Henan Shijia Photons Technology

What Henan Shijia Photons Technology does

Henan Shijia Photons Technology Co., Ltd. (SSE: 688313) is a vertically integrated IDM (Integrated Device Manufacturer) of optical chips, components, and indoor fiber optic cables, founded in October 2010 in Hebi, Henan Province, China, and listed on the Shanghai Stock Exchange Sci-Tech Innovation Board in August 2020. The company operates two technology platforms under one roof: a passive Planar Lightwave Circuit (PLC) / AWG platform for splitter chips, AWG modules, WDM devices, and VOA/OSW products, and an active Optical Active Lasers platform using MOCVD epitaxial growth with dual InGaAsP and AlInGaAs material systems spanning 1260-1700nm. The active platform produces DFB, FP, EML, SOA, and SLD laser chips with proprietary quantum-well designs incorporating SBS suppression and 100kHz ultra-narrow linewidth capability. Production capacity is at industrial scale, exceeding 50,000 wafer chips per month on 6-inch wafers, 400,000 AWG units, 500,000 PLC splitters, 150,000 WDM channels, and 100,000 MPO units. The company sells primarily through direct sales to optical module manufacturers, equipment vendors, and network operators, with operations in China (Hebi HQ, Wuhan R&D, Shenzhen cable manufacturing), Thailand (manufacturing since July 2024), and the United States (sales office in Fremont, California), plus a Singapore subsidiary established in 2025.

The company's revenue is generated almost entirely through hardware sales of chips, packaged devices (TO, TOSA, Butterfly, mini-box), modules (WDM, VMUX, optical switches), and fiber optic cables, with pricing conducted on a quote basis under multi-year contracts. Customer segments are organized by vertical: data center infrastructure (AWG, MT-FA, MPO assemblies, lasers for 200G-1.6T modules), telecom networks (PLC splitters, AWG, DWDM, VOA for backbone/metro), 4G/5G network construction (chips and cables for wireless base stations), and an emerging LiDAR/sensing vertical (laser chips for FMCW LiDAR, ToF LiDAR, TDLAS gas sensing). The historical milestone of holding >50% global market share in PLC splitter chips in 2014 establishes the passive franchise, while the 2021-2023 design-in of 2.5G/10G DFB chips at multiple top global equipment vendors validates the active-chip platform. Product marketing emphasizes exhibition presence at OFC, CIOE, ECOC, and SPIE Photonics West, with multi-year contract pricing and NRE fee waivers for bulk orders as commercial levers. Customer logos are not publicly disclosed beyond the category designation of 'top global equipment vendors' and 'optical module manufacturers,' indicating a B2B enterprise sales motion through international exhibitions and direct technical account management.

Name

Henan Shijia Photons Technology

Legal name

Henan Shijia Photons Technology Co., Ltd.

Website

https://sjphotons.com

Company type

Public

Founded year

2010

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

Henan Shijia Photons Technology (SSE: 688313) is a Chinese IDM manufacturer of optical laser chips, passive PLC/AWG components, and indoor fiber optic cables serving telecommunications, data center, 4G/5G, and LiDAR/sensing customers globally through direct sales.

Ownership category

akta.pro rank

Product category

Optical Communication Components and Semiconductor Laser Chips

NAICS

Semiconductor and Related Device Manufacturing (334413), Fiber Optic Cable Manufacturing (335921)

SIC

Semiconductors & Related Devices (3674), Optical Instruments & Lenses (3827), Instruments For Meas & Testing Of Electricity & Elec Signals (3825)

akta.pro primary industry

Optoelectronics & Photonics (LED/Laser/Optical ICs) (HDAHAAAH)

akta.pro secondary industries

Optoelectronic / Photonics Foundries (Silicon Photonics/LED/Laser) (HDAHACAG), Optical Transceivers (SFP/SFP+/SFP28/QSFP/QSFP-DD/OSFP) (HDAFAEAE), Quantum Photonics & Quantum Imaging (Single-Photon, Lidar, Ghost Imaging) (HDAGAHAF)

