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Malaysian Pacific Industries

Full company profile

uuid003gyhq

Namestring
Malaysian Pacific Industries
Legal namestring
Malaysian Pacific Industries Berhad 196201000323 (4817-U)
Websiteurl
mpind.my
Company typeenum
Public
Founded yearint
1962
Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
5,001–10,000
akta.pro rankint
HeadquartersKuala Lumpur, Malaysia
HQ citystring
Kuala Lumpur
HQ countrystring
Malaysia
HQ regionstring
Asia
Markets served

Serves global market

Offices5 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
semiconductor packaging services, outsourced semiconductor testing, OSAT services, advanced semiconductor assembly, wide-bandgap semiconductors
Industry4 codes
1PCB Assembly (PCBA/EMS)
CodeHDAHAOAIPrimaryYes
2Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware)
CodeIMAGAGAKPrimaryNo
3Embedded & HMI Electronics Manufacturing (Industrial PCs, HMIs, Panel PCs)
CodeIMAGAGADPrimaryNo
4Automotive Instrument Clusters, Displays & HMI Electronics Manufacturing
CodeIMACAJAGPrimaryNo
NAICS code2 codes
  • Computer and Electronic Product Manufacturing334
  • Motor Vehicle Electrical and Electronic Equipment Manufacturing336320
Product category
Semiconductor Packaging and Testing (OSAT)
GTM motion1 record

Each record includes

Type, Description, Source

Revenue model1 record
1OSAT Services (Outsourced Semiconductor Assembly and Testing)
TypeHardware Sales
Description

Core revenue from providing outsourced semiconductor packaging, assembly and testing services for global customers across automotive, AI, renewable energy, and communications segments. Revenue generated through manufacturing services contracts with semiconductor companies.

mpind.my
Marketing channels4 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels1 record

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components5 values
Operations, Supply Chain, Personnel, Infrastructure, Technology or R&D
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 of 2 records shown
1Carsem
Description

Primary brand for outsourced semiconductor packaging and testing services (OSAT) operated by MPI subsidiaries

mpind.my
+1 more record
Core offering1 text field

Malaysian Pacific Industries is principally an investment holding company whose subsidiaries provide outsourced semiconductor packaging and testing services (OSAT) globally. Operating under its primary brand Carsem, MPI delivers advanced packaging, assembly, and testing for integrated circuits, semiconductor devices, and electronic components across automotive, AI/data centre, renewable energy, and communications end markets. Manufacturing facilities are located in Malaysia (Ipoh), China (Suzhou), and Thailand (Bangkok/Nonthaburi).

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 4 values shown
  • Automotive segment accounts for 38% of revenue in 3QFY22
+3 more records
Product overview1 text field

Malaysian Pacific Industries (MPI) is a publicly-listed investment holding company on Bursa Malaysia, providing outsourced semiconductor assembly and testing services (OSAT) through its primary brand Carsem. The company operates manufacturing facilities in Malaysia (Ipoh), China (Suzhou), and Thailand (Bangkok/Nonthaburi). MPI's product portfolio centers on semiconductor packaging and testing for integrated circuits, semiconductor devices, electronic components, and leadframes, with strategic focus on advanced technologies including wide-bandgap semiconductors (SiC and GaN) for power management, AI-related products, automotive-grade memory solutions, and custom sensors serving automotive, AI data center, renewable energy, and communications markets. The company completed the RM327.56 million acquisition of Infineon Technologies Thailand in February 2026, expanding its automotive-grade memory capabilities.

Product and service6 records
1Carsem OSAT Services
CategoryOSAT Services
Description

Outsourced semiconductor assembly, packaging and testing services provided under the Carsem brand, delivering advanced packaging solutions including wide-bandgap (SiC/GaN), power management, automotive-grade memory, and custom sensor packages to semiconductor companies globally.

2Wide-bandgap Semiconductor (SiC and GaN) Packaging
CategoryPower Semiconductor Packaging
Description

Assembly and testing services for Silicon Carbide (SiC) and Gallium Nitride (GaN) wide-bandgap power products used in electric vehicles, AI servers, renewable energy systems, and consumer gadgets.

