Onto Innovation

What Onto Innovation does

Onto Innovation is a publicly traded semiconductor process control company (NYSE: ONTO) formed in 2019 through the merger of Rudolph Technologies and Nanometrics, headquartered in Wilmington, Massachusetts. The company designs, manufactures, and services inspection, metrology, lithography, and process control software for semiconductor manufacturers across the entire chip value chain, from bare silicon wafer through final back-end packaging. Its product portfolio spans defect inspection systems (Dragonfly G5, Firefly G3), optical critical dimension and thin film metrology (Atlas V, Atlas III+, Iris S, Iris G2, Aspect System, IMPULSE V), advanced packaging lithography steppers (JetStep S3500 and X500), specialty device electrical metrology (FAaST, CnCV), and a connected software suite (Ai Diffract, OCD Solutions, StepFAST) that uses AI-driven analytics to bridge standalone tools into integrated metrology solutions. The company serves leading-edge logic foundries, HBM memory makers, OSATs, and specialty semiconductor manufacturers, with named customers including TSMC, a leading HBM manufacturer with a $240M+ volume purchase agreement through 2027, ASE Technology, SK hynix, Samsung, and Micron.

The company generates revenue primarily from sales of capital equipment systems configured and quoted on a custom basis for each customer deployment, with a complementary stream from software licensing. Revenue is heavily AI compute-driven, with more than 60% tied to AI compute and advanced packaging revenue growing more than 30% in 2026. FY2025 revenue was $1.005 billion, with Q1 2026 revenue of $292 million and management guidance for FY2026 above $1.3 billion, implying greater than 30% YoY growth. Onto distributes exclusively through direct enterprise field sales with technical applications engineers stationed at customer sites across more than 15 regions, with Taiwan and South Korea together representing approximately 60% of revenue. Recent strategic actions include a $710M acquisition of a 27% stake in Rigaku Holdings (April 2026) to build a hybrid optical + X-ray platform, a $1.3B convertible senior notes offering (May 2026), the acquisition of Semilab International's Materials Analysis Business (June 2025), and multiple product launches including Dragonfly G5, 4Di InSpec SR, and IMPULSE V.

Name

Onto Innovation

Legal name

Onto Innovation Inc.

Website

https://ontoinnovation.com

Company type

Public

Founded year

2019

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

Onto Innovation is a publicly traded semiconductor process control company that designs and sells inspection, metrology, and lithography equipment plus AI-driven analytics software to leading-edge logic foundries, HBM memory makers, OSATs, and specialty semiconductor manufacturers across more than 15 global regions.

Ownership category

akta.pro rank

Product category

Semiconductor Process Control Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600), Optical Instruments & Lenses (3827)

akta.pro primary industry

Metrology, Inspection & Process Control Equipment (HDAHAEAH)

Keywords

• Semiconductor process control
• Defect inspection equipment
• Optical metrology systems
• Advanced packaging lithography
• CMP process control

Headquarters

HQ city

Wilmington

HQ country

United States

HQ region

North America

Offices24 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales

Revenue model

1. Semiconductor Capital Equipment Sales: Onto Innovation generates revenue primarily from selling inspection, metrology, and lithography equipment to semiconductor manufacturers. Revenue is driven by unit sales of capital equipment systems, with Q1 2026 revenue of $292 million and full-year 2025 revenue of $1.005 billion. Over 60% of revenue is AI compute-related, with advanced packaging revenue growing more than 30% in 2026. The company also generates software revenue through Ai Diffract and OCD Solutions software licensing integrated with its hardware platforms.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels6 records

Core offering

Onto Innovation designs, manufactures, and sells semiconductor process control equipment — including 2D/3D inspection systems (Dragonfly G5, Firefly G3), OCD and thin film metrology tools (Atlas V, Atlas III+, Iris S/G2, Aspect), lithography steppers for advanced packaging (JetStep S3500, X500), CMP process control systems (IMPULSE V), and AI-driven analytics software (Ai Diffract, OCD Solutions, StepFAST) — to semiconductor manufacturers, foundries, memory makers, and OSATs globally.

