OPC

Name

OPC

Legal name

株式会社オーピーシー

Website

https://opc-inc.co.jp

Company type

Private

Founded year

1987

Operating status

Operating

Ownership category

akta.pro rank

Product category

Precision Glass Substrates for Semiconductor and Nanotechnology Manufacturing

NAICS

Glass and Glass Product Manufacturing (3272)

SIC

Glass Products, Made Of Purchased Glass (3231), Optical Instruments & Lenses (3827)

akta.pro primary industry

Glass Fabrication & Processing Services (Cutting/Edging/Drilling/Polishing) (IMADAHAI)

akta.pro secondary industry

Optoelectronics & Photonics (LED/Laser/Optical ICs) (HDAHAAAH)

Keywords

• Precision glass polishing
• Quartz substrate processing
• Semiconductor glass wafers
• MEMS cover glass
• Nanoimprint mold substrates

Headquarters

HQ city

Sagamihara

HQ country

Japan

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Infrastructure, Technology or R&D, Supply Chain, Marketing or Sales

Revenue model

1. Precision Glass Substrate Processing: Custom precision planar grinding and polishing services for quartz, fused silica, and optical glass substrates supplied to semiconductor, MEMS, biochip, optical communication, and nanotechnology manufacturers. Revenue is generated through the sale of processed glass substrates manufactured to customer-specified dimensions, tolerances, and surface quality requirements.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels1 record

Core offering

OPC Corporation provides custom precision planar grinding, polishing, and cleaning services for quartz, fused silica, optical glass, glass ceramics, and other specialty glass materials, manufacturing ultra-precision glass substrates to customer-specified dimensions, tolerances, and surface quality requirements. Finished substrates achieve surface roughness Ra≒0.15nm, thickness variation <0.3μm, and metal contamination below 1×10^10 atoms/cm², with processing capabilities spanning ϕ2" to ϕ400mm in round and square formats. These substrates serve semiconductor fabrication, MEMS, nanoimprint lithography, flat-panel display, optical communication, and bio/chemical-chip manufacturers.

Product overview

OPC (株式会社オーピーシー) is a precision glass substrate manufacturing company and member of the OHARA Group, offering a portfolio of specialized products and services centered on planar polishing technology for quartz and various glass materials used in nanotechnology applications. The core offering consists of precision-polished glass substrates including Si back grinding support wafers, nanoimprint mold substrates, MEMS cover glass substrates, bio/chemical-chip substrates, optical communication substrates, TFT-LCD quartz glass wafers, micro lens arrays, opposing electrode substrates, photomasks, and line monitor substrates. These are complemented by processing dimension services (customizable wafer sizes per SEMI standards), glass shape processing (counterboring, drilling, custom geometries), and glass material supply (synthetic quartz, optical glass, glass-ceramics, non-alkaline glass, and float glass). The company operates twin facilities in Kanagawa and Yamanashi prefectures, providing comprehensive manufacturing from prototyping to volume production.