Keywords

• Optical semiconductor chips
• DFB laser chips
• PLC splitter wafers
• Optical transceivers components
• Indoor optical cables

Headquarters

HQ city

Hebi

HQ country

China

HQ region

Asia

Offices5 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Technology or R&D, Personnel, Operations, Infrastructure, Marketing or Sales

Revenue model

1. Optical Chips and Devices Sales: Shijia Photons generates revenue primarily through the sale of optical chips (DFB laser chips, PLC splitter chips, AWG chips) and packaged devices (TO, TOSA, Butterfly packages) to optical module manufacturers and network equipment vendors. The company also sells completed modules including WDM, VMUX, and optical switches.

Pricing tiers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

Henan Shijia Photons Technology is a vertically integrated IDM manufacturer of optical communication chips and components. It designs, fabricates, and packages optical semiconductor laser chips (DFB, FP, EML, SOA), passive optical chips and modules (PLC splitters, AWG, WDM, VOA, optical switches), TO/TOSA/butterfly packaged active devices, optical connection products (MPO/MTP, fiber arrays, patchcords), and indoor optical cables for telecom, data center, 4G/5G, LiDAR, and sensing applications. The company operates dual manufacturing platforms (PLC/AWG passive and Optical Active Lasers) covering 1260-1700nm wavelengths.

Product overview

Henan Shijia Photons Technology (Stock Code: 688313) is a vertically integrated IDM manufacturer specializing in optical communication components and laser technology. The company's portfolio centers on three core business segments: optical passive chips/components (PLC splitters, AWG modules, WDM devices), active laser chips and devices (DFB, FP, EML lasers in TO, TOSA, and butterfly packages), and indoor fiber optic cables. The products are organized under two main technology platforms - the Planar Lightwave Circuit/AWG Platform for passive components and the Optical Active Lasers Platform for semiconductor lasers. The company serves diverse applications including fiber-optic telecommunication networks, data centers, 4G/5G infrastructure, backbone/metropolitan area networks, FTTH deployments, LiDAR technology, and fiber optic sensing systems.

