What Wuxi DK Electronics Materials does

Wuxi DK Electronics Materials (DKEM) is a Yixing-headquartered, Shenzhen Stock Exchange ChiNext-listed (300842.SZ, listed June 18, 2020) Chinese manufacturer of high-performance electronic materials. Founded in 2010, the company specializes in conductive silver paste chemistry and adjacent electronic materials serving two end markets: solar photovoltaic (PV) metallization and semiconductor packaging/electronics. Its PV portfolio covers front-side silver pastes for all major crystalline-silicon cell architectures (p-BSF, p-PERC, n-TOPCon, n-HJT, IBC), silver-coated copper pastes for silver reduction, and PV module adhesives and sealants marketed under sub-brands including KFC and LEAD. Its semiconductor/electronics portfolio — marketed under the PacTite (PAC-TITE) sub-brand — encompasses sintering silver pastes, AMB (active metal brazing) copper-clad ceramic substrates, LED/IC chip conductive adhesives, and ancillary electronic materials.

DKEM operates a technology-driven, market-oriented model in which paste formulations are co-developed with leading PV cell manufacturers for each successive cell technology generation. R&D is distributed across centers in Yixing, Wuxi, Hong Kong, and the United States. The company sells direct to tier-one PV cell makers — including Jinko Energy, Tongwei Solar, Hanwha Q Cells, Jietai Solar and Aiko Solar — and to semiconductor packaging customers, operating a silver-cost-plus-processing-fee pricing model that passes real-time silver-price volatility to buyers. The company holds 375–388 patents (including 291–294 invention patents), holds MIIT "Specialized and Sophisticated Little Giant" status and National IP Strong Country Demonstration Enterprise recognition, and has annual production capacity exceeding 1,000 tons as of end-2022.

Revenue reached CNY 2.814 billion in 2021 (77.96% YoY), with the semiconductor packaging business growing 301.87% YoY. In 2021, DKEM acquired Jiangsu Suote (the former DuPont Solamet PV silver paste business) for CNY 1.247 billion, consolidating leading metallization IP and a global PV customer base. The company has subsequently expanded silver-coated copper paste capacity (200 tons with partner Huasheng, June 2025), launched the DM270x/DM280x/DM290x PV adhesive series at SNEC 2025, and in March 2026 hired IEEE Fellow Dr. Shi Guojun (Frank Shi) as Chief Strategy Scientist — moves that together broaden the platform from PV paste into silver reduction, module adhesives, and semiconductor memory/advanced packaging materials.

Name

Wuxi DK Electronics Materials

Legal name

无锡帝科电子材料股份有限公司

Website

https://dkem.cn

Company type

Public

Founded year

2010

Operating status

Operating

Headcount range

501–1,000 employees

Short description

Wuxi DK Electronics Materials (DKEM), founded in 2010 and listed on Shenzhen ChiNext as 300842.SZ, is a Chinese manufacturer of conductive silver pastes, silver-coated copper pastes, and semiconductor packaging materials (sintering silver, AMB brazing, LED/IC adhesives) serving tier-one photovoltaic cell makers and semiconductor packaging customers globally.

Ownership category

akta.pro rank

Product category

Electronic Materials

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441), Semiconductor and Related Device Manufacturing (334413), Electronic Connector Manufacturing (334417)

SIC

Semiconductors & Related Devices (3674), Electronic Components & Accessories (3670)

akta.pro primary industry

Solar Plant Components Supply & Manufacturing (Modules, Cells, Wafers, Mirrors, Heliostats) (EUACAGAK)

akta.pro secondary industries

Solar PV Module Manufacturing (Cells, Modules, Thin-Film) (EUAMABAD), Metallization & Plating Chemicals (Cu/Co/Ru/Barrier & Seed) (HDAHAGAK), Power Modules (IGBT/MOSFET/SiC/GaN Modules) (HDAHAHAH), Leadframes & Package Interconnect Materials (HDAHADAF)

Keywords

• Conductive silver paste
• Photovoltaic metallization
• Solar cell materials
• Semiconductor packaging materials
• Electronic materials manufacturing

