Koki Europe Sp. z o.o.

What Koki Europe Sp. z o.o. does

KOKI Company Limited is a Japanese privately held manufacturer of soldering materials, headquartered in Tokyo at 32-1 Senju Asahi-cho, Adachi-ku, with European operations conducted through Koki Europe Sp. z o.o. in Łućmierz, Poland (7 employees). The company produces solder paste, flux for wave soldering, tack flux, flux cored solder wire, and heat-curable SMT adhesives used by electronics manufacturers globally in more than 60 countries. Its product portfolio spans general-purpose industrial formulations through to specialty automotive and power-semiconductor grades, including the 'Zero Flux Residue' E-series for IGBT/MOSFET production, crack-free flux residue technology for automotive thermal cycling, and the SABI alloy (Sn3.5Ag0.5Bi6.0In) for high-reliability solder joints.

The company's underlying technology is rooted in proprietary flux chemistry, solder alloy metallurgy, and powder particle-size engineering (IPC Type 4 to Type 6, down to 5–20μm). Notable technical components include cobalt-based anti-iron tip erosion barriers, hydrophobic rosin systems for ultra-narrow 0.125mm pattern reliability, Mycronic-certified non-contact jet dispensing formulations for MY600/MY700 machines, and a water-based VOC-free flux system. The Global Solder Paste (GSP) was co-developed with Toyota Motor Corporation for automotive electronics, and the company participates in industry standards around halogen-free (BS EN14582), RoHS, and REACH compliance.

KOKI operates a B2B sales-led go-to-market combining direct sales representatives with a global distributor network. Customers contact the company through multilingual inquiry forms (Japanese, English, German, Spanish, French, Italian, Chinese, Korean) and are routed to sales engineers for quotes, technical support, and process optimization services. Pricing is not publicly disclosed; sales are one-time material purchases with professional services layered on top. Customer segments are vertical-driven: automotive electronics (primary), consumer and industrial products, mobile and smart devices, electronic components, and power devices. The company markets through its global website, technical catalogues, LinkedIn, and trade shows including Productronica and PCIM Europe.

Name

Koki Europe Sp. z o.o.

Legal name

KOKI COMPANY LIMITED

Website

https://koki-global.com

Company type

Private

Operating status

Operating

Headcount range

1–10 employees

Short description

KOKI Company Limited is a Japanese manufacturer of specialty soldering materials (solder pastes, fluxes, wires, SMT adhesives) serving automotive, power semiconductor, consumer, mobile, and electronics manufacturers across more than 60 countries through direct sales and distributors.

Ownership category

akta.pro rank

Product category

Soldering Materials

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Electronic Components & Accessories (3670)

akta.pro primary industry

Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)

Keywords

• Solder paste manufacturing
• SMT soldering materials
• Power electronics soldering
• Flux chemistry products
• Electronic assembly materials

Headquarters

HQ city

Tokyo

HQ country

Japan

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Technology or R&D, Personnel, Marketing or Sales, Infrastructure

Revenue model

1. Solder Paste Sales: KOKI generates revenue primarily through the sale of soldering materials including solder pastes, flux products, solder wires, and SMT adhesives to electronics manufacturers worldwide.
2. Technical Services: The company provides technical support services including analytical services, process optimization, and product evaluation assistance as part of customer support for their materials.

Go-to-market motion1 record

Distribution channels3 records

Marketing channels4 records

Core offering

KOKI manufactures soldering materials for Surface Mount Technology (SMT) and Power Electronics, including solder pastes (lead-free, low-Ag, high-reliability, low-melting point, jet dispensing, crack-free and zero flux residue), flux for wave soldering, tack flux, flux cored solder wire, and heat curable SMT adhesives. The product portfolio serves automotive electronics, consumer and industrial products, mobile/smart devices, electronic components, and power semiconductor devices worldwide.

Product overview

KOKI COMPANY LIMITED is a Japanese manufacturer of soldering materials operating globally in more than 60 countries. The product portfolio centers on solder pastes (including lead-free SAC305, low-Ag cost-reduction, high-reliability SABI alloys, low-melting point Sn-Bi, and specialty formulations like jet dispensing, crack-free flux residue, and zero flux residue for power devices), complemented by wave soldering fluxes, tack fluxes, flux cored solder wires, heat curable SMT adhesives, and products specifically designed for power semiconductor applications. The offering spans general-purpose industrial products to automotive-grade materials developed with partners like Toyota Motor Corporation.

