Name

Synic Solution

Legal name

Synic Solution Co., Ltd.

Website

https://synic.co.kr

Company type

Public

Founded year

2005

Operating status

Operating

Headcount range

11–50 employees

Ownership category

akta.pro rank

Product category

Semiconductor Design Services

NAICS

Other Measuring and Controlling Device Manufacturing (334519), Computer Systems Design and Related Services (54151), Industrial Design Services (54142)

SIC

Measuring & Controlling Devices, Nec (3829), Services-Computer Integrated Systems Design (7373)

akta.pro primary industry

Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification) (HDAHACAJ)

akta.pro secondary industries

General-Purpose Logic & Microcontrollers (MCU/MPU) (HDAHAAAA), Analog Front-End (AFE) ICs (Sensor/Medical/Industrial AFE) (HDAHAIAJ), Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Semiconductor design services
• Foundry services
• Payment SoC solutions
• MEMS sensor ICs
• System IC design house

Headquarters

HQ city

Gyeongju

HQ country

South Korea

HQ region

Asia

Offices5 records

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Technology or R&D, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Foundry Design Solutions: Design services providing optimized design solutions for fabless customers across 8-inch and 12-inch foundry platforms. Services cover design services (Full Custom ASIC, Analog Design, B/E Technical Support), foundry services (CMOS, GaN & SiC, MEMS, Silicon Photonics), and turn-key services including wafer supply, mass production management, packaging, testing, and reliability services. Over 70% of projects transition to mass production.
2. Sensor Products (MEMS, SWIR, Ultrasonic): Development and mass production of sensor products including MEMS microphone sensors, SWIR sensors, and ultrasonic sensors, as well as ROIC components. Revenue is generated through product sales and joint development arrangements with strategic foundry partners.
3. SoC / Payment Semiconductor Products: Sale of proprietary SoC products including SKY7000 integrated payment systems, SKY3700B magnetic stripe reader ICs, and SKY5000 smart card reader ICs. Also includes PUF-based security SoC ICs for payment terminals. Products are sold directly or through OEM/embedded arrangements with terminal manufacturers.

Go-to-market motion1 record

Distribution channels4 records

Marketing channels4 records

Core offering

Synic Solution is a system semiconductor design house providing end-to-end design services (RTL design, platform design, FPGA verification, layout, packaging and test Levels 0–3), foundry services across CMOS, GaN/SiC, MEMS and Silicon Photonics processes, and turn-key services from wafer supply through mass production management. The company also sells proprietary IC products including the SKY7000 integrated payment system, SKY3700B magnetic stripe reader IC, SKY5000 smart card reader IC, MEMS microphone sensors, Ge-on-Si SWIR sensors, ultrasonic sensors, ROICs, and a PUF-based security SoC IC.

Product overview

Synic Solution operates as a Total System IC Solution Provider offering a comprehensive portfolio of products and services across two main divisions: Foundry Solutions (Design Services, Turn-key Services, and Sensor Services) and SoC Solutions (Payment Solutions and SoC Platforms). The product lineup includes integrated payment systems (SKY7000), payment IC chips (SKY3700B magnetic stripe reader, SKY5000 smart card reader), and various sensors (MEMS microphone sensors, SWIR sensors, ultrasonic sensors) with associated ROIC components. Services span from RTL design and platform design through FPGA verification, layout, packaging, test, and full turn-key semiconductor solutions. The company recently launched a PUF-based security single-chip IC in 2026 integrating MSR, SCR, QR payment, MCU, and security functions into one chip for AI-era payment terminals.

