Zhejiang Jingsheng Mechanical & Electrical

What Zhejiang Jingsheng Mechanical & Electrical does

Zhejiang Jingsheng Mechanical & Electrical Co., Ltd. (Jingsheng, szse:300316) is a Chinese publicly listed manufacturer of crystalline silicon growth and wafer processing equipment, founded in 2006 and headquartered in Shangyu, Zhejiang with a registered address in Hangzhou. The company operates a 'Advanced Materials + Advanced Equipment' dual-engine strategy, providing crystal growth furnaces, slicing, polishing, cleaning, and epitaxy equipment for 8-12 inch semiconductor silicon wafers, 6-12 inch silicon carbide (SiC) and sapphire substrates, and full-chain photovoltaic (PV) silicon wafer production equipment. Core proprietary capabilities include 12-inch SiC crystal growth, double-chip SiC epitaxial reactors delivering 70% higher throughput, fully automated 12-inch SiC substrate processing pilot lines with 100% domestic equipment, and large-size sapphire crystal growth at 1,000kg-class scale.

The company monetizes through direct B2B sales of equipment to semiconductor and PV manufacturers, materials sales through its SuperSiC subsidiary (SiC and sapphire substrates), and smart factory solutions integrating AI big data, lean manufacturing, and digital systems. Customer segments are the semiconductor industry (IC and power semiconductor manufacturers) and the photovoltaic industry (solar cell/module manufacturers), with an emerging third segment in compound substrates and new materials. Go-to-market is sales-led via headquarters in Zhejiang with a network of 8 domestic service centers and overseas subsidiaries in Japan (Sendai) and Malaysia (Penang), targeting markets in China, India (Adani partnership), Turkey, Mexico, Vietnam, and Europe.

The company has 5,001-10,000 employees, 1,600+ R&D technicians (50+ PhDs), 4 global R&D centers, 1,274 valid patents, and reports revenue at the $1B-$5B scale. Key subsidiaries include SuperSiC/Zhejiang Jingrui Electronic Materials (SiC and sapphire materials), Hangzhou Huixiang E&H (magnetic fluid sealing and exhaust treatment), Hangzhou ZVISION (intelligent manufacturing and OHT systems), Zhejiang Jinghong Precision Machinery, and Ningxia Chuangsheng (SiC substrate production). Leadership includes Chairman Dr. Cao Jianwei and President He Jun, with a PhD-heavy executive bench.

Name

Zhejiang Jingsheng Mechanical & Electrical

Legal name

Zhejiang Jingsheng Mechanical & Electrical Co., Ltd.

Website

https://jsjd.cc

Company type

Public

Founded year

2006

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Zhejiang Jingsheng Mechanical & Electrical (szse:300316) is a Chinese public manufacturer of crystal growth and wafer processing equipment, plus SiC, sapphire, and diamond materials, serving semiconductor and photovoltaic manufacturers globally.

Ownership category

akta.pro rank

Product category

Semiconductor and Photovoltaic Equipment Manufacturing

NAICS

Semiconductor and Related Device Manufacturing (334413), Semiconductor Machinery Manufacturing (333242), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Compound Semiconductor Wafers & Substrates (SiC/GaN/GaAs/InP/Sapphire) (HDAHAGAB)

akta.pro secondary industry

Solar PV Module & Cell Manufacturing (Crystalline, Thin-Film) (EUAMAHAA)

Keywords

• Semiconductor equipment
• Silicon carbide substrates
• Photovoltaic manufacturing
• Crystal growth furnaces
• Compound semiconductor materials

Headquarters

HQ city

Hangzhou

HQ country

China

HQ region

Asia

Offices14 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Infrastructure, Marketing or Sales

Revenue model

1. Advanced Equipment (Semiconductor and PV): Sales of crystal growth equipment (monocrystalline silicon furnaces, SiC epitaxial furnaces, sapphire crystal growers), wafer processing equipment (slicers, polishers, grinders, EPD equipment), and photovoltaic manufacturing equipment. Equipment is sold directly to semiconductor and solar PV manufacturers. Revenue recognized upon delivery and acceptance.
2. Advanced Materials (SiC, Sapphire, Diamond, Quartz Crucible, Diamond Wire): Sales of silicon carbide substrates, sapphire materials, diamond materials, quartz crucibles, and diamond wire consumables. Materials are sold to semiconductor and PV manufacturers. Includes downstream expansion of SuperSiC subsidiary producing SiC substrates at scale.
3. Smart Factory Solutions: Digital and AI-powered intelligent factory solutions for semiconductor, PV, and compound substrate industries, providing lean manufacturing, digital, and AI big data systems to customers.

