Ings Shinano Co.

Name

Ings Shinano Co.

Legal name

株式会社イングスシナノ

Website

https://ings-s.co.jp

Company type

Private

Founded year

1946

Operating status

Operating

Headcount range

51–100 employees

Ownership category

akta.pro rank

Product category

Electronics Manufacturing Services

NAICS

Semiconductor and Other Electronic Component Manufacturing (3344), Computer and Electronic Product Manufacturing (334), Surgical Appliance and Supplies Manufacturing (339113)

SIC

Electromedical & Electrotherapeutic Apparatus (3845), Industrial Instruments For Measurement, Display, And Control (3823)

akta.pro primary industry

Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey) (HDAHADAJ)

akta.pro secondary industries

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI)

Keywords

• Electronics manufacturing services
• Semiconductor assembly services
• Precision optical assembly
• Display lamination bonding
• Fine device prototyping

Headquarters

HQ city

Suwa

HQ country

Japan

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Technology or R&D, Supply Chain, Infrastructure, Marketing or Sales

Revenue model

1. Electronics Manufacturing Services (EMS) - Semiconductor Mounting: Bare-die IC, LED, MEMS, and sensor mounting and packaging services. Revenue is generated through per-project fees for prototyping and small-batch production, with larger recurring volumes for established programs. Services include wire bonding, flip-chip bonding, die bonding, ACF connection, SMT, and vacuum hermetic sealing.
2. Display Module Assembly and Lamination: Flat panel display (FPD) module assembly, including LCD panel assembly, COG, FOG, COF bonding, and functional film lamination (OCA, OCR, polarized film, cover glass). Handles small prototype runs through to medium-volume production.
3. Precision Mechanical and Optical Assembly: Contract assembly of precision optical instruments (cameras, microscopes, endoscopes, projectors), medical devices, and industrial equipment. Revenue generated per assembly project, including associated kitting, sub-assembly, and final integration.
4. Environmental Testing and Evaluation Services: 恒温恒湿 (temperature and humidity controlled) testing, aging tests, and quality/ reliability evaluation services using large-scale environmental chambers. Billed on a per-use/rental basis.
5. Recycling and Material Reuse Services: Printer ink cartridge plastic/material recycling (マテリアルリサイクル), operating under ISO14001 environmental management. Involves collaboration with major corporate clients on circular economy initiatives.

Go-to-market motion2 records

Distribution channels1 record

Marketing channels6 records

Core offering

Ings Shinano is an electronics manufacturing services (EMS) provider that specializes in fine device assembly for Japanese enterprise customers. Its core offering is contract manufacturing and prototyping of bare-chip IC mounting (wire bonding, flip-chip bonding, ACF connection, COB, SMT, MEMS vacuum hermetic sealing), flat panel display module assembly and lamination (2D/2.5D/3D curved surface), precision optical and mechanical assembly, environmental testing via large constant-temperature/humidity chambers, and material recycling. Services span prototyping (down to 1-unit sample quantities) through small- and medium-batch production.

Product overview

Ings Shinano Co. is an electronics manufacturing services (EMS) provider offering a comprehensive portfolio of services centered on semiconductor mounting/implementation, display lamination, precision assembly, testing/evaluation, and recycling. The core offering spans seven business divisions: Implementation (bare-chip IC mounting via wire bonding, flip chip, COB, SMT, MEMS hermetic sealing), Display & Lamination (flat panel assembly, functional film application, 2D/2.5D/3D lamination), Assembly (optical and precision mechanical integration), Evaluation & Testing (environmental chambers), Recycling (printer cartridge material recovery), Solution Services (IT support), and Self-Development (DUV-LED sterilization devices, Peltier educational kits, specialty illumination). The company operates from prototype through mass production with a one-stop service model.

Differentiator

Problem solved

Functional benefit

Products and services

• Implementation/Mounting Business (実装事業) Contract bare-chip IC mounting services including wire bonding (gold, aluminum, copper), flip-chip bonding (ACF), COB mounting, SMT surface mounting, MEMS packaging with hermetic sealing, and Mini LED implementation, from prototyping through mass production for semiconductor and electronic device manufacturers.
• Display & Lamination Business (ディスプレイ・貼合事業) Flat panel display module assembly and lamination services including LCD panels, touch sensors, cover glass, polarizer films, functional films, 2D flat, 2.5D curved, and 3D spherical lamination up to 47 inches, for smartphone, tablet, automotive dashboard, digital signage, medical, and industrial HMI display manufacturers.
• Assembly Business (アセンブル（組立）事業) Precision assembly services for optical systems (lenses, prisms, mirrors integrated with precision housings and PCBs), electronic devices, medical equipment, and industrial machinery, including optical axis alignment and light path assembly under cleanroom environments with certified optical assembly technicians.
• Evaluation & Testing Business (評価・試験事業) Environmental testing and quality evaluation services using three large constant-temperature/humidity chambers (~5m × 4m × 2.1m interior dimensions) operating 24/7/365, with thermal shock testers and quality/reliability assessment, available on a per-use rental basis for external customers.
• Recycling Business (リサイクル事業) Printer ink cartridge plastic material recycling (material recycling) operating under ISO 14001 environmental management system certification and industrial waste disposal licenses, in collaboration with major corporate clients on circular economy initiatives.
• Solution Services Business (ソリューションサービス事業) IT and operational support services business offering solution support (details not specified in source material beyond being a listed business division); described generally as one of seven business divisions.
• EMS/OEM Contract Manufacturing (EMS/OEM受託製造サービス) End-to-end electronics manufacturing services from prototyping through mass production, including design support, parts procurement, mounting, assembly, quality assurance, and shipping for semiconductor and display products; provides one-stop integrated manufacturing service offering.
• DUV-LED Dental Sterilization Device (DUV-LED歯科用滅菌装置) Self-developed deep UV-LED module product for dental sterilization and medical disinfection applications, leveraging the company's high-density mounting technology. Built under Ings Shinano's self-development business unit.
• Peltier Power Generation Kit - Amphibious Vehicle (ペルチェ発電キット（水陸両用車）) Self-developed educational/promotional kit demonstrating thermoelectric power generation using Peltier elements, configured as an amphibious vehicle, sold via the company's self-development business unit.
• Peltier Power/Cooling Experiment Device (ペルチェ発電/冷却実験器) Self-developed experiment device for thermoelectric power generation and cooling demonstrations, sold via the company's self-development business unit.
• Karin-colored Illumination (かりん色イルミネーション) Self-developed illumination product with a distinctive orange-amber (かりん) color tone, sold via the company's self-development business unit.