Differentiator

Problem solved

Functional benefit

Products and services

• Design Services End-to-end system semiconductor design services covering Level 0–3, from architecture specification and RTL coding through synthesis, physical implementation, tape-out, mask tooling, fabrication, packaging and test. Targeted at fabless semiconductor companies requiring design expertise across CMOS, GaN, SiC, MEMS and Silicon Photonics processes on 8-inch and 12-inch foundries.
• Foundry Services Foundry services spanning CMOS Foundry, GaN & SiC Foundry, MEMS Foundry, and Silicon Photonics Foundry, leveraging partnerships with global foundries including SK hynix System IC and Renesas to provide optimal process solutions for fabless customers.
• Turn-key Services Comprehensive turn-key semiconductor services including product engineering (wafer supply, foundry mass production management, supply chain management), packaging services, test services (wafer probe, final package test, failure analysis) and reliability services for fabless semiconductor customers.
• Sensor Services Sensor product development and mass production services including identifying foundries with suitable facilities, modifying fabless processes to CMOS-friendly foundry processes, and supporting special processes not available at foundries. Covers MEMS, SWIR and ultrasonic sensor applications.
• SKY7000 Integrated Payment System Korea's only integrated payment system combining Smart Card Reader IC (SKY5000/5100), Magnetic Stripe Reader (SKY3700B), and Renesas RZ/G2UL CPU on a single multi-payment support board. Designed for POS terminals, kiosks, ATMs and barcode payment terminals, supporting EMV Level 1 certification.
• SKY3700B Magnetic Stripe Reader IC Single-chip magnetic stripe decoding IC integrating all analog and digital circuits, with support for 3-track simultaneous decoding, bidirectional card reading, wide swipe speed range (5–150 cm/s), TDES and AES-128 encryption, and DUKPT key management. Designed for payment terminal manufacturers.
• SKY5000 Smart Card Reader IC IC card reader MCU chip fully compliant with ISO-7816 and EMV standards, featuring a 32-bit RISC CPU (Cortus APS23) up to 48MHz, 2-channel ISO-7816 interface, USB 2.0, and full EMV4.1 and ISO-7816 compliance. The only domestically developed chip in Korea with both EMV Level 1 and Level 2 certification.
• PUF-based Security Single-Chip IC Physical Unclonable Function (PUF) based security chip integrating MSR (Magnetic Stripe Reader), SCR (Smart Card Reader), QR payment, MCU, and security functions on a single die for next-generation payment terminals. Features unique per-chip security values generated from semiconductor manufacturing variations and tamper detection capability.
• BLE-based AI SoC Platform SoC platform integrating a Bluetooth Low Energy (BLE) communication-based lightweight AI engine designed to maximize efficiency and performance while minimizing power consumption. Targeted at IoT and smart home device manufacturers.
• Intelligent Payment Terminal SoC Platform SoC platform for intelligent payment terminals with integrated encryption accelerator that efficiently processes cryptographic operations to enhance security and ensure safe transactions. Targeted at payment terminal OEMs requiring enhanced hardware security.
• MEMS Microphone Sensor (MCA5300) MEMS microphone sensor (MCA5300) for low-power, high-performance voice recognition in smartphones, wearables, automotive, military, and medical devices. Features SNR 65–67 dBA, ultra-compact design with customer-customizable design library.
• Ge-on-Si SWIR Sensor Germanium-based short-wavelength infrared (SWIR) image sensor detecting 0.9μm–2.5μm wavelengths using semiconductor MEMS processes. Cost-effective alternative to InGaAs sensors (1/10–1/20 the cost), enabling 12-inch wafer processes. Applications include autonomous driving, ADAS, semiconductor inspection, defense, consumer electronics, and robotics.
• MEMS Ultrasonic Sensor MEMS-based ultrasonic sensor using eco-friendly silicon technology for high performance, miniaturization, low power, and low cost. Targets medical devices, beauty equipment, and physical AI applications with 6-inch and 8-inch mass production processes.
• ROIC (Read-Out Integrated Circuit) Signal processing readout integrated circuit for sensor arrays, including ROICs for SWIR sensors and ultrasonic sensors, designed based on foundry PDKs and delivered to customers for integration with sensor arrays.

Quantifiable outcome

• Over 70% of projects transition to mass production
• +3 more outcomes

Named customers5 records

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability11 records

Feature10 records

Partnerships

Ten partnerships are on record, tiered core, strategic and supporting.