Headquarters

HQ city

Wuxi Shi

HQ country

China

HQ region

Asia

Offices7 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Technology or R&D, Personnel, Infrastructure, Operations, Marketing or Sales

Revenue model

1. Photovoltaic Conductive Silver Paste: Primary revenue driver. High-performance conductive silver paste products for solar cell metallization covering p-BSF, p-PERC, n-TOPCon, n-HJT, and IBC battery technologies. Priced on a silver-price-plus-processing-fee model with dynamic pricing linked to real-time silver prices.
2. Semiconductor Electronic Packaging Materials: Second growth engine. Conductive adhesives, sintering silver pastes, and AMB ceramic substrate brazing pastes for LED/IC chip packaging, power semiconductor packaging (SiC, GaN, IGBT), and automotive electronics. Fastest-growing segment with 301.87% YoY revenue growth in 2021.
3. Photovoltaic Adhesive Product Line: Newly launched high-reliability photovoltaic adhesive products including butyl sealants, 0BB interconnection adhesives, BC battery insulation/protection adhesives, addressing next-generation photovoltaic module reliability needs.
4. Low-Temperature Silver-Coated Copper Paste: DK61F silver-coated copper paste for HJT cells with 30-50% copper content, providing cost-effective metallization solutions for heterojunction battery technology.

Pricing tiers

Go-to-market motion1 record

Distribution channels3 records

Marketing channels7 records

Core offering

Wuxi DK Electronics Materials manufactures and sells high-performance conductive silver paste and related electronic materials for solar photovoltaic cell metallization and semiconductor/electronics packaging. The company serves solar cell manufacturers across p-BSF, p-PERC, n-TOPCon, n-HJT, and IBC cell technologies, and provides sintering silver pastes, conductive adhesives, AMB brazing pastes, and PV module adhesives for LED/IC chip packaging, power semiconductor (SiC/GaN/IGBT) packaging, automotive electronics, and photovoltaic module interconnection.

Product overview

帝科DKEM® (Wuxi DK Electronics Materials) is a leading global photovoltaic metallization solutions provider and high-performance electronic materials company. The company offers a comprehensive product portfolio centered on conductive silver paste technology for solar PV and semiconductor electronics applications. The core offerings include: (1) Photovoltaic metallization conductive silver pastes covering p-BSF, p-PERC, n-TOPCon, n-HJT, and IBC solar cell technologies (DK93A/B, DK71A, DK81A, DK93T, DK61A/F, DK51A, DK93H series); (2) Semiconductor electronic packaging materials including PacTite® DECA200/DECA400 LED/IC chip packaging silver paste, DECA600 series low-temperature sintering silver paste for power semiconductors (SiC/GaN/IGBT), and DK1200 series AMB ceramic copper-clad brazing paste; (3) Advanced photovoltaic module interconnection materials including DECA100 low-temperature conductive paste and DNCA45 non-conductive paste; (4) High-reliability PV adhesive product line (DM270x butyl sealant, DM290x 0BB structural adhesive, DM280x BC battery insulation adhesive); and (5) Silver-copper paste products (DECA240 series) for cost optimization in semiconductor packaging. The company operates under the brands 帝科DKEM® for PV materials and 湃泰PacTite® for semiconductor electronics.

Differentiator

Problem solved

Functional benefit

Brands

• 帝科湃泰 PacTite®: Semiconductor electronics business brand of Dike DKEM®, focused on power semiconductor packaging materials including sintering silver, AMB brazing paste, LED/IC chip packaging adhesives, targeting SiC/GaN/IGBT modules, automotive electronics, and consumer electronics.
• When Performance Matters®

