dyconex

What dyconex does

Dynconex is a Swiss-headquartered specialist manufacturer of miniaturized, high-density interconnect solutions for medical devices and other high-reliability electronics, operating as the MedTech Business Unit within Italy-based SOMACIS Group. The company designs and manufactures flexible HDI printed circuit boards, rigid-flex PCBs, IC substrates (ultra-HDI), and LCP-based flexible substrates with line/space capabilities down to 8/8 µm, laser-drilled microvias down to 25 µm, and 16-layer rigid-flex constructions using proprietary Semi Additive Process (mSAP/SAP) technology, the registered DYCOstrate® microvia plasma process, and DYCOre® BGA interposer technology. Production is conducted under ISO Class 10,000 clean room conditions to IPC Class 3 standards, with material traceability mandated for ISO 13485 medical device certification, EN 9100 aerospace, and IATF 16949 automotive compliance.

Revenue is generated through two principal streams: (1) PCB manufacturing and sales covering prototype development, small-batch production, and scalable high-volume series production for medical OEMs; and (2) engineering and R&D services including design support, feasibility studies, DFM reviews, test development, and process transfer to series production. Pricing is not publicly disclosed; quotes are provided based on design complexity, materials, volumes, and qualification requirements, reflecting a B2B custom-engineering model with long product lifecycles typical of regulated medical device supply chains.

Operations span three countries: engineering and prototyping at the 6,000 m² headquarters in Bassersdorf, Switzerland (including 600 m² of clean rooms); scalable series production in Ansan, South Korea (via subsidiary AIRMEDTEC Korea, 20+ years of manufacturing experience); and customer coordination in Graz, Austria (AIRMEDTEC GmbH). Global sales coverage spans Europe (Germany, Switzerland, Austria, Finland, Israel, Spain), North America (Baltimore MD, Seattle WA, Chicago IL), and Asia-Pacific (Malaysia, Singapore). Since Q2 2026, DYCONEX and the acquired AIRMEDTEC have been consolidated into a unified MedTech Business Unit under the DYCONEX brand within SOMACIS Group, which has over 800 employees globally across facilities in Italy, the USA, and China.

Name

dyconex

Legal name

DYCONEX AG

Website

https://dyconex.com

Company type

Private

Founded year

1991

Operating status

Operating

Short description

Dyconex is a Swiss-based specialist manufacturer of miniaturized high-reliability PCBs and interconnect solutions — including flex, rigid-flex, IC substrates, and LCP-based substrates down to 8/8 µm line/space — for medical device OEMs and other high-reliability industries, operating as the MedTech Business Unit of Italy's SOMACIS Group.

Ownership category

akta.pro rank

Product category

High-reliability PCB manufacturing

NAICS

Bare Printed Circuit Board Manufacturing (334412)

SIC

Printed Circuit Boards (3672)

akta.pro primary industry

Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK)

akta.pro secondary industry

Industrial PCB & Substrate Components (Bare PCBs, rigid-flex, ceramic substrates, thick-film) (IMAGAJAM)

Keywords

• Flexible printed circuits
• Rigid-flex PCBs
• LCP flexible substrates
• Ultra-HDI IC substrates
• Medical PCB manufacturing

Headquarters

HQ city

Bassersdorf

HQ country

Switzerland

HQ region

Europe

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Infrastructure, Supply Chain, Marketing or Sales

Revenue model

1. PCB Manufacturing and Sales: DYCONEX generates revenue through design, development, and manufacturing of advanced printed circuit boards and interconnect solutions. Revenue comes from prototype development, small-batch production, and scalable high-volume series production for medical technology and high-reliability industries. Services include engineering support, R&D partnership, testing and inspection, and logistics.
2. Engineering and R&D Services: Engineering services including design support, feasibility studies, DFM reviews, prototype development, test development, EMC/EMI evaluation, process transfer to series production, time-to-market management, and total cost/end-of-life management.

Go-to-market motion2 records

Distribution channels4 records

Marketing channels5 records

Core offering

Dyconex designs, engineers, and manufactures miniaturized, high-density printed circuit boards and interconnect solutions — including flexible HDI circuits, rigid-flex PCBs, ultra-HDI IC substrates, and LCP-based flexible substrates — for medical devices and other high-reliability electronic applications. The company supports customers from early design input through prototyping to scalable series production, operating under ISO 13485, EN 9100, and IPC Class 3 standards in ISO Class 10,000 clean rooms, with capabilities reaching line/space dimensions down to 8/8 µm.

