Name

Actions Technology Co.

Legal name

炬芯科技股份有限公司 (Actions Technology Co., Ltd.)

Website

https://www.actionstech.com

Company type

Public

Founded year

2014

Operating status

Operating

Headcount range

101–250 employees

Ownership category

akta.pro rank

Product category

Fabless Semiconductor / Wireless Audio SoCs

NAICS

Semiconductor and Related Device Manufacturing (334413)

SIC

Electronic Components & Accessories (3670)

akta.pro primary industry

Audio, Imaging & Multimedia SoCs (ISP/Codec/Display) (HDAHABAH)

Keywords

• Fabless semiconductor design
• Bluetooth audio SoC
• Edge AI processors
• Smart wearable chips
• Low-power AIoT chips

Headquarters

HQ city

Zhuhai

HQ country

China

HQ region

Asia

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Operations, Marketing or Sales, Supply Chain

Revenue model

1. Chip Product Sales (Bluetooth Audio SoC, Smart Wearable SoC, Edge AI Processor): As a fabless semiconductor company, Actions Technology generates primary revenue from the design, development, and sale of integrated circuit chips. The company sells chips directly to global consumer electronics brands across three main product lines: Bluetooth audio SoC chips (for speakers, headphones, soundbars, wireless microphones), smart wearable SoC chips (for smartwatches, bands, AR glasses), and edge AI processor chips (for AI audio devices). Revenue is generated through direct B2B sales to brand customers with chip shipments embedded in end consumer products.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels6 records

Core offering

Actions Technology Co., Ltd. is a fabless semiconductor company that designs and sells low-power AIoT system-on-chip integrated circuits for global consumer electronics brands. The company offers three main product lines: Bluetooth audio SoC chips for speakers, headphones, soundbars, and wireless microphones; smart wearable SoC chips for smartwatches, bands, and AR glasses; and edge AI processor chips for AI audio devices. Revenue is generated through direct B2B sales of chips that are embedded in branded end consumer products.

Product overview

Actions Technology Co. is a leading fabless semiconductor company specializing in low-power AIoT chip design for wireless audio, smart wearables, and intelligent interaction. The company offers a comprehensive portfolio of integrated SoC chips organized into three main product lines: (1) Bluetooth Audio SoC series including ATS2835P/L for speakers and soundbars, ATS3031 for low-latency wireless audio, and ATS3025 for open wireless audio; (2) Smart Watch SoC series including ATS3085 and ATS3089 generations with dual-core MCU+DSP architecture and 2D/2.5D GPU acceleration; and (3) Edge AI Audio Chips including ATS362X for entertainment audio, ATS323X for low-latency wireless audio, and ATW609X for wearables and AI glasses. All products leverage the company's proprietary MMSCIM (Mixed-Mode SRAM-based Computing-in-Memory) NPU technology for edge AI processing, enabling on-device AI noise reduction, vocal processing, and intelligent audio enhancement while maintaining ultra-low power consumption. The company also provides TDK (Tool Development Kit) software packages and collaborates with ecosystem partners including Ceva (Bluetooth IP), CyweeMotion (AI motion), VeriSilicon (GPU), and Roundπ (maps).