Differentiator

Problem solved

Functional benefit

Products and services

• Optical PLC Splitter 1xN 2xN Planar Lightwave Circuit (PLC) optical splitter chips and modules that divide or combine optical signals across 1xN or 2xN configurations, used in FTTX/PON networks.
• AAWG DWDM Modules Athermal Arrayed Waveguide Grating (AAWG) modules for Dense Wavelength Division Multiplexing (DWDM) systems, available in 40/48/60/96 channel configurations with 50GHz-150GHz wavelength spacing.
• TFF WDM Modules Thin Film Filter (TFF) based Wavelength Division Multiplexing modules including DWDM, CWDM, and FWDM variants for optical communication systems.
• VOA (Variable Optical Attenuator) Variable Optical Attenuator devices for power leveling in DWDM systems, available in SOI and PLC configurations with 4-48 channel options.
• OSW (Optical Switch) Optical switches including PLC-OSW (Mach-Zehnder Interferometer based) and MEMS-OSW for optical network monitoring and switching applications.
• Tunable Optical Filter (TOF) Tunable optical filters with wide tuning range for wavelength selection in DWDM systems, optical performance monitoring, and spectral analysis.
• Optical Channel Monitor (OCM) Device for real-time monitoring of DWDM systems and optical channel detection with high sensitivity and wide wavelength coverage.
• VMUX VOA Multiplexer combining individually-controllable VOAs with AWG for power pre-equalization in DWDM systems, available in 40/48/60 channel configurations.
• Optical Communication TO Transistor Outline (TO) packaged lasers for optical communication applications including GPON, EPON, XGSPON, and 5G front-haul with data rates from 2.5G to 25G.
• CW DFB Series TO Continuous Wave DFB laser TO packages for datacom and silicon photonics applications, with wavelengths from 1260nm to 1700nm and power output up to 100mW.
• OTDR TO Optical Time Domain Reflectometer (OTDR) pulse laser TO packages for fiber testing and network diagnostics at 1310nm, 1550nm, 1625nm, and 1650nm wavelengths.
• LiDAR TO TO-packaged lasers for LiDAR applications including Time-of-Flight (ToF) and Frequency Modulated Continuous Wave (FMCW) systems at 1532nm and 1550nm.
• TDLAS TO Tunable Diode Laser Absorption Spectroscopy (TDLAS) TO packages for gas sensing applications with wavelengths spanning 1260nm to 1700nm.
• Optical Communication Chip DFB and FP laser chips for optical communication including GPON (2.5G 1310nm), XGSPON (10G 1270nm), 5G front-haul (10G/25G), and Ethernet applications.
• High Power Light Source Chip High power DFB laser chips for silicon photonics, lithium niobate modulators, data centers, and 5G fronthaul with CWDM wavelengths (1270-1330nm) up to 200mW output.
• TDLAS Chip Gas sensing laser chips for TDLAS applications covering wavelengths from 1260nm to 1700nm for detection of CH4, CO2, CO, NH3, H2S, and other gases.
• OTDR Chip Pulse DFB laser chips for OTDR applications at 1310nm, 1550nm, 1625nm, and 1650nm wavelengths with output power from 30mW to 300mW.
• LiDAR Chip DFB laser chips for FMCW and ToF LiDAR applications at 1550nm with narrow linewidth (30kHz-100kHz) and high output power for autonomous driving and sensing.
• Tunable Laser Devices Tunable laser devices in TO and butterfly packages with wavelengths from 1250-1700nm for OTDR, interferometric measurement, and fiber-optic sensing applications.
• Tunable Temperature Controller and Drivers Low-noise drivers and temperature controllers for tunable lasers supporting CW/QCW, pulsed, and high-power short-pulse operation modes.
• CWDM LAN4-AWG Chip and Subassemblies LAN4-AWG chips and subassemblies for CWDM/LWDM applications in 40/100/200/400/800Gbps optical transceivers (QSFP28, CFP4 form factors).
• PM Fiber Array Polarization Maintaining (PM) fiber arrays with high channel accuracy and extinction ratio for coherent transceivers and LiDAR applications.
• MFD-FA Mode Field Diameter conversion fiber arrays for coupling small mode spot fibers to conventional single mode fibers, used in silicon photonics and CPO modules.
• MT-MT 12/24-pin MT-MT jumpers for parallel optical technology modules (QSFP+SR4/SR8) connecting optical lenses to external ports.
• Free Space Isolator Free space optical isolators with single or dual stage configurations for laser diode packaging and optical transmitter protection.
• MTP/MPO Fiber Patchcords Multi-fiber push-on (MPO) patchcords in 8/12/16/24/32/48 fiber counts for high-density data center applications.
• MTP/MPO Harness MPO-to-LC harness cables for patching within cabinets for 40G QSFP+ to 10G SFP+ and 400G OSFP/QSFP-DD connections.
• MTP/MPO Pre-Terminated Trunks Factory-terminated MPO trunk cables in 8F-288F configurations for cabinet-to-cabinet and data center interconnect applications.
• Standard Patchcords Single-fiber patch cords with LC/SC/ST/FC/LSH/MU connectors in various polish types (UPC/APC) for optical communication systems.
• Pre-terminated Trunks Pre-terminated indoor multi-fiber trunks for interconnection between transmission equipment and patch panels with 4-144F configurations.
• Parallel Light Assemblies (DR4 DR8) DR4/DR8 optical MPO assemblies for 800G optical modules with FA front-end mounted magnetic isolators for TX and 42° polished waveguide coupling for RX.
• Spiral Armour Cables Spiral armoured optical cables for pigtails, patch cords, and optical connections in equipment rooms and distribution frames.
• Invisible Cables Specialty optical cables designed for fiber access in renovated high-grade residential buildings, villas, and buildings of historical preservation.
• Data Center Cables Optical cables for data center cabling, equipment interconnection, and optical connections in communication equipment rooms.
• Base Station Cables Optical cables for wireless base station horizontal and vertical cabling in 4G/5G network deployments.
• Drop Cables Drop optical cables including Bow-Type, Self-Supporting, Round-Type, and Loose Tube variants for FTTH deployments.
• Indoor Cables Indoor optical cables including Simplex Round, Duplex Round/Flat, Multi-Fiber Distribution, and Multi-Fiber Breakout configurations.
• Planar Lightwave Circuit / AWG IDM Platform IDM full-process technology platform for PLC splitter and AWG wafer chip manufacturing with monthly capacity of over 50,000 six-inch wafer chips.
• Optical Active Lasers IDM Platform IDM full-process platform for active laser chip manufacturing including MOCVD epitaxial growth, photolithography, grating process, wafer processing, and chip packaging.