• Renesas Electronics CorporationcoreStrategic or Co-development Partner · 1 May 2024Selected as an official RENESAS IDH (Independent Design House) partner in May 2024. Renesas CPU (RZ/G2UL) is integrated into Synic Solution's SKY7000 integrated payment system. The partnership enables provision of Renesas-based payment solutions to the market.
• Elevation Microsystems (USA)strategicStrategic or Co-development Partner · 1 January 2024US-based fabless company in which Synic Solution and a global US company made initial equity investments. Also received strategic investment from Hyundai Mobis. Collaboration spans automotive and power semiconductor design, robotics, and automotive sensor fields, aligning with global automotive semiconductor self-reliance strategies.
• Stratio (STRATIO, INC.)coreStrategic or Co-development Partner · 1 January 2024Infrared AI specialist company ranked 2nd in the 2025 AI Champion Competition organized by Ministry of Science and ICT. Strategic MOU for joint development of Ge-on-Si SWIR sensors, ROIC development, mass production process support, and sensor packaging development. Applied to home appliances, medical, automotive, defense, and robotics markets.
• Cortus (France)coreTechnology or Integration · 1 January 2023French automotive chip design specialist collaborating with Synic Solution to provide RISC-V based SoC development platforms and IP/solutions to automotive customers including completed vehicle manufacturers.
• SK hynix System IC (SK하이닉스시스템IC)coreStrategic or Co-development Partner · 1 January 2019Foundry design house designated in 2019 (following 2013 foundry special sales contract and 2009 MagnaChip designation). Synic Solution is the only domestic design house for SK hynix System IC, providing foundry solutions for image sensors, power management ICs, and MEMS processes. Named as technology and cooperation excellent partner. SK hynix System IC's 8-inch 90nm BSI process is used for high-volume production.
• Stratio (Korea subsidiary)strategicStrategic or Co-development PartnerKorean subsidiary of Stratio Inc. partnered for Ge-on-Si SWIR sensor camera system development (2024-2027) under a national R&D project.
• eMemory Technology Inc. (力積電)supportingTechnology or IntegrationTaiwan-based non-volatile memory IP company; logo listed as a partner on Synic Solution's website, indicating technology and integration partnership for semiconductor design solutions.
• PUF SecuritysupportingTechnology or IntegrationSecurity IP company; logo listed as a partner on Synic Solution's website. PUF (Physical Unclonable Function) technology is relevant to Synic Solution's PUF-based security SoC IC development.
• Wafer Works (合晶科技)supportingTechnology or IntegrationTaiwan-based silicon wafer manufacturer; logo listed as a partner on Synic Solution's website, indicating wafer supply partnership for foundry operations.
• SK Powertek (SK파워텍)strategicChannel Partner/ Reseller/ DistributorSynic Solution signed a foundry distribution agreement with SK Powertek in 2024, expanding its power semiconductor foundry offerings through this channel partnership.

Scale indicators8 records

Recent moves12 records

Expansion highlights6 records

Direct peers

• Nuvoton Technology: Nuvoton is a Taiwan-based fabless IC design company (spun off from Winbond) specializing in microcontrollers, audio, and cloud networking ICs. Comparable to Synic Solution's MCU/SoC platforms and BLE-based low-power AI SoC development, with overlapping customer segments in industrial and IoT.
• Alchip Technologies: Alchip is a Taiwan-headquartered ASIC design services provider specializing in high-performance computing, AI, and networking ASICs. It is comparable to Synic Solution's foundry design services model and fabless customer base, operating at substantially larger scale.
• Global Unichip Corp (GUC): GUC is a leading Taiwan-based ASIC design services company providing end-to-end chip design from spec to mass production. Comparable to Synic Solution in delivering foundry-bound ASIC solutions to fabless customers, with an overlapping portfolio of advanced-node and mixed-signal design programs.
• VeriSilicon Holdings: VeriSilicon is a leading ASIC design service provider and semiconductor IP licensor. It directly mirrors Synic Solution's turnkey chip design services model (RTL-to-tape-out, PDK-based enablement), SoC platform approach, and global fabless customer base across China and the US.
• Holtek Semiconductor: Holtek is a Taiwan-based fabless IC design company specializing in microcontrollers and consumer/industrial SoCs. Comparable to Synic Solution in its fabless design services model, MCU and low-power SoC platforms, and customer overlap in IoT and consumer applications.
• Faraday Technology Corporation: Faraday is a Taiwan-based ASIC design services and IP provider serving fabless customers with end-to-end design, verification, and turnkey chip production. It is directly comparable to Synic Solution's design services business and foundry-partnership driven model in the broader Asia foundry ecosystem.
• ABOV Semiconductor: ABOV Semiconductor is a Korean fabless IC design company specializing in microcontrollers, ASICs, and mixed-signal ICs for consumer and industrial applications. It is a directly comparable Korean fabless design house serving similar domestic customers and overlapping with Synic's MCU and mixed-signal SoC platforms.
• Chipsbank Microelectronics: Shenzhen Chipsbank is a Chinese fabless IC design company specializing in payment, security, and battery management SoCs. Directly comparable to Synic Solution's SKY7000/SKY5000/SKY3700B payment series in target market, EMV-certified secure payment chips, and POS terminal customer base.

Others

• eMemory Technology: eMemory is a Taiwan-based NVM IP (NeoBit/NeoEE/NeoMTP) provider listed as a partner on Synic Solution's website. Comparable as an enabling IP ecosystem participant supplying embedded NVM IP used in Synic's designs, rather than as a direct competitor.

Broad incumbents

• Renesas Electronics: Renesas is a major Japanese IDM and global MCU/SoC leader. Synic Solution is an official Renesas IDH partner (May 2024) and integrates Renesas RZ/G2UL CPU in its SKY7000 payment platform, positioning Renesas as the broader incumbent incumbent in their partnership ecosystem.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/synic-solution

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Subsidiaries4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Synic Solution