Go-to-market motion1 record

Distribution channels3 records

Marketing channels4 records

Core offering

Zhejiang Jingsheng Mechanical & Electrical develops, manufactures, and sells crystalline silicon growth devices, their control systems, and a full chain of downstream equipment and advanced materials for the semiconductor and photovoltaic industries. Its portfolio spans 8–12 inch semiconductor silicon wafer equipment (crystal growth, slicing, polishing, cleaning, epitaxy), 6–12 inch silicon carbide (SiC) substrates and epitaxial equipment, large-size sapphire materials, photovoltaic equipment (crystal growth furnaces, slicers, EPD equipment, shingled-component assembly), and AI-driven Smart Factory Solutions for semiconductor and PV manufacturers.

Product overview

Zhejiang Jingsheng Mechanical & Electrical (JSG) operates as a comprehensive semiconductor materials and equipment provider with a dual-engine strategy of 'Advanced Materials + Advanced Equipment'. The product portfolio is organized into three main categories: (1) Advanced Equipment covering semiconductor materials equipment (8-12 inch silicon wafer production line including crystal growth, slicing, polishing equipment), power semiconductor epitaxial equipment (SiC epitaxial furnaces, furnace tubes), and photovoltaic equipment (crystal growth, slicing, cleaning, sorting systems, solar cell EPD equipment, shingled component equipment); (2) Advanced Materials including silicon carbide substrates (6-12 inch), sapphire (large-size crystals up to 1000kg), diamond materials, quartz crucibles, and diamond wire; (3) Smart Factory Solutions platform providing AI-powered digital manufacturing integration. The company also operates subsidiaries including SuperSiC (晶瑞电子) for SiC materials and Hangzhou ZVISION for intelligent manufacturing. Services include 24-hour customer support with service centers nationwide. The portfolio enables end-to-end solutions from crystal growth through wafer processing for semiconductor and photovoltaic industries.

Differentiator

Problem solved

Functional benefit

Brands

• SuperSiC: Subsidiary brand for silicon carbide and sapphire compound semiconductor materials, including 6-12 inch product development and smart factory construction
• Jingrui Electronic Materials (晶瑞电子材料)