Product overview

Onto Innovation provides comprehensive process solutions across the semiconductor value chain through a platform-plus-modules architecture. Their portfolio spans four core product categories: Inspection systems (Dragonfly G5, Firefly G3) for defect detection; Metrology tools (Atlas V, Atlas III+, Iris S, Iris G2, Aspect System) for OCD and thin film measurement; Lithography systems (JetStep S3500, JetStep X500) for advanced packaging; and Process Control Software (StepFAST, OCD Solutions, IMPULSE platforms) with AI-driven analytics. The IMPULSE V+ systems integrate advanced wavefront technology with AI analytics for CMP optimization. The subsidiary 4D Technology offers the 4Di InSpec SR for shop-floor surface metrology. PACE (Packaging Applications Center of Excellence) provides collaborative R&D facilities. Additionally, the SDI division offers electrical metrology products (FAaST, CnCV) for specialty semiconductor applications.

Differentiator

Problem solved

Functional benefit

Brands

• PACE (Packaging Applications Center of Excellence): A collaborative space located at Onto Innovation Headquarters in Wilmington, Massachusetts, combining the power of Onto Innovation technologies with a network of collaboration partners to accelerate advanced packaging R&D. Equipped with next generation panel level photolithography, inspection, and metrology tools including the latest software capabilities.

Products and services

• Dragonfly G5 Inspection System Latest generation pattern inspection system delivering sub-micron defect detection and high-resolution 3D measurements for leading-edge advanced packaging technologies including 2.5D and HBM applications. Qualified at TSMC for 2.5D advanced AI chip packaging.
• Firefly G3 Automated inspection and 3D metrology system for advanced IC substrates and panel level packaging, delivering high resolution and productivity for HPC, AI, cloud computing and machine/deep learning applications.
• Atlas V OCD and Thin Film Metrology System OCD and thin film metrology tool for high-volume manufacturing enabling FinFET and Gate-All-Around (GAA) logic, DRAM, and 3D NAND device process control.
• Atlas III+ Dependable OCD and thin film metrology system for established technologies with flexible performance across a wide range of process layers and device types.
• IMPULSE V System Advanced CMP processing system with enhanced wavefront technology and AI-driven analytics, delivering over 2X precision improvement and faster solutions for next-gen semiconductor manufacturing.
• IMPULSE+ Film measurement system designed for fidelity and productivity in the CMP process module, available as integrated or standalone platform with high sensitivity and accuracy.
• Iris S Versatile platform solution for advanced packaging and specialty market supporting 150mm, 200mm and 300mm wafers, providing thin and thick film, OCD and wafer bow measurements.
• Iris G2 Advanced optical metrology tool for both common and critical thin films for advanced node, mature and specialty devices, enabling increased transistor speed and reduced power consumption.
• JetStep S3500 High-volume manufacturing advanced packaging lithography solution for OSATs supporting fan-out panel level packaging on substrates up to 720mm x 600mm.
• JetStep X500 Lithography system for advanced IC substrates incorporating large field exposure area with large depth of focus and proprietary software for independent zone offset adjustments.
• Aspect System In-line, non-destructive infrared optical critical dimension system measuring Z-dimension profiling of high aspect ratio structures for critical process control.
• Aspect S System Advanced model-based infrared reflectometry metrology system for in-line monitoring of 3D structures used in V-NAND, CIS and power devices, as well as carbon hardmasks and dielectric compositions.
• FAaST CV/IV System Versatile, non-contact electrical metrology system for process control and development of semiconductor materials and devices, providing broad range of parameters characterizing wafers, dielectrics and interfaces.

Quantifiable outcome

• IMPULSE V delivers over 2X precision improvement in CMP process control
• +4 more outcomes

Named customers6 records

Segments4 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability7 records

Feature9 records

Partnerships

Seven partnerships are on record, tiered core.