Quantifiable outcome

• Sample delivery within 14 days with NRE fees waived for bulk orders
• +2 more outcomes

Named customers3 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Scale indicators5 records

Recent moves9 records

Expansion highlights6 records

Direct peers

• Innolight Technology: China-based leading optical transceiver manufacturer using DFB/EML laser chips and AWG components in 100G–800G modules. Direct customer for Shijia's laser chips and AWG subassemblies, also serving hyperscaler and datacenter customers worldwide.
• Accelink Technologies: Wuhan-headquartered Chinese optical chip and module manufacturer producing PLC splitters, AWG, WDM, and active optical devices. Closest direct domestic peer with overlapping PLC/AWG/passive product lines and similar customer base in Chinese telecom operators.
• Eoptolink Technology: Chinese optical transceiver manufacturer producing 10G–400G modules integrating DFB lasers and AWG components. Comparable product/customer overlap with Shijia's laser chip and passive component portfolio for telco/datacom.
• Source Photonics: Global optical transceiver and component company producing DFB lasers and PLC/AWG-based passive devices for telecom and datacenter. Direct competitor across Shijia's active and passive optical product lines.
• O-Net Communications: China-headquartered manufacturer of optical components and modules including PLC splitters, AWG, WDM, and active optical devices. Comparable vertically integrated optical component manufacturer serving similar telecom/datacom customers.
• Hisense Broadband: Chinese optical module maker producing optical transceivers using DFB lasers and passive optical components for telecom and datacenter customers. Direct customer and competitor within the Chinese optical supply chain.

Emerging players

• MACOM Technology Solutions: US-based semiconductor company producing laser drivers, photonic ICs, and components for datacenter, telecom, and industrial sensing. Competes with Shijia's laser and photonic chip business at the component level for high-speed optical links.
• Yuanjie Semiconductor (源杰半导体): China-listed fabless optical semiconductor company specializing in DFB/EML laser chips for telecom and datacom. Closest direct Chinese competitor to Shijia's active laser chip platform with overlapping customer wins.

Broad incumbents

• Lumentum Holdings: Global incumbent in photonic semiconductors and optical components producing DFB/EML lasers, AWGs, and WDM modules for telecom, datacenter, and 3D sensing/LiDAR. Larger, more diversified R&D and customer footprint than Shijia but overlapping product portfolio.
• Coherent Corp (II-VI): Broad-line global photonics incumbent producing laser chips, optical components, and modules for datacom, telecom, and industrial sensing. Competes with Shijia across multiple laser/photonic categories and serves the same hyperscaler/Telco OEM customer base.

Market position

Strengths2 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/13199004/admin/dashboard

Compliance7 records

Revenue estimate

Valuation estimate

Number of profiles

Subsidiaries5 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Henan Shijia Photons Technology