Products and services

• Semiconductor Silicon Equipment (8-12 inch) Complete equipment chain for 8-12 inch semiconductor silicon wafer production including crystal growth, slicing, polishing, cleaning, and epitaxy equipment. The only domestic company capable of large-scale manufacturing across this full chain.
• Power Semiconductor Epitaxial Equipment 6-inch and 8-inch silicon carbide epitaxial furnaces including single-chip, vertical, and double-chip variants, utilizing CVD technology for advanced process and power semiconductor applications. The 6-inch double-chip SiC epitaxial equipment delivers 70% higher single-set capacity and 30%+ lower per-chip operating cost versus single-chip equipment.
• Furnace Tube Equipment 8-inch and 12-inch furnace tubes capable of processing 150 and 125 products simultaneously respectively, suitable for polysilicon and annealing processes with high automation and MES system connectivity.
• Photovoltaic Equipment Complete photovoltaic silicon wafer manufacturing equipment chain including crystal growth furnaces, truncing, squaring, grinding, slicing, cleaning, sorting, and packaging equipment. Globally leading in PV equipment technology and scale, ranked No. 1 in silicon monocrystalline growth equipment sales for consecutive years.
• Solar Cell EPD Equipment Edge Passivation Device (EPD) utilizing atomic layer deposition technology for passivation treatment of cut edges of solar cells.
• Shingled Component Equipment Shingled component assembly equipment industry-leading in power, efficiency, and component BOM cost.
• Silicon Carbide (SiC) Substrates Third-generation semiconductor material with industry-leading 8-inch and 12-inch SiC crystal growth technology and independent controllable large-size SiC crystal growth and processing technology. First 12-inch conductive SiC single crystal successfully grown with diameter of 309mm.
• Sapphire Materials Global leader in technology and scale in sapphire field, with large-scale sapphire crystal growth technology reaching international leading level. Products include 1000kg ultra-large sapphire and 200kg ruby crystals.
• Diamond Materials Fourth-generation semiconductor material targeting ultimate semiconductor materials and equipment to break industry development bottlenecks.
• Quartz Crucible Leading in both technology and scale domestically with production technology for large-scale semiconductor-level quartz crucibles.
• Diamond Wire Core key technology mastered with flexible customization and large-scale production capabilities for photovoltaic, semiconductor, sapphire, and magnetic material cutting.
• Smart Factory Solutions Intelligent manufacturing platform providing lean manufacturing+digitalization+AI big data solutions for semiconductor, photovoltaic, and compound substrate industries, enabling digital and intelligent connection between equipment.
• Customer Services Comprehensive service system including 24-hour on-site after-sales service, 2-hour demand response, and 600+ professional service personnel with service centers across China (Tianjin, Baotou, Leshan, Qujing, Xining, Yixing, Yinchuan, Hohhot).
• SuperSiC Subsidiary Brand Subsidiary specializing in silicon carbide and sapphire compound semiconductor material R&D, production and sales, providing 6-12 inch products and building automated smart factories.
• Optical-grade Silicon Carbide (8-inch) 8-inch optical-grade SiC crystals with high refractive index (2.7), low dispersion coefficient (<0.03), high thermal conductivity (490 W/m·K) for AR glasses and advanced optical applications.
• 12-inch Sapphire Substrates 12-inch sapphire substrates with ultra-low defect density (EPD<300 ea/cm²) and high crystal integrity (FWHM<15 arcsec) for LED, optical window, and semiconductor applications.
• 12-inch Polycrystalline Silicon Carbide 12-inch polycrystalline SiC substrates with low cost, high temperature resistance, corrosion resistance, and high thermal conductivity for wafer bonding and semiconductor equipment wear parts.
• 12-inch Reduced-Pressure Silicon Epitaxial Equipment 12-inch reduced-pressure epitaxial equipment with single-zone and multi-zone closed-loop temperature control, multi-vacuum interval precise pressure control, unique flat cavity structure and multi-port shunt system design for superior film thickness and doping uniformity.
• 12-inch Atmospheric Pressure Silicon Epitaxial Equipment 12-inch atmospheric pressure silicon epitaxial equipment based on CVD technology, with key indicators including resistivity, thickness uniformity, epitaxial layer defect density, production efficiency, and process repeatability reaching international advanced level. Delivered to a leading domestic customer for silicon wafer manufacturing.
• 12-inch Silicon Wafer Final Polishing Equipment 12-inch silicon wafer final polishing equipment with high degree of automation, high stability, and good flatness of processed products. Recognized as a domestic first-set equipment for 2024 by Zhejiang Province.

Quantifiable outcome

• 6-inch double-chip SiC epitaxial equipment: single-set production capacity increased by 70%, single-chip operating cost decreased by more than 30% vs single-chip equipment
• +5 more outcomes

Named customers8 records

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration2 records

AI capability4 records

Feature10 records

Partnerships

Nine partnerships are on record, tiered minor, core, internal and major.

