What Anji Microelectronics Technology does

Anji Microelectronics Technology (安集微电子科技, Shanghai Stock Exchange STAR Market ticker 688019) is a Shanghai-headquartered semiconductor materials company founded in 2004 that develops, manufactures, and sells specialty chemistries used in integrated circuit fabrication. The company is organized around a proprietary '3+1' technology platform consisting of three product lines — (1) Chemical Mechanical Polishing (CMP) slurries covering copper, barrier, tungsten, dielectric (silica-based and ceria-based), substrate, and emerging-material applications including TSV and hybrid bonding; (2) functional electronic wet chemicals including post-etch residue removers (PERR), photoresist strippers, post-CMP cleaners, and selective etchants for 8" and 12" wafer processes; and (3) electroplating solutions and additives (VMS) for copper, nickel, nickel-iron, and tin-silver ECP used in IC front-end manufacturing and advanced packaging — plus self-controlled key raw materials (silica sol via joint venture and in-house ceria abrasives).

Anji serves integrated circuit manufacturers — foundries, IDMs, and memory chip producers in mainland China, Taiwan, and selected overseas markets — through a direct enterprise sales model. Products are consumable inputs qualified into specific customer process flows, with multi-year supply contracts and pricing negotiated on a per-contract basis. In 2025 the company reported revenue of CNY 2.504 billion (+36.47% YoY) and net profit attributable to shareholders of CNY 784 million (+46.85% YoY), with R&D investment of CNY 445 million (17.76% of revenue). Per TECHCET, Anji held an estimated ~13% global share of the CMP slurry market in 2025, up from ~8% in 2023, and ~6% of the global functional electronic wet chemicals market. The company operates manufacturing bases in Shanghai Jinqiao and Ningbo, has a third base under planning at Shanghai Chemical Industry Zone, and runs a Taiwan sales subsidiary.

The business model is anchored on the localization of critical semiconductor materials in China, breaking foreign supplier dominance in advanced CMP and wet chemistry applications. The company has achieved 100% import substitution at 28nm on its PERR product, has been awarded 'Excellent Supplier' by multiple tier-1 foundries, and holds 308 cumulative effective patents as of 2025 with 106 new invention-patent applications filed that year.

Name

Anji Microelectronics Technology

Legal name

安集微电子科技（上海）股份有限公司

Website

https://anjimicro.com

Company type

Public

Founded year

2004

Operating status

Operating

Headcount range

501–1,000 employees

Short description

Anji Microelectronics Technology (安集微电子科技) is a Shanghai-based, STAR Market-listed semiconductor materials company that develops CMP slurries, functional wet chemicals, and electroplating solutions for global IC manufacturers. Founded 2004, it holds ~13% global CMP slurry share and supplies fabs across China and Taiwan.

Ownership category

akta.pro rank

Product category

Semiconductor Materials

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441), Electroplating, Plating, Polishing, Anodizing, and Coloring (332813)

SIC

Semiconductors & Related Devices (3674), Industrial Organic Chemicals (2860), Miscellaneous Chemical Products (2890)

akta.pro primary industry

CMP Slurries & Pads Chemicals (CMP Consumables Chemicals) (IMAEAKAE)

akta.pro secondary industries

Electroplating & Metallization Chemicals (Cu/Ni/Au plating, additives) (IMAEAKAK), PCB & Electronics Manufacturing Chemicals (Desmear, micro-etch, plating, fluxes) (IMAEAKAL), Leadframes & Package Interconnect Materials (HDAHADAF)

Keywords

• Semiconductor materials
• CMP slurries
• Functional wet chemicals
• Electroplating solutions
• Advanced packaging materials

Headquarters

HQ city

Shanghai

HQ country

China

HQ region

Asia

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations, Infrastructure, Marketing or Sales

Revenue model

1. CMP Slurry Product Sales: Revenue from sale of chemical mechanical polishing slurries across multiple product lines (copper/barrier, tungsten, dielectric, ceria-based, substrate, new material/process slurries). Products sold directly to semiconductor wafer manufacturers in China and overseas.
2. Functional Electronic Wet Chemicals Sales: Sale of post-etch residue remover, photoresist stripper, post-CMP cleaning solution, and etchant products to chip manufacturers.
3. Electroplating Solutions & Additives Sales: Sale of copper, nickel, nickel-iron, and tin-silver electroplating solutions and additives for IC front-end and advanced packaging applications.
4. Technical Services: Technical services provided alongside product sales, including customized product development and joint development with customers.