3Power Management Chip Assembly and Testing
CategoryAI Semiconductor Packaging
Description

Specialized packaging and testing for power management chips deployed in AI data centre infrastructure, supported by US$65 million investment in AI server equipment. AI-related products are expected to grow from 13% to 20% of revenue.

4Automotive-grade Memory Packaging and Testing
CategoryAutomotive Semiconductor Packaging
Description

Assembly and testing services for automotive-grade memory products serving automotive, connectivity and IoT end markets. Capability was significantly expanded with the February 2026 acquisition of the Infineon Thailand backend facility.

5Panel Level Packaging
CategoryAdvanced Packaging Technology
Description

Advanced process technology for next-generation semiconductor packaging, providing differentiated manufacturing scale and reliability for advanced package architectures.

6Dynacraft Semiconductor Services
CategorySemiconductor Sales and Marketing
Description

Subsidiary brand of MPI providing additional semiconductor-related services including marketing of semiconductor devices and electronic components.

Scale indicator12 records

Each record includes

Type, Value, Description, Source

Partnership3 partners
1Infineon Technologies AG
Strategic tierCoreTypeStrategic or Co-development PartnerAnnounced on2025-09-18
Description

Infineon transferred its backend manufacturing site in Bangkok/Nonthaburi, Thailand to MPI for RM327.56 million. A long-term supply agreement was secured, and both companies agreed to strengthen their partnership and collaborate on joint development of innovative package solutions. The transaction completed in February 2026.

2Infineon Technologies
Strategic tierCoreTypeStrategic or Co-development Partner
Description

Strategic transfer of backend manufacturing operations with ongoing supply relationship. Infineon simultaneously invested in a new backend fab in Samut Prakan, Thailand, reinforcing the semiconductor ecosystem in the region.

3Suzhou Industrial Park Suxiang Cooperation Zone Management Committee
Strategic tierMinorTypeOthers
Description

Agreement signed for acquisition of 66,667-sq-m land with 50-year usage term at cost of around 22.4 million yuan (RM14.81 million) to build new plant in Suzhou, China.

mpind.my
Recent move6 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight6 records

Each record includes

Type, Description

Market position
Competitive moat6 records

Each record includes

Type, Details

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers2 records

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment5 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile3 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

AI maturity
App detail

Has app

Feature5 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles3 records

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

Subsidiaries10 records

Each record includes

Name, Acquired on, Relationship type, Type, Business focus

Compliance5 records

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Malaysian Pacific Industries

Semiconductor Packaging and Testing (OSAT)mpind.my

Malaysian Pacific Industries firmographics

Firmographics
Name
Malaysian Pacific Industries
Legal name
Malaysian Pacific Industries Berhad 196201000323 (4817-U)
Website
https://mpind.my
Company type
Public
Founded year
1962
Operating status
Operating
Headcount range
5,001–10,000 employees
Ownership category
akta.pro rank

Malaysian Pacific Industries industry classification

Industry
Product category
Semiconductor Packaging and Testing (OSAT)
NAICS
Computer and Electronic Product Manufacturing (334), Motor Vehicle Electrical and Electronic Equipment Manufacturing (336320)
akta.pro primary industry
PCB Assembly (PCBA/EMS) (HDAHAOAI)
akta.pro secondary industries
Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware) (IMAGAGAK), Embedded & HMI Electronics Manufacturing (Industrial PCs, HMIs, Panel PCs) (IMAGAGAD), Automotive Instrument Clusters, Displays & HMI Electronics Manufacturing (IMACAJAG)

Keywords

  • Semiconductor packaging services
  • Outsourced semiconductor testing
  • OSAT services
  • Advanced semiconductor assembly
  • Wide-bandgap semiconductors

Where Malaysian Pacific Industries is headquartered

Location

Headquarters

HQ city
Kuala Lumpur
HQ country
Malaysia
HQ region
Asia

Offices5 records

Markets served

Malaysian Pacific Industries business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Operations, Supply Chain, Personnel, Infrastructure, Technology or R&D

