Unitemp
UniTemp GmbH is a German manufacturer of vacuum soldering systems, RTP furnaces, hotplates, and bonding equipment serving semiconductor, MEMS, SiC, PV, and research customers including ASML, Micron, Osram, and Fraunhofer.
- Company typePrivate
- Founded2000
- HeadquartersPfaffenhofen An Der Ilm, Germany
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
What Unitemp does
UniTemp GmbH is a German manufacturer of vacuum soldering systems, rapid thermal processing (RTP) furnaces, hotplates, and miniaturized bonding equipment, founded in 2000 and headquartered in Pfaffenhofen an der Ilm, Bavaria. The company designs and builds capital equipment used in semiconductor/MEMS packaging, compound semiconductor (SiC) processing, photovoltaic manufacturing, and academic-industrial research, serving customers that include ASML, Micron, Osram, NexWafe, Fraunhofer, Max Planck, TU Delft, and CEA-Leti. Its product portfolio spans more than ten equipment families (RSS, VSS, HVS, RSO, RTP, VPO, HP, WB, PP, RV, MPS), with a focus on single-piece custom builds rather than standardized volume production.
The core technology stack centers on infrared-lamp-based heating, high-vacuum process chambers reaching 10^-6 hPa, formic-acid-assisted void-free soldering, and proprietary UniSoft control software integrated with Siemens SIMATIC automation. The company maintains an in-house mechanical workshop and software development team, enabling tight coupling between hardware and control systems. Newer platforms (VSS-650, SiC RTP, expanded WB-300-U) indicate active extension into larger substrate formats and compound-semiconductor thermal processing.
UniTemp operates a high-ASP, low-volume capital equipment business model: systems are quote-based, project-sold, and supported through a global distributor network covering the Americas, Europe, Asia, Australia, Russia, and Africa. The company is privately held by founders Michael Gerstmayer and Astrid Birkner, with a headcount of 11-50 employees and production capacity that has expanded from 1,000 m² (2015) to 1,600 m² (2025). Revenue is not publicly disclosed.
Unitemp firmographics
Firmographics- Name
- Unitemp
- Legal name
- UniTemp GmbH
- Website
- https://unitemp.de
- Company type
- Private
- Founded year
- 2000
- Operating status
- Operating
- Headcount range
- 11–50 employees
- Short description
- UniTemp GmbH is a German manufacturer of vacuum soldering systems, RTP furnaces, hotplates, and bonding equipment serving semiconductor, MEMS, SiC, PV, and research customers including ASML, Micron, Osram, and Fraunhofer.
- Ownership category
- akta.pro rank
Unitemp industry classification
Industry- Product category
- Semiconductor Manufacturing Equipment
- NAICS
- Industrial Process Furnace and Oven Manufacturing (333994)
- SIC
- Industrial Process Furnaces & Ovens (3567), Special Industry Machinery, Nec (3559)
- akta.pro primary industry
- Thermal Processing Equipment (Furnaces/RTP/Anneal) (HDAHAEAE)
- akta.pro secondary industries
- Heat Transfer Equipment (Heat Exchangers, Boilers, Condensers) (IMAHAEAC), Heat Exchangers & Thermal Transfer Equipment (IMAHAKAC)
Keywords
Where Unitemp is headquartered
LocationHeadquarters
- HQ city
- Pfaffenhofen An Der Ilm
- HQ country
- Germany
- HQ region
- Europe
Offices1 record
Markets served
Unitemp business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Supply Chain, Operations, Technology or R&D, Infrastructure, Marketing or Sales
Revenue model
- Thermal Processing Equipment Sales: Sale of vacuum furnaces, soldering systems, rapid thermal processing systems, heating plates, wire bonders, and die bonders to research institutions, semiconductor manufacturers, and solar companies. Products include custom configurations and standard tabletop models for R&D through small-scale production.
