Xiamen Hongxin Electron-Tech Group

What Xiamen Hongxin Electron-Tech Group does

Xiamen Hongxin Electron-Tech Group (厦门弘信电子科技集团股份有限公司, SZSE: 300657) is a Chinese publicly-listed manufacturer founded in 2003 and listed on the Shenzhen Stock Exchange in 2017. The firm operates a dual-core platform spanning flexible electronics and green affordable AI computing power (绿色普惠算力). The flexible electronics segment produces Flexible Printed Circuits (FPC), optical technology components, flexible sensors, and automotive new-energy solutions targeted at consumer electronics, automotive, and industrial OEMs. The green affordable computing power segment supplies High-Performance AI Equipment, AI Servers, Computing Power Pods, Mobile Computing Containers, Intelligent Computing Center Solutions, and a Computing Power Rental service line aimed at enterprise customers and SMEs that lack the capex to stand up their own AI compute.

The group's headquarters are in Xiamen, Fujian Province, with a strategic new site in Wuxi, Jiangsu Province established via its subsidiary 燧弘华创 (Suihong Huachuang) as the Token Factory headquarters for Jiangsu Province's first Huawei super-node AI cluster (announced May 2026). The company employs 5,001–10,000 staff, sells primarily through direct enterprise B2B channels within mainland China, and uses its Shenzhen Stock Exchange listing as a capital-raising channel. No public pricing is disclosed, revenue mix by segment is not disclosed, and no named end-customer logos are disclosed in the supplied sources. Marketing and investor communications run through the company website (hon-flex.com), a WeChat public account, and the cninfo.com.cn disclosure portal.

The firm's revenue model combines unit sales of electronics components and AI hardware with an emerging OPEX-style AI compute rental offering. The strategic narrative explicitly couples domestic 'AI + flexible electronics' industrial policy alignment (国家战略导向) with first-mover positioning in the affordable green AI compute niche, positioning the company at the intersection of consumer electronics manufacturing and AI infrastructure deployment in China.

Name

Xiamen Hongxin Electron-Tech Group

Legal name

Xiamen Hongxin Electronics Technology Group Co., Ltd. (厦门弘信电子科技集团股份有限公司)

Website

https://fpc98.com

Company type

Public

Founded year

2003

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Xiamen Hongxin Electron-Tech Group (SZSE: 300657) is a Chinese-listed dual-core manufacturer of flexible printed circuits, optical and sensor components, automotive new-energy electronics, and AI computing infrastructure (AI servers, computing pods, intelligent computing center solutions, and compute rental) serving enterprise customers across consumer electronics, automotive, and AI verticals.

Ownership category

akta.pro rank

Product category

Electronic Components & AI Computing Infrastructure

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441), Computer and Peripheral Equipment Manufacturing (33411), Electrical Equipment Manufacturing (3353)

SIC

Electronic Components & Accessories (3670), Electronic & Other Electrical Equipment (No Computer Equip) (3600), Electronic Computers (3571)

akta.pro primary industry

Embedded & HMI Electronics Manufacturing (Industrial PCs, HMIs, Panel PCs) (IMAGAGAD)

akta.pro secondary industries

Industrial IoT/Edge Electronics Manufacturing (Gateways, Edge Controllers) (IMAGAGAC), Semiconductors for Industrial Control & Power (MCUs, DSPs, FPGAs, ASICs, IGBTs, MOSFETs, diodes) (IMAGAJAE), Micromobility Electrical/Electronic Components Manufacturing (Wiring/Displays/Telematics/IoT) (IMACAOAI)

Keywords

• Flexible printed circuits
• Flexible electronics manufacturing
• AI computing infrastructure
• Intelligent computing centers
• Green computing power

Headquarters

HQ city

Xiamen

HQ country

China

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Technology or R&D, Personnel, Infrastructure

Distribution channels2 records

Marketing channels4 records

Core offering

Xiamen Hongxin Electron-Tech Group manufactures and sells flexible electronic components, including Flexible Printed Circuits (FPC), optical technology products, flexible sensors, and automotive new energy solutions. The group also develops and provides green affordable AI computing power infrastructure, including high-performance AI equipment, AI servers, computing power pods, mobile computing containers, intelligent computing center solutions, and computing power rental services, targeting enterprise customers across multiple industries.