Products and services

• DK93A/DK81A Metallization Conductive Silver Paste High-temperature sintering conductive silver paste for p-BSF solar cells with excellent fine-line printability and solderability for front-side busbar printing.
• DK93B Metallization Conductive Silver Paste High-temperature sintering conductive silver paste for p-PERC solar cells with excellent ohmic contact and metal recombination control, compatible with ≥220Ohm/sq phosphorus-doped high sheet resistance process and ultra-fine-line printing (≤13μm).
• DK71A/DK93T/DK81A n-TOPCon Metallization Silver Paste Complete n-TOPCon battery metallization solution including DK71A silver-aluminum paste for front-side busbars, DK93T back-side busbar paste, and DK81A front/back main busbar paste with non-penetrating glass design.
• DK61A/DK61F/DK51A n-HJT Metallization Silver Paste Complete n-HJT (Heterojunction) battery metallization solution including DK61A low-temperature curing conductive silver paste with ultra-fine-line capability (<18μm), DK61F silver-copper paste with 30-50% copper content for cost reduction, and DK51A main busbar paste.
• DK93H Metallization Conductive Silver Paste High-temperature sintering conductive silver paste for p-POLO IBC batteries with custom glass system meeting stringent requirements for back polishing, phosphorus-doped polysilicon layer, and thick AlOx/SiNx stacked layers.
• DK1200 Series AMB Ceramic Copper-Clad Brazing Paste Active metal brazing (AMB) paste series for ceramic copper-clad substrates including DK1200-BSN (for Si3N4 substrates), DK1200-BAN (for AlN substrates), and DK1200-BSC (for SiC substrates), providing high thermal conductivity and reliability for third-generation semiconductor packaging.
• PacTite® DECA200 Series Semiconductor Packaging Paste Low-temperature conductive silver paste for LED/IC chip packaging including DECA200-04B25 (regular thermal conductivity) and DECA200-22A46 (meeting MSL standards for power management chips, filters, antennas, CPUs, GPUs, FPGAs), providing excellent bonding and reliability.
• PacTite® DECA400 Semiconductor Packaging Paste High thermal conductivity low-temperature conductive silver paste with innovative high packing density silver technology, providing excellent thermal conductivity for small-to-medium power chip packaging such as MCU control chips and primary power amplifiers.
• PacTite® DECA600 Series Low-Temperature Sintering Silver Paste Low-temperature sintering silver paste for third-generation semiconductor chips including DECA600-08B (polymer-assisted full sintering technology, 150-230W/(mK) thermal conductivity) and DECA600-15K (pure silver full sintering, for SiC/GaN power devices, HBLED, RF power devices, IGBT modules).
• DECA100/DNCA45 Low-Temperature Conductive Silver Paste Low-temperature conductive silver paste for advanced photovoltaic module interconnection including DECA100 for shingled cell interconnects and HJT 0BB interconnection, and DNCA45 non-conductive paste for the same applications.
• DK95S/DK62T Low-Silver Metallization Paste Seed layer paste DK95S combined with high-copper paste DK62T for TOPCon/TBC battery silver reduction solutions, achieving over 50% silver consumption reduction while maintaining competitive efficiency through high-quality interface coupling.
• DK72E/DK95E/DK82E TOPCon 3.0 Metallization Paste TOPCon 3.0 metallization solution including DK72E front busbar paste, DK95E back busbar paste, and DK82E main busbar paste, enabling global first 'edge passivation + PolyFinger + 0BB' integrated TOPCon 3.0 mass production.
• DM270x Series High Water-Resistant Butyl Sealant High water-resistant butyl sealant for HJT/HBC/thin film/perovskite/BIPV/copper-metallized cell modules with industry-leading extremely low moisture permeability, excellent adhesion, and weather resistance. Supports on-site application, pre-made tape, and aluminum foil tape formats.
• DM290x Series 0BB Interconnection Structural Adhesive 0BB solder tape bonding adhesive for busbar and cell adhesion, featuring excellent processability, rapid curing, good adhesion, weather resistance, and yellowing resistance.
• DM280x Series BC Battery Insulation/Isolation Adhesive BC battery insulation adhesive for back electrode insulation protection and structural fixing with high insulation, high adhesion, high hardness, temperature resistance, and excellent processability. Also includes isolation adhesive for front surface protection.
• PacTite® DECA240 Series Silver-Coated Copper Paste Silver-copper conductive adhesive product line including DECA240-SC53 (silver content reduced to ~50%, volume resistivity ≤5×10⁻⁴ Ω·cm, high-speed automatic die attach compatible) and DECA240-YZ02 (silver content ~30%, compatible with screen printing and dispensing processes).
• DECA610 Series Pressure Sintering Silver Paste Pressure sintering silver paste for SiC automotive modules including DECA610-02T (porosity <1.2%, shear strength 194kg on 5×5mm² chip, passed TC2000 thermal cycle test and AQG324 reliability standard) and DECA610-08N226 (pure nano sintering silver with >200 W/m·K thermal conductivity for new energy vehicles and industrial power modules).
• DK95H n-Poly/DK73K p-Poly TBC Metallization Paste TBC (Tunneling Back Contact) battery metallization pastes including DK95H n-Poly silver paste and DK73K p-Poly silver paste for ohmic contact and metal recombination balance in TBC batteries, enabling PolySi layer thickness reduction to 180nm (n) and 200nm (p).