Revenue model

  1. OSAT Services (Outsourced Semiconductor Assembly and Testing): Core revenue from providing outsourced semiconductor packaging, assembly and testing services for global customers across automotive, AI, renewable energy, and communications segments. Revenue generated through manufacturing services contracts with semiconductor companies.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Malaysian Pacific Industries product offering

Product offering

Core offering

Malaysian Pacific Industries is principally an investment holding company whose subsidiaries provide outsourced semiconductor packaging and testing services (OSAT) globally. Operating under its primary brand Carsem, MPI delivers advanced packaging, assembly, and testing for integrated circuits, semiconductor devices, and electronic components across automotive, AI/data centre, renewable energy, and communications end markets. Manufacturing facilities are located in Malaysia (Ipoh), China (Suzhou), and Thailand (Bangkok/Nonthaburi).

Product overview

Malaysian Pacific Industries (MPI) is a publicly-listed investment holding company on Bursa Malaysia, providing outsourced semiconductor assembly and testing services (OSAT) through its primary brand Carsem. The company operates manufacturing facilities in Malaysia (Ipoh), China (Suzhou), and Thailand (Bangkok/Nonthaburi). MPI's product portfolio centers on semiconductor packaging and testing for integrated circuits, semiconductor devices, electronic components, and leadframes, with strategic focus on advanced technologies including wide-bandgap semiconductors (SiC and GaN) for power management, AI-related products, automotive-grade memory solutions, and custom sensors serving automotive, AI data center, renewable energy, and communications markets. The company completed the RM327.56 million acquisition of Infineon Technologies Thailand in February 2026, expanding its automotive-grade memory capabilities.

Differentiator

Problem solved

Functional benefit

Brands

  • Carsem: Primary brand for outsourced semiconductor packaging and testing services (OSAT) operated by MPI subsidiaries
  • Dynacraft

Products and services

  • Carsem OSAT Services Outsourced semiconductor assembly, packaging and testing services provided under the Carsem brand, delivering advanced packaging solutions including wide-bandgap (SiC/GaN), power management, automotive-grade memory, and custom sensor packages to semiconductor companies globally.
  • Wide-bandgap Semiconductor (SiC and GaN) Packaging Assembly and testing services for Silicon Carbide (SiC) and Gallium Nitride (GaN) wide-bandgap power products used in electric vehicles, AI servers, renewable energy systems, and consumer gadgets.
  • Power Management Chip Assembly and Testing Specialized packaging and testing for power management chips deployed in AI data centre infrastructure, supported by US$65 million investment in AI server equipment. AI-related products are expected to grow from 13% to 20% of revenue.
  • Automotive-grade Memory Packaging and Testing Assembly and testing services for automotive-grade memory products serving automotive, connectivity and IoT end markets. Capability was significantly expanded with the February 2026 acquisition of the Infineon Thailand backend facility.
  • Panel Level Packaging Advanced process technology for next-generation semiconductor packaging, providing differentiated manufacturing scale and reliability for advanced package architectures.
  • Dynacraft Semiconductor Services Subsidiary brand of MPI providing additional semiconductor-related services including marketing of semiconductor devices and electronic components.

Quantifiable outcome

  • Automotive segment accounts for 38% of revenue in 3QFY22
  • +3 more outcomes

Companies that use Malaysian Pacific Industries

Customer profile

Named customers2 records

Segments5 records

Ideal customer profiles3 records

Malaysian Pacific Industries technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Feature5 records

Malaysian Pacific Industries partnerships and signals

Strategic signal

Partnerships

Three partnerships are on record, tiered core and minor.

  • Infineon Technologies AGcoreStrategic or Co-development Partner · 18 September 2025Infineon transferred its backend manufacturing site in Bangkok/Nonthaburi, Thailand to MPI for RM327.56 million. A long-term supply agreement was secured, and both companies agreed to strengthen their partnership and collaborate on joint development of innovative package solutions. The transaction completed in February 2026.
  • Infineon TechnologiescoreStrategic or Co-development PartnerStrategic transfer of backend manufacturing operations with ongoing supply relationship. Infineon simultaneously invested in a new backend fab in Samut Prakan, Thailand, reinforcing the semiconductor ecosystem in the region.
  • Suzhou Industrial Park Suxiang Cooperation Zone Management CommitteeminorOthersAgreement signed for acquisition of 66,667-sq-m land with 50-year usage term at cost of around 22.4 million yuan (RM14.81 million) to build new plant in Suzhou, China.