Pricing tiers

Go-to-market motion1 record

Distribution channels2 records

Marketing channels6 records

Core offering

Anji Microelectronics Technology manufactures and sells specialty chemical materials used in integrated circuit (IC) fabrication and advanced packaging, organized as a "3+1" technology platform. The three core product lines are Chemical Mechanical Polishing (CMP) slurries (copper/barrier, tungsten, dielectric silica- and ceria-based, silicon substrate, and new-material/TSV/hybrid-bonding slurries), functional electronic wet chemicals (post-etch residue removers, photoresist strippers, post-CMP cleaners, etchants), and electroplating solutions and additives (copper, nickel, nickel-iron, tin-silver ECP for front-end and bumping/RDL). The "+1" refers to self-controlled key raw materials (silica sol via the Shandong Antnano joint venture and in-house ceria abrasives). Products are sold via B2B direct sales and multi-year contracts to semiconductor foundries, IDMs, memory makers, advanced packaging manufacturers, and silicon wafer producers in mainland China, Taiwan, and internationally.

Product overview

Anji Microelectronics Technology is a high-end semiconductor materials company that integrates R&D, production, sales, and technical services. The company has established a "3+1" technology platform consisting of three core product lines plus key raw materials: (1) Chemical Mechanical Polishing Slurry (CMP Slurry) portfolio covering copper/barrier slurries, tungsten slurries, dielectric slurries (silica-based and ceria-based), silicon substrate slurries, and slurries for new materials/technologies including TSV and hybrid bonding; (2) Functional Electronic Wet Chemicals including post-etch residue removers (PERR), selective etchants, post-CMP cleaners, and photoresist strippers; and (3) Virgin Makeup Solution (VMS) and Additives for electroplating including copper, nickel, nickel-iron, and tin-silver ECP products. The company serves both domestic Chinese and overseas semiconductor manufacturers with products used in logic chips, memory chips, and advanced packaging applications.