Quantifiable outcome

• Supports prototype quantities as low as 1 unit per job
• +4 more outcomes

Named customers1 record

Segments5 records

Ideal customer profiles5 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Three partnerships are on record, tiered core and minor.

• Texas Instruments Japan (日本TI)coreChannel Partner/ Reseller/ Distributor · 28 June 2013Texas Instruments Japan includes Ingss Shinano as a recommended bare-die mounting service provider in TI's bare-die sales collateral. Ingss Shinano is featured as an approved implementation partner for customers purchasing TI bare semiconductor dice. Conversely, Ingss Shinano can refer customers to TI for bare-die procurement, enabling one-stop service.
• Monozukuri Support Center Shimosuwa (のものづくり支援センターしもすわ)minorChannel Partner/ Reseller/ DistributorIngss Shinano co-exhibits at major trade shows (人とくるまのテクノロジー展, ネプコンジャパン, etc.) as part of the のものづくり支援センターしもすわ pavilion. The support center is a regional manufacturing support organization in Shimosuwa that provides a shared exhibition platform for local companies.
• Matsumoto Yamasa FC (松本山雅FC)minorOthersIngss Shinano is an official sponsor (ゴール裏アドボードスポンサー) of J-League football club Matsumoto Yamasa FC. Sponsorship began in the J2 era (pre-2018) and continues through the current J3 period. The company also hosts the Ingss Shinano Presents Mini Soccer Tournament for youth. This is primarily a regional community outreach / CSR sponsorship rather than a commercial business partnership.

Scale indicators7 records

Recent moves12 records

Expansion highlights4 records

Broad incumbents

• Dai Nippon Printing (DNP): DNP operates a large semiconductor photomask and advanced electronics packaging business alongside its core printing operations. It is comparable to Ings Shinano in offering precision electronic-component manufacturing to Japanese semiconductor and display customers, but at significantly larger scale and broader scope.
• TDK Corporation: TDK is a global leader in electronic components and sensor/actuator solutions, with substantial precision manufacturing and semiconductor packaging operations. It is comparable to Ings Shinano in precision sensor/electronics manufacturing, though at much larger scale across multiple product categories.
• Toppan Holdings: Toppan operates a semiconductor packaging business (including photomasks and flip-chip substrates) alongside its broader printing and electronics portfolio. It is comparable to Ings Shinano in providing back-end semiconductor and display-related manufacturing services to Japanese customers at much larger scale.
• Murata Manufacturing: Murata is a dominant Japanese electronic components manufacturer producing MLCCs, sensors, and RF modules, with extensive in-house precision assembly capabilities. It is comparable to Ings Shinano in the precision assembly and sensor/packaging domain, but at dramatically larger global scale and broader product portfolio.
• Shinko Electric Industries: Shinko is a major Japanese semiconductor packaging company producing lead frames, IC substrates, and flip-chip package substrates. It is comparable to Ings Shinano as a domestic back-end semiconductor manufacturing services provider, though operating at vastly greater scale across high-volume programs.

Direct peers

• Mitsui High-Tec: Mitsui High-Tec manufactures precision lead frames and motor core components for semiconductors and automotive electronics. It is comparable to Ings Shinano as a Japanese precision electronic-component manufacturer serving semiconductor and automotive customers, though focused on lead frames rather than mounting services.
• Nippon Mektron: Nippon Mektron is a Japanese manufacturer specializing in flexible printed circuits (FPCs) and COF/COP assembly, with precision bonding capabilities. It is comparable to Ings Shinano in fine-pitch display and semiconductor bonding services and serving similar Japanese display/electronics customers.
• Aoi Electronics: Aoi Electronics is a Japanese OSAT (Outsourced Semiconductor Assembly and Test) provider specializing in semiconductor back-end packaging and assembly. Like Ings Shinano, it serves fabless semiconductor customers with mounting and packaging services, making it a closely aligned direct peer.

Emerging players

• Yokowo Co. Yokowo manufactures precision components including antennas, sensors, and fine-pitch connectors for automotive and medical markets. It is comparable to Ings Shinano as a Japanese specialty precision-electronics manufacturer, though Yokowo is more vertically integrated into end products.
• NDK (Nihon Dempa Kogyo): NDK is a Japanese specialty manufacturer of crystal oscillators, sensors, and frequency control devices, requiring high-precision microelectronics assembly. It is comparable to Ings Shinano as a Japanese precision-electronics manufacturer serving sensor and communications customers with similar skill-set requirements.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/user/#
• Facebookfacebook.com/ings.shinano

Compliance7 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Ings Shinano Co.