- Accessories and Options: Sale of accessories including water chillers, vacuum pumps, formic acid modules, thermocouples, gas lines, wafer holders, graphite susceptors, and safety equipment
- Service and Support: Customer area with login access for existing customers, suggesting ongoing service and support relationships
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | — | Custom quotation-based pricing |
Go-to-market motion1 record
Distribution channels1 record
Marketing channels3 records
Unitemp product offering
Product offeringCore offering
UniTemp GmbH develops and manufactures precision thermal processing equipment for research and small-scale production. The portfolio includes vacuum soldering systems (RSS, VSS, HVS series), rapid thermal processing/annealing furnaces (RTP, RSO, VPO series), heated chucks and hotplates, wire bonders, die bonders, and pick-and-place systems. Equipment is built around infrared lamp heating, SIMATIC controls, and proprietary UniSoft software, with in-house software development and mechanical workshop capabilities enabling custom configurations.
Product overview
UniTemp GmbH is a German manufacturer specializing in thermal process equipment for research and development and production applications. The company offers a comprehensive portfolio of precision thermal processing systems organized into four main product lines: (1) Vacuum Soldering Systems comprising the RSS-Serie (compact reflow soldering), VSS-Serie (vacuum soldering with flux capability), HVS-Serie (high vacuum sealers for MEMS packaging), and RSO-Serie (rapid thermal annealing/processing); (2) Laboratory Furnaces including the RTP-Serie (rapid thermal processing furnaces for wafers up to 8") and VPO-Ofen (vacuum process ovens up to 300mm wafers); (3) Heating Solutions with the HP-Serie (heated chucks and plates with vacuum fixation); and (4) Assembly Equipment featuring the WB-Serie (wire/wedge ball bonder), PP-Serie (die bonder/pick & place), RV-Serie (diamond scribing), and MPS (mini pick & place). All systems utilize IR lamp heating technology, incorporate proprietary UniSoft control software based on SIMATIC controls, and support various process gases (nitrogen, argon, formic acid for flux-free soldering, and hydrogen). The company maintains in-house software development and mechanical workshop capabilities, enabling customer-specific configurations and solutions.
Differentiator
Problem solved
Functional benefit
Products and services
- RSS-Serie (Reflow Soldering Systems) Compact tabletop reflow soldering systems for R&D, prototype manufacturing, and small-scale production, featuring vacuum capability and flux-free/lead-free soldering processes.
- VSS-Serie (Vacuum Soldering Systems with flux capability) Vacuum soldering systems that enable soldering processes with flux using a cover/lid system, supporting substrate sizes up to 600x600mm (VSS-650).
- HVS-Serie (High Vacuum Soldering Systems) 2-zone high vacuum sealers for hermetic sealing of MEMS packages with getter activation, achieving vacuum levels up to 10^-6 hPa.
- RSO-Serie (Rapid Thermal Annealing/Processing Systems) Vacuum process furnaces with IR heating for rapid thermal treatment of wafers and substrates up to 300mm.
- RTP-Serie (Rapid Thermal Process / Rapid Thermal Annealing Furnaces) Quick-heating vacuum laboratory furnaces for research and development applications, supporting wafers up to 8 inches, with an upcoming high-temperature variant for silicon carbide (SiC) applications.
- VPO-Ofen (Vacuum Process Oven) Laboratory furnace for vacuum processes supporting wafers up to 300mm with automatic vertical opening and closing.
- HP-Serie (Heating Plates / Heated Chucks) Heated chucks and heating plates for thermal treatment with wafer fixation via vacuum suction, including models suitable for plasma cleaning.
- WB-Serie (Wire Bonders) Combined wedge and ball wire bonder for wire bonding of semiconductors and electronic components.
- PP-Serie (Pick & Place / Die Bonder) Pick & Place and die bonder systems for flip-chip assembly of small and large components, ICs, capacitor chips, and resistor chips.
- RV-Serie (Manual Diamond Scribing Device) Manual diamond scribing device with camera system for precision cutting and separation of semiconductor materials.
- MPS (Mini Pick and Place System) Compact system for component placement and assembly in small-scale and prototype production.
Companies that use Unitemp
Customer profileNamed customers10 records
Segments4 records
Ideal customer profiles3 records
Unitemp technology and API
TechnologyTechnology focussed No
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature5 records
Unitemp partnerships and signals
Strategic signalPartnerships
One partnership is on record.
- Distributor NetworkcoreUniTemp maintains a global distributor network covering Americas, Europe, Asia, Australia & Oceania, and Russia to support international sales and customer service.