Differentiator

Problem solved

Functional benefit

Products and services

• ATS362X Series Edge AI Audio Chip Edge AI chip for AI entertainment audio and professional audio equipment featuring ARM STAR CPU + HIFI5 DSP + MMSCIM NPU tri-core architecture with 132 GOPS theoretical computing power and 6.4-19.2 TOPS/W energy efficiency. Includes multi-channel I2S support (16 channels at 384KHz), ASRC dynamic sampling rate adjustment, and 4-channel 24-bit ADCs (SNR>111dBA) plus 2-channel 24-bit DACs (SNR>113dBA).
• ATS323X Series Edge AI Audio Chip First tri-core heterogeneous SoC with AI-NPU for proprietary low-latency wireless audio, featuring MMSCIM core computing of 100 GOPS@500MHz with 6.8 TOPS/W energy efficiency. Supports full-link 48KHz@32bit high-definition audio path with DAC SNR of 120dB and ADC SNR of 111dB, plus 48K dual-mic AI ENC noise reduction. Applications include wireless microphones, wireless gaming headsets, and wireless communication headsets.
• ATW609X Series Edge AI Chip Edge AI chip for wearables and AI glasses with CPU+DSP+NPU architecture, supporting AI directional pickup, multi-microphone pickup, and AI multi-channel audio separation for AI glasses and AI note-taking products.
• ATS2835P(L) Bluetooth Audio SoC High-end Bluetooth audio SoC with low latency and high audio quality, supporting Hi-Res audio processing with end-to-end latency of 20ms or less. Supports LE Audio, HD voice transmission, multi-channel wireless transmission, and full-format audio decoding. Powers products such as Anker Soundcore Motion X600 portable Bluetooth speaker and LG XBOOM Go wireless speakers.
• ATS3031 Wireless Audio SoC New generation low-latency high-quality wireless audio SoC integrating high-quality audio codec, ultra-low latency wireless transmission, 32K dual-mic AI noise reduction, and ultra-low power consumption. Applications include Bluetooth transceivers, wireless microphones, and low-latency gaming headsets. Winner of 2024 China IC Design Achievement Award - Best Communication/Network Chip of the Year.
• ATS3025 Bluetooth Audio SoC Bluetooth audio SoC with CPU+DSP dual-core heterogeneous architecture for open wireless audio (OWS) solutions, supporting spatial audio integration. Powers Baseus Eli Sport 1 open-ear TWS earbuds.
• ATS3085 Series Smart Watch SoC Dual-mode Bluetooth smartwatch SoC with MCU+DSP dual-core architecture, featuring high integration, high frame rates, low power consumption, 2D/2.5D GPU graphics acceleration, JPEG hardware decoder, and AI ENC noise reduction. Powers Honor Band 9, Xiaomi Redmi Band 3, and imoo Watch Buds.
• ATS3089X Series Smart Watch SoC Second-generation dual-mode Bluetooth smartwatch SoC with enhanced low-power design, dual GPU acceleration, AI ENC noise reduction, video dial support, and improved graphics display performance. Powers Honor 600 series, mentech Belief Professional Sports Watch, KOSPET M4T4 smart sports watches, and Halliday AI glasses.
• ATS2853+ATS2833PL Wireless Home Theater Solution Wireless home theater audio solution featuring NGPP-2.4G proprietary 2.4G wireless transmission protocol with 15ms end-to-end ultra-low latency, LC3plus High Resolution audio codec, and robust anti-interference capabilities. Powers TCL S65K 5.1-channel Soundbar.
• ATB1113 Bluetooth LE SoC Single-mode Bluetooth 5.3 LE SoC with ultra-low power consumption, supporting standby below 100nA, 10dBm transmit power, and applications in Bluetooth voice remotes, mouse, keyboard, translation devices, and Find My Network accessories. Certified compatible with Apple Find My Network accessory specifications.
• ATB119G Bluetooth LE SoC for CGM Next-generation compact Bluetooth LE chip for continuous glucose monitoring (CGM) medical devices with module diameter as small as 20mm. Ultra-low standby current (transportation mode current as low as 10nA, BLE connected-state current as low as 6µA) powered by disposable coin battery (CR920).
• ATS3231CL Edge AI Audio Chip Edge AI audio chip for wireless livestream sound cards featuring AI-NPU core with 100GOPS processing, DSP with 504MHz HiFi5 computing base, and fully wireless 32-bit transmission supporting 60m ultra-low latency connections. Powers Hollyland MELO P1 wireless livestream sound card with AI noise reduction.
• ATS2835K K-Song Speaker SoC First-generation single-chip K-song speaker solution with CPU+DSP dual-core architecture, featuring Karaoke and Speaker audio effects algorithms, high-performance audio ADC/DAC with 106dB SNR. Powers VIZIO MicMe 2.1 soundbar with built-in karaoke and wireless microphones.
• ATS296X-series Bluetooth HDT Audio Chips Bluetooth HDT audio chips developed in collaboration with Ceva, increasing peak throughput from 2 Mbps to approximately 7.5 Mbps, enabling lossless multi-channel audio, ultra-low latency gaming audio, faster file transfers, and accelerated OTA software updates. One of the industry's earliest commercial implementations of Bluetooth HDT technology.

Quantifiable outcome

• NGPP-2.4G achieves 9ms end-to-end latency vs 100-300ms for Classic Bluetooth and 30-70ms for LE Audio
• +5 more outcomes

Named customers28 records

Segments5 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration7 records

AI capability8 records

Feature8 records

Partnerships

Six partnerships are on record, tiered core and strategic.

