What 3D InCites does

3D InCites is a niche B2B media and community platform covering 3D IC technology and heterogeneous integration in the semiconductor packaging industry. Founded in 2013 and headquartered in Phoenix, AZ, the platform aggregates and distributes technical articles, industry news, press releases, white papers, podcasts, and conference coverage across topic verticals including design, devices, manufacturing, materials, processes, and test/inspection. The platform also operates a knowledge portal explaining foundational 3D integration concepts (TSVs, 2.5D interposers, heterogeneous integration) and serves as a content hub for the microelectronics packaging community.

The business operates a community-led go-to-market model. Revenue is generated through five streams: corporate memberships (three tiers, pricing undisclosed), individual professional memberships (approximately $95 per year), free student memberships, display advertising from member companies and technology providers, and content sponsorship (sponsored white papers, technical articles, and event coverage). Distribution is anchored by the IMAPS (International Microelectronics Assembly and Packaging Society) ecosystem, and in early 2026 IMAPS formally assumed stewardship of the platform, rebranding it as the IMAPS 3D InCites Content Platform.

The company serves two primary customer segments: semiconductor packaging engineers (individual professionals seeking technical content and peer networking) and equipment/materials suppliers (enterprises seeking brand visibility, thought leadership, and lead generation in the advanced packaging market). Secondary segments include academic researchers/students and semiconductor industry executives. With 8 employees and a global editorial footprint covering international conferences, the platform's scale is intentionally small, operating as a focused community property rather than a broad-based media business.

Name

3D InCites

Website

https://3dincites.com

Company type

Private

Founded year

2012

Operating status

Operating

Headcount range

1–10 employees

Short description

3D InCites is a B2B media and community platform covering 3D IC technology and heterogeneous integration in semiconductor packaging, now operating as the IMAPS Content Platform and serving engineers, equipment/materials suppliers, and researchers through articles, podcasts, white papers, and conference coverage.

Ownership category

akta.pro rank

GTM type

B2B

Offering type

Digital Commerce or Content

Cost components

Personnel, Operations, Technology or R&D, Marketing or Sales, Others

Revenue model

1. Corporate Membership: IMAPS corporate membership with three levels providing industry networking, brand promotion, and education benefits for organizations involved in semiconductor advanced packaging and microelectronics.
2. Individual Membership: Annual individual membership for microelectronics and packaging professionals providing access to technical resources and industry connections, typically priced at $95 per year for standard membership.
3. Student Membership: Free IMAPS Student Membership providing engineering students tools and resources for career development in semiconductor packaging.
4. Advertising: The platform displays advertisements and sponsored content from member companies and technology providers in the semiconductor ecosystem.
5. Content Sponsorship: Companies sponsor white papers, technical articles, and event coverage content on the platform.

Pricing tiers

Go-to-market motion1 record

Distribution channels2 records

Marketing channels5 records

Core offering

3D InCites operates as the official IMAPS Content Platform, aggregating and distributing technical content focused on 3D IC technology and heterogeneous integration in the semiconductor packaging industry. It delivers industry news, technical articles, white papers, podcasts, and event coverage, organized across topic areas including design, manufacturing, materials, processes, and test/inspection. The platform monetizes through IMAPS corporate and individual memberships, advertising, and content sponsorships.

Product overview

3D InCites is an IMAPS Content Platform that serves as a comprehensive media and community hub covering 3D IC technology and heterogeneous integration in the semiconductor industry. The platform operates as a content aggregation and distribution system rather than a traditional software product. It provides multiple content streams including 3D In-Depth technical articles, 3D InCites Podcasts (audio content), Community News/Press Releases (industry updates), White Papers (technical resources), and 3D Event Coverage (conference reporting). The platform also offers a Knowledge Portal with educational content on 3D integration technologies. Content is organized across topic categories including Design, Applications, Devices, Manufacturing, Materials, Processes and Technology, and Test and Inspection. The platform is powered by IMAPS (International Microelectronics Assembly and Packaging Society) and offers membership programs including Corporate, Individual, Student, and Academic tiers for the semiconductor packaging community.

