Shinko Electric America, Inc.

What Shinko Electric America, Inc. does

Shinko Electric America, Inc. is the U.S. subsidiary of Shinko Electric Industries Co., Ltd., a Japanese semiconductor packaging manufacturer founded in 1946, with the U.S. entity established in 1977 and headquartered in San Jose, California. The company supplies semiconductor packaging materials and assemblies — including flip-chip substrates (BGA/CSP), leadframes, IC assembly, glass-ceramic thermal management (GTMS), and metal products — serving four end-markets: Computing & Networking, Mobile, Industrial & IoT, and Automotive. Core proprietary technologies include the DLL/DLL3 build-up substrate platforms, i-THOP thin-film coreless substrates, MCeP coreless packaging, CNT-TIM thermal interface material, and emerging optical chiplet/co-packaged optics (CPO) substrates for data-center interconnects. The firm operates a B2B direct-sales model, with packaging designs custom-engineered per customer chip architecture and qualified against AEC-Q100 / IATF 16949 standards for automotive applications.

The business model is a vertically integrated B2B manufacturer: revenue is generated through unit sales of custom-designed substrates and leadframes to semiconductor OEMs and OSATs, with R&D investment and capacity decisions shaped by long qualification cycles in automotive and HPC. Recent corporate events materially repositioned the company: in June 2025 it was privatized via tender offer by JIC Capital (Japan's government-backed investment fund) at JPY 5,920 per share and delisted from the Tokyo Stock Exchange Prime Market. Post-privatization initiatives include a refreshed Mission, Vision, and Values framework, board restructuring, IATF 16949 certification (July 2025), RBA VAP Platinum status (April 2025), and a 2025 product pipeline targeting AI/HPC and data-center optics. The U.S. subsidiary operates with a lean headcount of approximately 74 employees, functioning primarily as a sales, technical-support, and customer-engineering arm for North American semiconductor customers.

Name

Shinko Electric America, Inc.

Legal name

SHINKO ELECTRIC INDUSTRIES CO., LTD.

Website

https://shinko.com

Company type

Private

Founded year

1946

Operating status

Acquired

Headcount range

51–100 employees

Short description

Shinko Electric America is the U.S. subsidiary of Japanese semiconductor packaging manufacturer Shinko Electric Industries, supplying custom flip-chip substrates, leadframes, thermal materials, and emerging co-packaged optics substrates to global semiconductor OEMs across computing, mobile, industrial, and automotive end-markets.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441), Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (3344)

SIC

Semiconductors & Related Devices (3674), Electronic Components & Accessories (3670), Electronic Components, Nec (3679)

akta.pro primary industry

Leadframes & Package Interconnect Materials (HDAHADAF)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL), Thin-Film Deposition Materials (PVD/CVD/ALD Targets & Precursors) (HDAHAGAH)

Keywords

• Semiconductor packaging
• Flip-chip substrates
• IC assembly services
• Thermal management parts
• Leadframe manufacturing

Headquarters

HQ city

Nagano

HQ country

Japan

HQ region

Asia

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations, Infrastructure, Marketing or Sales

Revenue model

1. Semiconductor Package Manufacturing and Sales: Core revenue from development, manufacturing, and sales of semiconductor packages including substrates (DLL/DLL3, PBGA, i-THOP), leadframes, IC assembly products, glass-to-metal seals, thermal management parts, ceramic equipment, and metal products. Revenue is generated through direct B2B sales to semiconductor and electronics manufacturers. The company was listed on the Tokyo Stock Exchange Prime Market until its delisting on June 6, 2025 following privatization by JIC Capital.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

Core offering

SHINKO manufactures semiconductor packages including flip-chip package substrates (DLL/DLL3, i-THOP), leadframes (QFN, QFP/TSOP, exposed pad, riveting, pre-plated), IC assembly products (MCeP, Bare Die Flip-Chip, Lidded Flip-Chip, Power Device Package POL, Optical Chiplet/CPO), glass-to-metal seals for LD devices and initiators, thermal management parts (heat spreaders, CNT-TIM), ceramic electrostatic chucks, and metal products (motor cores, precision die parts). The company sells these custom-engineered components directly to semiconductor and electronics OEMs across Computing & Networking, Mobile, Industrial & IoT, and Automotive markets.

