Meiko Electronics

What Meiko Electronics does

Meiko Electronics Co., Ltd. is a Japanese printed circuit board (PCB) manufacturer and designer founded in 1975 and headquartered in Ayase, Kanagawa Prefecture, Japan, publicly listed on the Tokyo Stock Exchange (tyo:6787) with 10,000+ employees across nine wholly-owned subsidiaries. The company designs, manufactures, and sells a comprehensive portfolio of PCB technologies including high-density interconnect (HDI) boards, FC-BGA semiconductor package substrates, flexible and flex-rigid substrates, millimeter-wave radar substrates, high-frequency substrates for 5G/6G, high-heat-dissipation boards, and component-embedded substrates using its proprietary M-VIA technology. Core manufacturing capabilities include Semi-Additive Process (SAP) at the Ishinomaki factory achieving line/space ratios of 10/10 micrometers or less, and materials characterization up to 100GHz frequency, supported by IATF16949 (automotive) and JAXA (aerospace) certifications.

The business model is B2B direct sales to enterprise electronics OEMs and Tier-1 suppliers, with named key accounts including Apple (iPhone PCBs supporting on-device AI applications) and Samsung Electronics (PCBs for generative-AI smartphones). Revenue is generated through negotiated multi-year supply contracts for custom PCB manufacturing and full-scope Electronics Manufacturing Services (EMS) that integrate design, substrate fabrication, component mounting, assembly, and shipping. Secondary revenue streams include Mechatronics equipment, multi-vision imaging systems, and prototype services under the MEIKO Labo sub-brand. Pricing is quote-based and not publicly disclosed, reflecting the custom-specification nature of the work.

The company operates manufacturing facilities in Yamagata, Ishinomaki, Kanagawa, and Hokkaido (Japan), and is investing over $795 million in new and expanded Vietnam capacity across Hoa Binh and Quang Ninh provinces to serve Apple and Samsung supply chains. The combination of advanced process IP, regulatory certifications, customer-specific qualification cycles, and capital intensity constitutes the operational foundation of the firm.

Name

Meiko Electronics

Legal name

Meiko Electronics Co., Ltd. (株式会社メイコー)

Website

https://meiko-elec.com

Company type

Private

Founded year

1975

Operating status

Operating

Headcount range

10,001+ employees

Short description

Meiko Electronics Co., Ltd. is a Japanese PCB manufacturer and designer (founded 1975, Tokyo Stock Exchange-listed, 10,000+ employees) supplying FC-BGA, HDI, flexible, and high-frequency printed circuit boards directly to enterprise customers including Apple and Samsung Electronics across consumer electronics, automotive, communications, and aerospace markets.

Ownership category

akta.pro rank

Product category

Printed Circuit Board Manufacturing

NAICS

Bare Printed Circuit Board Manufacturing (334412), Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Semiconductor and Other Electronic Component Manufacturing (3344)

SIC

Printed Circuit Boards (3672)

akta.pro industry

PRIMARYHDAHAOAK

Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components)

Hardware, Technology & Telecom/Semiconductors & Electronic Components/Connectors, Interconnects & Printed Circuit Boards (PCBs)

SECONDARYHDAHAOAG

PCB Fabrication (Rigid PCBs)

Hardware, Technology & Telecom/Semiconductors & Electronic Components/Connectors, Interconnects & Printed Circuit Boards (PCBs)

SECONDARYHDAHAOAH

PCB Fabrication (Flex & Rigid-Flex PCBs)

Hardware, Technology & Telecom/Semiconductors & Electronic Components/Connectors, Interconnects & Printed Circuit Boards (PCBs)

SECONDARYHDAHAOAI

PCB Assembly (PCBA/EMS)

Hardware, Technology & Telecom/Semiconductors & Electronic Components/Connectors, Interconnects & Printed Circuit Boards (PCBs)

SECONDARYIMAGAJAM

Industrial PCB & Substrate Components (Bare PCBs, rigid-flex, ceramic substrates, thick-film)

Industrials, Manufacturing & Construction/Electrical Equipment & Industrial Electronics/Electronic Components for Industrial Applications (Passive/active components, industrial-grade modules)

Keywords

• Printed circuit boards
• Semiconductor package substrates
• Electronics manufacturing services
• High-frequency PCB substrates
• Flexible printed circuits

Headquarters

HQ city

Ayase

HQ country

Japan

HQ region

Asia

Offices8 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Operations, Supply Chain, Infrastructure, Personnel, Technology or R&D

