BACO Solution
BACO Solution is a privately held South Korean semiconductor equipment manufacturer that designs and sells PVD sputtering systems (Cluster, In-Line, and R&D) for memory, foundry, power semiconductor, and packaging customers including Samsung and SK Hynix, with an installed base in Korea and growing presence in Europe.
- Company typePrivate
- Founded2013
- HeadquartersHwaseong-si, South Korea
- Headcount—
- GTM typeB2B
- OfferingHardware or Manufacturing
What BACO Solution does
BACO Solution Co., Ltd. (주식회사 바코솔루션) is a privately held South Korean semiconductor equipment manufacturer founded in August 2013 and headquartered in Hwaseong-si, Gyeonggi-do, with a planned relocation to Yongin-si after H1 2026. The company specializes in Physical Vapor Deposition (PVD) sputtering systems, localizing technology previously dominated by Applied Materials, Lam Research, and other foreign incumbents. Its product portfolio is organized into three core lines: Cluster PVD systems (NxT-200, NxT-200S, NxT-300, NxT-300S) for 8-inch and 12-inch wafer processing in memory, foundry, and advanced packaging; In-Line PVD systems for power semiconductor Active Metal Brazing (AMB) substrates, including what the company claims is the world's first mass-production AMB thin-film tool with dual-sided deposition; and R&D equipment including an EUV Blank Mask Ion Beam Deposition System, multi-reactive sputtering systems, and high-hardness TiCN/DLC coating tools. The company also operates a cryo pump overhaul service with 100 units/month capacity and has expanded into PECVD via the NxT-320 platform.
BACO generates revenue primarily through direct, enterprise field sales of capital equipment via formal competitive bidding processes to semiconductor manufacturers. Anchor customers include Samsung (process approvals in Global Foundry, 8-inch DDI, WLP, and 12-inch Bumping) and SK Hynix (12-inch Bumping and SiC power device mass production), with additional customers including the Korea Basic Science Institute and a European power semiconductor manufacturer. The company pursues dual geographic channels: direct sales into Korean Tier-1 fabs and direct sales/ODA projects into Europe and overseas. Pricing is quote-based and not publicly disclosed. The company supplements equipment sales with recurring service contracts and cryo pump overhauls, holds Korean government certifications (Venture Business, Innobiz, Materials/Parts/Equipment Specialized Company, Corporate Research Institute), and participates in national R&D projects such as Super Gap Startup 1000+ and Next-Generation Intelligent Semiconductor (2023-2025). Core proprietary technology includes magnet pattern designs, multi-power application (RF, DC, RF+DC, HiPIMS), the Octa-Magnet Source, and Vacuum Maglev Transfer Module.
BACO Solution firmographics
Firmographics- Name
- BACO Solution
- Legal name
- BACO Solution Co., Ltd.
- Website
- https://baco-solution.com
- Company type
- Private
- Founded year
- 2013
- Operating status
- Operating
- Short description
- BACO Solution is a privately held South Korean semiconductor equipment manufacturer that designs and sells PVD sputtering systems (Cluster, In-Line, and R&D) for memory, foundry, power semiconductor, and packaging customers including Samsung and SK Hynix, with an installed base in Korea and growing presence in Europe.
- Ownership category
- akta.pro rank
BACO Solution industry classification
Industry- Product category
- Semiconductor PVD Equipment Manufacturing
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- akta.pro primary industry
- Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)
- akta.pro secondary industry
- Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)
Keywords
Where BACO Solution is headquartered
LocationHeadquarters
- HQ city
- Hwaseong-si
- HQ country
- South Korea
- HQ region
- Asia
Offices3 records
Markets served
BACO Solution business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Personnel, Operations, Supply Chain, Marketing or Sales
Revenue model
- PVD Equipment Sales: Sale of semiconductor manufacturing equipment including Cluster PVD systems (NxT-300, NxT-300S, NxT-200, NxT-200S), In-line PVD systems, and R&D equipment. Equipment is sold to semiconductor manufacturers for memory, system semiconductor, power semiconductor, and packaging applications. Sales involve formal bidding and procurement processes with specifications.
- Cryo Pump Overhaul Services: Cryopump overhaul and maintenance services with capacity of 100 units per month, providing after-market support for semiconductor equipment
- Sputtering System Service: Service contracts for sputtering systems providing ongoing maintenance and support
Go-to-market motion2 records
Distribution channels3 records
Marketing channels4 records
BACO Solution product offering
Product offeringCore offering
BACO Solution manufactures and sells semiconductor Physical Vapor Deposition (PVD) sputtering equipment, including Cluster PVD systems (NxT-200, NxT-200S, NxT-300, NxT-300S), In-Line PVD systems for power semiconductor AMB processes, and R&D equipment for thin film research and EUV mask deposition. The company also provides Cryo Pump Overhaul services. Customers include memory, foundry, power semiconductor, advanced packaging, and research organizations in South Korea, Europe, and overseas ODA markets.