Scale indicators12 records

Recent moves6 records

Expansion highlights6 records

Malaysian Pacific Industries competitors and assessment

Company assessment

Market position

Competitive moat6 records

Key highlights7 records

Customer concentration

Malaysian Pacific Industries social profiles

Digital presence

Malaysian Pacific Industries compliance and trust

Trust signal

Compliance5 records

Malaysian Pacific Industries financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Malaysian Pacific Industries leadership team

Management profile

Number of profiles

Profiles3 records

Malaysian Pacific Industries subsidiaries and ownership

Company hierarchy

Subsidiaries10 records

Malaysian Pacific Industries funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Malaysian Pacific Industries M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Malaysian Pacific Industries

What does Malaysian Pacific Industries do?

Malaysian Pacific Industries is principally an investment holding company whose subsidiaries provide outsourced semiconductor packaging and testing services (OSAT) globally. Operating under its primary brand Carsem, MPI delivers advanced packaging, assembly, and testing for integrated circuits, semiconductor devices, and electronic components across automotive, AI/data centre, renewable energy, and communications end markets. Manufacturing facilities are located in Malaysia (Ipoh), China (Suzhou), and Thailand (Bangkok/Nonthaburi).

Is Malaysian Pacific Industries a public or private company?

Malaysian Pacific Industries is a public company. It is classified as public and is currently operating.

When was Malaysian Pacific Industries founded?

Malaysian Pacific Industries was founded in 1962. It employs 5,001 to 10,000 people.

Where is Malaysian Pacific Industries based?

Malaysian Pacific Industries is headquartered in Kuala Lumpur, Malaysia, in the Asia region.

How does Malaysian Pacific Industries make money?

One revenue line is on record: OSAT Services (Outsourced Semiconductor Assembly and Testing).

Does Malaysian Pacific Industries have an API?

No public API is recorded for Malaysian Pacific Industries.

What industry is Malaysian Pacific Industries in?

Malaysian Pacific Industries's product category is Semiconductor Packaging and Testing (OSAT). Its primary akta.pro industry code is HDAHAOAI, PCB Assembly (PCBA/EMS), with a secondary code of IMAGAGAK, Process Control & Automation Electronics Manufacturing Services (PLCs, I/O, DCS/SCADA hardware). Its NAICS code is 334.