Revenue model

1. PCB Manufacturing and Sales: Core business of designing and manufacturing printed circuit boards including HDI boards, FC-BGA substrates, flexible substrates, and specialized boards for automotive, consumer electronics, and industrial applications. Revenue is generated through direct sales to electronics manufacturers.
2. EMS (Electronic Manufacturing Services): Full-service electronics manufacturing including design, PCB manufacturing, component mounting, assembly, and testing. Provides turnkey solutions from product planning through circuit design to final assembly and shipping.
3. Image Equipment Development: Development and manufacturing of multi-vision systems and imaging-related equipment, leveraging proprietary display technology for industrial applications.
4. Mechatronics Products: Custom equipment and software development for solving field problems and eliminating defects in manufacturing environments, including soldering robots and specialized machinery.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

Core offering

Meiko Electronics designs, manufactures, and sells printed circuit boards (PCBs) including HDI boards, FC-BGA semiconductor package substrates, flexible and flex-rigid substrates, high-frequency boards (up to 100GHz), heat-dissipation substrates, and component-embedded substrates. The company also provides full Electronics Manufacturing Services (EMS) integrating circuit design, PCB fabrication, component mounting, assembly, and shipping, and develops custom mechatronics equipment and multi-vision imaging systems.

Product overview

Meiko Electronics is a printed circuit board (PCB) manufacturing company offering a comprehensive portfolio of products and services. The core offerings include: (1) High-density/high-functionality PCBs and semiconductor package substrates for smartphones and AI servers; (2) High-frequency substrates for 5G and automotive radar applications; (3) Flexible and flex-rigid substrates for automotive and mobile devices; (4) Heat-dissipation and thick-copper substrates for high-power applications; (5) EMS services integrating design, manufacturing, mounting, and assembly. Supporting services include component-embedded substrates (M-VIA), liquid loop cooling substrates, and custom mechatronics solutions. The company operates under sub-brands including MEIKO Labo (prototype manufacturing) and Meiko Electronic Manufacturing (embedded device manufacturing), offering both standard products and ODM/EMS solutions across consumer electronics, automotive, aerospace, and industrial sectors.

Differentiator

Problem solved

Functional benefit

Brands

• MEIKO Labo: PCB prototype manufacturing and hardware development services, offering easy quotation creation and technical consultation for engineers seeking highest quality technology.
• Meiko Electronic Manufacturing (メイucoエレクマニュファクチャー)

Products and services

• Printed Circuit Boards (PCB / プリント基板) High-density, high-functionality PCBs for smartphones, high-frequency substrates for automated driving, and high-heat-dissipation/high-current substrates for engine compartments and solar installations. Used by major consumer electronics and automotive manufacturers.
• Semiconductor Package Substrates (PKG基板) Semiconductor package substrates manufactured using the SAP (Semi-Additive Process) achieving L/S = 10/10 micrometers or less, targeting FC-BGA substrates for expanding semiconductor demand from AI and HPC applications.
• Build-up Substrates (ビルドアップ基板) High-density multi-layer substrates for advanced electronics packaging and AI server applications, supporting ultra-high density interconnection.
• Flexible Printed Circuits (FPC / フレキシブル基板) Flexible substrates addressing diverse automotive and 5G environment requirements, produced in Vietnam with IATF16949 automotive quality certification.
• Flex-Rigid Boards (FR / フレックスリジッド基板) Selectively bendable flex-rigid boards that enable compact device design and reduce assembly steps by eliminating connector requirements.
• Millimeter-wave Radar Substrates (ハイブリッド基板) High-frequency substrates for millimeter-wave radar applications supporting automotive ADAS and communications systems.
• High-frequency Substrates (高速伝送対応基板) Substrates supporting high-speed data transmission up to the 100GHz band, with materials characterization and transmission line measurement capabilities, for 5G/6G communications and data center applications.
• Heat-dissipation Substrates (放熱基板) Thick-copper substrates for high current applications, thermal resin materials, and cooling-functional substrates for heat management in power electronics and harsh environments.
• Liquid Loop Substrates (リキッドループ基板) Advanced cooling-functional substrates using liquid loop technology for high-performance computing applications requiring active thermal management.
• Component-embedded Substrates (M-VIA / 部品内蔵基板) M-VIA proprietary embedded-component substrates with built-in components for high-current and high-heat-dissipation automotive power IC applications.
• EMS (Electronics Manufacturing Services) - 実装・組立 Total EMS outsourcing solution integrating design, substrate manufacturing, component mounting, assembly, and shipping in a single-process workflow for electronics OEMs.
• Multi-vision Systems (マルチビジョンシステム) Meiko-developed multi-vision imaging systems leveraging proprietary display technology for large-scale information monitoring and visualization in industrial and commercial settings.
• Mechatronics Products (メカトロニクス製品) Custom equipment and software development to solve on-site problems and eliminate defects in manufacturing environments, including soldering robots and specialized machinery.
• Metal Mask "Hayate" (疾風) All-metal detachable metal mask "Hayate" (疾風) for precision solder paste printing in electronics assembly.
• MEIKO Labo (Prototype PCB Service) Prototype PCB manufacturing and hardware development service offering easy online quotation, small-batch production from a minimum of 3 boards, and domestic Japan manufacturing for engineers seeking highest-quality technology.
• Embedded Device Contract Development/Manufacturing (組込み 委託開発・製造) Contract development and manufacturing services for embedded devices, provided by Meiko Electronic Manufacturing Co., Ltd. (メイコーエレクマニュファクチャ).

