RRP Electronics

What RRP Electronics does

RRP Electronics Limited is an India-based Outsourced Semiconductor Assembly and Test (OSAT) company headquartered in Navi Mumbai, Maharashtra, that operates Maharashtra's first dedicated OSAT facility. The company provides full-suite IC packaging services — including Quad Flat No-Lead (QFN) packages and fan-out wafer-level packaging (FOWLP) via its partnership with DECA Technologies — alongside prototype compound semiconductor fabrication focused on infrared detectors for aerospace, defense, medical imaging, and autonomous systems. In January 2026, RRP expanded into downstream products with the launch of Samved, India's first indigenous fingerprint sensor module featuring Edge-AI intelligence for secure digital identity verification, manufactured in partnership with Taiwanese firm Horng.com. The company holds ISO 9001:2015, ISO 14001:2015, and ANSI ESD S20.20:2021 certifications, serves telecommunications, industrial, automotive, medical, commercial, and advanced computing customers through direct enterprise B2B sales, and has secured strategic partnerships with Bharat Electronics Limited (defense), Asprofin Bank Corporation (data centers), and Wow Global Technologies.

RRP is pursuing an aggressive multi-site expansion strategy, having secured 200+ acres of industrial land across Maharashtra (a 101-acre plot in Khalapur and 100 acres in Navi Mumbai for a fab with 1.25 lakh wafers/month planned capacity) and a ₹10,239 crore OSAT and fab project approval in Sri Sathya Sai district, Andhra Pradesh, with total planned capital expenditure exceeding ₹36,000 crore. In December 2025, Indian Link Chain Manufacturers Ltd acquired a majority stake, with plans to rebrand the listed entity as RRP Electronics India Ltd; the stock (previously traded as RRP Semiconductor) had risen more than 55,000% over the prior 20 months. Founder and Chairman Rajendra Chodankar brings 40+ years of engineering expertise and is supported by mentor Dr. Anil Kakodkar and strategic investor Sachin Tendulkar. The company operates 51-100 employees and positions itself as a critical enabler of India's semiconductor indigenization agenda, with additional initiatives spanning modular AI data center construction across India, Qatar, and Southeast Asia.

Name

RRP Electronics

Legal name

RRP Electronics Limited

Website

https://www.rrpelectronics.com

Company type

Public

Founded year

2024

Operating status

Operating

Headcount range

11–50 employees

Short description

RRP Electronics is an India-based OSAT company operating Maharashtra's first dedicated semiconductor packaging and testing facility, serving telecommunications, industrial, automotive, medical, and defense customers through advanced packaging, compound semiconductor fabrication, and the indigenous Samved Edge-AI fingerprint sensor product line.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging & Testing (OSAT)

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey) (HDAHADAJ)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Test Services (Wafer Sort, Final Test, Burn-In) (HDAHADAD)

Keywords

• Semiconductor packaging
• OSAT services
• Wafer-level packaging
• Compound semiconductors
• Fingerprint sensor modules

Headquarters

HQ city

Mumbai

HQ country

India

HQ region

Asia

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Operations, Infrastructure, Technology or R&D, Personnel, Supply Chain

Revenue model

1. OSAT Services: Outsourced Semiconductor Assembly and Test services providing full-suite IC packaging, scalable from prototyping to high-volume production for consumer, industrial, and defense applications.
2. Advanced Packaging: Wafer-level packaging and advanced assembly services including FOWLP with DECA Technologies partnership, targeting AI, automotive, and high-performance computing sectors.
3. Prototype Fab Services: India's Prototype Compound Semiconductor Fabrication Facility specializing in infrared (IR) detectors for aerospace, defense, medical imaging, and autonomous systems.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

RRP Electronics operates Maharashtra's first dedicated OSAT (Outsourced Semiconductor Assembly and Test) facility, providing full-suite IC packaging services scalable from prototyping to high-volume production. Its portfolio spans QFN surface-mount packages, advanced fan-out wafer-level packaging (FOWLP) via partnership with DECA Technologies, a prototype compound semiconductor fab for infrared detectors, and India's first indigenous Edge-AI fingerprint sensor modules (Samved) manufactured with Taiwanese partner Horng.com.

Product overview

RRP Electronics operates as a unified OSAT-focused semiconductor company offering integrated solutions across the semiconductor value chain. The core portfolio centers on Maharashtra's first dedicated OSAT (Outsourced Semiconductor Assembly and Test) facility providing QFN packaging and full IC packaging services. Adjacent offerings include Advanced Packaging through DECA Technologies partnership for fan-out wafer-level packaging (FOWLP), a Prototype Compound Semiconductor Fabrication Facility for IR detectors, and Display Technologies for various sectors. The company has recently expanded into indigenous fingerprint sensors (Samved) with Edge-AI capabilities, and modular data center construction. The products range from core OSAT services to advanced packaging technologies, compound semiconductor fabrication, and AI-enabled sensor modules, serving telecommunications, industrial, automotive, medical, commercial, and advanced computing industries.