Scale indicators4 records
Recent moves11 records
Expansion highlights5 records
Unitemp competitors and assessment
Company assessmentDirect peers
- PVA TePla: German manufacturer of vacuum and RTP/RTA furnaces for semiconductor and MEMS applications. Highly comparable to UniTemp in product family (vacuum soldering, RTP, high-vacuum sealing) and customer base (semiconductor packaging and research).
- centrotherm international: German supplier of thermal processing systems for semiconductor, photovoltaic and advanced packaging markets. Directly comparable to UniTemp in vacuum/RTP furnace technology and customer overlap, especially in solar cell processing.
- Annealsys: French manufacturer of rapid thermal annealing (RTA/RTP) and thermal processing equipment for research and small-scale production. Comparable niche positioning to UniTemp with focus on R&D-grade RTP systems.
- BTU International: US-based supplier of thermal processing equipment for semiconductor packaging, including reflow and RTP systems. Comparable to UniTemp in reflow soldering and RTP product categories.
- TEMPRESS Systems: Netherlands-based supplier of RTP furnaces and thermal processing systems for semiconductor and photovoltaic industries. Directly competes with UniTemp in wafer-level rapid thermal processing.
- ATV Technologie GmbH: German maker of vacuum process furnaces and rapid thermal processing systems for semiconductor, MEMS and photovoltaic applications. Closely comparable to UniTemp's RTP and vacuum soldering portfolio.
- Koyo Thermo Systems: Japanese manufacturer of thermal processing systems, including rapid thermal annealers and diffusion furnaces for semiconductor manufacturing. Comparable in RTP and wafer thermal processing technology to UniTemp.
Broad incumbents
- Nabertherm: German maker of industrial and laboratory furnaces covering a wide temperature and application range. Comparable to UniTemp on vacuum process oven technology, though with a much broader industrial focus beyond semiconductors.
- Amtech Systems: US-headquartered supplier of thermal processing and wafer handling equipment for semiconductor and solar industries. Overlaps with UniTemp in RTP/diffusion furnace categories and shares solar/semiconductor end markets.
- Carbolite Gero: German manufacturer of laboratory and industrial furnaces including high-temperature and vacuum ovens. Overlaps with UniTemp in vacuum process ovens and laboratory RTP equipment but serves a broader industrial/R&D market.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat4 records
Key risks6 records
Key highlights6 records
Customer concentration
Unitemp social profiles
Digital presenceUnitemp financial estimates
Financial estimateRevenue estimate
Valuation estimate
Unitemp leadership team
Management profileNumber of profiles
Profiles2 records
Unitemp funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Unitemp M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Unitemp
What does Unitemp do?
UniTemp GmbH develops and manufactures precision thermal processing equipment for research and small-scale production. The portfolio includes vacuum soldering systems (RSS, VSS, HVS series), rapid thermal processing/annealing furnaces (RTP, RSO, VPO series), heated chucks and hotplates, wire bonders, die bonders, and pick-and-place systems. Equipment is built around infrared lamp heating, SIMATIC controls, and proprietary UniSoft software, with in-house software development and mechanical workshop capabilities enabling custom configurations.
Is Unitemp a public or private company?
Unitemp is a private company. It is classified as founder individual operated bootstrapped and is currently operating.
When was Unitemp founded?
Unitemp was founded in 2000. It employs 11 to 50 people.
Where is Unitemp based?
Unitemp is headquartered in Pfaffenhofen An Der Ilm, Germany, in the Europe region.
How does Unitemp make money?
Three revenue lines are on record. Thermal Processing Equipment Sales are the primary driver. The others are accessories and Options and service and Support.
Who are Unitemp's main competitors?
Direct peers on record are PVA TePla, centrotherm international, Annealsys, BTU International, TEMPRESS Systems, ATV Technologie GmbH and Koyo Thermo Systems. Broad incumbents are Nabertherm, Amtech Systems and Carbolite Gero.
Does Unitemp have an API?
No public API is recorded for Unitemp.
What industry is Unitemp in?
Unitemp's product category is Semiconductor Manufacturing Equipment. Its primary akta.pro industry code is HDAHAEAE, Thermal Processing Equipment (Furnaces/RTP/Anneal), with a secondary code of IMAHAEAC, Heat Transfer Equipment (Heat Exchangers, Boilers, Condensers). Its NAICS code is 333994 and its SIC code is 3567.