Quantifiable outcome

• FC-BGA substrate production with L/S = 10/10 micrometer or less using SAP technology
• +2 more outcomes

Named customers2 records

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Three partnerships are on record, tiered core and specialized.

• Samsung ElectronicscoreTechnology or Integration · 6 January 2026Meiko Electronics is supplying PCBs for Samsung Electronics' latest smartphones equipped with generative AI features from their Vietnam factory. The Quang Ninh factory will mass produce these boards starting 2027, with projected sales of ¥30 billion (~$191 million) by fiscal 2029. This positions Meiko as a key component supplier in Samsung's supply chain for AI-capable mobile devices.
• ApplecoreTechnology or Integration · 14 April 2025Meiko Electronics serves as an Apple supplier, manufacturing ultra-small, energy-efficient PCBs for iPhones to meet Apple's artificial intelligence application demands. The expanded Hoa Binh province facility will produce these boards with products exported to India as part of Apple's supply chain diversification strategy.
• JAXA (Japan Aerospace Exploration Agency)specializedTechnology or IntegrationMeiko Electronics has obtained JAXA certification for its Kanagawa and Hokkaido factories, enabling the company to provide high-reliability printed circuit boards for space applications. This certification demonstrates compliance with stringent aerospace quality standards required for space environments.

Scale indicators9 records

Recent moves9 records

Expansion highlights5 records

Direct peers

• Ibiden: Japanese PCB and IC substrate manufacturer and the global market leader in FC-BGA package substrates. Ibiden is the most direct competitor to Meiko in advanced semiconductor package substrates, with substantially larger scale.
• AT&S: Austrian PCB manufacturer specializing in IC substrates and high-end PCBs for AI, automotive, and mobile applications. Competes with Meiko in advanced substrates and high-density interconnect boards for AI server customers.
• Shinko Electric Industries: Japanese manufacturer of plastic laminates and IC package substrates, particularly dominant in FC-BGA and flip-chip substrates. Directly competes with Meiko's Ishinomaki SAP-based FC-BGA business for the same customer base.
• Samsung Electro-Mechanics: Korean subsidiary of Samsung Group manufacturing MLCCs, package substrates, and PCBs. Both competes with Meiko in substrates and is also a sister entity to its customer (Samsung Electronics), creating a competitor-customer dynamic.
• CMK Corporation: Japanese PCB manufacturer specializing in automotive and industrial PCBs. Competes with Meiko in automotive-grade multilayer PCBs and shares Japanese OEM/Tier-1 customer relationships.
• Zhen Ding Technology: Taiwanese FPC (flexible PCB) leader supplying Apple and other smartphone OEMs. Competes with Meiko's Vietnam flexible substrate business for the same iPhone supply chain.
• Tripod Technology: Taiwanese PCB manufacturer focused on HDI, multilayer, and high-density PCBs for smartphones, networking, and automotive applications. Directly competes with Meiko in HDI boards for Apple and other smartphone OEMs.
• Nippon Mektron: Japanese manufacturer of flexible printed circuits (FPC) owned by Sumitomo. Competes with Meiko's automotive-grade flexible substrates and serves overlapping automotive Tier-1 customers.
• Unimicron Technology: Taiwanese PCB and IC substrate manufacturer with leading global market share in HDI boards and IC substrates. Competes with Meiko in HDI boards for smartphones and in advanced substrate technology.
• TTM Technologies: US-based PCB manufacturer serving aerospace, defense, automotive, and computing markets. Competes with Meiko's automotive and aerospace PCB segments and overlaps in high-layer-count boards for networking/data center.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights6 records

Customer concentration

• YouTubeyoutube.com/channel/UC26C_LLe_C6UzY_gsKBLgiw

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries9 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Meiko Electronics