What Leeno Industrial does

Leeno Industrial Inc. (KOSDAQ: 058470), founded in 1978 and headquartered in Busan, South Korea, is a specialized manufacturer of critical testing interface components for the semiconductor and medical-device industries. The company designs and produces spring contact probes, IC test sockets (system-level, RF, large device, memory, elastomer, strip, and Kelvin), probe heads (fine-pitch RF, large pin-count, and Kelvin), and medical device components such as catheter flexible PCBs and ultrasound transducer sub-parts. Manufacturing is 100% in-house across design, precision fabrication (automatic lathe, MCT), barrel production, spring production, plating, injection molding, assembly, inspection, and reliability testing (SEM, AFM, EDS, VNA, TDR), enabling both high-mix low-volume and high-volume output.

The company's revenue model is hardware sales of these custom-engineered, quote-based B2B interface solutions, priced per specification rather than via published tiers. Products serve five primary verticals: semiconductor manufacturers (including Samsung Electronics and SK hynix), cloud and network server (AI/high-speed), 5G/6G RF, automotive (including EV battery testing), and medical devices. Technically, Leeno's flagship capabilities include fine-pitch probes down to 75μm pitch and ≥50GHz, coaxial probes up to 110GHz with 50Ω impedance, 30,000+ pin-count probe heads, and battery probes rated to 2000A.

Go-to-market combines direct enterprise field sales with an exclusive global distributor network across Taiwan, Philippines, USA (California), Singapore, Israel, and Germany, supported by regional subsidiaries in Japan and China. Marketing is concentrated at major semiconductor industry events (SEMICON across Taiwan, West, Europa, Japan, SEA, China; TestConX; DesignCon) and a multilingual B2B website, supplemented by an active investor-relations program. Operating geographies span Korea, North America, Taiwan, Southeast Asia, the Middle East, and Europe, with FY2025 reported revenue of KRW 372.5 billion and FY2024 net income of KRW 113.3 billion (~USD 84M).

Name

Leeno Industrial

Legal name

LEENO INDUSTRIAL INC.

Website

https://leeno.com

Company type

Public

Founded year

1978

Operating status

Operating

Headcount range

501–1,000 employees

Short description

Leeno Industrial is a South Korean, KOSDAQ-listed manufacturer of IC test sockets, spring contact probes, and probe heads serving semiconductor, cloud/server, 5G/6G, automotive, and medical-device customers globally through 100% in-house production and an exclusive distributor network.

Ownership category

akta.pro rank

Product category

Semiconductor Test Equipment

NAICS

Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515), Semiconductor Machinery Manufacturing (333242)

SIC

Instruments For Meas & Testing Of Electricity & Elec Signals (3825), Electronic Components, Nec (3679)

akta.pro primary industry

Test, Probe & Burn-In Equipment (Wafer Sort/Final Test) (HDAHAEAJ)

akta.pro secondary industry

Sockets, IC Sockets & Test/Programming Interconnects (HDAHAOAF)

Keywords

• IC test sockets
• Spring contact probes
• Semiconductor test equipment
• Wafer level testing
• Probe heads

Headquarters

HQ city

Busan

HQ country

South Korea

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Operations, Supply Chain, Personnel, Technology or R&D, Marketing or Sales, Infrastructure

Revenue model

1. IC Test Sockets: Sale of test sockets for IC package testing including system level test sockets, RF device test sockets, large device test sockets, memory device test sockets, elastomer sockets, strip test sockets, and Kelvin sockets
2. Probe Cards and Spring Contact Probes: Fine pitch probes, probe heads (RF probe heads, large pin count probe heads, Kelvin probe heads), and spring contact probes for wafer level testing and device testing applications
3. Battery Probes: High current probes for battery charging and discharging applications including pouch, cylinder, and prism type batteries supporting up to 2000A current rating
4. Medical Device Components: Medical transducer sub-parts including lens caps, shields, matching layers, flexible PCBs for catheters, and other medical components complying with ISO 13485 and global medical device standards

Go-to-market motion2 records

Distribution channels7 records

Marketing channels6 records

Core offering

Leeno Industrial manufactures critical testing components for IC manufacturing, testing, and analysis processes. The company produces IC test sockets, spring contact probes (pogo pins), probe heads, and related interface solutions for semiconductor wafer level testing and device validation. All products are 100% in-house manufactured from design to final inspection and reliability testing. The company also produces medical device components compliant with ISO 13485 standards.