Product overview
BACO Solution is a world-class PVD (Physical Vapor Deposition) equipment manufacturer for the semiconductor industry. The product portfolio consists of three main categories: Cluster PVD systems (NxT-200 and NxT-300 series) providing high-productivity mass production equipment for semiconductor packaging, power devices, and display applications; In-Line PVD systems designed for power semiconductor AMB (Active Metal Brazing) applications featuring world-first technology for double-sided simultaneous deposition; and R&D Equipment for material development, thin-film characterization, and process optimization. Additionally, the company offers Cryo Pump Overhaul services. BACO Solution has achieved localization of foreign semiconductor equipment and holds certifications from major semiconductor manufacturers including Samsung and SK Hynix.
Differentiator
Problem solved
Functional benefit
Products and services
- NxT-300 Sputtering System Dual Cluster PVD system for semiconductor packaging, power devices, and Micro OLED applications. Supports Metal, Oxide, and Nitride materials with RF, DC, RF+DC, and HiPIMS power options, ultra-high vacuum (5x10-8 Torr), and 12" wafer processing for memory, foundry, and power semiconductor manufacturers.
- NxT-300S Sputtering System Single Cluster PVD system with 8-angle transfer module chamber and vacuum robot for 12" wafer processing, supporting Si, SiC, Glass, Quartz, and Ceramic substrates.
- NxT-200 Sputtering System Standard sputtering system for 8" wafer processing with DC/RF/RF+DC/HiPIMS power options, Ar/N2/O2 gas support, ultra-high vacuum (5x10-8 Torr), and 25-slot wafer cassette with automatic mapping. Holds CE certification for European markets and process approval from Samsung Global Foundry Division for 8" DDI and WLP.
- NxT-200S Sputtering System Single Cluster PVD system with 9-angle transfer module chamber, vacuum robot, Top Magnet and ICP Antenna sources with RF 13.56 MHz and LF 400 kHz power for 8" wafer processing.
- In-Line Sputtering System for Power Semiconductor World's first AMB (Active Metal Brazing) In-Line PVD system for power semiconductor mass production thin film. Features double-sided simultaneous sputtering, linear moving magnet transfer, vacuum maglev transfer module for low vibration and minimal particles, and is optimized for SiN and AlN substrates.
- EUV Blank Mask Ion Beam Deposition System Research-grade ion beam deposition system for EUV blank mask fabrication supporting Mo, Si, Cr, CrO, C, and SiN materials on 12" wafers or 200x200mm glass substrates, achieving film uniformity of 3% or less.
- Cluster R&D Equipment Cluster-type research equipment designed for experimentation and optimization of various materials and process conditions, used for material development, thin film characterization, and process parameter testing with fast setup and precise control.
- TiCN/DLC High Hardness Sputtering System High hardness coating sputtering system for MCA Chuck coating applications supporting chuck sizes from 8" to 12" with TiCN and Diamond-Like Carbon (DLC) processes.
- Multi-Reactive Sputtering System Multi-material reactive sputtering system supporting Metal, Transparent Conductive Oxide (TCO), and Oxide materials on 4" to 8" wafers with excellent process reproducibility for R&D and pilot applications.
- NxT-320 PECVD for 12" AlF Coating Plasma-Enhanced Chemical Vapor Deposition (PECVD) system for 12" wafer AlF coating, complementing BACO's PVD portfolio for advanced semiconductor packaging applications.
- Cryo Pump Overhaul Service After-market cryogenic pump maintenance and overhaul service with capacity of 100 units per month, including fab-in inspection, disassembly and parts cleaning, critical parts replacement and assembly, and final leak and pumping performance testing.
Quantifiable outcome
- World First AMB Tool for Mass Production (Thin Film) in power semiconductor market
- +3 more outcomes
Companies that use BACO Solution
Customer profileNamed customers4 records
Segments5 records
Ideal customer profiles3 records
BACO Solution technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature7 records
BACO Solution partnerships and signals
Strategic signalPartnerships
Five partnerships are on record, tiered minor and core.
- HKD Coms Co., Ltd. ((주)에이치케이디컴즈)minorWebsite operation and management outsourced to HKD Coms Co., Ltd. for website and system management. Contract continues until termination agreement.
- Samsung Electronics (Global Foundry Division)coreProcess approval obtained from Samsung Global Foundry Division for 8 inch DDI and WLP process mass production using BACO xT-200 PVD equipment. Samsung and SK Hynix have approved BACO's 12 inch Bumping mass production processes.
- SK HynixcoreProcess approval obtained from SK Hynix for 12 inch Bumping mass production using BACO xT-300 PVD equipment. Partnership enables BACO equipment qualification for advanced memory semiconductor manufacturing.
- AK Corporation ((주)에이케이코퍼레이션)minorSelected as winning bidder for public tender of thickness thin film measurement equipment (tender number 20250618-1). Business relationship established through competitive bidding process for measurement equipment procurement.