Product overview

Shinko Electric Industries is a semiconductor package manufacturer offering a comprehensive portfolio of products organized into five main categories: (1) Substrates including Flip-Chip Package Substrate (DLL®/DLL3®), Plastic BGA Substrate, Coreless Substrate, 2.3D Package Substrate (i-THOP®), and Substrate with Optical Waveguides for Co-Packaged Optics; (2) Leadframes including QFN, QFP/TSOP, Exposed Pad, Riveting, and Pre-Plated types; (3) IC Assembly products including Device Embedded Package (MCeP®), Bare Die Flip-Chip, Molded Underfill, Lidded Flip-Chip, Power Device Package (POL), and Optical Chiplet/Co-Packaged Optics; (4) Glass-to-Metal Seals for LD Devices, LD Light Sources, CAN Packages, and Initiators; (5) Thermal Management Parts including Heat Spreaders and Carbon Nanotube TIM; (6) Semiconductor Manufacturing Equipment including Ceramic Electrostatic Chucks; and (7) Metal Products including Motor Cores and Precision Die Parts. Several advanced products including i-THOP®, Optical Chiplet/CPO, POL, and CNT-TIM remain under development.

Differentiator

Problem solved

Functional benefit

Brands

• DLL/DLL3: Flip-Chip Package Substrate trademarks - Direct Laser & Lamination technology for fine line patterning
• i-THOP
• MCeP
• CNT-TIM
• GTMS

Products and services

• Flip-Chip Package Substrate ~DLL/DLL3~ High-density flip-chip package substrates using semi-additive process with fine line patterning, multilayer structure, and excellent electrical characteristics. DLL3 is a coreless variant offering thinner structure with enhanced electrical performance. Targeted at semiconductor OEMs for high-performance computing, networking, and advanced IC packaging.
• Plastic BGA Substrate Organic substrates using prepreg for BGA packages available in 2-layer/4-layer through-hole configurations for high reliability applications, and build-up substrates (IVH substrate) for size reduction and high density.
• Plastic BGA Thin Substrate (Coreless Substrate) Thin build-up substrates with core layer removed for sophisticated small electronic devices such as smartphones. Offers ultimate substrate thickness reduction, superior electrical characteristics, and supports both wire bonding and flip-chip.
• 2.3D Package Substrate ~i-THOP~ Ultra-high-density organic substrate integrating organic interposer and build-up substrate enabling chip-last assembly. Features ultra fine pitch for line and space with thin film technology, supporting heterogeneous chip integration and HBM mounting. Targeted at semiconductor OEMs for advanced 2.3D packaging applications.
• Substrate with Optical Waveguides (Co-Package) Multilayer high-density substrate with optical waveguides for high-speed transmission and high-capacity communication. Uses polymer optical waveguides capable of single mode transmission applied to Co-Packaged Optics. Targeted at data center and high-speed communication semiconductor OEMs.
• Non-Lead Package (QFN) Leadframe Leadless packages with exposed external leads on back side for package size reduction. Uses etching technology and plating/surface finish technologies. Package mounting area can be reduced by approximately 40%.
• Leaded Package (QFP/TSOP) Leadframe Leaded packages with outer leads functioning as external terminals. Uses high precision stamping and etching technologies with surface finish technologies for automotive and other high reliability applications.
• Exposed Pad Leadframe Leadframes for exposed pad packages achieving high heat dissipation by exposing die pad back side. Features unique deep metal bending technology for stable level difference control and flatness.
• Riveting Leadframe Two-layered leadframe stacking non-die-pad leadframe and heat slug by riveting technology for high heat dissipation. Heat slug is exposed outside the package and applicable for high reliability automotive products.
• Pre-Plated Leadframe Three-layer Nickel-Palladium-Gold (Ni/Pd/Au) plated leadframe eliminating external solder plating process. Reduces lead-time and prevents solder bridge in fine pitch leadframes.
• Device Embedded Package ~MCeP~ Semiconductor package containing IC chips and active/passive components in a compact thin form. Features superior electrical characteristics and high reliability for small electronic devices and modules.
• Bare Die Flip-Chip Package IC chip flip-chip mounted on organic substrate with underfill resin. Enables overall package height reduction with IC chip thickness 70 micrometers or less and IC pad pitch connection less than 45 micrometers.
• Molded Underfill Flip-Chip Package Semiconductor package where gap between IC chip and substrate is filled with mold resin simultaneously with package molding. Fills gaps 45 micrometers or less, achieves smaller package size, supports passive component built-in.
• Lidded Flip-Chip Package High-heat-dissipation flip-chip package radiating heat to heat spreader (lid) from IC chip back side through TIM. Uses in-house leadframe as lid for high quality and low price, applicable up to AEC-Q100 grade 2.
• Power Device Package ~POL~ Power semiconductor package using printed circuit board manufacturing technology. Provides high dimensional precision, low conduction resistance, and high-speed switching for Si, SiC, and GaN power semiconductors. Targeted at power electronics OEMs.
• Optical Chiplet / Co-Packaged Optics Optoelectronic convergence technology combining electrical and optical circuits. Features small optical chiplet assembly with efficient optical connection between optical devices and Fiber Array, and CPO assembly with xPU packages. Targeted at data center and high-performance computing semiconductor OEMs.
• Glass-to-Metal Seals (GTMS) for LD Device Metal and glass packages featuring high hermeticity and outstanding electrical properties for laser diodes. Available in 5.6mm diameter types and various shapes with TO-5, 8, 18, 39, 46 configurations.
• Glass-to-Metal Seals (GTMS) for LD Light Source Optical source packages with high heat dissipation material for projectors, automotive headlights, and laser processing machines. Offers optimal heat dissipation properties through material composition and heat dissipation simulation.
• CAN Package for High Speed Optical Communication

