TESCAN GROUP a.s.

What TESCAN GROUP a.s. does

TESCAN GROUP a.s., headquartered in Brno, Czech Republic, develops and manufactures advanced microscopy and imaging systems for nanoscale scientific and industrial analysis. Founded in 1991 by a team of five engineers, the company has grown to approximately 1,000 employees across 11 countries, with nearly 4,500 systems installed in over 80 countries. Its product portfolio spans scanning electron microscopes (SEMs: VEGA, MIRA, MIRA XR, CLARA, MAGNA, TIMA), focused ion beam-scanning electron microscopes (FIB-SEM: AMBER 2, AMBER X 2, SOLARIS 2, SOLARIS X 2), micro-computed tomography systems (UniTOM HR 2, UniTOM XL, CoreTOM, DynaTOM, Spectral), 4D-STEM (TENSOR), and femtosecond laser ablation systems (FemtoChisel). These platforms serve materials science, semiconductor failure analysis, battery and energy storage research, life sciences, geoscience, and emerging quantum technology applications.

The company operates an enterprise direct-sales model supplemented by a global distributor network and regional demo laboratories, including a newly opened facility in Seoul, Korea. Revenue is generated primarily through high-value capital equipment sales (typically $1M+ per system), complemented by software licensing (both perpetual and demo licenses for the Essence software platform), recurring maintenance contracts, and professional training delivered through the TESCAN Academy. Customer engagement spans academic research institutions, universities, and industrial R&D departments across the named segments. TESCAN has integrated AI-assisted capabilities into specific workflows, including AI-driven noise reduction (Panthera AI), automated lamella preparation (TEM AutoPrep Pro), and machine-vision navigation in FemtoChisel systems.

TESCAN's recent strategic trajectory has been shaped by a major ownership transition. Following a 2022 majority investment by The Carlyle Group, the company executed a series of acquisitions in 2024 (FemtoInnovations, TESCAN KOREA, DML, plus new APAC subsidiaries in Taiwan and Singapore) and launched new products including FemtoChisel (November 2025) and CLARA (July 2026). A definitive agreement for Carlyle's sale to Shimadzu Corporation was announced January 5, 2026, and the full acquisition closed on July 7, 2026, making TESCAN a wholly-owned subsidiary operating under the brand identity 'TESCAN, A Shimadzu Company.'

Name

TESCAN GROUP a.s.

Legal name

TESCAN GROUP, a.s.

Website

https://tescan-usa.com

Company type

Private

Founded year

1991

Operating status

Operating

Short description

TESCAN GROUP a.s. is a Czech-based scientific instrumentation company developing electron microscopy, FIB-SEM, micro-CT, 4D-STEM, and femtosecond laser systems for materials science, semiconductor, battery, life sciences, and industrial research customers in over 80 countries.

Ownership category

akta.pro rank

Product category

Scientific Instrumentation - Electron Microscopy

NAICS

Analytical Laboratory Instrument Manufacturing (334516), Navigational, Measuring, Electromedical, and Control Instruments Manufacturing (33451), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515)

SIC

Laboratory Analytical Instruments (3826), X-Ray Apparatus & Tubes & Related Irradiation Apparatus (3844)

akta.pro primary industry

Microscopy, Imaging & Flow Cytometry Instruments (HLAGAIAE)

akta.pro secondary industries

Analytical Instruments & Chromatography Systems (HLAGAIAA), Metrology, Inspection & Process Control Equipment (HDAHAEAH), Ion Implantation & Doping Equipment (HDAHAEAD)

Keywords

• Electron microscopy instruments
• FIB-SEM systems
• Micro-CT imaging
• Semiconductor failure analysis
• 4D-STEM nanocharacterization

Headquarters

HQ city

Brno

HQ country

Czechia

HQ region

Europe

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Scientific Instrumentation Hardware Sales: Sale of high-performance electron microscopy systems including SEM, FIB-SEM, micro-CT, STEM, and laser platforms. Products are sold as complete systems with associated software.
2. Software Licenses and Maintenance: Software licensing including purchased perpetual licenses and demo licenses with time-limited access. Maintenance services provided including bug fixes, remote system management, and technical support.
3. Professional Services and Training: Tescan Academy provides training programs and the Tescan Collaboration Network supports peer exchange. On-site technical support services available for customers.

