What Indubond Technologies S.L. does

Indubond Technologies S.L., operating under the legal entity Chemplate Materials SL, is a Barcelona-based manufacturer of specialized industrial equipment for the multilayer printed circuit board (PCB) industry. The company's core offering is the patented InduBond® induction bonding technology platform, which uses electromagnetic energy to heat stainless steel separator plates within PCB lamination stacks, enabling layer registration and bonding without the thermal delays inherent in conventional conductive heating. The product line spans eight machine families — the 130N and 230N joining machines (the latter achieving sub-10-micron template registration accuracy), the RFX for rigid-flex circuits, the PLR with artificial-vision-based layer alignment, the X-Press 100 and X-Press 360 lamination presses (the latter operating at up to 75 kg/cm² and 450°C), the X1 standalone workstation, and the CD automated storage system — collectively addressing registration precision, thermal uniformity, and stack thickness up to 10 mm across rigid, rigid-flex, and high-layer-count (12-70 layer) PCB applications.

The company monetizes almost exclusively through capital-equipment sales (hardware) of these InduBond-branded machines, supplemented by chemical products for the galvanotechnics and electronics sectors carried by the parent Chemplate entity. Pricing is not publicly disclosed and appears to be negotiated on an order-by-order basis. Go-to-market is indirect: Indubond operates a global distributor model with four appointed channel partners covering the United States (Insulectro), China and Taiwan (World Wide Group), South Korea (Global Business Corporation), and Japan (Shoda Techtron), supported by participation in major PCB industry trade shows including IPC APEX, Productronica, HKPCA, and KPCA Show. The customer base is narrowly defined as PCB manufacturers, with no disclosed named end-customers, no public revenue figures, and the headcount of approximately 16 employees suggesting a focused specialist operation rather than a diversified industrial supplier.

Name

Indubond Technologies S.L.

Legal name

Chemplate Materials SL

Website

https://indubond.com

Company type

Private

Operating status

Operating

Headcount range

11–50 employees

Short description

Indubond Technologies (Chemplate Materials SL) manufactures patented InduBond® induction bonding machinery for multilayer PCB production, serving PCB manufacturers globally through distributors in the USA, China/Taiwan, South Korea, and Japan.

Ownership category

akta.pro rank

Product category

PCB Manufacturing Equipment

NAICS

Electrical Equipment Manufacturing (3353), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

Keywords

• PCB manufacturing equipment
• Induction bonding technology
• Multilayer lamination
• PCB layer registration
• Rigid-flex circuits

Headquarters

HQ city

Santa Perpètua de Mogoda

HQ country

Spain

HQ region

Europe

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Technology or R&D, Personnel, Marketing or Sales, Operations

Revenue model

1. Manufacturing and Sale of Induction Bonding Machinery: Chemplate Materials SL manufactures and sells Indubond® branded induction bonding machines and lamination equipment for the PCB manufacturing industry. The company has achieved significant growth driven by product quality and the expansion of the national market for printed circuit production.
2. Sale of Chemical Products: Chemplate Materials SL also sells chemical products for the galvanotechnics and electronics sectors.

Go-to-market motion1 record

Distribution channels4 records

Marketing channels3 records

Core offering

Indubond Technologies S.L. (Chemplate Materials SL) designs, manufactures, and sells industrial induction bonding machinery used by printed circuit board (PCB) manufacturers for the registration and lamination of multilayer circuits. The product line comprises induction bonding machines (130N, 230N, RFX, X1), vision-based registration systems (PLR), lamination presses (X-Press 100, X-Press 360), and an automated storage system (CD), all built on the patented InduBond® induction heating platform. The company also sells chemical products for the galvanotechnics and electronics sectors.

Product overview

Indubond Technologies S.L. (Chemplate Materials SL) offers a portfolio of industrial induction bonding machines and equipment specifically designed for multilayer PCB (printed circuit board) manufacturing. The core InduBond® technology uses patented induction heating to weld and register multilayer circuits with precision under 10 microns. The product line includes: the 130N and 230N as primary bonding machines for layer registration and joining; the RFX with mobile heads for Rigid-Flex circuits; the PLR with artificial vision for optical alignment; the X-Press 100 and X-Press 360 for lamination using induction heating without thermal conduction; the CD for automated storage and organization of cores and prepregs; and the X1 standalone workstation. All products share the InduBond® induction technology platform, enabling precision registration and bonding of multilayer circuits across various PCB types.