Product overview

DYCONEX offers a comprehensive portfolio of miniaturized, high-reliability interconnect solutions for medical technology and other high-reliability industries. The core product line includes Flexible HDI Printed Circuit Boards, Rigid-Flex PCBs, IC Substrates (Ultra-HDI), and LCP-Based Flexible Substrates. These products are supported by advanced technology platforms including Semi Additive Process (SAP) technology enabling 8/8 μm line/space capabilities, comprehensive Miniaturization Technologies, and Advanced Materials including biocompatible substrates. The portfolio is completed by engineering services (R&D Engineering, Design Guidelines) and manufacturing capabilities across Swiss and South Korean facilities.

Differentiator

Problem solved

Functional benefit

Products and services

• Flexible HDI Printed Circuit Boards Ultra-fine, miniaturized flexible printed circuit boards using polyimide materials and advanced micro-structuring technologies that enable tight bending radii while maintaining electrical performance. Designed for medical device OEMs requiring extreme miniaturization and high reliability.
• Rigid-Flex PCBs One continuous board combining rigid mounting zones with flexible interconnects, eliminating connectors and reducing assembly steps for improved reliability in space-constrained medical devices. Supports up to 16 total layers with impedance-controlled transmission lines.
• IC Substrates (Ultra-HDI) Ultra-HDI substrate technology for advanced semiconductor packaging and chip-level integration with extremely fine structures, high I/O density, and reliable interconnect architectures for medical and high-reliability applications.
• LCP-Based Flexible Substrates High-performance Liquid Crystal Polymer (LCP) based flex circuits offering extremely low moisture absorption, stable dielectric properties over frequency and temperature, high chemical resistance, and excellent dimensional stability for high-frequency and implantable medical applications.
• Semi Additive Process (SAP / mSAP) Technology Advanced mSAP/SAP process technology enabling ultra-fine circuit structures with line and space dimensions down to 8/8 µm for next-level miniaturization. Suitable for both rigid and flexible substrates with surface finishes including ENIG, ENEPIG, OSP, DIG, and electroplated Ni/Au.
• Miniaturization Technologies Comprehensive set of manufacturing technologies including mSAP fine-line structuring, laser-drilled microvias from Ø 25 µm, advanced packaging, and engineered bending zones for extreme density interconnects. Targeted at medical device OEMs requiring the smallest form factors.
• Advanced Materials Qualified portfolio of advanced substrate materials including LCP, medical-grade polyimides, ultra-thin rigid substrates, and precious metals (gold, platinum) for implantable and patient-connected medical devices.
• R&D Engineering Services Engineering services from early design input through layout, materials selection, testing, and process development. Services include design support, feasibility studies, DFM reviews, prototype development, test development, EMC/EMI evaluation, process transfer to series production, and time-to-market management.
• High-Reliability PCB Manufacturing Manufacturing services combining Swiss engineering expertise with scalable production in South Korea under clean room conditions (ISO Class 10,000) and IPC Class 3 standards, with 100% electrical testing and complete material traceability for every PCB.

Quantifiable outcome

• Lines/spaces down to 8/8 µm with SAP technology
• +4 more outcomes

Named customers2 records

Segments6 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature12 records

Partnerships

Five partnerships are on record, tiered core and minor.