Pricing tiers

Go-to-market motion3 records

Distribution channels5 records

Marketing channels8 records

Core offering

TESCAN GROUP a.s. designs, manufactures, and sells advanced electron and ion-beam microscopy systems for scientific and industrial analysis. The portfolio includes Scanning Electron Microscopes (SEM), Focused Ion Beam-SEM systems (FIB-SEM), X-ray micro-CT systems, a 4D-STEM platform, femtosecond laser sample preparation systems, and ex-situ lift-out and ion implantation solutions, sold as complete instruments with bundled software to research institutions, universities, and industrial customers.

Product overview

Tescan is a global scientific instrumentation company offering an integrated portfolio of advanced imaging and analysis solutions. The product architecture centers on multiple electron microscopy platforms (SEM Solutions: VEGA, MIRA, MIRA XR, CLARA, MAGNA, TIMA) and FIB-SEM systems (AMBER 2, AMBER X 2, SOLARIS 2, SOLARIS X 2) that combine high-resolution imaging with precision material modification capabilities. Micro-CT solutions (UniTOM HR 2, UniTOM XL/CoreTOM, DynaTOM, Spectral) provide non-destructive 3D and 4D imaging. The portfolio extends to TENSOR 4D-STEM for analytical microscopy, FemtoChisel femtosecond laser for semiconductor sample prep, EXLO ex-situ lift-out solutions, and specialized ion implantation systems (Quiin, NanoSpace). Supporting add-ons include Panthera AI noise reduction, Essence software with automation tools, EBL Kit for electron beam lithography, and Nanomanipulator/Orage 2 for TEM preparation. The platform-plus-modules architecture enables customers to select core instruments and add specialized capabilities for their specific research workflows in materials science, semiconductors, life sciences, batteries, and geoscience.

Differentiator

Problem solved

Functional benefit

Brands

• Tescan VEGA: SEM platform offering.
• Tescan MIRA
• Tescan MIRA XR
• Tescan CLARA
• Tescan MAGNA
• Tescan TIMA
• Tescan AMBER 2
• Tescan AMBER X 2
• Tescan SOLARIS 2
• Tescan SOLARIS X 2
• Tescan UniTOM HR 2
• Tescan UniTOM XL / CoreTOM
• Tescan DynaTOM
• Tescan Spectral
• Panthera AI
• Tescan TENSOR
• Tescan FemtoChisel
• Tescan EXLO
• Tescan Quiin
• Tescan NanoSpace
• Tescan Essence
• Tescan Orage 2
• Tescan Aura