Product overview

LEENO Industrial is a specialized manufacturer of critical testing components for IC manufacturing, testing, and analysis processes. The company offers a comprehensive portfolio of spring contact probes, IC test sockets, probe heads, and medical device components under its "Total Interface Solutions" brand. The product lineup includes Fine Pitch Probes (including 0.80mm Probe and 110GHz measurement capability), IC Test Sockets (System Level, RF Device, Large Device, Memory Device, Elastomer, Strip Test, and Kelvin sockets), Probe Heads (Fine Pitch RF, Fine Pitch Large Pin Count, and Kelvin), Spring Contact Probes (Coaxial, Non Magnetic, and ICT variants), Medical Solutions (Flexible PCBs for catheter applications and other medical components), and specialty probes for battery charging/discharging and module connector testing. All products are 100% in-house manufactured from design through final inspection, enabling rapid delivery and customized solutions.

Differentiator

Problem solved

Functional benefit

Products and services

• Fine Pitch Probe The thinnest and shortest fine pitch spring contact probe designed specifically for wafer-level RF testing, supporting pitch sizes of 75µm or larger. Built for advanced semiconductor wafer level testing applications.
• 0.80mm Probe The shortest spring contact probe specially designed for high-speed testing purposes, with an average of 9.3g spring force at 0.30mm pitch. Engineered for high-speed semiconductor test applications.
• 110GHz Actual Measurement Capability RF measurement capability service using N5244B/N5292A PNA-X network analyzer with custom LEENO-designed jigs, providing actual 110GHz (2-Port) and 43GHz (4-Port) measurement data for customer RF test requirements.
• System Level Test Socket Custom system level test socket for various device types including AP, baseband, and AI chips, supporting pitch sizes down to 0.25mm and pin counts up to 10,000.
• RF Device Test Socket Coaxial RF test socket with high bandwidth up to 100GHz and 50Ω impedance matching, supporting LGA, FBGA, QFN, and WLCSP package types for RF device testing.
• Large Device Test Socket Test socket for large-size devices using FEM simulation (structural deformation/stress) and RF simulation (112Gbps/224Gbps), supporting BGA and LGA packages for CPU, GPU, network, server, and AI applications.
• High Power Cooling Lid Efficient cooling lid solutions for thermal validation of high-power devices, supporting device power up to 700W with air or liquid cooling methods.
• Memory Device Test Socket Test sockets for all types of memory devices including BGA and TSOP packages, manufactured using precision injection equipment and LEENO's proprietary technology.
• Elastomer Socket Socket solution optimized for device engineering or validation stages with short signal paths providing excellent electrical characteristics, using proprietary conductive particle structures embedded in silicone rubber.
• Strip Test Socket Multi-site strip test socket designed for various device types and test requirements, supporting BGA and LGA packages for parallel testing of multiple devices.
• Kelvin Socket Full Kelvin or Mixed Kelvin socket for accurate and stable voltage measurement requirements, supporting QFN, LGA, BGA, and DFN package types.
• Fine Pitch RF Probe Head Fine pitch RF probe head for wafer-level testing, supporting device pitches of 130µm or larger with multi-site and large pin count capabilities.
• Fine Pitch, Large Pin Count Probe Head Fine pitch probe head with large pin count for wafer-level testing, supporting pitches of 92µm or larger and pin counts exceeding 30,000.
• Kelvin Probe Head Full Kelvin or Mixed Kelvin probe head for accurate and stable voltage measurement, supporting bump and pad contact objects with pitches starting at 150µm.
• Spring Contact Probe Custom-designed and 100% in-house manufactured spring contact probes (pogo pins) with shortest lead times, suitable for both small and large volume orders.
• Coaxial Probe Coaxial spring contact probe for RF and coaxial testing requirements in smaller pitch devices, supporting frequencies up to 100GHz with 50Ω impedance matching.
• Non Magnetic Probe Fine-pitch non-magnetic spring probe for testing navigation devices and Hall IC applications in mobile, automotive, and industrial sectors, with pitch of 200µm or larger.
• ICT Probe Custom ICT probes designed to customer specifications, with over 1,000 standard models available for various testing applications including in-circuit testing.
• Flexible PCB for Catheter Application Flexible printed circuit boards for catheter applications using proprietary manufacturing processes and facilities, with single/double side configurations up to 2000mm length, meeting customer specifications and reliability requirements for minimally invasive surgeries.
• Other Medical Components High-precision machined components for medical ultrasound probes compliant with global medical equipment standards (ISO 13485), including lens caps, shields, matching layers, and flexible PCBs.
• Memory Module Test Socket User-friendly, long-life test socket for DDR4 and DDR5 memory modules (288-pin RDIMM), improving productivity while minimizing module pad scratching.
• Module Connector Test Socket & Probe Fine pitch pad contact solution and proprietary probe block for B2B connectors, designed for camera module testing with pitches starting at 0.18mm.
• Battery Charging & Discharging Probe Custom high-current probes for battery testing including electric vehicle batteries, supporting Cylinder, Pouch, and Prism battery types with current ratings up to 2000A.