Quantifiable outcome

• DKM's TOPCon metallization paste helped TOPCon cells achieve >25% mass production conversion efficiency; assisted leading customers in multiple TOPCon efficiency world records
• +4 more outcomes

Named customers7 records

Segments2 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Ten partnerships are on record, tiered core, minor and moderate.

• Jinko Energy (晶科能源, 688223)coreStrategic or Co-development Partner · 10 October 2025Comprehensive strategic cooperation agreement signed in Shanghai in October 2025. Focus areas include high-efficiency PV cell metallization paste technology innovation and silver-reduction/no-silver metallization technology innovation. DKM has collaborated with Jinko since 2018, jointly driving TOPCon 1.0 industrialization, TOPCon 2.0 laser-enhanced sintering metallization, and currently TOPCon 3.0 technology development and silver-reduction metallization mass production practice.
• Anhui Huasheng New Energy Technology (安徽华晟新能源科技股份有限公司)coreStrategic or Co-development Partner · 12 June 2025Strategic cooperation on silver-coated copper paste, pure copper paste, and butyl adhesive joint development, application, and production capacity. Signed at SNEC 2025: 200-ton silver-coated copper paste and pure copper paste production project, and 5,000-ton butyl sealant production project. Deep collaboration on HJT and perovskite/silicon tandem cell silver-reduction metallization solutions.
• Xuancheng Economic Development Zone (宣城经济技术开发区)minorStrategic or Co-development Partner · 12 June 2025Strategic cooperation signed at SNEC 2025 as part of the Huasheng ecosystem, supporting the 200-ton silver-coated copper/copper paste and 5,000-ton butyl sealant capacity project location.
• Kaisheng Group (开盛集团)minorStrategic or Co-development Partner · 12 June 2025Strategic cooperation partner in the SNEC 2025 multi-party signing ceremony for HJT silver-coated copper paste, pure copper paste, and butyl adhesive cooperation and capacity projects.
• Tongwei Solar (通威太阳能)coreStrategic or Co-development PartnerLong-standing strategic partner since 2016, collaborating across multiple PV technology cycles from multi-crystalline to monocrystalline, BSF, PERC, TOPCon, to HJT. Recognized with Tongwei '十年同舟共济奖'. Active participation in Tongwei's annual partner conferences and joint supply chain collaboration initiatives.
• Dongfang Electric Group (东方电气集团)moderateStrategic or Co-development PartnerParticipant in the Ministry of Industry and Information Technology's 2023 Key Product/Process 'One-Stop' Application Demonstration for 'Efficient PV Cell Electronic Silver Paste', alongside DKM as lead organization and Jinko Energy.
• CPVT (国家太阳能光伏产品质量监督检测中心)moderateStrategic or Co-development PartnerExpanded strategic cooperation signed in June 2021 to jointly promote high-reliability empirical research for PV conductive silver paste modules, including damp heat, dry heat, and other reliability test scenarios. Responsible attitude to explore robust metallization solutions for the industry.
• Jiangsu Suote Materials Technology (江苏索特/原杜邦Solamet)coreTechnology or IntegrationDKM announced acquisition of Jiangsu Suote for 1.247 billion yuan in December 2021 to acquire DuPont's Solamet PV silver paste business including 216 invention patents, TOPCon and HJT core technology patents, and the Solamet brand. Transaction completed after CSRC review.
• TCL Technology / Zhonghuan Semiconductor (TCL科技/中环股份)moderateStrategic or Co-development PartnerTCL Technology Chairman Li Dongsheng and Zhonghuan Semiconductor Chairman Shen Haoping visited DKM in August 2020. Discussions covered PV cell conductive silver paste and shingled module conductive adhesive collaboration, as well as next-generation PV cell and module technology cooperation. TCL had made a strategic investment in DKM in 2015.
• IEEE Fellow Dr. Shi Guojun (史国均/Frank Shi)coreOthersDr. Shi Guojun, IEEE Fellow and retired UC Irvine Distinguished Professor, joined DKM in March 2026 as Chief Strategy Scientist and Head of Future Industries Research Institute. He will lead planning and development in emerging industries, focusing on the semiconductor memory business. Dr. Shi received the IEEE-CPMT 'Persistent Outstanding Technical Contribution Award' in 2010.