- Elimb Global ((주)엘림글로벌)minorSelected as winning bidder for public tender of non-contact sheet resistance measurement equipment (tender number 20250618-2). Business relationship established through competitive bidding process.
Scale indicators4 records
Recent moves7 records
Expansion highlights6 records
BACO Solution competitors and assessment
Company assessmentBroad incumbents
- Applied Materials: Global leader in semiconductor deposition (including PVD/CVD/ALD) equipment with the broadest installed base. Directly comparable because its Producer® Selectra™ and ENDURA® PVD platforms compete head-to-head with BACO's NxT cluster PVD systems at the same Korean fab customers.
- Lam Research: Major incumbent in semiconductor deposition equipment, including PVD and PECVD. Comparable because its VECTOR® PVD and related deposition tools compete for the same memory and advanced packaging tool slots that BACO targets with its NxT systems.
- Tokyo Electron (TEL): Large Japanese semiconductor equipment maker with deep PVD and CVD product lines serving memory and logic fabs. Comparable because it sells deposition equipment into the same Korean customer base (Samsung, SK Hynix) that BACO is targeting.
Direct peers
- Ulvac: Japanese specialty vacuum and sputtering/PVD equipment manufacturer. Comparable because it produces sputtering systems serving semiconductor packaging and power device applications, overlapping directly with BACO's cluster and in-line PVD product lines.
- Jusung Engineering: Korean semiconductor equipment specialist in deposition (ALD/CVD/PVD) and etch. Comparable because it is a Korea-based, fab-supplier equipment company pursuing the same localization opportunity in Korean semiconductor fabs as BACO.
- Wonik IPS: Korean semiconductor equipment supplier specializing in deposition and etch systems. Comparable because it is a domestic Korean deposition equipment competitor pursuing similar customer qualifications and Korean Materials/Parts/Equipment policy benefits.
- Veeco Instruments: U.S.-based supplier of deposition and process equipment including PVD and IBD systems. Comparable because its IBD and PVD tools serve advanced packaging and emerging semiconductor applications similar to BACO's EUV blank mask IBD and power device AMB systems.
- SPTS Technologies (KLA): PVD and plasma etch equipment supplier owned by KLA, specializing in advanced packaging, MEMS, and power device applications. Comparable because its PVD platforms directly compete with BACO's in-line AMB and WLP/bumping PVD equipment at similar customer applications.
- Semes (Samsung Electronics subsidiary): Korean semiconductor equipment maker, wholly owned by Samsung Electronics, supplying deposition and cleaning tools. Comparable because it is a Korean-domestic semiconductor equipment competitor with strong Samsung relationship, mirroring BACO's primary customer base.
Emerging players
- Aixtron: European deposition equipment supplier specializing in MOCVD/CVD for power semiconductors and optoelectronics. Comparable because it serves the same SiC/GaN power semiconductor end market that BACO is targeting with its AMB in-line sputtering systems.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
BACO Solution compliance and trust
Trust signalCompliance8 records
BACO Solution financial estimates
Financial estimateRevenue estimate
Valuation estimate
BACO Solution leadership team
Management profileNumber of profiles
Profiles2 records
BACO Solution funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
BACO Solution M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about BACO Solution
What does BACO Solution do?
BACO Solution manufactures and sells semiconductor Physical Vapor Deposition (PVD) sputtering equipment, including Cluster PVD systems (NxT-200, NxT-200S, NxT-300, NxT-300S), In-Line PVD systems for power semiconductor AMB processes, and R&D equipment for thin film research and EUV mask deposition. The company also provides Cryo Pump Overhaul services. Customers include memory, foundry, power semiconductor, advanced packaging, and research organizations in South Korea, Europe, and overseas ODA markets.
Is BACO Solution a public or private company?
BACO Solution is a private company. It is classified as founder individual operated bootstrapped and is currently operating.
When was BACO Solution founded?
BACO Solution was founded in 2013.
Where is BACO Solution based?
BACO Solution is headquartered in Hwaseong-si, South Korea, in the Asia region.
How does BACO Solution make money?
Three revenue lines are on record. PVD Equipment Sales are the primary driver. The others are cryo Pump Overhaul Services and sputtering System Service.
Who are BACO Solution's main competitors?
Broad incumbents on record are Applied Materials, Lam Research and Tokyo Electron (TEL). Direct peers are Ulvac, Jusung Engineering, Wonik IPS, Veeco Instruments, SPTS Technologies (KLA) and Semes (Samsung Electronics subsidiary). Aixtron is listed as an emerging player.
Does BACO Solution have an API?
No public API is recorded for BACO Solution.
What industry is BACO Solution in?
BACO Solution's product category is Semiconductor PVD Equipment Manufacturing. Its primary akta.pro industry code is HDAHAEAB, Deposition Equipment (CVD/PVD/ALD/Epitaxy), with a secondary code of HDAHADAA, Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA). Its NAICS code is 333242.