Fraunhofer IZM

What Fraunhofer IZM does

Fraunhofer IZM (Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration) is a German non-profit applied research institute specializing in electronic packaging, microintegration, and reliability engineering. It was founded in 1993 and is operationally headquartered in Berlin (Gustav-Meyer-Allee 25), with branch sites at Dresden-Moritzburg (Fraunhofer IZM-ASSID, focused on all-silicon system integration) and Cottbus (high-frequency sensors and high-speed systems). The institute is a constituent entity of Fraunhofer-Gesellschaft, a publicly funded research organization, and operates four research departments: Wafer Level System Integration, System Integration & Interconnection Technologies, Environmental & Reliability Engineering, and RF & Smart Sensor Systems. With approximately 316 employees, Fraunhofer IZM develops miniaturization technologies, heterogeneous and chiplet-based integration schemes, wafer-level packaging, FEM-based reliability simulation, ultra-low-power RF and energy-harvesting modules, electronic textiles, and photonic integration.

The institute's core technology platform covers heterogeneous integration including High-End Performance Packaging (HPP), wafer-level system integration, broadband scalable IoT platforms (ZEPOWEL) with up to 5x energy savings, ultra-low-power wake-up receivers claimed to be 1000x more efficient than standard radio solutions, broadband energy harvesters with quadrupled efficiency, FEM-based thermo-mechanical reliability assessment, and vibration testing capabilities spanning -50 °C to +150 °C. Service offerings range from technology consulting and feasibility studies through process and product development, prototyping, testing and qualification, laboratory collaborations, training workshops, and pilot line operation. Notable proprietary assets include the Textile-Bond-Technology developed by the System-on-Flex working group and the institute's integral role in the APECS chiplet pilot line and Forschungsfabrik Mikroelektronik Deutschland (FMD) consortium.

Fraunhofer IZM generates revenue through a multi-stream model: publicly funded core appropriations via Fraunhofer-Gesellschaft (federal and state government sources), contract R&D with industrial partners billed once project scope is defined (customer retains ownership of developed products, prototypes, and usage rights to inventions), European research project funding, fee-based testing and qualification services, paid training and workshops, and the Start-A-Factory hardware prototyping program targeted at startups. Initial consultations are typically free. Revenue figures are not publicly disclosed. The institute serves semiconductor, automotive, medical technology, ICT/IoT, aerospace/space, smart textiles, and hardware startup segments through direct enterprise engagement, supported by an active conference presence (ECOC, EuMW, EFX) and digital channels including a scientific blog, LinkedIn, YouTube, and email newsletters.

Name

Fraunhofer IZM

Legal name

Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Website

https://izm.fraunhofer.de

Company type

Private

Operating status

Operating

Headcount range

251–500 employees

Short description

Fraunhofer IZM is a German non-profit applied research institute specializing in electronic packaging, heterogeneous integration, and reliability engineering, serving semiconductor, automotive, medical, ICT, and startup customers through contract R&D, public funding, and pilot-line services from Berlin, Dresden, and Cottbus.

Ownership category

akta.pro rank

Product category

Microelectronics R&D and Electronic Packaging Services

NAICS

Scientific Research and Development Services (5417), Electronic and Precision Equipment Repair and Maintenance (811210), Semiconductor Machinery Manufacturing (333242)

SIC

Services-Testing Laboratories (8734), Services-Commercial Physical & Biological Research (8731)

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

akta.pro secondary industries

Testing, Inspection, Certification & Commissioning (TICx) Technical Services (BPAHAIAL), Ruggedized/Harsh-Environment Electronics Manufacturing (IP-rated, shock/vibration, wide-temp) (IMAGAGAF), Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification) (HDAHACAJ), Test, Measurement & Calibration Equipment Manufacturing Services (ATE, DAQ, metrology electronics) (IMAGAGAH)

Keywords

• Microelectronics research
• Electronic packaging services
• Reliability engineering
• Wafer level integration
• Contract R&D services

Headquarters

HQ city

Berlin

HQ country

Germany

HQ region

Europe

Offices3 records

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Technology or R&D, Infrastructure, Operations

Revenue model

1. Contract Research and Development: Project-based R&D services charged to industrial partners once cooperation scope is defined. The customer receives ownership of products, prototypes, and materials developed in their contract, along with usage rights to inventions and know-how.
2. Publicly Funded Research: Core funding from Fraunhofer-Gesellschaft which is publicly funded through federal and state government sources. Additional funding from European research projects and initiatives.
3. Start-A-Factory Hardware Prototyping: Hardware prototyping services for startups and hardware developers, transforming ideas from first draft to production-ready prototypes using state-of-the-art equipment and expert support.
4. Training and Workshops: Educational services including seminars on system design, integration technologies, materials & reliability, and reliability management.
5. Testing and Qualification Services: Fee-based testing, qualification, and reliability services for electronic systems including vibration tests, thermal management, and FEM-based reliability assessments.