Differentiator

Problem solved

Functional benefit

Products and services

• OSAT (Outsourced Semiconductor Assembly and Test) Maharashtra's first dedicated OSAT facility providing full-suite IC packaging services scalable from prototyping to high-volume production for consumer, industrial, and defense applications.
• QFN Packages (Quad Flat No-Lead)

Quantifiable outcome

• First OSAT facility in Maharashtra operational status
• +1 more outcomes

Segments7 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability1 record

Feature4 records

Partnerships

Two partnerships are on record, tiered core.

• Bharat Electronics Limited (BEL)coreStrategic or Co-development Partner · 24 March 2026Strategic partnership between BEL (Navratna Defence PSU) and RRP Group to co-develop technologies in semiconductors, electro-optics, unmanned systems, and advanced defense technologies. The collaboration combines BEL's expertise in defense electronics with RRP's semiconductor manufacturing capabilities to develop high-precision surveillance systems, weapon sights, and next-generation unmanned solutions for India's defense and strategic applications, supporting indigenization and export opportunities.
• DECA TechnologiescoreTechnology or Integration · 1 January 2025MoU signed with DECA Technologies to bring fan-out wafer-level packaging (FOWLP) and high-density RDL interconnect innovations to the Indian market. The partnership provides access to DECA's revolutionary packaging technologies for ultra-compact form factors with enhanced electrical performance, ideal for mobile, AI, automotive, and high-performance computing applications.

Scale indicators7 records

Recent moves11 records

Expansion highlights8 records

Direct peers

• Amkor Technology: Leading global OSAT with advanced packaging portfolio including fan-out wafer-level packaging and 2.5D/3D integration. Directly comparable to RRP as a pure-play OSAT serving similar end markets (automotive, mobile, AI/HPC) with overlapping packaging technologies.
• Hana Microelectronics: Thailand-based OSAT and EMS provider offering IC assembly and test services with strong exposure to automotive, telecom, and consumer markets. Directly comparable to RRP across OSAT service lines and customer segments.
• UTAC Holdings: Singapore-headquartered OSAT providing analog, mixed-signal, and advanced packaging services. Directly comparable to RRP as a specialty OSAT targeting automotive, industrial, and consumer end markets.
• Tongfu Microelectronics: Major Chinese OSAT offering IC assembly, packaging, and testing services across consumer, automotive, and telecom. Directly comparable to RRP in service mix and end-market breadth, with comparable scale ambitions in advanced packaging.
• ASE Technology Holding: World's largest OSAT provider offering IC packaging, test services, and advanced packaging including FOWLP and 2.5D/3D-IC. Directly comparable to RRP across the same OSAT service lines, including assembly, packaging, and test for automotive, telecom, and high-performance computing end markets.
• JCET (Jiangsu Changjiang Electronics Technology): One of China's largest OSAT providers offering full-range IC packaging and test services including advanced packaging. Directly comparable to RRP given the similar OSAT service model and end-market exposure across automotive, telecom, and consumer.
• Powertech Technology (PTI): Taiwan-based OSAT specializing in IC packaging and testing, with growing advanced packaging exposure. Directly comparable to RRP's QFN and advanced packaging offerings and shared focus on foundry-linked back-end services.

Broad incumbents

• Tata Electronics: India's flagship semiconductor play with OSAT and fab operations under development, part of the broader Tata Group industrial ecosystem. Comparable to RRP as a fellow domestic OSAT entrant but with broader group resources, conglomerate backing, and a wider portfolio beyond pure-play OSAT.

Emerging players

• Kaynes Semicon: India-based emerging OSAT player building semiconductor packaging capacity. Directly comparable to RRP as a fellow first-generation Indian OSAT addressing the same domestic market, but at an earlier stage of capacity build-out.

Others

• DECA Technologies: US-based advanced packaging technology provider and RRP's technology partner for FOWLP and high-density RDL interconnect. Listed here as an ecosystem participant rather than a competitor; understanding DECA helps frame the technology base and competitive moat RRP is leveraging.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/rrpelectronic
• Facebookfacebook.com/RRP-Electronics-61560419650983
• LinkedInlinkedin.com/company/rrp-electronics

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Subsidiaries1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about RRP Electronics