Differentiator

Problem solved

Functional benefit

Products and services

• IMAPS Corporate Membership Corporate membership program offering industry networking, brand/product promotion, and education for organizations involved in semiconductor advanced packaging and microelectronics. Available in three tier levels with benefits including member pricing on events, brand visibility through the content platform, and access to the IMAPS professional network.
• IMAPS Individual Membership Annual professional membership providing microelectronics and packaging professionals with access to technical resources, industry connections, and exclusive member benefits. Standard membership is priced at approximately $95 per year with annual billing cadence.
• IMAPS Student Membership Free membership for engineering students providing tools, resources, and content access to support career development and expertise building in semiconductor packaging and microelectronics.
• Advertising Placements Display advertising placements on the 3D InCites website targeted at the semiconductor packaging professional audience, including banner ad placements (such as 970x90 top banners and 300x250 side banners) sold to member companies and technology providers in the semiconductor ecosystem.
• Content Sponsorship Sponsorship packages enabling companies to sponsor white papers, technical articles, and event coverage content on the 3D InCites platform, providing thought leadership visibility and lead generation within the advanced packaging community.

Named customers7 records

Segments4 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Partnerships

One partnership is on record.

• IMAPScoreStrategic or Co-development Partner · 1 January 2026In early 2026, IMAPS (International Microelectronics Assembly and Packaging Society) took over the stewardship of 3D InCites. The platform became the official IMAPS Content Platform, combining 3D InCites' focus on 3D IC and heterogeneous integration with IMAPS' broader microelectronics packaging community and resources.

Scale indicators1 record

Recent moves5 records

Expansion highlights4 records

Direct peers

• EE Times: EE Times is a long-running electronics engineering trade publication covering semiconductors, packaging, and electronics with industry news and technical articles. It is directly comparable to 3D InCites as a B2B media outlet serving electronics engineers, though it covers a much broader scope across the entire electronics industry.
• Semiconductor Engineering: Semiconductor Engineering is a B2B trade publication covering semiconductor manufacturing, design, and packaging topics with technical articles and analysis. It is directly comparable to 3D InCites as a B2B media outlet serving semiconductor professionals, though with broader coverage across the full semiconductor value chain.
• Semiconductor Digest: Semiconductor Digest is a B2B publication covering semiconductor manufacturing, packaging, and test. It is directly comparable to 3D InCites as a niche trade publication serving semiconductor packaging professionals, with overlapping coverage of advanced packaging, test, and manufacturing topics.
• IEEE Spectrum: IEEE Spectrum is IEEE's flagship engineering and technology publication covering a broad range of engineering topics including semiconductors. It is comparable to 3D InCites as a professional society-backed B2B media outlet serving engineers, though with much broader engineering coverage beyond semiconductor packaging.
• Compound Semiconductor Magazine: Compound Semiconductor Magazine covers compound semiconductor industry news and technology including SiC, GaN, and III-V materials. It is comparable to 3D InCites as a niche B2B publication serving semiconductor professionals, with similar business model of advertising, events, and specialized content for a specific semiconductor segment.

Broad incumbents

• SEMI: SEMI is the global semiconductor manufacturing industry association providing events, content, standards, and community for the semiconductor supply chain. It is comparable to IMAPS/3D InCites as a broader industry organization offering content and community, though SEMI operates across the full semiconductor manufacturing ecosystem rather than focusing specifically on packaging.

Others

• TechInsights: TechInsights provides reverse engineering, teardowns, and technical analysis of semiconductors and electronic systems. It is adjacent to 3D InCites as a B2B information provider serving the semiconductor industry, though it operates in technical analysis rather than media/content publishing.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat4 records

Key risks5 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/incites-group-llc

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about 3D InCites