Differentiator

Problem solved

Functional benefit

Products and services

• Chemical Mechanical Polishing (CMP) Slurries Comprehensive CMP slurry portfolio for wafer planarization in IC manufacturing, covering copper/barrier, tungsten, dielectric (silica-based and ceria-based), silicon substrate, and emerging-material/TSV/hybrid-bonding slurry products used in logic chips, memory chips, and advanced packaging.
• Copper and Copper Barrier CMP Polishing Slurries CMP slurries for removal and planarization of copper interconnections in IC manufacturing; applicable to Cu and Barrier processes in logic chips, memory chips, and other devices, mass-produced and supplied to chip manufacturers in China and abroad.
• Tungsten CMP Polishing Slurries CMP slurries for removal and planarization of tungsten metals in IC manufacturing, widely used in memory (3D NAND, DRAM) and logic chip production with continuously rising market share.
• Dielectric CMP Polishing Slurries (Silica-based and Ceria-based) Slurries for removal and planarization of dielectric materials including silicon dioxide and silicon nitride in IC manufacturing; ceria-based formulations offer high silicon dioxide removal rates, high selectivity, and good planarization efficiency for shallow trench isolation (STI) and high-removal polishing.
• Silicon Substrate Polishing Slurries Silicon stock polishing slurries and fine polishing slurries applicable to silicon substrate polishing; customized products successfully released at client sites for domestic silicon wafer manufacturers.
• Polishing Slurries for New Materials and New Technology (TSV, Hybrid Bonding, Polymer, Carbon) Slurries developed for emerging processes including through-silicon-via (TSV) and hybrid bonding for advanced packaging, plus slurries for innovative materials such as polymers and carbon.
• Functional Electronic Wet Chemicals Formulated wet electronic chemicals used in IC manufacturing including post-etch residue remover (PERR), photoresist stripper, post-CMP cleaning solution, and etchant products, widely applied in 8-inch and 12-inch wafer volume production.
• Post Etch Residue Remover (PERR) Products for metal, via, and pad post-etch residue removal, including Al PERR for IC AlCu interconnect, Cu PERR for BEOL Cu post-etch clean, and TiN Hard Mask Cu PERR for advanced technology nodes.
• Post CMP Clean Solution Copper post-CMP cleaners offering acid-based and alkaline-based formulations with excellent residue removal capability and substrate protection for mature and advanced technology nodes.
• Photoresist Stripper Strippers for removal of thick-film photoresist in advanced packaging fields such as wafer-level packaging and MEMS, plus cured PI remover and deflux remover for advanced packaging technology.
• Selective Etchant Selective etchants applicable to SiGe, Si, SiN, and polysilicon to meet special process requirements across different IC technology nodes.
• Virgin Makeup Solution (VMS) and Additives for Electroplating Electrochemical plating product line covering copper, nickel, nickel-iron, and tin-silver ECP products for IC front-end manufacturing and advanced packaging (TSV, bumping, RDL) processes across 6-inch, 8-inch, and 12-inch wafer processes.
• Copper ECP VMS and Additives High-purity copper electroplating solutions for IC manufacturing Cu dual damascene front-end processes and TSV, bumping, and RDL assembly processes.
• Nickel Plating Solution High-purity, ductile, low-stress nickel plating solutions for the bumping process as a barrier between Cu and SnAg in advanced packaging.
• Nickel-Iron Plating Solution Nickel-iron plating solution for advanced packaging and MEMS Hall Element technology, mass-produced.
• Tin-Silver Plating Solution Tin-silver plating solutions for the bumping process in advanced packaging technology, providing normal-speed and high-speed plating variants.

Quantifiable outcome

• Global CMP slurry market share increased from ~8% (2023) to ~13% (2025)
• +3 more outcomes

Named customers5 records

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Nine partnerships are on record, tiered minor and core.

• 上海市集成电路行业协会知识产权专家委员会minorStrategic or Co-development Partner · 6 December 2023Anji participated in the establishment of the Shanghai IC Industry Association IP Expert Committee alongside Tongji University, HiSilicon, UNISOC, CXMT, JCET, ACME, and others. The committee aims to build an IP protection, operation, and cultivation system for the IC industry chain.
• 宋庆龄基金会 (Soong Ching-ling Foundation)minorStrategic or Co-development Partner · 25 April 2023Long-term partnership in the '芯肝宝贝计划' (XIN GAN Baby Plan) — a charity initiative with SMIC and Shanghai Renji Hospital to provide liver transplant assistance for children with congenital biliary diseases. Anji has donated to this cause for multiple consecutive years.
• Fudan University (复旦大学)minorStrategic or Co-development Partner · 1 January 2023University-industry cooperation in talent development and scientific research. Anji collaborates with Fudan University for joint research projects and talent cultivation.
• East China University of Science and Technology (华东理工大学)minorStrategic or Co-development Partner · 1 January 2023University-industry cooperation in talent cultivation and scientific research collaboration.
• Shanghai Second Polytechnic University (上海第二工业大学)minorStrategic or Co-development Partner · 1 January 2023University-industry cooperation for talent cultivation and research support.
• Harbin Engineering University Yantai Research Institute (哈尔滨工程大学烟台研究院)minorStrategic or Co-development Partner · 1 January 2023University-industry cooperation for talent cultivation and joint research projects.
• 山东安特纳米材料有限公司 (Shandong Antnano Materials Co., Ltd.)coreStrategic or Co-development Partner · 1 July 2022Joint venture subsidiary established with domestic partner possessing strong R&D and production capabilities, to build independent and controllable production supply capacity for silica sol — a key raw material for CMP slurries. Multiple silica sol products developed have passed internal testing in Anji's polishing slurry products and are being validated with customers.
• 金桥碧云公益基金会 (Jinqiao Biyun Public Welfare Foundation)minorStrategic or Co-development Partner · 22 June 2022Charitable foundation partnership for public welfare activities including '荟聚爱' poverty alleviation and education support in Sichuan Yuesi, Yunnan Yangbi, Henan Hebi, and other regions; tree planting; and other social responsibility programs.
• 中芯国际 (SMIC) and 上海仁济医院 (Shanghai Renji Hospital)minorStrategic or Co-development Partner · 1 July 2021Co-initiators of the '芯肝宝贝计划' charity program providing financial assistance for liver transplants for children with congenital biliary diseases. Anji has participated since 2013, contributing to over 725 children receiving life-saving surgeries.