• MIDA Malaysia (马来西亚投资发展局)minorOthers · 4 July 2025MIDA (Malaysian Investment Development Authority) is the Malaysian government's primary investment promotion agency. MIDA supports the SuperSiC Malaysia manufacturing project, which represents a significant China-Malaysia economic cooperation initiative. MIDA will support attracting high-quality investment to Malaysia.
• InvestPenang (槟城招商局)minorOthers · 4 July 2025InvestPenang is the primary investment promotion agency of Penang State Government, Malaysia. It supports the establishment of SuperSiC manufacturing in Penang, viewing the project as strengthening Penang's position as a high-tech industry and advanced manufacturing hub.
• Zhejiang University School of Integrated Circuits (浙江大学集成电路学院) and Zhejiang Chuangxin Integrated Circuits Co., Ltd. (浙江创芯)coreStrategic or Co-development Partner · 24 June 2025Three-way strategic cooperation to build a 'Joint R&D Center for Advanced IC Equipment and Technology' and 'IC Talent Training and Technology Innovation University-Enterprise Collaboration Center.' Joint R&D in 12-inch silicon epitaxial equipment and process development, talent cultivation with joint teaching and research programs.
• China Building Materials Artificial Crystal Research Institute (中国建材人工晶体研究院)minorStrategic or Co-development Partner · 17 June 2025Subsidiary Ningxia Jinghuan Electronics and China Building Materials Artificial Crystal Research Institute signed a strategic cooperation agreement to co-build a sapphire functional crystal materials joint laboratory. Focus on sapphire-based functional crystal materials for deep collaborative innovation.
• Siemens China (西门子中国)coreStrategic or Co-development Partner · 14 March 2025Jingsheng and Siemens signed a strategic cooperation agreement covering automation, digitalization, and green low-carbon development. Siemens' industrial digital technology (industrial software, Siemens Xcelerator platform) will empower Jingsheng's intelligent factory construction in crystal growth and semiconductor material processing. Jointly build customized, high-reliability intelligent manufacturing systems.
• Hangzhou ZVISION (杭州中为光电)internalOthers · 3 March 2023Hangzhou ZVISION is a wholly-owned subsidiary of Jingsheng, founded in 2005. It is a national high-tech enterprise with provincial R&D center, provincial enterprise technology center, Hangzhou academician workstation, and the industry's first provincial key enterprise research institute for semiconductor intelligent manufacturing.
• Adani Solar (India)majorChannel Partner/ Reseller/ Distributor · 16 February 2023Jingsheng signed an equipment purchase agreement with Adani Solar, a solar PV manufacturer under India's Adani Group, to provide 2GW photovoltaic single crystal growing and processing equipment and help build India's first monocrystalline silicon wafer factory. Adani Group aims to reach 45GW renewable energy capacity by 2030 with $20 billion investment over the next decade.
• Estun Automation (埃斯顿自动化)majorStrategic or Co-development Partner · 16 February 2023Jingsheng and Estun signed a strategic cooperation agreement to establish a joint venture company to promote overseas business development. Estun has global presence through subsidiaries including UK Trio, Germany Cloos, Germany M.A.i., Italy R&D center, and US Barrett.
• Hangzhou Huixiang E&H (杭州慧翔电液)internalOthers · 22 August 2022Hangzhou Huixiang E&H is a holding subsidiary founded in 2006. Industry leader in magnetic fluid sealing devices and semiconductor equipment tail gas treatment devices. Listed in the national Little Giant enterprise list (4th batch).

Scale indicators14 records

Recent moves13 records

Expansion highlights7 records

Peers

• Tokyo Electron (TEL):

Direct peers

• TankeBlue Semiconductor: Chinese SiC substrate specialist with full chain from crystal growth to epi-wafer processing. Direct competitor to Jingsheng's SuperSiC in 6/8-inch SiC substrates, both chasing China's domestic SiC localization mandate driven by EV and renewable demand.
• Advanced Micro-Fabrication Equipment (AMEC): China's leading etch equipment specialist, also expanding into CVD and epitaxy. Overlaps with Jingsheng in advanced semiconductor process equipment serving Chinese foundries and power device fabs, both pursuing import substitution under export-control pressure.
• Suzhou Maxwell Technologies: Major Chinese PV equipment supplier specializing in HJT and TOPCon cell manufacturing equipment. Direct peer in the photovoltaic equipment value chain, serving the same leading Chinese wafer/cell/module customers (Tongwei, JinkoSolar, Trina) as Jingsheng.
• NAURA Technology Group: Leading Chinese semiconductor equipment manufacturer producing etching, CVD, PVD, oxidation/diffusion and cleaning tools. Directly comparable to Jingsheng as the other major domestic alternative in semiconductor capital equipment, competing for the same Chinese fab localization wallet.
• SICC (Shenzhen SiCarrier / SICC Co., Ltd.): Leading Chinese silicon carbide substrate manufacturer competing directly with Jingsheng's SuperSiC subsidiary in 6-inch and 8-inch SiC wafer production for power electronics. Both target the same EV inverter and renewable energy customers in the domestic SiC supply chain build-out.

Broad incumbents

• Wolfspeed: Global SiC substrate and device leader operating the largest 8-inch SiC fab (Mohawk Valley). Competes with Jingsheng/SuperSiC in compound semiconductor materials globally, though Wolfspeed's primary position is upstream SiC wafer supply rather than equipment.
• Coherent Corp (formerly II-VI): Global compound semiconductor materials and laser equipment leader with a broad SiC substrate portfolio after the II-VI/Finisar merger. Comparable to Jingsheng across compound semiconductor substrates (SiC, GaAs, InP) and in providing SiC epi-ready wafers to power electronics customers.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat7 records

Key risks6 records

Key highlights7 records

Customer concentration

Compliance20 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles7 records

Subsidiaries7 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments2 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Zhejiang Jingsheng Mechanical & Electrical