Differentiator

Problem solved

Functional benefit

Products and services

• Indubond 130N Induction bonding machine used in the pre-pressing step to weld internal and prepreg layers that form a multilayer printed circuit. Can be configured with up to 6 welding heads for panels larger than 24 inches. Designed for PCB manufacturers producing multilayer circuits.
• Indubond RFX Induction bonding equipment with mobile heads that allow fast welding at interior points of the circuit. Specifically developed for Rigid-Flex multilayer PCB manufacturing. Used by PCB fabricators handling rigid-flex circuits.
• Indubond PLR Equipment for registration and bonding of multilayer printed circuits using a mechatronic system based on artificial vision. Cameras measure the shape of each layer and the alignment of upper and lower images to compensate for distortions from prior processes. Targeted at PCB manufacturers requiring precise optical alignment.
• Indubond X-Press 100 Press machine that produces heat directly in the laminated material in each layer of the stack simultaneously with uniform temperature, without thermal conduction. Designed for PCB manufacturers seeking induction-based lamination.
• Indubond X-Press 360 Revolutionary PCB lamination system using induction heating technology to deliver precise energy to cure resins with no thermal delays in X, Y, and Z directions. Features modular concept, compact design, hydraulic pressure up to 75 kg/Cm2 (1066 PSI), vacuum capability, and temperatures up to 450°C. Designed for PCB manufacturers requiring high-precision multilayer lamination.
• Indubond CD Compact intelligent and fast automatic storage system that organizes inner layer cores and prepregs during the construction process before lamination. Reduces floor space and handling with intuitive software for programming multiple stacks for different jobs. Targeted at PCB manufacturers seeking pre-lamination automation.
• Indubond X1 Standalone station with a solid low-friction table for moving the registration tool plate with one next-generation InduBond V3 head with PTF film protection and high-pressure system up to 300 PSI. Includes latest-generation V3.1 controller and laser pointer for bond location centering. For PCB manufacturers requiring a dedicated registration workstation.
• Indubond 230N Next-generation inductive joining machine for layer-to-layer pin registration and joining of internal and pre-impregnated layers of multilayer PCBs. Configurable with 4 (optional 6) InduBond heads, supports tool plates with 2–3 round pins, multiple round pins, 3–4 slot pins, or combinations. Template registration accuracy under 10 microns. Handles bonding stacks up to 10 mm thickness. Designed for PCB manufacturers producing high-layer-count and high-precision multilayer circuits.
• Chemical products for galvanotechnics and electronics Chemical products sold by Chemplate Materials SL for the galvanotechnics and electronics sectors, complementing the company's machinery portfolio.

Quantifiable outcome

• Registration accuracy <10 microns with template tooling
• +1 more outcomes

Segments1 record

Ideal customer profiles1 record

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

Five partnerships are on record, tiered core and minor.

• Insulectro Inc.coreChannel Partner/ Reseller/ DistributorAppointed Indubond distributor for the United States market. Located at 20362 Windrow Dr., Lake Forest, CA 92630, USA. Tel: +1 (949) 5873200.
• World Wide GroupcoreChannel Partner/ Reseller/ DistributorAppointed Indubond distributor for China and Taiwan markets. Located at World Wide Group Centre, 24 On Chuen Street, On Lok Tsuen, Fanling, N.T., Hong Kong. Contact via email. Tel: (852) 2415 6686.
• Global Business CorporationcoreChannel Partner/ Reseller/ DistributorAppointed Indubond distributor for South Korea. Located at 301 Dong 401 Ho, SeokCheonRo 397, OJeongGu, GyeongGiDo 421-742 BUCHEONSI. Tel: 82-32-624-1555.
• Shoda Techtron Corp.coreChannel Partner/ Reseller/ DistributorAppointed Indubond distributor for Japan. Located at 1-1 5-Chome Sakuradai, Nishi-ku, Hamamatsu 431-1104, Japan.
• CDTIminorStrategic or Co-development PartnerChemplate Materials SL collaborated with CDTI (Centro para el Desarrollo Tecnológico Industrial, a Spanish public entity) to develop its first productive machines for the induction layer joining process.

Scale indicators1 record

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• TRUMPF: Global industrial leader in laser technology, machine tools, and induction heating systems. While not a pure-play PCB equipment maker, TRUMPF's induction heating portfolio competes for the same electromagnetic heating applications Indubond exploits and has the scale to enter PCB lamination.
• Inductotherm Group: Largest global manufacturer of induction heating and melting equipment for industrial applications. Highly comparable on induction heating core technology; a broad incumbent that could repurpose its induction expertise for PCB lamination.

Direct peers

• Schmid Group: German supplier of equipment for PCB and semiconductor wet-processing, handling, and lamination. Overlaps with Indubond in serving PCB manufacturers with capital equipment, including bonding-adjacent process tooling.
• Lauffer GmbH & Co. KG: German manufacturer of hydraulic PCB lamination presses and multilayer bonding systems. A direct competitor in the PCB lamination press category, addressing the same registration and lamination workflow that Indubond targets with induction-based technology.
• Plitec S.r.l. Italian manufacturer of PCB manufacturing equipment including photoplotters, laminators, and process machinery. A direct peer in the niche PCB equipment vendor category, addressing multilayer PCB production lines similar to those Indubond serves.
• CEA S.p.A. Italian manufacturer of laminators, presses, and exposure systems for PCB manufacturing. Directly comparable to Indubond as a specialized supplier of PCB lamination and bonding equipment serving similar fabricator customers.
• Bungard Elektronik GmbH: German maker of PCB prototyping and small-series production equipment. Directly comparable as a smaller, specialized PCB equipment manufacturer targeting multilayer fabrication workflows overlapping with Indubond's customer base.
• ATG Luther & Maelzer: Supplier of electrical testing equipment for PCBs, now part of Mycronic. Adjacent peer serving the same PCB fabricator customer base with complementary process equipment; comparable as a niche, specialized PCB capital equipment vendor.

Market position

Strengths4 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/indubond

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Indubond Technologies S.L.