Products and services

• Tescan VEGA SEM platform providing high-resolution imaging and surface analysis for materials research and industrial quality control.
• Tescan MIRA FEG-SEM platform for high-resolution imaging and surface analysis with exceptional contrast and detail for materials research and analytical applications.
• Tescan MIRA XR Extended-range SEM platform providing clear, reproducible insight with high-resolution imaging capabilities for materials research and quality control applications.
• Tescan CLARA Next-generation ultra-high-resolution scanning electron microscope for nanoscale materials characterization, featuring low-keV ultra-high-resolution imaging, MultiDetector and Axial detection, and flexibility for non-conductive, magnetic, beam-sensitive, porous, and topographic samples.
• Tescan MAGNA SEM platform delivering high-resolution imaging and surface analysis with exceptional contrast and ease of use for analytical applications.
• Tescan TIMA SEM-based automated mineralogy system for quantitative phase analysis and material characterization.
• Tescan AMBER 2 Advanced FIB-SEM system combining fast, precise milling with high-resolution imaging and advanced automation for sample preparation and failure analysis, featuring a gallium (Ga+) FIB source.
• Tescan AMBER X 2 Xenon plasma FIB-SEM system offering high-throughput large-volume processing with rapid material removal while maintaining precision for failure analysis and sample preparation.
• Tescan SOLARIS 2 FIB-SEM solution for advanced imaging and sample preparation applications.
• Tescan SOLARIS X 2 Plasma FIB-SEM solution for high-throughput sample preparation and analysis.
• Tescan UniTOM HR 2 High-resolution X-ray micro-CT system for fast, dynamic 3D and 4D imaging with non-destructive internal analysis, featuring detector switching and VOIS for dynamic-to-detail workflows.
• Tescan UniTOM XL / CoreTOM Multi-resolution micro-CT system designed to accommodate large and dense samples without compromise, capable of imaging full cores up to 1 meter in length and millimeter-sized samples.
• Tescan DynaTOM Dynamic micro-CT system for time-resolved imaging of structural and material evolution under in-situ conditions.
• Tescan Spectral Spectral micro-CT system for advanced materials characterization with spectral imaging capabilities.
• Tescan TENSOR First commercial 4D-STEM platform for intuitive multimodal nanocharacterization, combining structural, morphological, and chemical insights in every scan with real-time data processing, automation, and scripting support.
• Tescan FemtoChisel Next-generation femtosecond laser solution for semiconductor sample preparation and failure analysis, with material removal rates up to 2,000x faster than Xe plasma FIB, dual wavelength (1030nm IR / 515nm green), intelligent multi-gas processing, and correlative machine vision targeting.
• Tescan EXLO Ex situ lift-out solution for TEM specimen preparation that moves specimen lift-out outside the FIB-SEM to parallelize lamella transfer and grid mounting for higher throughput.
• Tescan Quiin Advanced system for ion implantation under controlled conditions, supporting demanding analytical tasks in research applications.
• Tescan NanoSpace Ultra-high vacuum (UHV) FIB-SEM system for analytical tasks in demanding environments with customizable system configuration and workflows.
• Panthera AI AI-powered noise reduction software for micro-CT that reduces noise in fast 3D and 4D scans, supporting more reliable interpretation and analysis.

Quantifiable outcome

• FemtoChisel delivers up to 2,000x faster material removal than Xe plasma FIB and up to 10,000x faster than Ga FIB
• +4 more outcomes

Named customers5 records

Segments7 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability4 records

Feature12 records

Partnerships

Twelve partnerships are on record, tiered flagship, core and minor.

• Shimadzu Corporation (Business Alliance)flagshipStrategic or Co-development Partner · 9 July 2024Business alliance established in 2024 leading to joint 'Shimadzu by Tescan' SEM product line in Japan. This alliance preceded the full acquisition and demonstrated complementary strengths in analytical instrumentation and advanced imaging technologies.
• EXpressLO LLCcoreStrategic or Co-development Partner · 1 January 2024Acquisition in 2024 added new capabilities in precision stage control and sample handling along with patent portfolio, expanding specimen preparation expertise.
• TESCAN KOREA Co., Ltd.coreStrategic or Co-development Partner · 1 January 2024Acquisition in 2024 of TESCAN KOREA Co., Ltd. strengthened presence in Asia-Pacific region and expanded customer support capabilities.
• DML Co., Ltd.minorStrategic or Co-development Partner · 1 January 2024Acquisition in 2024 of DML Co., Ltd. alongside TESCAN KOREA expanded presence in Asian markets.
• FemtoInnovationscoreStrategic or Co-development Partner · 1 January 2024Acquisition led to establishment of dedicated Laser Technology Business Unit for continued innovation in laser-enabled sample preparation technologies for semiconductor industry, resulting in FemtoChisel product.
• XREcoreStrategic or Co-development Partner · 1 January 2018Acquisition in 2018 expanded Tescan's capabilities in dynamic and micro-CT imaging, opening new possibilities in non-destructive analysis.
• ORSAY PHYSICScoreStrategic or Co-development Partner · 1 January 2013Partnership/merger in 2013 brought advanced focused ion and electron beam technologies into Tescan Group, significantly expanding technological capabilities.
• SpinLab Katowice (University of Silesia)minorStrategic or Co-development PartnerCore facility sharing practical approaches to running multi-user microscopy and micro-CT environments. Speaker in Tescan Core Facility Webinar Series.
• TU Graz (Graz University of Technology)minorStrategic or Co-development PartnerMulti-institutional micro-CT consortium operating Tescan UniTOM HR and UniTOM XL systems. Speaker in Tescan Core Facility Webinar Series sharing practical insights into managing shared tomography infrastructure.
• Aarhus UniversityminorStrategic or Co-development PartnerCollaborative research with Museum Silkeborg using Tescan CoreTOM micro-CT system to scan Tollund Man archaeological specimen at up to 4,000x higher resolution than previous methods.
• Museum SilkeborgminorStrategic or Co-development PartnerCollaborative research with Aarhus University using Tescan CoreTOM micro-CT system for non-destructive analysis of Tollund Man bog body.
• CNRS (Institut de Recherche de Chimie Paris)minorStrategic or Co-development PartnerResearch collaboration with Dr. Alexandre Tallaire, CNRS Research Director, on diamond material engineering with focused ion beam implantation for quantum technologies.