• Rigaku Holdings CorporationcoreStrategic or Co-development Partner · 20 April 2026Onto Innovation entered a definitive agreement to acquire a 27% equity stake in Rigaku Holdings Corporation from Atom Investment, L.P. (an affiliate of The Carlyle Group) for approximately $710 million. The partnership combines Rigaku's X-ray CD-SAXS platforms with Onto Innovation's Ai Diffract analysis software to develop hybrid metrology solutions for advanced semiconductor manufacturing. Two key customers have already been selected for the combined offering. The deal is expected to close in H2 2026 subject to regulatory approvals, with external analysts estimating the market opportunity could exceed $1 billion within five years. Rigaku targets at least $300 million in incremental market opportunity by 2030.
• LPKF Laser & ElectronicscoreStrategic or Co-development Partner · 30 September 2024LPKF Laser & Electronics is a collaboration partner in Onto Innovation's Packaging Applications Center of Excellence (PACE), contributing panel-level packaging ecosystem expertise to accelerate PLP technology development for organic and glass substrates.
• EvateccoreStrategic or Co-development Partner · 30 September 2024Evatec is a collaboration partner in Onto Innovation's Packaging Applications Center of Excellence (PACE), contributing thin film deposition and equipment expertise for panel-level packaging development.
• MKS-AtotechcoreStrategic or Co-development Partner · 30 September 2024MKS-Atotech is a collaboration partner in Onto Innovation's PACE facility, providing surface treatment and deposition equipment expertise for advanced packaging applications.
• Lam ResearchcoreStrategic or Co-development Partner · 30 September 2024Lam Research is a collaboration partner in Onto Innovation's PACE facility, contributing deposition and etch process expertise for panel-level packaging technology development.
• ResonaccoreStrategic or Co-development Partner · 30 September 2024Resonac is a collaboration partner in Onto Innovation's PACE facility, contributing materials expertise for advanced packaging development.
• CorningcoreStrategic or Co-development Partner · 30 September 2024Corning is a collaboration partner in Onto Innovation's PACE facility, contributing glass substrate materials expertise for emerging glass core substrate packaging technologies targeted at AI and HPC applications.

Scale indicators14 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• Camtek Ltd. Camtek provides automated optical inspection and metrology for advanced packaging, HBM and 2.5D/3D applications - directly overlapping Onto's Dragonfly G5 and Firefly G3 business at OSATs and foundries.
• KLA Corporation: KLA is the dominant incumbent in semiconductor process control, offering inspection, metrology and software across the same advanced-node and advanced-packaging customers that Onto Innovation serves. It competes head-to-head with Onto's Dragonfly, Atlas and Ai Diffract platforms in front-end and back-end fabs.
• Nova Measuring Instruments: Nova is a pure-play semiconductor metrology company providing OCD and thin-film metrology for advanced logic and memory customers, directly overlapping with Onto's Atlas V and Iris product families at the same leading-edge fabs.
• Lasertec Corporation: Lasertec specializes in mask blank and EUV/photomask inspection equipment for advanced semiconductor manufacturing, addressing the same advanced-node process-control market that underpins Onto Innovation's OCD/inspection portfolio.
• SCREEN Holdings: SCREEN provides semiconductor cleaning, coating and surface-preparation equipment alongside inspection solutions for memory and foundry customers, competing with portions of Onto's process-control portfolio.
• Hitachi High-Tech: Hitachi High-Tech provides CD metrology, defect inspection and SEM/TEM review tools used by the same leading foundries, memory and OSAT customers as Onto Innovation, making it a directly comparable process-control peer.
• Carl Zeiss SMT: Carl Zeiss SMT supplies optical subsystems and mask inspection equipment for semiconductor lithography and process control, addressing adjacent process-control use cases to Onto's optical and X-ray metrology platforms.

Broad incumbents

• ASML Holding: ASML is the dominant lithography equipment maker whose stepper/scanner ecosystem complements Onto's JetStep lithography and broader process-control portfolio at the same leading-edge customers. It is a much larger incumbent rather than a direct metrology competitor.
• Applied Materials: Applied Materials offers a broad semiconductor manufacturing equipment portfolio including inspection and process control offerings that overlap with Onto's metrology and inspection at advanced-node customers. It is a broader incumbent, not focused on Onto's niche.

Emerging players

• Veeco Instruments: Veeco makes precision surface-processing and inspection/metrology equipment for advanced semiconductor packaging and compound semiconductor applications, with meaningful but partial overlap to Onto's advanced packaging and specialty devices segments.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/onto-innovation
• Facebookfacebook.com/ontoinnovation

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles7 records

Subsidiaries1 record

Funding overview

Funding rounds1 record

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A4 records

Investments2 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Onto Innovation