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Live signals
The future of tradingEPF lifts Malaysian Pacific Industries stake to 13,446,748 shares after 30,000-share buyEPF raised its stake in Malaysian Pacific Industries by purchasing 30,000 shares on Sept. 30, 2026, bringing total holdings to 13,446,748 ordinary shares. The disclosure was dated Oct. 1, 2026, with receipt recorded on Oct. 5, 2026.AInvestMalaysia's Bursa Edges Higher Amid Wall Street Rebound, Tech Counters GainBursa Malaysia edged higher in early trade after Wall Street's overnight rebound, with technology and semiconductor counters among top gainers. Malaysian Pacific Industries surged RM1.44 to RM41.54, while the FBM KLCI rose 0.02% to 1,675.08. Berjaya Research maintains a cautious outlook on the index.The Edge MalaysiaMPI 4Q net profit hit by costs and taxationMalaysian Pacific Industries reported a marginal 1.6% increase in fourth-quarter net profit to RM44.23 million, despite a 30.6% surge in revenue to RM736.64 million, as higher costs and taxation eroded margins. The company announced no final dividend for the quarter but outlined strategic priorities to expand into higher-margin segments such as AI servers and sensors. Management is actively working to mitigate rising production costs amid global economic challenges and geopolitical uncertainty.MoomooTech Outlook: AI, Advanced Packaging Set To Drive New Semiconductor UpcycleKenanga Investment Bank Research has raised valuation benchmarks for selected Malaysian semiconductor and technology stocks, citing AI infrastructure spending, advanced packaging, and high-performance computing as structural drivers of a new upcycle distinct from previous recoveries tied to consumer electronics demand. The research house increased price-to-earnings multiples for Inari Amertron, Malaysian Pacific Industries, and Pentamaster, while maintaining a more cautious stance on EMS companies due to consumer market uncertainty. It identified preferred stocks including Kelington Group, Inari Amertron, LGMS, Infomina, Frontken, UWC, and SkyeChip as top picks with Outperform ratings, citing favourable exposure to AI infrastructure and semiconductor manufacturing expansion.The Edge MalaysiaCover Story: MPI bets on next semiconductor wave as AI reshapes industryMalaysian Pacific Industries Bhd (MPI) reported a 25.3% year-on-year revenue increase to RM651.57 million for the quarter ended March 31, 2026, driven by surging demand for power management chips in AI data centers and a rebound in its automotive business. The company is actively investing US$65 million in new equipment and leveraging its acquisition of Infineon’s Thailand subsidiary to capture market share from geopolitical supply chain shifts. Management projects that AI-related products will grow their revenue contribution to 20%, positioning MPI to capitalize on the next wave of semiconductor infrastructure buildout.KlsescreenerCover Story: MPI bets on next semiconductor wave as AI reshapes industryMalaysian Pacific Industries Bhd (MPI) reported record quarterly revenue of RM651.57 million in 3QFY2026, up 25.3% year on year, driven by surging demand for power management chips used in AI data centres. The company has invested approximately US$65 million in AI server equipment and expects AI-related products to grow from 13% to 20% of revenue, while also completing the RM327.56 million acquisition of Infineon Technologies (Thailand) Ltd to expand into automotive-grade memory solutions. MPI's managing director Manuel Zarauza Brandulas outlined the company's strategic focus on wide-bandgap semiconductor technologies (SiC and GaN) for next-generation AI infrastructure, positioning the company for future markets including autonomous vehicles and humanoid robotics.eeNews EuropeInfineon completes Thailand backend fab sale to MPIInfineon Technologies completed the sale of its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to Malaysian Pacific Industries Berhad (MPI) on February 4, 2026, as part of its strategy to optimize manufacturing between in-house capacity and outsourced partners. MPI will take over operations, retain all production employees, and operate under a long-term supply agreement with Infineon, while Infineon simultaneously invested in a new backend fab in Samut Prakan, reinforcing its commitment to Thailand's semiconductor ecosystem. The transaction reflects broader industry trends as leading IDMs balance in-house fab ownership with specialized OSAT providers, underscoring Southeast Asia's growing role in advanced semiconductor manufacturing.The Edge MalaysiaMalaysian tech stocks outperform amid broad rally in AsiaMalaysian technology stocks outperformed on October 2, 2025, with the Bursa Malaysia Technology Index rising more than 5% amid a broad Asian rally driven by rising expectations of a US Federal Reserve interest rate cut. Key movers included Inari Amertron Bhd surging 11%, Malaysian Pacific Industries Bhd up nearly 10%, and Censof Holdings Bhd gaining 16%, as hot money flows moved into Asian markets seeking higher returns. The rally was attributed to prospects of looser US monetary policy making capital cheaper for tech companies with heavy capital expenditure, with China's week-long holiday also contributing to fund inflows into Malaysia.NucampGetting a Job in Tech in Malaysia in 2024: The Complete GuideMalaysia's tech sector is experiencing significant growth in 2024, driven by RM83.7 billion in investments that have created over 29,000 new jobs and sustained a low unemployment rate of 3.3%. The market is seeing increased demand for software engineers, data scientists, and cybersecurity specialists, supported by government initiatives like the Malaysia Digital Economy Blueprint to establish the nation as a regional data center hub. Companies such as Malaysian Pacific Industries and Inari Amertron are positioned to benefit from this expansion, particularly in memory and integrated circuit sales.