Pricing tiers

Go-to-market motion3 records

Distribution channels4 records

Marketing channels9 records

Core offering

Fraunhofer IZM is a contract research institute that develops and qualifies electronic packaging, microintegration, and reliability engineering solutions for industrial partners. It sells tailor-made R&D services including technology consulting, feasibility studies, process and product development, prototype fabrication through pilot lines (notably APECS for chiplet technologies), testing and qualification services, and training programs. Customers span semiconductor, automotive, medical technology, ICT, aerospace, and smart textiles industries and retain ownership of developed products and prototypes along with usage rights to resulting inventions.

Product overview

Fraunhofer IZM is a research institute (not a product company) offering a comprehensive portfolio of technology services, research departments, and collaborative programs focused on electronic packaging, reliability engineering, and microintegration. The core offerings include technology consulting, process and product development, testing and qualification services, and pilot line facilities. The institute operates four main research departments (Wafer Level System Integration, System Integration & Interconnection Technologies, Environmental & Reliability Engineering, and RF & Smart Sensor Systems) that provide specialized expertise. Supporting programs include Start-A-Factory for hardware prototyping, laboratory collaborations, training workshops, and pilot production lines. Services span from feasibility studies through prototype development to qualification testing, serving industrial partners across semiconductors, automotive, medical, and communication sectors.

Differentiator

Problem solved

Functional benefit

Products and services

• Technology Consulting and Feasibility Studies
• Process and Product Development

Quantifiable outcome

• Energy savings up to factor five demonstrated in IoT-Core platform configurations
• +2 more outcomes

Segments7 records

Ideal customer profiles7 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

16 partnerships are on record, tiered core, flagship and minor.

• Fraunhofer EMFT (Mikrosysteme und Festkörper-Technologien)coreStrategic or Co-development Partner · 3 April 2018Partnership in the ZEPOWEL lighthouse project focused on highly integrated, extremely energy-efficient modules for IoT. Fraunhofer EMFT contributes expertise in production-oriented microtechnology, innovative sensor solutions, and microdosage, developing a highly integrated gravimetric CMOS particle sensor.
• Fraunhofer ESK (Eingebettete Systeme und Kommunikationstechnologie)coreStrategic or Co-development PartnerPartnership in ZEPOWEL lighthouse project focusing on reliable communication systems for IoT applications, working in the fields of communication technologies, networked mobility, industrial communication, and smart grid.
• Fraunhofer IAF (Angewandte Festkörperphysik)coreStrategic or Co-development PartnerPartnership in ZEPOWEL project developing cost-effective and highly efficient power amplifiers and transceiver ICs for mm-wave frequency range at 60 GHz based on gallium nitride (GaN) on silicon.
• Fraunhofer IIS (Integrierte Schaltungen)coreStrategic or Co-development PartnerPartnership in ZEPOWEL project developing integrated ultra-low-power radio receivers for ISM bands in standard CMOS technology, including encryption procedures for secure wake-up processes.
• Fraunhofer IISB (Integrierte Systeme und Bauelementetechnologie)coreStrategic or Co-development PartnerPartnership in ZEPOWEL project researching extremely compact power converters of next generation while reducing power loss to minimum, with novel technologies for predictive maintenance.
• Fraunhofer IIS/EAS (Entwicklung Adaptiver Systeme)coreStrategic or Co-development PartnerPartnership in ZEPOWEL developing ultra-low-power circuit for self-sufficient sensor applications with components for universal conditioning and analog-to-digital conversion of various sensor signals.
• Fraunhofer IPMS (Photonische Mikrosysteme)coreStrategic or Co-development PartnerPartnership in ZEPOWEL developing ASIC that converts harvested energy into charging voltage for battery, including thin-film processes for lithium-containing functional layers for miniaturized lithium-ion accumulators.
• Fraunhofer ISIT (Siliziumtechnologie)coreStrategic or Co-development PartnerPartnership in ZEPOWEL developing broadband energy harvester for mechanical and magnetic ambient energy with quadrupled efficiency compared to currently available harvesters.
• Forschungsfabrik Mikroelektronik Deutschland (FMD)flagshipStrategic or Co-development PartnerJoint research on future topics for digitalization, technology transfer for multifunctional, energy-saving sensors, communication technology, power electronics, and Internet of Things.
• Leistungszentrum Digitale VernetzungcoreStrategic or Co-development PartnerCollaboration supporting digital transformation processes across all phases from initial idea and solution conception to implementation of digital processes and business models.
• Leistungszentrum Funktionsintegration für die Mikro-/NanoelektronikcoreStrategic or Co-development PartnerResearch consortium for new functionalities and comprehensive ecosystem for micro- and nanoelectronics, working in network for cross-disciplinary innovation.
• APECS PilotlinieflagshipStrategic or Co-development PartnerAPECS pilot line for chiplet technologies with high-precision integration technologies, substrate prototyping, and modular chiplet architecture research. Fraunhofer IZM is integral part of this European initiative.
• Fraunhofer Forschungsbereich TextilcoreStrategic or Co-development PartnerCollaboration within Fraunhofer Textile Research Division, working on textile electronics and smart textiles integration.
• Smart Textiles AllianceminorStrategic or Co-development PartnerAmbassador membership in Smart Textiles Alliance supporting standardization and collaboration in electronic textiles sector.
• Textile ETPminorStrategic or Co-development PartnerMembership in European Technology Platform for textiles, contributing to strategic research agendas in textile innovation.
• IPC (Association Connecting Electronics Industries)minorStrategic or Co-development PartnerActive participation in standardization efforts for E-Textiles quality and processing standards through IPC organization.

