方 (BOE / Beijing Oriental Electronics)coreStrategic or Co-development Partner · 9 April 2026Wg Tech serves as a key supplier and pixel-level supporting partner for 京东方's G8.6 AMOLED production line. Wg Tech's Chengdu subsidiary (成都沃格显示技术有限公司) was established specifically to provide AMOLED glass substrate precision processing using proprietary ECI technology, complementing BOE's G8.6 OLED line. Wg Tech attended BOE's 2025 Global Supply Partner Conference (SPC) in Qingdao. The Chengdu project enables BOE's high世代 OLED products.
• 追觅 (Dreame)majorStrategic or Co-development Partner · 13 March 2026Wg Tech and Dreame jointly launched the world's first 85-inch glass-based RGB Mini LED AI fully-transparent TV (Z8000) at AWE 2026, creating a landmark large-screen consumer product using Wg Tech's glass substrate technology. This marks the extension of Wg Tech's GCP technology from professional monitors to premium home entertainment.
• 设备供应商联合开发 (Joint Equipment Development with Equipment Suppliers)coreTechnology or Integration · 1 October 2025Wg Tech jointly develops key production equipment including high-precision laser drilling machines and vacuum sputtering systems with equipment suppliers, achieving core equipment localization. This proprietary equipment development creates manufacturing barriers and differentiates Wg Tech from competitors.
• 海信 (Hisense)coreStrategic or Co-development Partner · 16 April 2025Wg Tech collaborated with 海信 to develop and mass-produce the world's first glass-based Mini LED gaming monitor (Hisense 大圣G9, 2304 zones, launched April 2025), marking the first commercial application of Wg Tech's glass-based Mini LED backlight technology. The product achieved TOP1 sales ranking in its category, validating Wg Tech's GCP technology for consumer electronics.
• 全国集成电路标准化技术委员会 (National Integrated Circuit Standardization Technical Committee)majorStrategic or Co-development Partner · 11 April 2025Wg Tech participated in the 'Glass Substrate Advanced Packaging Technology Seminar' during the National IC Standardization Technical Committee Week in Shanghai. 通格微半导体SBU总经理魏炳义 gave a technical presentation. Wg Tech contributes to standardization work for glass substrate advanced packaging technology, helping establish industry standards.
• 北京大学集成电路学院 (Peking University School of Integrated Circuits)majorStrategic or Co-development Partner · 17 October 2024Wg Tech conducted cooperation discussions with 北京大学集成电路学院 (院长蔡一茂) to explore joint research collaboration in technology innovation and talent development. The meeting discussed glass substrate technology research, IC packaging, and potential joint R&D projects. Both parties committed to leveraging their respective advantages for deeper cooperation in technology tackling and research collaboration.
• 北极雄芯 (Polaris X Core / Arctic Core)coreStrategic or Co-development Partner · 23 August 2024Wg Tech's subsidiary 湖北通格微 entered a strategic cooperation with 北极雄芯 (founded by Tsinghua University's Prof. Yao Qizhi) to develop full-glass multilayer interconnection AI chip packaging. The partnership focuses on heterogeneous chiplet and glass substrate high-density integrated AI computing chip development, targeting AI compute, high-bandwidth memory packaging, and automotive computing chips. In June 2025, both parties signed a dedicated product development agreement for full-glass stacked chip packaging.

Scale indicators16 records

Recent moves14 records

Expansion highlights6 records

Direct peers

• Kinsus Interconnect Technology: Taiwanese IC substrate maker with growing advanced packaging substrate portfolio. Comparable to Wg Tech's positioning as a substrate supplier serving global semiconductor packaging supply chains.
• Shinko Electric Industries: Shinko manufactures flip-chip package substrates and is investing in glass core substrates for next-generation advanced packaging. Comparable to Wg Tech's TGV glass substrate roadmap for AI/semiconductor packaging.
• Unimicron Technology Corp. Taiwanese PCB and IC substrate maker with leading share in advanced packaging substrates including ABF substrates. A direct peer for Wg Tech's semiconductor packaging substrate ambitions targeting AI/chiplet applications.
• Ibiden Co., Ltd. Ibiden is a leading Japanese IC package substrate manufacturer for high-end CPUs, GPUs, and AI chips. Highly comparable to Wg Tech's Tonggewei subsidiary, which is targeting glass-based substrates for chiplet and AI compute packaging.
• AT&S Austria Technologie & Systemtechnik: AT&S is a European leader in IC substrates and is one of the first movers in glass-based substrates for advanced packaging. Directly comparable to Wg Tech as a competing supplier of glass-based substrates to AI/semiconductor packaging customers.

Broad incumbents

• AGC Inc. AGC is a Japanese specialty glass manufacturer with a large display glass substrate business and growing semiconductor packaging glass efforts. Comparable to Wg Tech as a glass substrate supplier targeting both display and advanced packaging customers.
• Nippon Electric Glass: NEG produces glass substrates for displays and is developing glass core substrates for semiconductor packaging. Direct comparability with Wg Tech's glass-based circuit board and TGV technology for advanced packaging applications.
• Corning Incorporated: Corning is the global leader in display glass substrates and a major supplier of glass-based semiconductor packaging substrates. Wg Tech competes as a China-based challenger offering GCP and TGV alternatives to Corning's glass substrate portfolio.
• Schott AG: German specialty glass maker with a portfolio spanning display, semiconductor, and pharmaceutical glass applications. Comparable as a global specialty glass materials supplier targeting advanced packaging and high-end display use cases.
• Samsung Electro-Mechanics: Korean substrate maker and Samsung group affiliate with major IC substrate operations for memory and logic packaging. A broad incumbent with overlapping substrate technology to Wg Tech's glass-based advanced packaging business.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles11 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments2 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Wg Tech