Scale indicators14 records

Recent moves10 records

Expansion highlights6 records

Direct peers

• Thermo Fisher Scientific: Operates the FEI/Scienion electron microscopy business, the global leader in SEM, FIB-SEM, and TEM systems serving the same semiconductor failure analysis, materials science, and life science customers as Tescan. Closest direct competitor across Tescan's full product portfolio.
• Carl Zeiss Microscopy (ZEISS): ZEISS Microscopy division competes directly with Tescan in SEM (EVO, Sigma), FIB-SEM (Crossbeam), and X-ray microscopy (Xradia), targeting overlapping materials science and semiconductor failure analysis customers with comparable product architectures.
• JEOL Ltd. Japan-based manufacturer of electron microscopes (SEM, TEM, FIB-SEM) and analytical instruments — a foundational peer competing against Tescan in academic, industrial, and semiconductor applications worldwide.
• Hitachi High-Tech Corporation: Makes FE-SEM, FIB-SEM, and atomic resolution STEM systems under the Hitachi brand and competes with Tescan in semiconductor metrology, materials characterization, and life sciences globally.
• Bruker Corporation: Operates Bruker microCT (Xradia) for high-resolution X-ray microtomography and analytical instruments that overlap directly with Tescan UniTOM, CoreTOM, and micro-CT workflows in materials, life science, and geoscience research.
• Rigaku Corporation: Manufactures X-ray analytical instrumentation including X-ray CT, diffraction, and fluorescence systems; partial overlap with Tescan's micro-CT portfolio and analytical imaging customers in industrial and academic research.

Emerging players

• Nion Company: Specialist developer of high-end aberration-corrected STEM and 4D-STEM platforms (HERMES, SAMRAI) — a focused innovator in the same category as Tescan TENSOR, addressing advanced 4D-STEM and materials science research customers.
• Delong Instruments: Czech-based manufacturer of low-voltage SEM and specialized electron microscopes — a smaller direct competitor in the SEM category with overlapping geographic and academic research customer base in Europe.
• Protochips: Specializes in in-situ TEM/SEM holders and software for dynamic experiments, complementing Tescan's electron microscopy platforms with a niche focus on live imaging and gas/liquid cell workflows.

Broad incumbents

• Oxford Instruments: Provides broader nanotechnology tools — including ion beam etching, nanofabrication, and select electron microscopy adjacencies — competing with Tescan in semiconductor process control and nanotechnology research through a wider instrument portfolio.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks5 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/tescan

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles7 records

Subsidiaries7 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about TESCAN GROUP a.s.