• Ceva, Inc.coreTechnology or Integration · 4 August 2026Long-standing technology partnership where Ceva provides Bluetooth IP (including Bluetooth High Data Throughput HDT platform) used in Actions Technology's wireless audio SoC chips. The partnership has delivered over 100 million wireless audio SoCs to the market. The two companies collaborated on the ATS296X-series Bluetooth HDT audio chips — one of the industry's earliest commercial implementations of Bluetooth HDT technology, increasing peak throughput from 2 Mbps to approximately 7.5 Mbps.
• Zhejiang University (浙江大学)strategicStrategic or Co-development Partner · 6 July 2026Academic-industry collaboration for technology research, talent development, and graduate employment. Zhejiang University President Ma Yanming visited Actions Technology headquarters in July 2026 to strengthen university-enterprise cooperation. Actions Technology's Chairman & CEO Dr. Zhou Zhenyu is a Zhejiang University alumnus. Both parties agreed to deepen cooperation in technology innovation, research translation, talent cultivation, and student employment.
• 驊訊電子 (C-Media Electronics)strategicStrategic or Co-development Partner · 13 September 2024Joint development of Xear™ 7.1.4 3D Panoramic Audio wireless gaming headset solution. Actions Technology provides low-latency high-quality wireless audio SoC chips while C-Media provides Xear™ 3D panoramic spatial audio algorithms and 7.1-channel audio processing drivers. The solution supports 360-degree head tracking, dual-mode 2.4G+BT coexistence for real-time mixing, and is already in mass production.
• CyweeMotion (咸兑科技)strategicTechnology or Integration · 25 July 2024Long-term strategic partnership for AI motion sensing solutions on Actions Technology smart watch platforms. CyweeMotion's AI Motion algorithm models are deeply adapted to Actions' SoC platforms, providing features including all-day health monitoring, gesture interaction, sports tracking, and sleep monitoring. The combination has been adopted in products from Honor, realme, Nothing, and KOSPET.
• VeriSilicon (芯原股份)coreTechnology or Integration · 15 May 2024Actions Technology's smart watch SoC chips (ATS3085S and ATS3089 series) integrate VeriSilicon's low-power 2.5D GPU IP for vector graphics rendering. The GPU supports LVGL library, SVG rendering via VGLite API, and has extended support for Baidu Maps and offline map formats, providing high-quality GUI display performance for smart wearables.
• 熵码科技 (PUFsecurity)strategicTechnology or Integration · 6 June 2023Actions Technology obtained PUFsecurity's chip security root IP (PUFrt) for hardware-level security design. PUFrt combines Physical Unclonable Function (PUF), One-Time Programmable (OTP) memory, True Random Number Generator (TRNG), and anti-tamper design to provide high-quality, unclonable cryptographic keys and secure storage for wireless Bluetooth and IoT applications.

Scale indicators5 records

Recent moves7 records

Expansion highlights6 records

Direct peers

• Ceva, Inc. Ceva is a leading licensor of wireless connectivity and smart sensing IP, including Bluetooth IP that is integrated into Actions Technology's wireless audio SoCs via a long-standing technology partnership. While Ceva sits upstream as an IP provider, its Bluetooth platform competes with and complements Actions' own wireless audio SoC business, making it the closest technology comparable.
• Cirrus Logic: Cirrus Logic designs high-performance, low-power ICs for audio and voice applications, including smart codecs, boosted amplifiers, and haptic solutions for premium smartphones, headsets, and wearables. It directly competes with Actions Technology in the consumer audio IC market serving similar brand customers including premium audio OEMs.
• Airoha Technology: Airoha is a MediaTek subsidiary focused on Bluetooth audio SoCs, TWS earbud chips, and wireless headset solutions, competing head-to-head with Actions Technology's ATS series for the same audio brand design wins including TWS and gaming headset customers.
• Bestechnic (博通集成): Bestechnic is a leading Chinese fabless semiconductor company specializing in Bluetooth audio SoCs and wireless communication chips for TWS earbuds, Bluetooth speakers, and smart wearables, competing directly with Actions Technology's ATS2835, ATS3031, and ATS3025 product families.
• Bluetrum Technology (中科蓝讯): Bluetrum is a Chinese STAR Market-listed fabless chip designer focused on Bluetooth audio and AIoT SoCs, serving many of the same mid-tier audio brands (Anker, Baseus, and other Chinese OEMs) as Actions Technology and competing on price-performance in the wireless audio and wearable chip market.
• Synaptics: Synaptics provides wireless connectivity, audio SoCs, and mixed-signal semiconductors for IoT, automotive, and consumer audio markets, including the legacy Conexant audio portfolio. It competes with Actions Technology in low-latency wireless audio and voice-processing SoCs for smart speakers, headsets, and IoT devices.
• Realtek Semiconductor: Realtek designs audio codecs, Bluetooth SoCs, and wireless connectivity ICs widely used in consumer audio, headphones, and computer peripherals. It is a direct competitor in the Bluetooth audio and wireless headphone SoC market, often serving the same Chinese and Taiwanese OEM/ODM customers as Actions Technology.

Broad incumbents

• Qualcomm Technologies: Qualcomm's Snapdragon audio platforms, S5/S7 Sound Platforms, and Bluetooth SoCs serve premium TWS, smart speakers, and headsets — competing in the same design wins as Actions Technology but as part of a much broader mobile and connectivity portfolio. Its scale and brand pull make it the dominant incumbent Actions Technology must displace at premium brands.
• MediaTek: MediaTek is a global fabless leader in mobile SoCs, smart wearables, smart home, and wireless connectivity (via its Airoha subsidiary). It competes with Actions Technology both directly (Airoha Bluetooth audio SoCs) and indirectly (smartwatch platforms, smartphone companion chips) across overlapping customer sets.

Emerging players

• Ambiq Micro: Ambiq designs ultra-low-power Apollo SoCs based on subthreshold power-optimized technology, targeting wearables, hearables, and edge AI devices — directly overlapping with Actions Technology's low-power wearable and edge AI positioning. It represents an emerging competitor in the milliwatt-class AI compute category where MMSCIM also plays.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks5 records

Key highlights7 records

Customer concentration

• Xx.com/actionstech
• LinkedInlinkedin.com/company/actions-technology-co-ltd

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Subsidiaries5 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Actions Technology Co.