Differentiator

Problem solved

Functional benefit

Products and services

• Solder Paste Primary product category including lead-free and leaded solder pastes for SMT applications, featuring various alloy compositions (SAC305, low-Ag, high-reliability, low-melting point) and specialty formulations (halogen-free, crack-free flux residue, jet dispensing compatible, micro-pattern).
• Flux for Wave Soldering Flux products for wave soldering processes including VOC-free water-based formulations and ultra-low residue options.
• Tack Flux Specialty tack flux for package-on-package (PoP) and 3D assembly applications.
• Flux Cored Solder Wire Flux cored solder wires including anti-iron tip erosion formulations with low silver content and halogen-free options.
• Heat Curable SMT Adhesive SMT adhesives for component temporary fixing during reflow and wave soldering, available in general-purpose, low-temperature curing, and self-alignment compatible formulations.
• Products for Power Semiconductor Devices Specialty solder solutions for power electronics including E series 'Zero Flux Residue' pastes for IGBT and MOSFET applications with ultra-low voiding performance.
• GSP (Global Solder Paste) TOYOTA-recommended solder paste developed in collaboration with Toyota Motor Corporation for automotive electronics in N₂ environment, featuring anti-crack resin technology for moisture-proof flux residue.
• E150DN Series Non-contact jet dispensing solder paste with Sn3.0Ag0.5Cu alloy, 217-219°C melting point, halogen-free (Br+Cl <1,500ppm), available in Type 4-6 powder sizes.
• S3X70-E160DN Mycronic-approved solder paste for jet dispensing with MY600 and MY700 machines, 10-25μm particle size, 80 Pa.s viscosity, halogen-free.
• S3X811-M500-6 Lead-free solder paste for micro-pattern applications supporting 0201-03015 chip components and 0.1mm pitch CSP, featuring ultra-fine Type 6 powder (5-20μm) and optimized viscosity for fine-pitch printing.
• S3X58-CF100-2 Crack-free flux residue solder paste with anti-crack resin technology for automotive applications, ROM1 flux type, air reflow compatible, designed for high insulation in condensing environments.
• T4AB58-HF360 High performance low melting point solder paste with Koki's original T4AB alloy (Sn0.4Ag57.6Bi, 138-140°C), reduces energy consumption by approx. 40% compared to SAC305.
• SB6N58-HF350 Halogen-free high reliability solder paste with SABI alloy (Sn3.5Ag0.5Bi6.0In), 202-210°C melting point, uses solid solution strengthening for thermal cycle resistance in automotive applications.
• JS-3000V-3 VOC-free water-based wave soldering flux with organic acid type, 5.0% solid content, ORM0 classification, designed to prevent solder splattering and bridging.
• S1XBIG58-M650-7 ICT testable low-cost high-reliability solder paste with reduced silver content (1.1% Ag), thermal cycle resistance exceeding SAC305, Sn1.1Ag0.7Cu1.8Bi+Ni alloy.

Quantifiable outcome

• Energy consumption can be reduced by approximately 40% using low-temperature solder paste profiles
• +2 more outcomes

Segments5 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration1 record

Feature8 records

Partnerships

One partnership is on record.

• MycroniccoreTechnology or IntegrationMycronic, a Swedish industrial machine manufacturer, has approved the use of KOKI's S3X70-E160DN solder paste with their MY600 and MY700 jet dispensers. This certification validates product compatibility with Mycronic's jetting machines for non-contact solder paste dispensing applications.

Scale indicators1 record

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• Henkel AG & Co. KGaA: Global adhesives and electronic materials giant offering solder pastes and fluxes under its Loctite and Henkel brands. A broad incumbent with much larger resources than KOKI, operating across multiple material categories beyond just solder.
• MacDermid Enthone Electronics Solutions: Part of Element Solutions Inc., MacDermid Enthone supplies plating chemicals, solder materials, and assembly products. A broad incumbent in electronic materials with significant overlap with KOKI's SMT chemistry portfolio.

Direct peers

• AIM Solder: Canadian-headquartered manufacturer of solder pastes, fluxes, and bar solder for SMT and through-hole assembly. Competes directly with KOKI in mid-market electronics assembly materials globally.
• Alpha Assembly Solutions: A division of Element Solutions Inc. that produces solder pastes, fluxes, and electronic assembly materials. Alpha is a top-tier direct competitor to KOKI in the global solder materials market across SMT and power electronics.
• Tamura Corporation: Japanese electronic materials manufacturer with a strong solder paste and flux business serving SMT, automotive, and power electronics. Directly comparable to KOKI in Japan-domestic automotive and power semiconductor supply.
• Shenmao Technology Inc. Taiwanese manufacturer of solder pastes, fluxes, and preforms serving SMT, semiconductor packaging, and LED assembly. A direct Asia-based peer with comparable product breadth in lead-free solder chemistries.
• Heraeus Electronics: German specialty materials group producing solder pastes, bonding wires, and thick-film materials for electronics and semiconductor packaging. Directly competes with KOKI in automotive-grade solder and power electronics materials.
• Nihon Superior Co., Ltd. Japanese manufacturer of solder alloys, pastes, and fluxes with patented SN100C and other lead-free alloy systems. A long-standing direct peer of KOKI in Japanese-developed lead-free solder chemistries for SMT.
• Senju Metal Industry Co., Ltd. Japanese manufacturer of solder pastes, fluxes, and related joining materials for SMT and power electronics. Senju is one of KOKI's closest direct peers, sharing Japanese heritage, automotive-grade offerings (including relationships with Japanese OEMs), and a global sales network.
• Indium Corporation: US-based global supplier of solder materials including solder pastes, fluxes, and preforms for SMT, power electronics, and semiconductor packaging. Directly competes with KOKI across automotive, mobile, and power device segments.

Market position

Strengths5 records

Weaknesses4 records

Competitive moat1 record

Key risks5 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/koki-europe-sp-z-o-o

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Koki Europe Sp. z o.o.