Scale indicators9 records

Recent moves8 records

Expansion highlights6 records

Others

• Targray Technology International: Canadian specialty materials distributor supplying silver pastes, ribbons, and encapsulants to PV module manufacturers globally. Adjacent ecosystem participant rather than a direct competitor — represents the channel/distribution layer that DKEM reaches directly.

Regional players

• Sumitomo Metal Mining: Japanese non-ferrous metals producer of ultra-fine silver and copper powders used as feedstocks for conductive pastes. Comparable as a vertically-adjacent materials supplier and technology peer for high-purity silver micro/nano powders underlying both PV and semiconductor paste formulations.
• Daejoo Electronic Materials: Korean specialty electronic materials company (078600.KQ) producing silver pastes, conductive inks, and EMI shielding materials for displays, semiconductors and PV. Comparable product technology but primarily serves Korean and broader Asian display/semiconductor customers.

Direct peers

• Heraeus Holding: German precious-metals technology group and historic global leader in PV metallization pastes (the franchise DKEM displaced in China). Directly comparable in product portfolio — conductive silver pastes and silver-coated copper pastes for solar cell metallization.
• Giga Solar Materials Corporation: Taiwan-based manufacturer of conductive silver pastes for crystalline silicon solar cells. Closest pure-play comparable to DKEM's core photovoltaic metallization paste business, with overlapping customer base among Asian cell makers.
• Sino-Platinum Metals (贵研铂业): Chinese precious-metal materials group (600459.SH) supplying silver powders, sputtering targets, and conductive materials including PV paste inputs. Comparable as a domestic Chinese competitor and supplier-adjacent peer in PV metallization chemistry.
• Namics Corporation: Japanese specialty chemical company producing conductive silver pastes, sintering silver, and underfill materials for LED, IC and power semiconductor packaging. Direct comparable to DKEM's PacTite® semiconductor packaging materials franchise.
• Suzhou Goodteam Electronic Materials (苏州固锝): Chinese electronic materials manufacturer (002079.SZ) producing diode-related and PV metallization materials. A fellow domestic Chinese silver-paste competitor serving the same tier-1 PV cell customer base as DKEM.

Broad incumbents

• Resonac (formerly Showa Denko / Hitachi Chemical): Japanese diversified materials incumbent with a substantial semiconductor packaging materials portfolio (including sintering silver and bonding materials) under the former Hitachi Chemical franchise. Overlaps with DKEM's PacTite® business as a broader, established competitor with a wider product portfolio.
• Henkel AG & Co. KGaA: German multinational with a broad electronic materials business including conductive adhesives, sintering materials, and underfills for semiconductor packaging. Comparable on the PacTite® semiconductor side as a much larger, diversified incumbent.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/dk-electronic-materials

Compliance6 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Subsidiaries7 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Wuxi DK Electronics Materials