Quantifiable outcome

• Fastest lead times in the industry for IC test sockets and spring contact probes
• +2 more outcomes

Named customers2 records

Segments5 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Six partnerships are on record, tiered core.

• Diamond-Shamrock Enterprise Co., Ltd.coreChannel Partner/ Reseller/ DistributorExclusive distributor for Taiwan region, providing local sales and support for LEENO's test socket and probe products. Located at 4F-14, No.40-2, SEC.1 Ming-Sheng N.Road, Kwei-Shan Shiang, Taoyuan Hsien, Taiwan.
• Eloop International LimitedcoreChannel Partner/ Reseller/ DistributorExclusive distributor for Philippines, operating through Dyna-serv Global Corp at Unit 808, page 1 Building, 1215 Acacia St., Madrigal Business Park, Ayala-Alabang, 1780 Philippines.
• Blair Gordon Associate Inc.coreChannel Partner/ Reseller/ DistributorUS distributor based in Danville, California (9000 Crow Canyon Road; STE S-364, Danville. California, USA 94506) covering the North American market.
• Dyna-Serv Global Resources Pte. Ltd.coreChannel Partner/ Reseller/ DistributorSingapore-based distributor at 66 Tannery Lane, #01-04E Sindo Building, Singapore 347805, covering Southeast Asia region.
• SAS Technologies LTD.coreChannel Partner/ Reseller/ DistributorIsrael-based distributor located at Hamarpe 3 st. Har Hotzvim, Jerusalem 45008 Israel, covering Middle East region.
• uwe electronic GmbHcoreChannel Partner/ Reseller/ DistributorGermany-based distributor at Inselkammerstraße 10, 82008 Unterhaching, Germany, covering European market.

Scale indicators4 records

Recent moves10 records

Expansion highlights6 records

Direct peers

• Cohu: Cohu (including its ISC and ECT legacy units) is a major global supplier of semiconductor test handlers, test contactors, and interface solutions. Competes head-to-head with LEENO in IC test sockets, strip test, Kelvin, and MEMS probe contactors across logic, memory, and automotive customers.
• Yokowo Co., Ltd. Yokowo is a Japanese manufacturer of spring contact probes (pogo pins), test sockets, and probe cards for semiconductor and connector testing. Highly comparable to LEENO in core pogo-pin technology, RF probes, and IC test socket portfolio, serving overlapping Japanese, Korean, and global customers.
• WinWay Technology: WinWay is a Taiwan-based leading supplier of high-frequency probe cards and IC test interfaces. Directly competes with LEENO in fine-pitch, high-pin-count, and RF test sockets used by Asian semiconductor manufacturers including foundries and OSATs.
• FormFactor: FormFactor is the leading global supplier of probe cards, test sockets, and advanced probe head assemblies for the semiconductor industry. Directly comparable to LEENO across wafer-level test sockets, RF probe cards, and high-pin-count interface solutions for HBM, AI, and advanced packaging.
• MPI Corporation: MPI Corporation is a Taiwan-based manufacturer of probe cards, test sockets, and semiconductor test equipment. Directly comparable to LEENO in wafer-level probe cards, high-frequency test interfaces, and advanced packaging test solutions for foundries and IDMs across Asia.
• Micronics Japan (MJC): MJC is a Japanese probe card and test interface specialist serving memory, logic, and CMOS image sensor manufacturers. Comparable to LEENO across MEMS probe cards, fine-pitch wafer-level test, and Asian semiconductor customer base with overlapping technology and similar product portfolio.
• Chunghwa Precision Test Technology (ChPT): ChPT is a Taiwan-based probe card and semiconductor test interface manufacturer serving foundry, memory, and logic customers. Directly comparable to LEENO across MEMS and cantilever probe cards, vertical probe technology, and Asian customer base with overlapping product and end-market overlap.

Emerging players

• Translarity: Translarity is a US-based emerging supplier of full-wafer contact and advanced probe card technology for semiconductor test. Comparable to LEENO in wafer-level test and fine-pitch interface solutions, with focus on disruptive contact technologies targeting AI and HBM test applications.
• Hprobe: Hprobe is a France-based emerging supplier of magnetic-based test equipment and probes for MRAM and MEMS devices. Compares to LEENO in non-magnetic spring probes and Hall IC test solutions, addressing emerging memory and sensor test adjacencies rather than direct socket competition.

Broad incumbents

• Smiths Interconnect: Smiths Interconnect is a global provider of high-reliability interconnect, test sockets, and probe solutions across semiconductor, aerospace, and medical markets. Broader incumbent with overlapping semiconductor test interface portfolio; competes with LEENO in high-end IC test sockets and pogo pins.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Leeno Industrial