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability2 records

Feature12 records

Scale indicators4 records

Recent moves7 records

Expansion highlights5 records

Direct peers

• Kinsus Interconnect Technology Corp. Taiwanese maker of flip-chip BGA substrates, HDI PCBs, and leadframes. Direct overlap with Shinko's substrate and leadframe product lines.
• Unimicron Technology Corp. Taiwanese substrate manufacturer of FC-BGA, ABF substrates, and HDI PCBs. Competes with Shinko in high-end flip-chip substrates used for HPC, AI, and mobile processors.
• Shennan Circuits Co., Ltd. Chinese PCB and substrate manufacturer with growing FC-BGA and IC substrate capacity. Competes with Shinko in flip-chip and high-density substrates for computing and communications end markets.
• Ibiden Co., Ltd. Japanese-headquartered leader in IC package substrates (FC-BGA, flip-chip BGA) and a direct competitor to Shinko's DLL/DLL3 flip-chip substrates. Most relevant substrate peer by technology overlap.
• AT&S (Austria Technologie & Systemtechnik AG): European-headquartered high-end PCB and IC substrate supplier focused on FC-BGA and substrate-like-PCBs for AI/data center. Competes with Shinko in advanced flip-chip substrates for HPC customers.
• LG Innotek Co., Ltd. Korean maker of flip-chip BGA substrates and IC packages, serving mobile, computing, and automotive end markets. Competes with Shinko across multiple substrate and IC assembly product lines.
• Samsung Electro-Mechanics Co., Ltd. (SEMCO): Korean substrate manufacturer (FC-BGA, FC-CSP) and passive component supplier with major investments in AI server substrates. Competes with Shinko in high-end flip-chip substrates and advanced packaging.

Broad incumbents

• ASE Technology Holding Co., Ltd. World's largest OSAT, offering IC assembly, packaging (including advanced 2.5D/3D/chiplet), and testing. Competes with Shinko in advanced packaging and IC assembly, with broader scale and service portfolio.
• Powertech Technology Inc. Taiwanese OSAT providing IC packaging and testing, including flip-chip and stacked die packaging. Comparable to Shinko's IC assembly offerings across memory and logic customers.
• Amkor Technology, Inc. Major U.S./Asian OSAT offering flip-chip, wafer-level, and advanced packaging services including 2.5D/3D integration. Competes with Shinko in IC assembly and advanced packaging for AI/HPC customers.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/shinko-electric-co--ltd-

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Shinko Electric America, Inc.