Product overview

Xiamen Hongxin Electron-Tech Group (stock code: 300657) operates as a dual-core business platform combining flexible electronics and green affordable computing power. The flexible electronics segment includes FPC (Flexible Printed Circuits), optical technology, flexible sensors, and automotive new energy solutions. The green affordable computing power segment encompasses high-performance AI equipment, AI servers, computing power pods, mobile computing containers, intelligent computing center solutions, and computing power rental solutions. The company also provides AI application services to empower various industries. Founded in 2003 and listed on Shenzhen Stock Exchange in 2017, the company positions itself at the intersection of the Fourth Industrial Revolution, integrating AI with flexible electronics technology.

Differentiator

Problem solved

Functional benefit

Products and services

• FPC (Flexible Printed Circuits) (柔性电子) Flexible Printed Circuit products designed for various electronic applications within the flexible electronics segment. Targeted at electronics manufacturers requiring lightweight, miniaturized interconnect solutions.
• Optical Technology (光学科技) Optical technology products offered as part of the flexible electronics division, supporting optical applications in consumer electronics, automotive, and industrial sectors.
• Flexible Sensors (柔性传感器) Flexible sensor products targeting IoT, wearable devices, and automotive applications as part of the flexible electronics industry chain.
• Automotive New Energy (车载新能源) New energy solutions for automotive applications within the flexible electronics ecosystem, addressing demand from electric vehicles and new energy automotive manufacturers.
• High-Performance AI Equipment (高性能AI设备) High-performance AI computing equipment supporting intelligent computing center deployment and AI training/inference workloads for enterprise customers.
• Intelligent Computing Center Solutions (智算中心解决方案) End-to-end solutions for building and operating intelligent computing centers, providing integrated AI infrastructure for enterprise and institutional customers.
• Computing Power Rental Complete Solutions (算力租赁整体解决方案) Comprehensive AI computing power rental services enabling enterprises, particularly small and medium enterprises, to access affordable AI compute capacity without large upfront capital investments.
• AI Applications (AI应用) AI application solutions designed to empower various industry verticals by integrating AI with flexible electronics technology.

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

One partnership is on record.

• Huawei (华为)coreTechnology or Integration · 1 May 2026Hongxin subsidiary 燧弘华创 established Token Factory headquarters in Wuxi, marking the formal implementation of Jiangsu Province's first Huawei super-node cluster. This represents a core technology partnership for AI computing infrastructure development.

Scale indicators3 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• Zhen Ding Technology Holding: Global leader in flexible printed circuits (FPC) serving smartphones, automotive, and consumer electronics. Most directly comparable to Hongxin's flexible electronics (FPC) segment by product category, customer base, and manufacturing scale.
• Career Technology (MFLX): Taiwan-based FPC manufacturer focused on consumer electronics and mobile applications. Directly comparable to Hongxin's flexible printed circuit business by product, scale, and customer profile.
• Sumitomo Electric Industries: Diversified Japanese electronics and components manufacturer with FPC, flexible sensors, and wiring products for automotive and electronics OEMs. Overlaps Hongxin's flexible electronics and sensor product lines.
• Flexium Interconnect: Taiwan-based FPC manufacturer serving consumer electronics, mobile devices, and automotive applications. Closely matches Hongxin's core FPC business model and end-market exposure.
• Fujikura Ltd. Japanese electronics manufacturer with a substantial FPC and flexible electronics business serving automotive, consumer, and industrial markets. Comparable in product mix and geographic end-market reach.

Broad incumbents

• Inspur Electronic Information Industry: Major Chinese AI server and computing infrastructure provider serving hyperscale and enterprise customers. Comparable to Hongxin's AI computing infrastructure segment (servers, intelligent computing centers) and competes for the same China national AI capacity contracts.
• Inventec Corporation: Taiwan-based ODM producing AI servers, storage, and computing infrastructure for hyperscalers. Comparable to Hongxin's AI server business in product category, with significantly larger scale and broader customer base.
• Sugon (Dawning Information Industry): Leading Chinese AI server, HPC, and intelligent computing center provider with strong ties to national research institutes. Directly comparable to Hongxin's AI infrastructure buildout and computing power offerings.
• Wistron Corporation: Taiwan ODM with server, AI infrastructure, and electronics manufacturing services. Comparable to Hongxin's combined AI server and electronics manufacturing positioning, though at materially larger scale.
• Lenovo Group: Global PC and server manufacturer with a growing AI server and infrastructure portfolio. Comparable to Hongxin's AI server and computing infrastructure segment, though Lenovo operates at much larger scale and broader scope.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments2 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Xiamen Hongxin Electron-Tech Group