• inspire AGcoreStrategic or Co-development Partner · 1 January 2026Joint research partnership with inspire AG (strategic partner of ETH Zurich) focused on microvia reliability in HDI PCBs. Combined electrical stress testing, microstructural analysis (SEM, electron backscatter diffraction), and simulation-based modeling. Project delivered insights into copper microvia failure modes including shoulder cracking, base copper separation, and sleeve cracking. Developed physics-based damage model linking microscale void growth to electrical resistance increase.
• AIRMEDTECcoreStrategic or Co-development Partner · 1 January 2024Since Q2 2026, SOMACIS Group brought DYCONEX and AIRMEDTEC together in a unified MedTech Business Unit under the DYCONEX brand. This integration brings together complementary capabilities, technologies, and regional strengths within one organizational structure focused on the medical technology sector. AIRMEDTEC's advanced PCB expertise combined with DYCONEX's engineering excellence creates a stronger platform for advanced interconnect solutions, long-term manufacturing stability, and reliable support for medical technology customers. Both companies acquired by SOMACIS Group in 2024-2025.
• 3D-MID e.V.minorStrategic or Co-development Partner · 1 January 2008Partnership with 3D-MID e.V. (established driver of MID technology for over 15 years) to explore molded interconnect devices for medical and defense sectors. DYCONEX investigated 3D MID technology for applications requiring 3D alignment precision in low- to mid-complexity designs.
• AIMM Lab (Chair of Artificial Intelligence in Mechanics and Manufacturing, ETH Zurich)minorStrategic or Co-development PartnerResearch partner that provided experimental facilities for microvia reliability research project. Located at ETH Zurich, contributing to joint project understanding of microvia behavior under cyclic thermal loading.
• GS Swiss PCBminorStrategic or Co-development PartnerPartnership created 2002-2004 with GS Swiss PCB in Küssnacht equipped with DYCONEX technology as extended manufacturing capacity. Collaboration served as extended workbench and increased production capacity to meet demand from large customers.

Scale indicators9 records

Recent moves9 records

Expansion highlights7 records

Broad incumbents

• AT&S (Austria Technologie & Systemtechnik AG): Austrian-headquartered global PCB and IC substrate manufacturer with HDI, substrate-like-PCB, and advanced packaging capabilities. Comparable as a European-headquartered advanced PCB incumbent with overlapping HDI/IC substrate technology, though serving a much broader end-market portfolio.
• Unimicron Technology Corp: Taiwanese PCB leader with strong IC substrate and HDI substrate capabilities for semiconductor packaging and advanced electronics. Comparable on the IC substrate / ultra-HDI technology axis, though focused on much higher-volume semiconductor packaging end-markets.
• TTM Technologies: Large US-headquartered PCB manufacturer with advanced HDI, rigid-flex, and high-reliability product lines serving aerospace/defense, medical, industrial, and networking. Comparable as a broad incumbent with explicit medical and aerospace exposure and overlapping advanced flex/rigid-flex capabilities.
• Multek (a Flex company): Global PCB manufacturer with HDI, rigid, flex, rigid-flex, and substrate capabilities, part of Flex (the EMS giant). Comparable as an advanced PCB manufacturer with overlapping flex/HDI capabilities serving industrial, medical, and communications end-markets.
• Ibiden Co., Ltd. Japanese PCB manufacturer with leading IC substrate and high-end HDI capabilities for semiconductor packaging and advanced electronics. Comparable as a high-end advanced-PCB incumbent, particularly on the IC substrate technology axis.

Direct peers

• MFS Technology (Multi-Fineline Electronix): Specialist flexible printed circuit and sub-assembly manufacturer serving mobile, consumer, and industrial markets. Highly comparable as a dedicated flex PCB specialist with overlapping flex-circuit capabilities.
• NCAB Group: PCB sourcing specialist with deep focus on high-reliability segments (medical, aerospace, industrial) and a global factory network. Comparable as a high-reliability PCB specialist operating in the same regulated end-markets, though NCAB is a sourcing/fabricator-management model rather than a manufacturing owner.
• Trackwise Designs: UK-based specialist in flex and rigid-flex printed circuits, including very long multi-layer flex PCBs for medical, aerospace, and industrial applications. Directly comparable as a Western specialist fabricator focused on high-reliability flex circuits serving regulated end-markets.
• Career Technology (MFLEX): Taiwanese/Hong Kong-headquartered flex PCB manufacturer with strong HDI flex and rigid-flex capabilities serving mobile, consumer, automotive, and industrial markets. Comparable as a flex-circuit specialist with overlapping advanced flex and rigid-flex technology.

Emerging players

• Shennan Circuits: Chinese PCB manufacturer with growing HDI, substrate, and high-reliability PCB capabilities serving communications, automotive, and industrial markets. Comparable as an emerging advanced-PCB player investing in higher-end capabilities that may overlap with DYCONEX's end-markets.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/dyconex

Compliance8 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles13 records

Subsidiaries3 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about dyconex