Scale indicators8 records

Recent moves10 records

Expansion highlights5 records

Broad incumbents

• CMC Materials (Entegris): Entegris (which acquired CMC Materials, formerly Cabot Microelectronics) is one of the largest global CMP slurry suppliers and a direct benchmark for Anji's core polishing slurry product line; it operates globally with mature relationships at all leading logic and memory fabs, making it the dominant incumbent Anji competes against for share.
• Resonac (formerly Hitachi Chemical / Showa Denko): Resonac's electronic materials division includes CMP slurries, functional wet chemicals, and advanced packaging materials — overlapping with most of Anji's product platform and serving many of the same leading-edge fabs globally.
• Versum Materials (Merck KGaA Performance Materials): Merck KGaA's Performance Materials business (which absorbed Versum Materials) offers CMP slurries, functional wet chemicals, and advanced packaging materials — directly overlapping Anji's full '3+1' platform. It is one of the most direct global competitors in the integrated semiconductor materials space.
• 3M (Electronic Materials): 3M's Electronics Materials business includes CMP pads and select slurry adjacencies, supplying global semiconductor fabs; while its slurry focus is narrower than Anji's, it competes in the same fab qualification process and is part of the global incumbent materials set.
• DuPont Electronics & Industrial: DuPont offers a broad portfolio of semiconductor materials including CMP slurries, photoresists, and advanced packaging materials — a large diversified competitor with global reach that overlaps with Anji's slurry and wet-chemical offerings.

Direct peers

• Fujimi Incorporated: Fujimi is a leading Japanese CMP slurry manufacturer with deep qualifications at memory and logic fabs globally; its product breadth across copper, barrier, dielectric, and ceria slurries makes it a direct technical competitor to Anji, particularly in advanced node applications.
• Shanghai Sinyang (上海新阳半导体材料): Shanghai Sinyang is a domestic Chinese supplier of semiconductor wet chemicals and electroplating solutions (ECP additives), directly overlapping with Anji's functional wet chemicals and ECP product lines; it is one of the closest pure-play domestic peers competing for the same Chinese fab customers.
• JSR Corporation: JSR is a Japanese chemical/materials supplier with a significant CMP slurry business alongside its broader electronic materials portfolio; it competes with Anji for qualifications at logic and memory fabs and represents one of the established Asian CMP suppliers.

Emerging players

• Beijing Shengang Advanced Materials (北京科华/科创): Domestic Chinese slurry and wet chemical vendors collectively form Anji's home-market competitive set for lower-end CMP and cleaning applications; these players compete on localized service and cost rather than full-platform scope.

Regional players

• Jiangyin Jianghua Microelectronics Materials (江化微): Jianghua is a China-based specialty wet electronic chemicals supplier serving domestic semiconductor and display panel manufacturers, overlapping with Anji's functional wet chemicals and localizing supply for Chinese fab customers.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Subsidiaries3 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments1 record

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Anji Microelectronics Technology