Differentiator

Problem solved

Functional benefit

Products and services

• Si Back Grinding Support Wafers (Si裏面研削用サポート基板) Borofloat glass support substrates used during silicon wafer back-grinding (BG) processes, offering high thermal expansion compatibility with silicon. Available in diameters from ϕ6" to ϕ12", thicknesses of t0.5 to 0.8mm, and supporting SEMI notch and orientation flat specifications. Targeted at semiconductor wafer fabrication manufacturers.
• Nano Imprint Mold Substrates (ナノインプリント用モールド基板) High-precision mold substrates for nanoimprint lithography, made from quartz glass (high UV transmittance) and non-alkaline glass. Outer diameters from ϕ100mm to ϕ300mm, thicknesses from t0.3 to 1.1mm, thickness tolerance of ±0.005mm, and TTV less than 1μm. Targeted at nanolithography equipment manufacturers and nanofabrication researchers.
• MEMS Cover Glass Substrates (MEMS向カバーガラス基板) Cover glass substrates designed for Micro-Electro-Mechanical Systems (MEMS) applications, providing precision-polished glass components for MEMS device packaging and protection. Targeted at MEMS device manufacturers.
• Bio-chip and Chemical-chip Substrates (バイオチップ・ケミカルチップ基板) Precision glass substrates specifically processed for bio-chip and chemical-chip applications, supporting microfluidic and lab-on-a-chip device manufacturing. Targeted at biotechnology and medical diagnostics developers.
• Optical Communication Parts Substrates (光通信関連部品用基板) Glass substrates engineered for optical communication components, providing the high precision and surface quality required for photonic and fiber optic applications. Targeted at photonics and optical communication component manufacturers.
• High Temperature Poly-Si TFT-LCD Quartz Glass Wafers (高温ポリSi-TFT-LCD用石英ガラスウエハ) Fused silica wafers designed for high-temperature polysilicon TFT-LCD (Thin Film Transistor Liquid Crystal Display) manufacturing processes, leveraging the thermal stability and optical purity of quartz glass. Targeted at flat panel display manufacturers.
• Micro Lens Array Substrates (マイクロレンズアレイ基板) Precision glass substrates for micro lens array fabrication, supporting optical imaging, light guiding, and photonic integrated circuit applications. Targeted at optical component and photonic device manufacturers.
• Opposing Electrode Substrates (対向 electrode 用基板) Glass substrates manufactured for opposing electrode applications in display and semiconductor devices, requiring high flatness and uniformity specifications. Targeted at display and semiconductor device manufacturers.
• LSI Photomask Substrates (LSI用フォトマスク) Precision-polished quartz glass substrates serving as photomask blanks for Large-Scale Integration (LSI) semiconductor device manufacturing. Targeted at semiconductor photomask and LSI manufacturers.
• Line Monitor Substrates (ラインモニター基板) Glass substrates used for line monitoring applications in semiconductor and display manufacturing processes, enabling precision measurement and quality control. Targeted at semiconductor and display fab process engineers.
• Stamper Master Plates Master plate substrates for stamping and replication processes, supporting high-volume manufacturing of micro and nano-scale patterns. Targeted at replication and stamping equipment manufacturers.
• Precision Flat Polishing Services (精密平面研磨加工サービス) Core precision planar polishing technology service for quartz, glass, and other materials, achieving surface roughness of Ra≒0.15nm and thickness variation (TTV) less than 0.3μm. Services include lapping, polishing, inner/outer diameter grinding, and both single and double-sided polishing. Targeted at semiconductor, MEMS, optical, and nanotechnology manufacturers requiring custom precision glass substrates.
• Custom Processing Dimension Services (加工寸法サービス) Customizable processing dimensions including wafer types (ϕ2" to ϕ12" × t0.5–1.2mm per SEMI standards), round substrates up to ϕ400mm × t40mm, and square substrates up to □400mm × t40mm. Options include notch marks, orientation flats, and special shapes. Targeted at manufacturers requiring non-standard substrate dimensions.
• Glass Shape Processing Services (ガラス形状加工) Specialized glass shaping services including counterboring, drilling, high concentricity and roundness processing (≤10μm achievable), and custom irregular or special edge shapes. Targeted at manufacturers requiring customized glass substrate geometries.
• Glass Material Supply (ガラス素材供給) Supply and processing of various glass materials including synthetic quartz, glass-ceramics, ultra-low expansion glass-ceramics, low expansion glass, optical glass, special glass, non-alkaline glass, and float glass (white and blue plate). Targeted at manufacturers requiring specialty glass material processing.

Segments2 records

Ideal customer profiles2 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

One partnership is on record.

• OHARA INC. (株式会社オハラ)coreStrategic or Co-development PartnerOPC is a wholly-owned subsidiary of OHARA INC., a major optical glass manufacturer founded in 1935. OHARA develops and supplies advanced optical and electronic materials including optical glass, fused silica, and glass ceramics, which OPC uses as raw materials for its precision grinding and polishing services. OHARA Group provides OPC with access to proprietary glass materials and deep domain expertise in optical and electronic materials.

Scale indicators2 records

Recent moves4 records

Expansion highlights3 records

Broad incumbents

• Corning Incorporated: Global specialty glass leader with significant semiconductor and display glass substrate businesses. Competes with OPC in advanced glass substrates for semiconductor and photonics applications, though at a much larger scale.
• Schott AG: German specialty glass and glass-ceramics manufacturer with extensive semiconductor and optics portfolios. Comparable to OPC in specialty glass material expertise and semiconductor-grade processing capabilities.
• OHARA Inc. Parent company of OPC and a major optical glass manufacturer founded in 1935. While the parent, OHARA is also a peer in the broader specialty glass market, supplying optical glass, fused silica, and glass ceramics that OPC processes.
• Coherent Corp. Global photonics and materials company (formerly II-VI) with precision optics and engineered materials for semiconductor and communications applications. Competes with OPC in optical communication and photonic component substrates.
• AGC Inc. One of the world's largest glass manufacturers with a precision glass division serving electronics and semiconductor end markets. A much larger incumbent with broader product portfolio that competes with OPC across multiple glass substrate applications.

Direct peers

• Nippon Electric Glass (NEG): Major Japanese electronic glass manufacturer producing glass substrates for displays, semiconductors, and electronics. Overlaps with OPC in flat glass substrate processing for TFT-LCD and semiconductor applications.
• Maruwa Co., Ltd. Japanese manufacturer specializing in ceramic and glass substrates for electronics and semiconductor applications. Overlaps with OPC in precision substrate fabrication for semiconductor and electronics end markets.
• Sumita Optical Glass: Japanese specialty optical glass manufacturer with capabilities in precision glass materials. Comparable to OPC in serving precision glass applications, though with more focus on optical materials than substrate processing.
• HOYA Corporation: Japanese specialty glass and optical components manufacturer with precision glass substrates for semiconductor and electronics applications. Directly competes with OPC in high-precision quartz and specialty glass finishing for semiconductor and optical markets.

Emerging players

• CDGM Glass Co., Ltd. Chinese specialty glass manufacturer with growing capabilities in optical and electronic glass substrates. Emerging competitor in the precision glass substrate market that could pressure OPC's pricing in Asia-Pacific.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat4 records

Key risks5 records

Key highlights6 records

Customer concentration

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about OPC