Scale indicators4 records

Recent moves6 records

Expansion highlights6 records

Direct peers

• CEA-Leti: France's micro/nanoelectronics research institute under CEA, providing R&D services across semiconductor processes, packaging, IoT, and reliability — a near-parallel public research peer with overlapping chiplet, photonics, and sensor programs.
• Fraunhofer IIS: Sister Fraunhofer institute focused on integrated circuits, sensor systems, and communications — collaborates with IZM on ZEPOWEL and other IoT programs, sharing the same parent, public funding model, and project-based R&D revenue structure.
• Fraunhofer IAF: Fraunhofer Institute for Applied Solid-State Physics working on GaN/III-V semiconductor devices and high-frequency electronics — a sister R&D institute with strong joint-program involvement (ZEPOWEL) and comparable contract research and IP models.
• IMEC: Belgium-based leading microelectronics R&D center offering contract research, advanced packaging, heterogeneous integration, and prototyping services — directly comparable to Fraunhofer IZM in mission, funding model (public/private blended), and customer segments.
• VTT Technical Research Centre of Finland: Finland's publicly funded applied research organization with deep microelectronics, packaging, and reliability engineering capabilities, serving similar industrial customers across Europe through contract R&D and pilot-line services.
• CSEM: Swiss Centre for Electronics and Microtechnology delivers applied R&D services in MEMS, sensors, ultra-low-power electronics, and packaging — closely comparable to IZM's mix of reliability engineering, IoT, and sensor systems work for industrial partners.

Emerging players

• Deca Technologies: Emerging chiplet and advanced packaging specialist focused on heterogeneous integration and high-density fan-out — overlaps with IZM's chiplet/APECS agenda as a nimble commercial complement to the institute's pilot-line research.

Broad incumbents

• Amkor Technology: Top-tier global OSAT with strong advanced packaging (2.5D, 3D, chiplet integration) and test capabilities — overlapping with IZM's packaging and reliability competencies at industrial scale, serving many of the same semiconductor and automotive customers.
• Bosch Research: Corporate research arm of Bosch covering MEMS, sensors, automotive electronics, and packaging — a large in-house R&D peer whose automotive electronics, MEMS, and reliability needs mirror IZM's automotive customer-segment focus and often engages IZM as an external R&D partner.
• ASE Technology Holding: World's largest OSAT provider operating across the full semiconductor packaging, test, and assembly value chain at commercial scale — relevant as a broad incumbent whose advanced packaging roadmap (2.5D/3D, chiplets) sets the industrial standard IZM's clients must integrate with.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

• YouTubeyoutube.com/channel/UCLizVX8z89dg8FyB0jGUmQw
• LinkedInlinkedin.com/company/fraunhofer-izm-berlin
• Instagraminstagram.com/fraunhofer_izm

Revenue estimate

Valuation estimate

Number of profiles

Profiles9 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Fraunhofer IZM